Standard Guide for Analysis of Overtest Data in Radiation Testing of Electronic Parts

SIGNIFICANCE AND USE
Overtesting should be done when (a) testing by variables is impractical because of time and cost considerations or because the probability distribution of stress to failure cannot be estimated with sufficient accuracy, and (b) an unrealistically large number of parts would have to be tested at the specification stress for the necessary confidence and survival probability.
SCOPE
1.1 This guide covers the use of overtesting in order to reduce the required number of parts that must be tested to meet a given quality acceptance standard. Overtesting is testing a sample number of parts at a stress higher than their specification stress in order to reduce the amount of necessary data taking. This guide discusses when and how overtesting may be applied to forming probabilistic estimates for the survival of electronic piece parts subjected to radiation stress. Some knowledge of the probability distribution governing the stress-to-failure of the parts is necessary though exact knowledge may be replaced by over-conservative estimates of this distribution.

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Historical
Publication Date
09-Dec-1999
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ASTM F1263-99(2005) - Standard Guide for Analysis of Overtest Data in Radiation Testing of Electronic Parts
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NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
Contact ASTM International (www.astm.org) for the latest information
Designation: F1263 – 99 (Reapproved 2005)
Standard Guide for
Analysis of Overtest Data in Radiation Testing of Electronic
Parts
This standard is issued under the fixed designation F1263; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (´) indicates an editorial change since the last revision or reapproval.
1. Scope rior lots, where the survival probability of the parts is less than
probability, P, will be rejected with confidence, C. In order to
1.1 This guide covers the use of overtesting in order to
infer a true confidence, it would require a Bayes Theorem
reduce the required number of parts that must be tested to meet
calculation. In many cases, the distinction between confidence
a given quality acceptance standard. Overtesting is testing a
and rejection confidence is of little practical importance.
sample number of parts at a stress higher than their specifica-
However, in other cases (typically when a large number of lots
tion stress in order to reduce the amount of necessary data
are rejected) the distinction between these two kinds of
taking. This guide discusses when and how overtesting may be
confidence can be significant. The formulas given in this guide
applied to forming probabilistic estimates for the survival of
apply whether one is dealing with confidence or rejection
electronic piece parts subjected to radiation stress. Some
confidence.
knowledge of the probability distribution governing the stress-
to-failure of the parts is necessary though exact knowledge
4. Summary of Guide
may be replaced by over-conservative estimates of this distri-
4.1 This guide is intended to primarily apply to sampling by
bution.
attribute plans typified by Lot Tolerance Percent Defective
2. Referenced Documents (LTPD) tables given in MIL-PRF 38535 and MIL-PRF 19500,
and contains the following:
2.1 Military Standards:
4.1.1 An equation for estimating the effectiveness of over-
MIL-PRF 19500 Semiconductor Devices, General Specifi-
testing in terms of increased probability of survival,
cations for
4.1.2 An equation for the required amount of overtesting
MIL-PRF 38535 Integrated Circuits (Microcircuit Manu-
given a necessary survival probability, and
facturing)
4.1.3 Cautions and limitations on the method.
3. Terminology
5. Significance and Use
3.1 Description of Term:
5.1 Overtesting should be done when (a) testing by vari-
3.1.1 confidence—the probability, C, that at least a fraction,
ables is impractical because of time and cost considerations or
P, of the electronic parts from a test lot will survive in actual
because the probability distribution of stress to failure cannot
service; since radiation testing of electronic parts is generally
be estimated with sufficient accuracy, and (b) an unrealistically
destructive, this probability must be calculated from tests on
large number of parts would have to be tested at the specifi-
selected specimens from the lot.
cation stress for the necessary confidence and survival prob-
3.1.2 rejection confidence—the probability, R, that a lot will
ability.
be rejected based on destructive tests of selected specimens if
more than a specified fraction P of the parts in the lot will fail
6. Interferences
in actual service.
6.1 Probability Distributions—In overtesting, a knowledge
3.1.3 Discussion of Preceding Terms—Strictly speaking,
of the probability distribution governing stress to failure is
most lot acceptance tests (be they testing by attributes or
required, though it need not be specified with the same
variables) do not guarantee survivability, but rather that infe-
accuracy necessary for testing by variables. For bipolar tran-
sistors exposed to neutron radiation, the failure mechanism is
1 usually gain degradation and the stress to failure is known to
This guide is under the jurisdiction of ASTM Committee F01 on Electronics
and is the direct responsibility of Subcommittee F01.11 on Quality and Hardness follow a lognormal distribution. For bipolar transistors ex-
Assurance.
posed to total dose the use of the lognormal distribution is also
Current edition approved Jan. 1, 2005. Published January 2005. Originally
approved in 1989. Last previous edition approved in 1999 as F1263 – 99. DOI:
10.1520/F1263-99R05. Messenger, G. C., Steele, E. L., “Statistical Modeling of Semiconductor
AvailablefromStandardizationDocumentsOrderDesk,Bldg.4SectionD,700 Devices for the TREE Environment,’’ Transactions on Nuclear Science NS-15,
Robbins Ave., Philadelphia, PA 19111-5094, Attn: NPODS. 1968, p. 4691.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.
F1263 – 99 (2005)
TABLE 1 Survival Probability at Specification Level VersusR and Survival Probability at Overtest Level
Specification Level Probability for:
Overtest Level R=0.5 R=1.0 R=1.5 R=2.0 R=3.0 R=5.0
Probability
0.50 0.691462 0.841345 0.933193 0.977250 0.998650 1.000000
0.80 0.910140 0.967235 0.990400 0.997756 0.999939 1.000000
0.90 0.962588 0.988742 0.997295 0.999484 0.999991 1.000000
0.95 0.984016 0.995913 0.999169 0.999866 0.999998 1.000000
¯
fairly good. For more complex electronics and other kinds of
P 5 F[F 1 ln ~3! / 0.5] 5 F[0.84 1 2.20] 5 0.999,
S
radiation stress, the lognormal distribution is widely used in
where we used the following facts governing the normal
estimating the failure probabilities of electronic piece parts,
distribution:
and therefore this standa
...

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