SIST-TP CEN/CLC/TR 17603-20-05:2021
(Main)Space engineering - High voltage engineering and design handbook
Space engineering - High voltage engineering and design handbook
This Handbook establishes guidelines to ensure a reliable design, manufacturing and testing of high voltage electronic
equipment and covers:
• Design
• Manufacturing
• Verification/Testing
of equipment generating, carrying or consuming high voltage, like: high voltage power conditioner, high voltage
distribution (cables and connectors).
This Handbook is dedicated to all parties involved at all levels in the realization of space segment hardware and its
interface with high voltage for which EN 16603-20 (based on ECSS-E-ST-20) is applicable.
This handbook sets out to:
• summarize most relevant aspects and data of high voltage insulation
• provide design guidelines for high voltage insulation
• provide design guidelines for high voltage electronic equipment
• give an overview of appropriate high voltage test methods
• establish a set of recommendations for generation design and verification rules and methods
• provide best practices
Applicability is mainly focused on power conditioning equipment but may be also applicable for all other high voltage
electric and electronic power equipment used on space missions, except items of experimental nature.
Raumfahrttechnik - Handbuch für Hochspannungstechnik und Design
Ingénierie spatiale - Manuel d'ingénierie et de conception haute tension
Vesoljska tehnika - Priročnik o visokonapetostni tehniki in načrtovanju
General Information
Buy Standard
Standards Content (Sample)
SLOVENSKI STANDARD
SIST-TP CEN/CLC/TR 17603-20-05:2021
01-oktober-2021
Vesoljska tehnika - Priročnik o visokonapetostni tehniki in načrtovanju
Space engineering - High voltage engineering and design handbook
Raumfahrttechnik - Handbuch für Hochspannungstechnik und Design
Ingénierie spatiale - Manuel d'ingénierie et de conception haute tension
Ta slovenski standard je istoveten z: CEN/CLC/TR 17603-20-05:2021
ICS:
49.140 Vesoljski sistemi in operacije Space systems and
operations
SIST-TP CEN/CLC/TR 17603-20-05:2021 en,fr,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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SIST-TP CEN/CLC/TR 17603-20-05:2021
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SIST-TP CEN/CLC/TR 17603-20-05:2021
TECHNICAL REPORT
CEN/CLC/TR 17603-20-
05
RAPPORT TECHNIQUE
TECHNISCHER BERICHT
August 2021
ICS 49.140
English version
Space engineering - High voltage engineering and design
handbook
Ingénierie spatiale - Manuel d'ingénierie et de Raumfahrttechnik - Handbuch für
conception haute tension Hochspannungstechnik und Design
This Technical Report was approved by CEN on 14 June 2021. It has been drawn up by the Technical Committee CEN/CLC/JTC 5.
CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium,
Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia,
Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom.
CEN-CENELEC Management Centre:
Rue de la Science 23, B-1040 Brussels
© 2021 CEN/CENELEC All rights of exploitation in any form and by any means Ref. No. CEN/CLC/TR 17603-20-05:2021 E
reserved worldwide for CEN national Members and for
CENELEC Members.
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SIST-TP CEN/CLC/TR 17603-20-05:2021
CEN/CLC/TR 17603-20-05:2021 (E)
Table of contents
European Foreword . 10
Introduction . 11
1 Scope . 12
2 References . 13
3 Terms, definitions and abbreviated terms . 17
3.1 Terms from other documents .17
3.2 Terms specific to the present document . 17
3.3 Abbreviated terms. 21
4 High voltage design considerations . 23
4.1 Environment .23
4.1.1 Impact of environment .23
4.1.2 Pressure . 23
4.1.3 Temperature .25
4.1.4 Energetic Particle Radiation .26
4.1.5 Space Debris and Micrometeoroids . 27
4.1.6 Plasma .27
4.1.7 Mechanical .28
4.2 Electrical insulation .28
4.2.1 Categories of insulation .28
4.2.2 Gaseous insulation.28
4.2.3 Liquid insulation .31
4.2.4 Solid insulation .32
4.2.5 Vacuum insulation .35
4.2.6 Composites .36
4.3 Life limiting factors .36
4.3.1 Perspective .36
4.3.2 Electrical breakdown .37
4.3.3 Partial discharges .43
4.3.4 Paschen breakdown .46
2
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CEN/CLC/TR 17603-20-05:2021 (E)
4.3.5 Ageing .48
4.4 Typical applications .54
4.4.1 DC-DC High voltage power conditioners . 54
4.4.2 Electronic power conditioners for TWTA . 56
4.4.3 Electric propulsion .63
4.4.4 Microwave tubes .70
4.4.5 Scientific instruments and experiments . 73
5 High voltage design principles . 75
5.1 Basic design principles .75
5.1.1 Control of voltage .75
5.1.2 Control of electrical field strengths . 76
5.1.3 Control of electrical field distribution . 87
5.1.4 Control of insulation properties .89
5.1.5 Control of surface properties .92
5.1.6 Control of partial discharges .93
5.1.7 Control of corona effects .95
5.1.8 Control of Paschen breakdown . 95
5.1.9 Control of triple junction effects . 98
5.1.10 Control of creepage path .99
5.1.11 Control of surface charging . 100
5.1.12 Control of interferences . 102
5.2 High voltage assemblies . 105
5.2.1 Solid insulation: potted modules . 105
5.2.2 Solid insulation: others . 125
5.2.3 Gaseous insulation. 127
5.2.4 Liquid insulation (Oil) . 132
5.2.5 Space vacuum insulation . 133
5.3 High voltage components . 141
5.3.1 Transformers and inductors . 141
5.3.2 Capacitors .144
5.3.3 Resistors .147
5.3.4 Semiconductors . 149
5.3.5 Wires and cables . 149
5.3.6 Connectors . 154
5.3.7 Interconnections . 155
5.3.8 Insulators and spacers . 157
5.3.9 Feedthroughs . 158
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5.3.10 Printed circuit boards . 159
5.3.11 Other components. 161
6 High voltage testing . 162
6.1 Non-Destructive Testing . 162
6.1.1 Insulation Resistance Test (INR) . 162
6.1.2 Bulk Resistance Measurement (BRM) . 163
6.1.3 Surface Resistance Measurement (SRM) . 164
6.1.4 Polarisation and Depolarisation Current Measurement (PDC) . 165
6.1.5 Dielectric Loss Factor Test (DLF) . 166
6.1.6 Partial Discharge Test (PDT) . 167
6.1.7 Dielectric Withstanding Voltage Test (DWV) . 173
6.1.8 Triple Junction Test (TRJ) . 175
6.1.9 Critical pressure testing/Corona testing (CPT) . 177
6.1.10 Life testing (LIT) . 180
6.1.11 Accelerated life testing (ALT) . 181
6.1.12 Burn-in testing (BIT) . 182
6.2 Destructive Testing . 183
6.2.1 Breakdown Voltage Test (BVT) . 183
6.2.2 Lifetime evaluation testing (LET) . 184
6.3 Supplementary Methods . 185
6.4 Testing strategy .186
7 High voltage product aspects . 189
7.1.1 Best practice for materials and processes selection . 189
7.1.2 Best practice for design . 191
7.1.3 Best practice for qualification . 193
7.1.4 Best practice for flight acceptance . 194
7.1.5 Best practice for verification . 195
7.1.6 PID . 196
7.1.7 Evaluation Plan . 197
8 Specific problem areas . 198
8.1.1 High voltage converters . 198
8.1.2 Electric propulsion . 200
8.1.3 Electron devices (tubes) . 205
8.1.4 Scientific instruments and experiments . 205
8.1.5 EMC aspects . 205
9 Hazards and safety . 207
4
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9.1 Hazards .207
9.2 Safety .207
Annex A High Voltage Field Calculation Tables . 208
A.1 Principles of field efficiency factors for spheres and cylindrical geometries . 208
A.2 Spherical geometries . 209
A.3 Cylindrical geometries . 210
Annex B Best Practice References . 212
B.1 High Voltage Evaluation Plan . 212
B.1.1 Evaluation Activities . 212
B.1.2 Evaluation Plan . 212
B.1.3 Manufacturing of Evaluation Samples . 213
B.1.4 Test and Characterisation . 213
B.1.5 Evaluation Review. 213
B.2 Materials Evaluation . 214
B.3 PID – Process Identification Document . 218
Figures
Figure 4-1: Arc Caused by Particle Bridge . 27
Figure 4-2: Discharge (breakdown) development in a gas volume between two
electrodes by electron avalanche process . 38
Figure 4-3: Electrical strengths of a liquid insulation (here: transformer oil in 2,5 mm
gap) in relation to voltage exposure time and assumed breakdown
mechanism .40
Figure 4-4: Vacuum breakdown phenomena .42
Figure 4-5: Typical partial discharge configurations . 44
Figure 4-6: Electrical model of partial discharges for a gas-bubble in a solid . 45
Figure 4-7: Breakdown voltage of gases vs. the product of pressure times gap
spacing .47
Figure 4-8: Electrical treeing caused by partial discharges . 50
Figure 4-9: Example: Fatigue (thermo-mechanical stress-related) failures in assemblies
expressed as stress (∆T – temperature cycle amplitude) over number of
thermal cycles .51
Figure 4-10: Example: Fatigue (thermo-mechanical stress-related) failures in
assemblies expressed as stress (∆T – temperature cycle amplitude) over
number of thermal cycles .52
Figure 4-11: Electrical field strengths over time curve according to the Crine model . 54
Figure 4-12: DC/DC power conversion chains for high voltage of an EPC . 55
Figure 4-13: Topologies of electronic power conditioners . 56
Figure 4-14: Functional block diagram of an EPC . 57
5
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Figure 4-15: Example for a high voltage generation of an EPC . 59
Figure 4-16: Example of a high voltage transformer for an EPC . 60
Figure 4-17: Example of a FEM calculation result: Equipotential Lines for a Plane-to-
Plane configuration with spherical edges of the upper plane . 62
Figure 4-18: Principle of Electrical Propulsion vs. Chemical Propulsion . 63
Figure 4-19: FEEP Ion Emitter Principle .65
Figure 4-20: FEEP Ion Emitter Load – Equivalent Circuit . 65
Figure 4-21: Hall Effect Thruster Principle .66
Figure 4-22: HEMP Thruster Principle .67
Figure 4-23: Ion Thruster Principle (Kaufmann) .68
Figure 4-24: Radio Frequency Ion Thruster (RIT) Principle . 70
Figure 4-25: Schematic layout of a TWT .71
Figure 4-26: Principle of the electron gun of a TWT . 72
Figure 4-27: Principle of the collector stage of a TWT . 72
Figure 5-1: Electrical field strength depending on voltage and geometrical parameters
(Examples) .78
Figure 5-2: Uniform electrical field for indefinite parallel planes . 79
Figure 5-3: Sphere-inside-sphere electrical field .80
Figure 5-4: Examples for practical use of field equations for spheres . 81
Figure 5-5: Examples for practical: connections of wires by using spherical solder
joints .82
Figure 5-6: Cylinder-inside-cylinder electrical field . 82
Figure 5-7: Space charge formation on an isolating surface . 84
Figure 5-8: Space charge formation on sharp-edged structures in various
environments .85
Figure 5-9: Surface charging of an isolator .85
Figure 5-10: Correct meshing of shapes .87
Figure 5-11: General: E-Field and voltage for a three-dimensional path . 87
Figure 5-12: E-Field and voltage for gap lengths (straight path) . 88
Figure 5-13: Control of electrical field distribution - Examples. 89
Figure 5-14: Avoiding fibre bridging effect in liquid insulation . 90
Figure 5-15: Optimum design of interfaces between materials w.r.t. the electrical field 92
Figure 5-16: Limit critical Paschen breakdown pressure range by limitation of maximum
gap .96
Figure 5-17: Paschen discharge in a gap between solid insulation and ground . 97
Figure 5-18: Triggered Paschen discharge in a gap between solid insulation and
ground .97
Figure 5-19: Critical triple-junction point/area in an interface between solid -
gaseous/liquid/vacuum insulation - metal conductor . 98
Figure 5-20: Methods to reduce the influence of the triple junction zone by design . 99
6
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Figure 5-21: Impact of creepage path on electrical field distribution . 99
Figure 5-22: Designs to reduce impact of creepage path on electric insulation . 100
Figure 5-23: Designs to reduce impact of surface charging on electric insulation . 101
Figure 5-24: Segmenting of insulator to influence surface charging . 102
Figure 5-25: Implementation of design measures minimizing interference problems for
a typical high voltage power conditioner (regulated DC-DC converter for
high voltage as an example) . 104
Figure 5-26: Designs example: potting of embedded aluminium structure, i.e. an HV
terminal . 110
Figure 5-27: Designs example: potting of embedded aluminium structure, i.e. HV
terminal . 112
Figure 5-28: Shielding necessary to avoid exposure of an electronic part to excessive
electrical field stress . 113
Figure 5-29: Potting of PCB`s: typical design aspects . 115
Figure 5-30: Transformer with rectifier and filter designed as two separate modules
using open terminals for interconnecting HV harness . 117
Figure 5-31: Transformer and rectifier filter designed as two separate modules using
potted terminals for interconnecting HV harness . 118
Figure 5-32: Transformer and rectifier filter designed as one combined module potted
in (a) one or (b) two and more sequential potting processes . 118
Figure 5-33: Designs example: Spherical solder ball . 119
Figure 5-34: Fitting a potted assembly to partial discharge testing (Example of a potted
transformer winding) . 122
Figure 5-35: Examples for thermal drains embedded in potted modules . 123
Figure 5-36: Relative Dielectric Strength of a SF -N -Mixture versus Composition of the
6 2
Mixture .129
Figure 5-37: Surface flashover process in a vacuum environment . 134
Figure 5-38: Surface shapes for insulators . 136
Figure 5-39: Arrangement of cylindrically layers of windings . 141
Figure 5-40: Arrangement of windings in discs of a bobbin . 143
Figure 5-41: Partial discharge test aspects of a high voltage transformer . 144
Figure 5-42: Critical electrical field stress in the surrounding of high voltage capacitors
and proposed measures . 146
Figure 5-43: Basic high voltage resistor design variants . 147
Figure 5-44: High voltage resistor design aspects . 148
Figure 5-45: Suitable partial discharge test setup for high voltage wires . 150
Figure 5-46: Critical stress cases for high voltage wires . 151
Figure 5-47: Critical stress cases for high voltage wires terminations . 152
Figure 5-48: Interconnection of high voltage harness via soldering or crimping/bolting at
terminals .156
Figure 5-49: Flying lead interconnections . 157
7
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Figure 5-50: Suitable insulator design variants . 158
Figure 5-51: Suitable feedthrough design variants . 159
Figure 6-1: Guard ring test set-up for bulk resistance measurement. 163
Figure 6-2: Partial discharge test set-up . 169
Figure 6-3: Typical partial discharge test flow . 170
Figure 6-4: Partial discharge testing aspects. Example: High voltage transformer . 171
Figure 6-5: Dielectric Withstand Voltage Test Electrical Schematic . 174
Figure 6-6: Triple Junction Test Electrical Schematic . 176
Figure 6-7: Critical Pressure Test Electrical Schematic . 178
Figure 6-8: Breakdown Voltage Test Electrical Schematic . 183
Figure 8-1: High voltage conditioner with grounding at converter – load floating . 199
Figure 8-2: High voltage conditioner with grounding at load side – including a clamping
device at the conditioner . 199
Figure 8-3: High voltage conditioner with grounding at load side – including a clamping
device at the conditioner and triax HV cable for load connection . 200
: Field efficiency factors (Schwaiger factors) η as a function of geometry
parameter p for spheres . 209
: Field efficiency factors (Schwaiger factors) η as a function of geometry
parameter p for cylinders . 211
: Field efficiency factors (Schwaiger factors) η as a function of geometry
parameter p for cylinders . 211
: Typical material evaluation flow . 216
: Potted Rogowsky-profile electrodes . 217
: Crossed wire electrode . 217
: Material disk between electrodes . 217
Tables
Table 4-1: Course Classification of the potential impact to electrical insulations by
environmental type.23
Table 4-2: Properties of gaseous insulations .30
Table 4-3: Properties of liquid insulations .31
Table 4-4: Properties of EP, PUR and SI . 33
Table 4-5: Properties of various polymers . 34
Table 4-6: Properties of porcelain and alumina . 35
Table 4-7: Paschen Minimum for various gases .48
Table 4-8: Overview on Electrical Propulsion Principles, Thruster Type and Electrical
Physical Parameters .64
Table 5-1: Critical “thresholds” for high voltage .75
Table 5-2: Orientation “map” for maximum electrical field strengths in electrical
insulation .77
8
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Table 5-3: Orientation values (examples) for selection sphere structures to limit the
maximum electrical field of a high voltage assembly . 81
Table 5-4: Dew point of SF -N -mixtures versus pressure and depending of
6 2
composition.130
Table 5-5: Surface shapes for insulators in combination with selected materials
comparing the relative surface flashover strengths of +/- 45 degree cone
insulators for various voltage waveforms w.r.t pure cylindrical shapes . 137
Table 5-6: Theoretical predictions and experimental consequences of
...
SLOVENSKI STANDARD
kSIST-TP FprCEN/CLC/TR 17603-20-05:2021
01-maj-2021
Vesoljska tehnika - Priročnik za visokonapetostno tehniko in načrtovanje
Space engineering - High voltage engineering and design handbook
Raumfahrttechnik - Handbuch für Hochspannungstechnik und Design
Ingénierie spatiale - Manuel d'ingénierie et de conception haute tension
Ta slovenski standard je istoveten z: FprCEN/CLC/TR 17603-20-05
ICS:
49.140 Vesoljski sistemi in operacije Space systems and
operations
kSIST-TP FprCEN/CLC/TR 17603-20- en,fr,de
05:2021
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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kSIST-TP FprCEN/CLC/TR 17603-20-05:2021
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kSIST-TP FprCEN/CLC/TR 17603-20-05:2021
TECHNICAL REPORT
FINAL DRAFT
FprCEN/CLC/TR 17603-
RAPPORT TECHNIQUE
20-05
TECHNISCHER BERICHT
February 2021
ICS 49.140
English version
Space engineering - High voltage engineering and design
handbook
Ingénierie spatiale - Manuel d'ingénierie et de Raumfahrttechnik - Handbuch für
conception haute tension Hochspannungstechnik und Design
This draft Technical Report is submitted to CEN members for Vote. It has been drawn up by the Technical Committee
CEN/CLC/JTC 5.
CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium,
Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia,
Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom.
Recipients of this draft are invited to submit, with their comments, notification of any relevant patent rights of which they are
aware and to provide supporting documentation.
Warning : This document is not a Technical Report. It is distributed for review and comments. It is subject to change without
notice and shall not be referred to as a Technical Report.
CEN-CENELEC Management Centre:
Rue de la Science 23, B-1040 Brussels
© 2021 CEN/CENELEC All rights of exploitation in any form and by any means Ref. No. FprCEN/CLC/TR 17603-20-05:2021 E
reserved worldwide for CEN national Members and for
CENELEC Members.
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kSIST-TP FprCEN/CLC/TR 17603-20-05:2021
FprCEN/CLC/TR 17603-20-05:2021 (E)
Table of contents
European Foreword . 10
Introduction . 11
1 Scope . 12
2 References . 13
3 Terms, definitions and abbreviated terms . 17
3.1 Terms from other documents . 17
3.2 Terms specific to the present document . 17
3.3 Abbreviated terms. 21
4 High voltage design considerations . 23
4.1 Environment . 23
4.1.1 Impact of environment . 23
4.1.2 Pressure . 23
4.1.3 Temperature . 25
4.1.4 Energetic Particle Radiation . 26
4.1.5 Space Debris and Micrometeoroids . 27
4.1.6 Plasma . 27
4.1.7 Mechanical . 28
4.2 Electrical insulation . 28
4.2.1 Categories of insulation . 28
4.2.2 Gaseous insulation. 28
4.2.3 Liquid insulation . 31
4.2.4 Solid insulation . 32
4.2.5 Vacuum insulation . 35
4.2.6 Composites . 36
4.3 Life limiting factors . 36
4.3.1 Perspective . 36
4.3.2 Electrical breakdown . 37
4.3.3 Partial discharges . 43
4.3.4 Paschen breakdown . 46
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FprCEN/CLC/TR 17603-20-05:2021 (E)
4.3.5 Ageing . 48
4.4 Typical applications . 54
4.4.1 DC-DC High voltage power conditioners . 54
4.4.2 Electronic power conditioners for TWTA . 56
4.4.3 Electric propulsion . 63
4.4.4 Microwave tubes . 70
4.4.5 Scientific instruments and experiments . 73
5 High voltage design principles . 75
5.1 Basic design principles . 75
5.1.1 Control of voltage . 75
5.1.2 Control of electrical field strengths . 76
5.1.3 Control of electrical field distribution . 87
5.1.4 Control of insulation properties . 89
5.1.5 Control of surface properties . 92
5.1.6 Control of partial discharges . 93
5.1.7 Control of corona effects . 95
5.1.8 Control of Paschen breakdown . 95
5.1.9 Control of triple junction effects . 98
5.1.10 Control of creepage path . 99
5.1.11 Control of surface charging . 100
5.1.12 Control of interferences . 102
5.2 High voltage assemblies . 105
5.2.1 Solid insulation: potted modules . 105
5.2.2 Solid insulation: others . 125
5.2.3 Gaseous insulation. 127
5.2.4 Liquid insulation (Oil) . 132
5.2.5 Space vacuum insulation . 133
5.3 High voltage components . 141
5.3.1 Transformers and inductors . 141
5.3.2 Capacitors . 144
5.3.3 Resistors . 147
5.3.4 Semiconductors . 149
5.3.5 Wires and cables . 149
5.3.6 Connectors . 154
5.3.7 Interconnections . 155
5.3.8 Insulators and spacers . 157
5.3.9 Feedthroughs . 158
3
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5.3.10 Printed circuit boards . 159
5.3.11 Other components. 161
6 High voltage testing . 162
6.1 Non-Destructive Testing . 162
6.1.1 Insulation Resistance Test (INR) . 162
6.1.2 Bulk Resistance Measurement (BRM) . 163
6.1.3 Surface Resistance Measurement (SRM) . 164
6.1.4 Polarisation and Depolarisation Current Measurement (PDC) . 165
6.1.5 Dielectric Loss Factor Test (DLF) . 166
6.1.6 Partial Discharge Test (PDT) . 167
6.1.7 Dielectric Withstanding Voltage Test (DWV) . 173
6.1.8 Triple Junction Test (TRJ) . 175
6.1.9 Critical pressure testing/Corona testing (CPT) . 177
6.1.10 Life testing (LIT) . 180
6.1.11 Accelerated life testing (ALT) . 181
6.1.12 Burn-in testing (BIT) . 182
6.2 Destructive Testing . 183
6.2.1 Breakdown Voltage Test (BVT) . 183
6.2.2 Lifetime evaluation testing (LET) . 184
6.3 Supplementary Methods . 185
6.4 Testing strategy . 186
7 High voltage product aspects . 189
7.1.1 Best practice for materials and processes selection . 189
7.1.2 Best practice for design . 191
7.1.3 Best practice for qualification . 193
7.1.4 Best practice for flight acceptance . 194
7.1.5 Best practice for verification . 195
7.1.6 PID . 196
7.1.7 Evaluation Plan . 197
8 Specific problem areas . 198
8.1.1 High voltage converters . 198
8.1.2 Electric propulsion . 200
8.1.3 Electron devices (tubes) . 205
8.1.4 Scientific instruments and experiments . 205
8.1.5 EMC aspects . 205
9 Hazards and safety . 207
4
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9.1 Hazards . 207
9.2 Safety . 207
Annex A High Voltage Field Calculation Tables . 208
A.1 Principles of field efficiency factors for spheres and cylindrical geometries . 208
A.2 Spherical geometries . 209
A.3 Cylindrical geometries . 210
Annex B Best Practice References . 212
B.1 High Voltage Evaluation Plan . 212
B.1.1 Evaluation Activities . 212
B.1.2 Evaluation Plan . 212
B.1.3 Manufacturing of Evaluation Samples . 213
B.1.4 Test and Characterisation . 213
B.1.5 Evaluation Review. 213
B.2 Materials Evaluation . 214
B.3 PID – Process Identification Document . 218
Figures
Figure 4-1: Arc Caused by Particle Bridge . 27
Figure 4-2: Discharge (breakdown) development in a gas volume between two
electrodes by electron avalanche process . 38
Figure 4-3: Electrical strengths of a liquid insulation (here: transformer oil in 2,5 mm
gap) in relation to voltage exposure time and assumed breakdown
mechanism . 40
Figure 4-4: Vacuum breakdown phenomena . 42
Figure 4-5: Typical partial discharge configurations . 44
Figure 4-6: Electrical model of partial discharges for a gas-bubble in a solid . 45
Figure 4-7: Breakdown voltage of gases vs. the product of pressure times gap
spacing . 47
Figure 4-8: Electrical treeing caused by partial discharges . 50
Figure 4-9: Example: Fatigue (thermo-mechanical stress-related) failures in assemblies
expressed as stress (∆T – temperature cycle amplitude) over number of
thermal cycles . 51
Figure 4-10: Example: Fatigue (thermo-mechanical stress-related) failures in
assemblies expressed as stress (∆T – temperature cycle amplitude) over
number of thermal cycles . 52
Figure 4-11: Electrical field strengths over time curve according to the Crine model . 54
Figure 4-12: DC/DC power conversion chains for high voltage of an EPC . 55
Figure 4-13: Topologies of electronic power conditioners . 56
Figure 4-14: Functional block diagram of an EPC . 57
5
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Figure 4-15: Example for a high voltage generation of an EPC . 59
Figure 4-16: Example of a high voltage transformer for an EPC . 60
Figure 4-17: Example of a FEM calculation result: Equipotential Lines for a Plane-to-
Plane configuration with spherical edges of the upper plane . 62
Figure 4-18: Principle of Electrical Propulsion vs. Chemical Propulsion . 63
Figure 4-19: FEEP Ion Emitter Principle . 65
Figure 4-20: FEEP Ion Emitter Load – Equivalent Circuit . 65
Figure 4-21: Hall Effect Thruster Principle . 66
Figure 4-22: HEMP Thruster Principle . 67
Figure 4-23: Ion Thruster Principle (Kaufmann) . 68
Figure 4-24: Radio Frequency Ion Thruster (RIT) Principle . 70
Figure 4-25: Schematic layout of a TWT . 71
Figure 4-26: Principle of the electron gun of a TWT . 72
Figure 4-27: Principle of the collector stage of a TWT . 72
Figure 5-1: Electrical field strength depending on voltage and geometrical parameters
(Examples) . 78
Figure 5-2: Uniform electrical field for indefinite parallel planes . 79
Figure 5-3: Sphere-inside-sphere electrical field . 80
Figure 5-4: Examples for practical use of field equations for spheres . 81
Figure 5-5: Examples for practical: connections of wires by using spherical solder
joints . 82
Figure 5-6: Cylinder-inside-cylinder electrical field . 82
Figure 5-7: Space charge formation on an isolating surface . 84
Figure 5-8: Space charge formation on sharp-edged structures in various
environments . 85
Figure 5-9: Surface charging of an isolator . 85
Figure 5-10: Correct meshing of shapes . 87
Figure 5-11: General: E-Field and voltage for a three-dimensional path . 87
Figure 5-12: E-Field and voltage for gap lengths (straight path) . 88
Figure 5-13: Control of electrical field distribution - Examples. 89
Figure 5-14: Avoiding fibre bridging effect in liquid insulation . 90
Figure 5-15: Optimum design of interfaces between materials w.r.t. the electrical field 92
Figure 5-16: Limit critical Paschen breakdown pressure range by limitation of maximum
gap . 96
Figure 5-17: Paschen discharge in a gap between solid insulation and ground . 97
Figure 5-18: Triggered Paschen discharge in a gap between solid insulation and
ground . 97
Figure 5-19: Critical triple-junction point/area in an interface between solid -
gaseous/liquid/vacuum insulation - metal conductor . 98
Figure 5-20: Methods to reduce the influence of the triple junction zone by design . 99
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Figure 5-21: Impact of creepage path on electrical field distribution . 99
Figure 5-22: Designs to reduce impact of creepage path on electric insulation . 100
Figure 5-23: Designs to reduce impact of surface charging on electric insulation . 101
Figure 5-24: Segmenting of insulator to influence surface charging . 102
Figure 5-25: Implementation of design measures minimizing interference problems for
a typical high voltage power conditioner (regulated DC-DC converter for
high voltage as an example) . 104
Figure 5-26: Designs example: potting of embedded aluminium structure, i.e. an HV
terminal . 110
Figure 5-27: Designs example: potting of embedded aluminium structure, i.e. HV
terminal . 112
Figure 5-28: Shielding necessary to avoid exposure of an electronic part to excessive
electrical field stress . 113
Figure 5-29: Potting of PCB`s: typical design aspects . 115
Figure 5-30: Transformer with rectifier and filter designed as two separate modules
using open terminals for interconnecting HV harness . 117
Figure 5-31: Transformer and rectifier filter designed as two separate modules using
potted terminals for interconnecting HV harness . 118
Figure 5-32: Transformer and rectifier filter designed as one combined module potted
in (a) one or (b) two and more sequential potting processes . 118
Figure 5-33: Designs example: Spherical solder ball . 119
Figure 5-34: Fitting a potted assembly to partial discharge testing (Example of a potted
transformer winding) . 122
Figure 5-35: Examples for thermal drains embedded in potted modules . 123
Figure 5-36: Relative Dielectric Strength of a SF -N -Mixture versus Composition of the
6 2
Mixture . 129
Figure 5-37: Surface flashover process in a vacuum environment . 134
Figure 5-38: Surface shapes for insulators . 136
Figure 5-39: Arrangement of cylindrically layers of windings . 141
Figure 5-40: Arrangement of windings in discs of a bobbin . 143
Figure 5-41: Partial discharge test aspects of a high voltage transformer . 144
Figure 5-42: Critical electrical field stress in the surrounding of high voltage capacitors
and proposed measures . 146
Figure 5-43: Basic high voltage resistor design variants . 147
Figure 5-44: High voltage resistor design aspects . 148
Figure 5-45: Suitable partial discharge test setup for high voltage wires . 150
Figure 5-46: Critical stress cases for high voltage wires . 151
Figure 5-47: Critical stress cases for high voltage wires terminations . 152
Figure 5-48: Interconnection of high voltage harness via soldering or crimping/bolting at
terminals . 156
Figure 5-49: Flying lead interconnections . 157
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Figure 5-50: Suitable insulator design variants . 158
Figure 5-51: Suitable feedthrough design variants . 159
Figure 6-1: Guard ring test set-up for bulk resistance measurement. 163
Figure 6-2: Partial discharge test set-up . 169
Figure 6-3: Typical partial discharge test flow . 170
Figure 6-4: Partial discharge testing aspects. Example: High voltage transformer . 171
Figure 6-5: Dielectric Withstand Voltage Test Electrical Schematic . 174
Figure 6-6: Triple Junction Test Electrical Schematic . 176
Figure 6-7: Critical Pressure Test Electrical Schematic . 178
Figure 6-8: Breakdown Voltage Test Electrical Schematic . 183
Figure 8-1: High voltage conditioner with grounding at converter – load floating . 199
Figure 8-2: High voltage conditioner with grounding at load side – including a clamping
device at the conditioner . 199
Figure 8-3: High voltage conditioner with grounding at load side – including a clamping
device at the conditioner and triax HV cable for load connection . 200
Figure A-1 : Field efficiency factors (Schwaiger factors) η as a function of geometry
parameter p for spheres . 209
Figure A-2 : Field efficiency factors (Schwaiger factors) η as a function of geometry
parameter p for cylinders . 211
Figure A-3 : Field efficiency factors (Schwaiger factors) η as a function of geometry
parameter p for cylinders . 211
Figure B-1 : Typical material evaluation flow . 216
Figure B-2 : Potted Rogowsky-profile electrodes . 217
Figure B-3 : Crossed wire electrode . 217
Figure B-4 : Material disk between electrodes . 217
Tables
Table 4-1: Course Classification of the potential impact to electrical insulations by
environmental type. 23
Table 4-2: Properties of gaseous insulations . 30
Table 4-3: Properties of liquid insulations . 31
Table 4-4: Properties of EP, PUR and SI . 33
Table 4-5: Properties of various polymers . 34
Table 4-6: Properties of porcelain and alumina . 35
Table 4-7: Paschen Minimum for various gases . 48
Table 4-8: Overview on Electrical Propulsion Principles, Thruster Type and Electrical
Physical Parameters . 64
Table 5-1: Critical “thresholds” for high voltage . 75
Table 5-2: Orientation “map” for maximum electrical field strengths in electrical
insulation . 77
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Table 5-3: Orientation values (examples) for selection sphere structures to limit the
maximum electrical field of a high voltage as
...
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