SIST-TP CEN/CLC/TR 17603-20-05:2021

Space engineering - High voltage engineering and design handbook

This Handbook establishes guidelines to ensure a reliable design, manufacturing and testing of high voltage electronic
equipment and covers:
• Design
• Manufacturing
• Verification/Testing
of equipment generating, carrying or consuming high voltage, like: high voltage power conditioner, high voltage
distribution (cables and connectors).
This Handbook is dedicated to all parties involved at all levels in the realization of space segment hardware and its
interface with high voltage for which EN 16603-20 (based on ECSS-E-ST-20) is applicable.
This handbook sets out to:
• summarize most relevant aspects and data of high voltage insulation
• provide design guidelines for high voltage insulation
• provide design guidelines for high voltage electronic equipment
• give an overview of appropriate high voltage test methods
• establish a set of recommendations for generation design and verification rules and methods
• provide best practices
Applicability is mainly focused on power conditioning equipment but may be also applicable for all other high voltage
electric and electronic power equipment used on space missions, except items of experimental nature.

Raumfahrttechnik - Handbuch für Hochspannungstechnik und Design

Ingénierie spatiale - Manuel d'ingénierie et de conception haute tension

Vesoljska tehnika - Priročnik o visokonapetostni tehniki in načrtovanju

General Information

• Status: Published
• Public Enquiry End Date: 12-May-2021
• Publication Date: 19-Aug-2021
• ICS: 49.140 - Space systems and operations
• Technical Committee: I13 - Imaginarni 13
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 16-Aug-2021
• Due Date: 21-Oct-2021
• Completion Date: 20-Aug-2021
• Mandate: M/496 - Mandate addressed to CEN, CENELEC and ETSI to develop standardisation regarding space industry (Phase 3 of the process)
• Ref Project: CEN/CLC/TR 17603-20-05:2021 - Space engineering - High voltage engineering and design handbook

Overview

SIST-TP CEN/CLC/TR 17603-20-05:2021 - Space engineering: High voltage engineering and design handbook is a technical handbook that provides guidelines for the reliable design, manufacture and verification/testing of high‑voltage (HV) electronic equipment for space applications. Its primary focus is power conditioning equipment (e.g., HV power conditioners, distribution cables and connectors), but the guidance is broadly applicable to other spacecraft high‑voltage electric and electronic power hardware (non‑experimental items). The handbook summarizes insulation data, design rules, test methods and best practices to support flight‑worthy HV hardware interfacing with EN 16603-20 / ECSS‑E‑ST‑20 regimes.

Key topics and technical requirements

• High‑voltage design considerations: environmental drivers (vacuum, pressure, temperature, plasma, radiation, micrometeoroids), mechanical and thermal effects.
• Electrical insulation: categories and behavior of gaseous, liquid, solid, vacuum and composite insulations; ageing and life‑limiting mechanisms.
• Breakdown and discharge phenomena: electrical breakdown, partial discharges, Paschen effect, corona, surface charging, triple‑junction effects and electrical treeing.
• Design principles and controls: field control, field distribution, creepage/clearance, surface treatments, partial discharge mitigation, material selection and assembly practices.
• Components and assemblies: guidance for transformers, inductors, capacitors, resistors, semiconductors, wires/cables, connectors, feedthroughs, insulators, potted modules and PCBs.
• Testing and verification: recommended non‑destructive and destructive tests (insulation resistance, dielectric loss, partial discharge test, dielectric withstand, breakdown voltage, life/accelerated life, burn‑in, critical pressure/corona tests), test strategy and evaluation plans.
• Product lifecycle and quality: best practices for materials/process selection, qualification, flight acceptance, verification, manufacturing controls and process identification (PID).

Practical applications - who uses this standard

• Space HV designers & electrical engineers designing DC‑DC converters, HV power conditioners and distribution systems.
• Systems and mission engineers ensuring HV interfaces meet spacecraft environmental and safety constraints.
• Manufacturing & QA teams implementing material selection, potting, assembly and process control for HV hardware.
• Test laboratories & verification engineers defining HV test programs (partial discharge, DWV, accelerated life).
• Suppliers & procurement specifying requirements for cables, connectors, feedthroughs and HV components.
• Mission assurance & safety officers assessing hazards and acceptance criteria for flight hardware.

Related standards and context

• Aligns with EN 16603-20 (based on ECSS‑E‑ST‑20) for space electrical design practices.
• Complements other ECSS/CENELEC guidance on spacecraft systems, materials and testing.

This handbook is a practical reference for anyone involved in developing or qualifying high‑voltage spacecraft hardware, combining environmental, materials, design and test guidance to reduce HV risks and improve flight reliability.

Standards Content (Sample)

SLOVENSKI STANDARD
01-oktober-2021
Vesoljska tehnika - Priročnik o visokonapetostni tehniki in načrtovanju
Space engineering - High voltage engineering and design handbook
Raumfahrttechnik - Handbuch für Hochspannungstechnik und Design
Ingénierie spatiale - Manuel d'ingénierie et de conception haute tension
Ta slovenski standard je istoveten z: CEN/CLC/TR 17603-20-05:2021
ICS:
49.140 Vesoljski sistemi in operacije Space systems and
operations
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

TECHNICAL REPORT
CEN/CLC/TR 17603-20-
RAPPORT TECHNIQUE
TECHNISCHER BERICHT
August 2021
ICS 49.140
English version
Space engineering - High voltage engineering and design
handbook
Ingénierie spatiale - Manuel d'ingénierie et de Raumfahrttechnik - Handbuch für
conception haute tension Hochspannungstechnik und Design

This Technical Report was approved by CEN on 14 June 2021. It has been drawn up by the Technical Committee CEN/CLC/JTC 5.

CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium,
Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia,
Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom.

CEN-CENELEC Management Centre:
Rue de la Science 23, B-1040 Brussels
© 2021 CEN/CENELEC All rights of exploitation in any form and by any means Ref. No. CEN/CLC/TR 17603-20-05:2021 E
reserved worldwide for CEN national Members and for
CENELEC Members.
Table of contents
European Foreword . 10
Introduction . 11
1 Scope . 12
2 References . 13
3 Terms, definitions and abbreviated terms . 17
3.1 Terms from other documents .17
3.2 Terms specific to the present document . 17
3.3 Abbreviated terms. 21
4 High voltage design considerations . 23
4.1 Environment .23
4.1.1 Impact of environment .23
4.1.2 Pressure . 23
4.1.3 Temperature .25
4.1.4 Energetic Particle Radiation .26
4.1.5 Space Debris and Micrometeoroids . 27
4.1.6 Plasma .27
4.1.7 Mechanical .28
4.2 Electrical insulation .28
4.2.1 Categories of insulation .28
4.2.2 Gaseous insulation.28
4.2.3 Liquid insulation .31
4.2.4 Solid insulation .32
4.2.5 Vacuum insulation .35
4.2.6 Composites .36
4.3 Life limiting factors .36
4.3.1 Perspective .36
4.3.2 Electrical breakdown .37
4.3.3 Partial discharges .43
4.3.4 Paschen breakdown .46
4.3.5 Ageing .48
4.4 Typical applications .54
4.4.1 DC-DC High voltage power conditioners . 54
4.4.2 Electronic power conditioners for TWTA . 56
4.4.3 Electric propulsion .63
4.4.4 Microwave tubes .70
4.4.5 Scientific instruments and experiments . 73
5 High voltage design principles . 75
5.1 Basic design principles .75
5.1.1 Control of voltage .75
5.1.2 Control of electrical field strengths . 76
5.1.3 Control of electrical field distribution . 87
5.1.4 Control of insulation properties .89
5.1.5 Control of surface properties .92
5.1.6 Control of partial discharges .93
5.1.7 Control of corona effects .95
5.1.8 Control of Paschen breakdown . 95
5.1.9 Control of triple junction effects . 98
5.1.10 Control of creepage path .99
5.1.11 Control of surface charging . 100
5.1.12 Control of interferences . 102
5.2 High voltage assemblies . 105
5.2.1 Solid insulation: potted modules . 105
5.2.2 Solid insulation: others . 125
5.2.3 Gaseous insulation. 127
5.2.4 Liquid insulation (Oil) . 132
5.2.5 Space vacuum insulation . 133
5.3 High voltage components . 141
5.3.1 Transformers and inductors . 141
5.3.2 Capacitors .144
5.3.3 Resistors .147
5.3.4 Semiconductors . 149
5.3.5 Wires and cables . 149
5.3.6 Connectors . 154
5.3.7 Interconnections . 155
5.3.8 Insulators and spacers . 157
5.3.9 Feedthroughs . 158
5.3.10 Printed circuit boards . 159
5.3.11 Other components. 161
6 High voltage testing . 162
6.1 Non-Destructive Testing . 162
6.1.1 Insulation Resistance Test (INR) . 162
6.1.2 Bulk Resistance Measurement (BRM) . 163
6.1.3 Surface Resistance Measurement (SRM) . 164
6.1.4 Polarisation and Depolarisation Current Measurement (PDC) . 165
6.1.5 Dielectric Loss Factor Test (DLF) . 166
6.1.6 Partial Discharge Test (PDT) . 167
6.1.7 Dielectric Withstanding Voltage Test (DWV) . 173
6.1.8 Triple Junction Test (TRJ) . 175
6.1.9 Critical pressure testing/Corona testing (CPT) . 177
6.1.10 Life testing (LIT) . 180
6.1.11 Accelerated life testing (ALT) . 181
6.1.12 Burn-in testing (BIT) . 182
6.2 Destructive Testing . 183
6.2.1 Breakdown Voltage Test (BVT) . 183
6.2.2 Lifetime evaluation testing (LET) . 184
6.3 Supplementary Methods . 185
6.4 Testing strategy .186
7 High voltage product aspects . 189
7.1.1 Best practice for materials and processes selection . 189
7.1.2 Best practice for design . 191
7.1.3 Best practice for qualification . 193
7.1.4 Best practice for flight acceptance . 194
7.1.5 Best practice for verification . 195
7.1.6 PID . 196
7.1.7 Evaluation Plan . 197
8 Specific problem areas . 198
8.1.1 High voltage converters . 198
8.1.2 Electric propulsion . 200
8.1.3 Electron devices (tubes) . 205
8.1.4 Scientific instruments and experiments . 205
8.1.5 EMC aspects . 205
9 Hazards and safety . 207
9.1 Hazards .207
9.2 Safety .207
Annex A High Voltage Field Calculation Tables . 208
A.1 Principles of field efficiency factors for spheres and cylindrical geometries . 208
A.2 Spherical geometries . 209
A.3 Cylindrical geometries . 210
Annex B Best Practice References . 212
B.1 High Voltage Evaluation Plan . 212
B.1.1 Evaluation Activities . 212
B.1.2 Evaluation Plan . 212
B.1.3 Manufacturing of Evaluation Samples . 213
B.1.4 Test and Characterisation . 213
B.1.5 Evaluation Review. 213
B.2 Materials Evaluation . 214
B.3 PID – Process Identification Document . 218

Figures
Figure 4-1: Arc Caused by Particle Bridge . 27
Figure 4-2: Discharge (breakdown) development in a gas volume between two
electrodes by electron avalanche process . 38
Figure 4-3: Electrical strengths of a liquid insulation (here: transformer oil in 2,5 mm
gap) in relation to voltage exposure time and assumed breakdown
mechanism .40
Figure 4-4: Vacuum breakdown phenomena .42
Figure 4-5: Typical partial discharge configurations . 44
Figure 4-6: Electrical model of partial discharges for a gas-bubble in a solid . 45
Figure 4-7: Breakdown voltage of gases vs. the product of pressure times gap
spacing .47
Figure 4-8: Electrical treeing caused by partial discharges . 50
Figure 4-9: Example: Fatigue (thermo-mechanical stress-related) failures in assemblies
expressed as stress (∆T – temperature cycle amplitude) over number of
thermal cycles .51
Figure 4-10: Example: Fatigue (thermo-mechanical stress-related) failures in
assemblies expressed as stress (∆T – temperature cycle amplitude) over
number of thermal cycles .52
Figure 4-11: Electrical field strengths over time curve according to the Crine model . 54
Figure 4-12: DC/DC power conversion chains for high voltage of an EPC . 55
Figure 4-13: Topologies of electronic power conditioners . 56
Figure 4-14: Functional block diagram of an EPC . 57
Figure 4-15: Example for a high voltage generation of an EPC . 59
Figure 4-16: Example of a high voltage transformer for an EPC . 60
Figure 4-17: Example of a FEM calculation result: Equipotential Lines for a Plane-to-
Plane configuration with spherical edges of the upper plane . 62
Figure 4-18: Principle of Electrical Propulsion vs. Chemical Propulsion . 63
Figure 4-19: FEEP Ion Emitter Principle .65
Figure 4-20: FEEP Ion Emitter Load – Equivalent Circuit . 65
Figure 4-21: Hall Effect Thruster Principle .66
Figure 4-22: HEMP Thruster Principle .67
Figure 4-23: Ion Thruster Principle (Kaufmann) .68
Figure 4-24: Radio Frequency Ion Thruster (RIT) Principle . 70
Figure 4-25: Schematic layout of a TWT .71
Figure 4-26: Principle of the electron gun of a TWT . 72
Figure 4-27: Principle of the collector stage of a TWT . 72
Figure 5-1: Electrical field strength depending on voltage and geometrical parameters
(Examples) .78
Figure 5-2: Uniform electrical field for indefinite parallel planes . 79
Figure 5-3: Sphere-inside-sphere electrical field .80
Figure 5-4: Examples for practical use of field equations for spheres . 81
Figure 5-5: Examples for practical: connections of wires by using spherical solder
joints .82
Figure 5-6: Cylinder-inside-cylinder electrical field . 82
Figure 5-7: Space charge formation on an isolating surface . 84
Figure 5-8: Space charge formation on sharp-edged structures in various
environments .85
Figure 5-9: Surface charging of an isolator .85
Figure 5-10: Correct meshing of shapes .87
Figure 5-11: General: E-Field and voltage for a three-dimensional path . 87
Figure 5-12: E-Field and voltage for gap lengths (straight path) . 88
Figure 5-13: Control of electrical field distribution - Examples. 89
Figure 5-14: Avoiding fibre bridging effect in liquid insulation . 90
Figure 5-15: Optimum design of interfaces between materials w.r.t. the electrical field 92
Figure 5-16: Limit critical Paschen breakdown pressure range by limitation of maximum
gap .96
Figure 5-17: Paschen discharge in a gap between solid insulation and ground . 97
Figure 5-18: Triggered Paschen discharge in a gap between solid insulation and
ground .97
Figure 5-19: Critical triple-junction point/area in an interface between solid -
gaseous/liquid/vacuum insulation - metal conductor . 98
Figure 5-20: Methods to reduce the influence of the triple junction zone by design . 99
Figure 5-21: Impact of creepage path on electrical field distribution . 99
Figure 5-22: Designs to reduce impact of creepage path on electric insulation . 100
Figure 5-23: Designs to reduce impact of surface charging on electric insulation . 101
Figure 5-24: Segmenting of insulator to influence surface charging . 102
Figure 5-25: Implementation of design measures minimizing interference problems for
a typical high voltage power conditioner (regulated DC-DC converter for
high voltage as an example) . 104
Figure 5-26: Designs example: potting of embedded aluminium structure, i.e. an HV
terminal . 110
Figure 5-27: Designs example: potting of embedded aluminium structure, i.e. HV
terminal . 112
Figure 5-28: Shielding necessary to avoid exposure of an electronic part to excessive
electrical field stress . 113
Figure 5-29: Potting of PCB`s: typical design aspects . 115
Figure 5-30: Transformer with rectifier and filter designed as two separate modules
using open terminals for interconnecting HV harness . 117
Figure 5-31: Transformer and rectifier filter designed as two separate modules using
potted terminals for interconnecting HV harness . 118
Figure 5-32: Transformer and rectifier filter designed as one combined module potted
in (a) one or (b) two and more sequential potting processes . 118
Figure 5-33: Designs example: Spherical solder ball . 119
Figure 5-34: Fitting a potted assembly to partial discharge testing (Example of a potted
transformer winding) . 122
Figure 5-35: Examples for thermal drains embedded in potted modules . 123
Figure 5-36: Relative Dielectric Strength of a SF -N -Mixture versus Composition of the
6 2
Mixture .129
Figure 5-37: Surface flashover process in a vacuum environment . 134
Figure 5-38: Surface shapes for insulators . 136
Figure 5-39: Arrangement of cylindrically layers of windings . 141
Figure 5-40: Arrangement of windings in discs of a bobbin . 143
Figure 5-41: Partial discharge test aspects of a high voltage transformer . 144
Figure 5-42: Critical electrical field stress in the surrounding of high voltage capacitors
and proposed measures . 146
Figure 5-43: Basic high voltage resistor design variants . 147
Figure 5-44: High voltage resistor design aspects . 148
Figure 5-45: Suitable partial discharge test setup for high voltage wires . 150
Figure 5-46: Critical stress cases for high voltage wires . 151
Figure 5-47: Critical stress cases for high voltage wires terminations . 152
Figure 5-48: Interconnection of high voltage harness via soldering or crimping/bolting at
terminals .156
Figure 5-49: Flying lead interconnections . 157
Figure 5-50: Suitable insulator design variants . 158
Figure 5-51: Suitable feedthrough design variants . 159
Figure 6-1: Guard ring test set-up for bulk resistance measurement. 163
Figure 6-2: Partial discharge test set-up . 169
Figure 6-3: Typical partial discharge test flow . 170
Figure 6-4: Partial discharge testing aspects. Example: High voltage transformer . 171
Figure 6-5: Dielectric Withstand Voltage Test Electrical Schematic . 174
Figure 6-6: Triple Junction Test Electrical Schematic . 176
Figure 6-7: Critical Pressure Test Electrical Schematic . 178
Figure 6-8: Breakdown Voltage Test Electrical Schematic . 183
Figure 8-1: High voltage conditioner with grounding at converter – load floating . 199
Figure 8-2: High voltage conditioner with grounding at load side – including a clamping
device at the conditioner . 199
Figure 8-3: High voltage conditioner with grounding at load side – including a clamping
device at the conditioner and triax HV cable for load connection . 200
: Field efficiency factors (Schwaiger factors) η as a function of geometry
parameter p for spheres . 209
: Field efficiency factors (Schwaiger factors) η as a function of geometry
parameter p for cylinders . 211
: Field efficiency factors (Schwaiger factors) η as a function of geometry
parameter p for cylinders . 211
: Typical material evaluation flow . 216
: Potted Rogowsky-profile electrodes . 217
: Crossed wire electrode . 217
: Material disk between electrodes . 217

Tables
Table 4-1: Course Classification of the potential impact to electrical insulations by
environmental type.23
Table 4-2: Properties of gaseous insulations .30
Table 4-3: Properties of liquid insulations .31
Table 4-4: Properties of EP, PUR and SI . 33
Table 4-5: Properties of various polymers . 34
Table 4-6: Properties of porcelain and alumina . 35
Table 4-7: Paschen Minimum for various gases .48
Table 4-8: Overview on Electrical Propulsion Principles, Thruster Type and Electrical
Physical Parameters .64
Table 5-1: Critical “thresholds” for high voltage .75
Table 5-2: Orientation “map” for maximum electrical field strengths in electrical
insulation .77
Table 5-3: Orientation values (examples) for selection sphere structures to limit the
maximum electrical field of a high voltage assembly . 81
Table 5-4: Dew point of SF -N -mixtures versus pressure and depending of
6 2
composition.130
Table 5-5: Surface shapes for insulators in combination with selected materials
comparing the relative surface flashover strengths of +/- 45 degree cone
insulators for various voltage waveforms w.r.t pure cylindrical shapes . 137
Table 5-6: Theoretical predictions and experimental consequences of methods to
improve the surface flashover strengths in vacuum . 138
Table 5-7: Application matrix for PCB with high voltage. 160
Table 6-1: Test methods, levels and acceptance criteria for partial discharge testing 172
Table 6-2: Assessment of test methods w.r.t. its application . 186
Table 7-1: Typical material properties and reference test methods for high voltage
insulation materials . 189
Table 7-2: Best practice of verification for high voltage design aspects . 196
Table A-1 : Sphere geometries . 209
Table A-2 : Cylinder-parallel-to-a-cylinder geometries . 210
Table A-3 : Cylinder-inside-a-cylinder geometries . 210
Table B-1 : Product categories according to heritage (Ref.: ECSS-E-ST-10-02) . 214

European Foreword
This document (CEN/CLC//TR 17603-20-05:2021) has been prepared by Technical Committee
CEN/CLC/JTC 5 “Space”, the secretariat of which is held by DIN.
It is highlighted that this technical report does not contain any requirement but only collection of data
or descriptions and guidelines about how to organize and perform the work in support of EN 16603-20.
This Technical report (TR 17603-20-05:2021) originates from ECSS-E-HB-20-05A.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN [and/or CENELEC] shall not be held responsible for identifying any or all such
patent rights.
This document has been prepared under a mandate given to CEN by the European Commission and
the European Free Trade Association.
This document has been developed to cover specifically space systems and has therefore precedence
over any TR covering the same scope but with a wider domain of applicability (e.g.: aerospace).
Introduction
The subject of high voltage engineering and design has been part of the spacecraft design process since
the early times of spaceflight.
This was due to need for high voltage power conditioners being a key element of communication links.
The relate expertise was built up in Europe in the decade of the 1980 with the support of the
development of modern Electronic Power Conditioners (EPC’s), to operate Travelling Wave Tube
Amplifiers for telecommunication satellites and for high power radar applications.
In 1989 ESA launched its first high power radar for earth observation onboard the ERS-1 (European
Remote Sensing Satellite), achieving a technology for 15 kV – 17 kV in space.
Today typically between some ten and over hundred EPC’s with operating voltages of 5 kV - 8 kV are
placed on many of the telecommunications satellites.
Several space borne radars with travelling wave tubes and klystrons are in orbit using voltage up to 20
kV. Various detectors for various kind of space environment with voltage between a few hundred volts
and up to 30 kV are used in many missions, high power lasers up to 150 kV were studied, and even
some experiments onboard the International Space Station using fancy high voltage sources.
The latest trend is the increasing use of electric propulsion for satellites dealing with supply voltage in
the range between a few hundred volts and above 10 kV. High voltage related anomalies have been
observed only a few times, some in the early years of building up experience, some also later, especially
when new developments were done with new teams inexperienced in the field.
A need was identified for a standard already in the early years of the space flight, the US air force and
NASA presented a series design and test handbook in the 1970’s and 1980’s. In Europe, ESA started
discussing a draft standard with industry: the PSS-02-303 draft 2 from 1992 “Requirements for High
Voltage Transformer and Components used in Electronic Power Conditioners for ESA Space Systems”
this became a quasi standard reference in many space projects, even if it was never formally released.
The growing diversity of high voltage application gave finally the urgency to make a new approach for
standardization. The discussion started in 2007 with ECSS who led to the conclusion, that a standard
would not satisfy the immediate needs for projects, as it would be too wide to cover the diverse
applications and also would not be suitable to transfer the “know-how” of high voltage engineering
and design. Therefore it was decided to produce a handbook to give a broad scope of knowledge and
recommendations for design and test of high voltage equipment and components.
This document aims to satisfy these needs and provides a detailed view of high voltage knowledge
aspects as well as giving a guideline to identify suitable design rules.
Proper design of high voltage effects of these processes is part of the system engineering process as
defined in ECSS-E-ST-20, where only a small subset of high voltage requirements is given.
For new projects involving high voltage equipment and design it is useful to provide this handbook as
a reference to generate suitable requirements specific to the targeted high voltage application.
Chapter 7 of this document gives some “best practice” statements.
Only a smart answer can be given to the definition of the range of voltages which should be considered
as high voltages: The ECSS-E-ST-20C states for the definition of a high voltage “AC or DC voltage at
which partial discharges, corona, arcing or high electrical fields can occur”. For space environment this
can occur “. This in fact can already appear at 60 V – 80 V if a low pressure environment in an inert gas
provides a critical pressure for “Paschen Breakdown”. Under air (N2/O2 mixtures) this can occur for
voltage of above 300 V.
Scope
This Handbook establishes guidelines to ensure a reliable design, manufacturing and testing of high
voltage electronic equipment and covers:
• Design
• Manufacturing
• Verification/Testing
of equipment generating, carrying or consuming high voltage, like: high voltage power conditioner,
high voltage distribution (cables and connectors).
This Handbook is dedicated to all parties involved at all levels in the realization of space segment
hardware and its interface with high voltage for which ECSS-E-ST-20C is applicable.
This handbook sets out to:
• summarize most relevant aspects and data of high voltage insulation
• provide design guidelines for high voltage insulation
• provide design guidelines for high voltage electronic equipment
• give an overview of appropriate high voltage test methods
• establish a set of recommendations for generation design and verification rules and methods
• provide best practices
Applicability is mainly focused on power conditioning equipment but may be also applicable for all
other high voltage electric and electronic power equipment used on space missions, except items of
experimental nature.
References
EN Reference Reference in text Title
EN 16601-00-01 ECSS-S-ST-00-01 ECSS System – Glossary of terms
EN 16603-10-02 ECSS-E-ST-10-02 Space engineering - Verification
EN 16603-10-03 ECSS-E-ST-10-03 Space engineering - Testing
EN 16603-10-04 ECSS-E-ST-10-04 Space engineering - Space environment
EN 16603-20 ECSS-E-ST-20 Space engineering - Electrical and electronic
EN 16603-20-01 ECSS-E-ST-20-01 Space engineering - Multipactor design and test
EN 16603-20-06 ECSS-E-ST-20-06 Space engineering - Spacecraft charging
EN 16603-32 ECSS-E-ST-32 Space engineering - Structural general requirements
EN 16602-30-11 ECSS-Q-ST-30-11 Space product assurance - Derating – EEE components
EN 16602-70-10 ECSS-Q-ST-70-10 Space product assurance - Qualification of printed
circuit boards
EN 16602-70-11 ECSS-Q-ST-70-11 Space product assurance - Procurement of printed
circuit boards
EN 16602-70-71 ECSS-Q-ST-70-71 Space product assurance - Data for selection of space
materials and processes
- ESA SP-398 Power supply and control unit (PCSU) for radio
(May 1997) frequency ion thrusters (RIT)” ESA, Proc. 2nd European
Spacecraft Propulsion, Noordwijk, The Netherlands,
27-29 May 1997 (ESA SP-398), pp 643-648.
- ESA SP-555 The Power Control Unit for the Propulsion Engine of
(June 2004) GOCE Program, Tato, C.; Palencia, J.; De la Cruz, F., 4th
International Spacecraft Propulsion Conference, 2-4
June 2004 Chia Laguna (Cagliari), Sardinia, Italy
- ESA SP-569 The T5 Ion Propulsion Assembly for Drag
(June 2004) Compensation on GOCE, Proceedings of the Second
International GOCE User Workshop
- AIAA 2005-4224 (2005) First Test Results of the 1 to 15 kW Coaxial HEMP 30250
Thurster, 41st AIAA/ASME/SAE/ASEE Joint
Propulsion Conference & Exhibit, 10 - 13 July 2005,
Tucson, Arizona
- AIAA 2006-4476 (2006) High Power HEMP-Thruster Module, Status and
Results of a DLR and ESA Development Program, 42nd
AIAA/ASME/SAE/ASEE Joint Propulsion Conference
& Exhibit, 9 - 12 July 2006, Sacramento, California
EN Reference Reference in text Title
- AIAA 2006-4825 (2006) Micro-Newton Electric Propulsion Subsystems for
Ultra-Stable Platforms, 42nd AIAA/ASME/SAE/ASEE
Joint Propulsion Conference & Exhibit, 9 - 12 July 2006,
Sacramento, California
- AIAA 2006-5172 (2006) Theoretical Study of the Breathing Mode in Hall
Thrusters, 42nd AIAA/ASME/SAE/ASEE Joint
Propulsion Conference & Exhibit, 9 - 12 July 2006,
Sacramento, California
- AIAA 2007-5215 Generic High Voltage Power Supply – Next Generation,
(2007) 43rd AIAA/ASME/SAE/ASEE Joint Propulsion
Conference & Exhibit, 8 - 11 July 2007, Cincinnati, OH
- AIAA 2007-5250 RIT-μX - High Precision Micro Ion Propulsion System
(2007) based on RF-Technology, 43rd AIAA/ASME/SAE/ASEE
Joint Propulsion Conference & Exhibit, 8 - 11 July 2007,
Cincinnati, OH
- AIAA 2008-4632 (2008) A model for the active control of low frequency
oscillations in Hall thrusters, 44th
AIAA/ASME/SAE/ASEE Joint Propulsion Conference
& Exhibit, 21 - 23 July 2008, Hartford, CT
- ASTM-D-150 Standard Test Methods for AC Loss :Characteristics and
(2011) Permittivity (Dielectric Constant) of Solid Electrical
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