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ASTM F1211-89(2001)

(Specification)

Standard Specification for Semiconductor Device Passivation Opening Layouts (Withdrawn 2007)

Standard Specification for Semiconductor Device Passivation Opening Layouts (Withdrawn 2007)

SCOPE
1.1 This specification covers standard semiconductor device passivation opening layouts for various tape automated bonding interconnection technologies.
1.2 This specification establishes the nominal passivation opening dimensions, nominal passivation, opening spacing, nominal corner passivation opening offset, minimum scribe guard and minimum die size for the most common input/ output counts within each technology.
1.3 This specification is extendable to other interconnection technologies if the passivation opening and spacing are adjusted in such a way that the progression is not modified.
1.4 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.
WITHDRAWN RATIONALE
This specification covers standard semiconductor device passivation opening layouts for various tape automated bonding interconnection technologies.
Formerly under the jurisdiction of Committee F01 on Electronics and Subcommittee F01.07 on Wire Bonding, Flip Chip, and Tape Automated Bonding, this specification was withdrawn in July 2007 in accordance with section 10.6.3.1 of the Regulations Governing ASTM Technical Committees, which requires that standards shall be updated by the end of the eighth year since the last approval date.

General Information

Status
Withdrawn
Publication Date
31-Dec-2000
Withdrawal Date
26-Aug-2007
ICS
31.080.01 - Semiconductor devices in general
Technical Committee
F01 - Electronics
Current Stage
Ref Project

Relations

Replaces
ASTM F1211-89(1994)e1 - Standard Specification for Semiconductor Device Passivation Opening Layouts
Effective Date
01-Jan-2001

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ASTM F1211-89(2001) - Standard Specification for Semiconductor Device Passivation Opening Layouts (Withdrawn 2007)ASTM F1211-89(2001) - Standard Specification for Semiconductor Device Passivation Opening Layouts (Withdrawn 2007)
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ASTM F1211-89(2001) - Standard Specification for Semiconductor Device Passivation Opening Layouts (Withdrawn 2007)
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NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
Contact ASTM International (www.astm.org) for the latest information
Designation: F 1211 – 89 (Reapproved 2001)
Standard Specification for
Semiconductor Device Passivation Opening Layouts
This standard is issued under the fixed designation F 1211; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (e) indicates an editorial change since the last revision or reapproval.
1. Scope 2.1.6 passivation opening size—The minimum othagonal
dimensions of the passivation opening for the particular
1.1 This specification covers standard semiconductor device
technology herein used as the nominal passivation opening
passivation opening layouts for various tape automated bond-
size.
ing interconnection technologies.
2.1.7 passivation opening space—The minimum space be-
1.2 This specification established the nominal passivation
tween adjacent passivation openings for the particular technol-
opening dimensions, nominal passivation, opening spacing,
ogy herein used as the nominal passivation opening spacing.
nominal corner passivation opening offset, minimum scribe
2.1.8 progression—The dimension as measured from a
guard and minimum die size for the most common input/output
reference point on one passivation opening to the same
counts within each technology.
reference point on the adjacent passivation opening.
1.3 This specification is extendable to other interconnection
2.1.9 technology—The minimum passivation opening pro-
technologies if the passivation opening and spacing are ad-
gression allowable for a specific interconnection method.
justed in such a way that the progression is not modified.
1.4 The values stated in SI units are to be regarded as the
3. Classification
standard. The values given in parentheses are for information
3.1 The passivation opening layouts are separated into four
only.
technology types where:
2. Terminology Type I = 220 µm technology (220 µm = 8.7 mils)
Type II = 185 µm technology (185 µm = 7.3 mils)
2.1 Definitions:
Type III = 150 µm technology (150 µm = 5.9 mils)
2.1.1 corner offset—The orthogonal distance between the
Type IV = 100 µm technology (100 µm = 3.9 mils)
corner passivation opening on adjacent sides of the die where
a corner passivation opening is indentified as the end passiva-
4. Dimensions, Mass, and Permissible Variations
tion opening on a die side.
4.1 The primary unit of measure is micrometres (µm) (1
2.1.2 lead count—The number of passivation openings
micrometre = 1 micron) and the secondary unit of measure is
available on a fully populated die layout.
mils (1/1000 of an in.), where 1 mil (0.001 in.) = 25.4 µm.
2.1.3 minimum die edge guard—The minimum distance
4.2 Fig. 1 shows the generic dimension measurement for
between the die edge and the passivation opening nearest to the
each defined dimension.
die edge herein used to establish the minimum die size.
4.3 The lead count independent dimensions are summarized
2.1.4 minimum die size—The minimum die size is calcu-
in Table 1 for all technologies.
lated by the following equation:
4.4 The specific standard layouts are listed in Tables 2-5 for
minimum die size5~~lead count/4!~p.o. size 1 p.o. space!!
Type I,Type II,Type III andType IVtechnologies respectively.
2 p.o. space1~2 ~corner offset 1 p.o. size
4.5 Progression—Any variations must be noncumulative.
1 die edge guard!!
4.6 Lead Count—All passivation openings as specified in
2.1.5 passivation opening—The unpassivated area within
this specification must be included in the design whether they
the device metal bonding pad area.
are or are not connected internally.
5. Keywords
This specification is under the jurisdiction of ASTM Committee F01 on
Electronics and is the direct responsibility of Subcommittee F01.07 on Wire
5.1 opening layouts; passivation; semiconductor devices
Bonding, Flip Chip, and Tape Automated Bonding.
Current edition approved Feb. 24, 1989. Published April 1989.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.
F 1211 – 89 (2001)
TABLE 3 Specific Dimensions for the Type II (185 µm)
Technology for Each Lead Count
Passivation Passivation Minimum
Corner Minimum
Lead Count Opening Opening Die Edge
Offset, µm Die Size,
n Size, µm Space, µm Guard, µm
(mil) µm (mil)
(mil) (mil) (mil)
28 80 (3.14) 105 (4.13) 188 (7.40) 125 (4.92) 2.0 (78)
32 80 (3.14) 105 (4.13) 188 (7.40) 125 (4.92) 2.2 (86)
40 80 (3.14) 105 (4.13) 188 (7.40) 125 (4.92) 2.6 (100)
44 80 (3.14) 105 (4.13) 188 (7.40) 125 (4.92) 2.8 (107)
68 80 (3.14) 105 (4.13) 188 (7.40) 125 (4.92) 3.9 (151)
84 80 (3.14) 105 (4.13) 188 (7.40) 125 (4.92) 4.6 (180)
100 80 (3.14) 105 (4.13) 188 (7.40) 125 (4.92) 5.4 (209)
132 80 (3.14) 105 (4.13) 188 (7.40) 125 (4.92) 6.8 (268)
144 80 (3.14) 105 (4.13) 188 (7.40) 125 (4.92) 7.4 (290)
164 80 (3.14) 105 (4.13) 188 (7.40) 125 (4.92) 8.3 (326)
180 80 (3.14) 105 (4.13) 188 (7.40) 125 (4.92) 9.1 (355)
196 80 (3.14) 105 (4.13) 188 (7.40) 125 (4.92) 9.7 (384)
FIG. 1 Generic Dimension Measurement
220 80 (3.14) 105 (4.13) 188 (7.40) 125 (4.92) 10.9 (428)
244 80 (3.14)
...

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1.1.2 Grades B6–B20 S5000, B6–B20 S500, and B6–B20 S15 are middle distillate fuel/biodiesel blends for use in domestic and small industrial burners.  
1.1.3 Grades No. 4 (Light) and No. 4 are heavy distillate fuels or middle distillate/residual fuel blends used in commercial/industrial burners equipped for this viscosity range.  
1.1.4 Grades No. 5 (Light), No. 5 (Heavy), and No. 6 are residual fuels of increasing viscosity and boiling range, used in industrial burners. Preheating is usually required for handling and proper atomization.  
Note 1: For information on the significance of the terminology and test methods used in this specification, see Appendix X1.
Note 2: A more detailed description of the grades of fuel oils is given in X1.3.  
1.2 This specification is for the use of purchasing agencies in formulating specifications to be included in contracts for purchases of fuel oils and for the guidance of consumers of fuel oils in the selection of the grades most suitable for their needs.  
1.3 Nothing in this specification shall preclude observance of federal, state, or local regulations which can be more restrictive.  
1.4 The values stated in SI units are to be regarded as standard.  
1.4.1 Non-SI units are provided in Table 1 and Table 2 and in 7.1.2.1/7.1.2.2 because these are common units used in the industry.
Note 3: The generation and dissipation of static electricity can create problems in the handling of distillate burner fuel oils. For more information on the subject, see Guide D4865.  
1.5 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

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ASTM
ASTM D8165-24(Test Method)
Standard Test Method for Evaluation of Load-Carrying Capacity of Lubricants Used in Hypoid Final-Drive Axles Operated under Low-Speed and High-Torque Conditions

SIGNIFICANCE AND USE
5.1 This test method measures a lubricant's ability to protect hypoid final drive axles from abrasive wear, adhesive wear, plastic deformation, and surface fatigue when subjected to low-speed, high-torque conditions. Lack of protection can lead to premature gear or bearing failure, or both.  
5.2 This test method is used, or referred to, in specifications and classifications of rear-axle gear lubricants such as:  
5.2.1 Specification D7450.  
5.2.2 American Petroleum Institute (API) Publication 1560.  
5.2.3 SAE J308.  
5.2.4 SAE J2360.
SCOPE
1.1 This test method, commonly referred to as the L-37-1 test, describes a test procedure for evaluating the load-carrying capacity, wear performance, and extreme pressure properties of a gear lubricant in a hypoid axle under conditions of low-speed, high-torque operation.3  
1.2 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.  
1.2.1 Exceptions—Where there is no direct SI equivalent such as National Pipe threads/diameters, tubing size, or where there is a sole source supply equipment specification.
1.2.1.1 The drawing in Annex A6 is in inch-pound units.  
1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use. Specific warning statements are provided in 7.2 and 10.1.  
1.4 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

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