Standard Test Method for Measuring Dose Rate Threshold for Upset of Digital Integrated Circuits [Metric]

SIGNIFICANCE AND USE
Digital integrated circuits are specified to operate with their inputs and outputs in either a logical 1 or a logical 0 state. The occurrence of signals having voltage levels not meeting the specifications of either of these levels (an upset condition) may cause the generation and propagation of erroneous data in a digital system.
Knowledge of the radiation dose rate that causes upset in digital integrated circuits is essential for the design, production, and maintenance of electronic systems that are required to operate in the presence of pulsed radiation environments.
SCOPE
1.1 This test method covers the measurement of the threshold level of radiation dose rate that causes upset in digital integrated circuits under static operating conditions. The radiation source is either a flash X-ray machine (FXR) or an electron linear accelerator (LINAC).
1.2 The precision of the measurement depends on the homogeneity of the radiation field and on the precision of the radiation dosimetry and the recording instrumentation.
1.3 The test may be destructive either for further tests or for purposes other than this test if the integrated circuit being tested absorbs a total radiation dose exceeding some predetermined level. Because this level depends both on the kind of integrated circuit and on the application, a specific value must be agreed upon by the parties to the test (6.8).
1.4 Setup, calibration, and test circuit evaluation procedures are included in this test method.
1.5 Procedures for lot qualification and sampling are not included in this test method.
1.6 Because of the variability of the response of different device types, the initial dose rate for any specific test is not given in this test method but must be agreed upon by the parties to the test.
1.7 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.
1.8 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

General Information

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Historical
Publication Date
30-Apr-2010
Current Stage
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Standards Content (Sample)

NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
Contact ASTM International (www.astm.org) for the latest information
Designation: F744M − 10
StandardTest Method for
Measuring Dose Rate Threshold for Upset of Digital
1
Integrated Circuits (Metric)
This standard is issued under the fixed designation F744M; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision.Anumber in parentheses indicates the year of last reapproval.A
superscript epsilon (´) indicates an editorial change since the last revision or reapproval.
This standard has been approved for use by agencies of the U.S. Department of Defense.
1. Scope 2. Referenced Documents
2
1.1 This test method covers the measurement of the thresh-
2.1 ASTM Standards:
old level of radiation dose rate that causes upset in digital
E665PracticeforDeterminingAbsorbedDoseVersusDepth
integratedcircuitsunderstaticoperatingconditions.Theradia-
inMaterialsExposedtotheX-RayOutputofFlashX-Ray
3
tionsourceiseitheraflashX-raymachine(FXR)oranelectron
Machines (Withdrawn 2000)
linear accelerator (LINAC).
E666Practice for CalculatingAbsorbed Dose From Gamma
or X Radiation
1.2 The precision of the measurement depends on the
homogeneity of the radiation field and on the precision of the E668 Practice for Application of Thermoluminescence-
radiation dosimetry and the recording instrumentation.
Dosimetry (TLD) Systems for Determining Absorbed
DoseinRadiation-HardnessTestingofElectronicDevices
1.3 Thetestmaybedestructiveeitherforfurthertestsorfor
E1894Guide for Selecting Dosimetry Systems for Applica-
purposes other than this test if the integrated circuit being
tion in Pulsed X-Ray Sources
tested absorbs a total radiation dose exceeding some predeter-
F526Test Method for Using Calorimeters for Total Dose
mined level. Because this level depends both on the kind of
Measurements in Pulsed Linear Accelerator or Flash
integrated circuit and on the application, a specific value must
be agreed upon by the parties to the test (6.8). X-ray Machines
1.4 Setup,calibration,andtestcircuitevaluationprocedures
3. Terminology
are included in this test method.
3.1 Definitions:
1.5 Procedures for lot qualification and sampling are not
3.1.1 determined integrated circuit—integrated circuit
included in this test method.
whose output is a unique function of the inputs; the output
1.6 Because of the variability of the response of different
changes if and only if the input changes (for example, AND-
device types, the initial dose rate for any specific test is not
and OR-gates).
giveninthistestmethodbutmustbeagreeduponbytheparties
to the test. 3.1.2 dose rate—energy absorbed per unit time and per unit
mass by a given material from the radiation to which it is
1.7 The values stated in SI units are to be regarded as
exposed.
standard. No other units of measurement are included in this
standard.
3.1.3 dose rate threshold for upset—minimumdoseratethat
causes either: (1) the instantaneous output voltage of an
1.8 This standard does not purport to address all of the
operating digital integrated circuit to be greater than the
safety concerns, if any, associated with its use. It is the
specified maximum LOW value (for a LOW output level) or
responsibility of the user of this standard to establish appro-
less than the specified minimum HIGH value (for a HIGH
priate safety and health practices and determine the applica-
bility of regulatory limitations prior to use. output level), or (2) a change of state of any stored data.
1 2
This test method is under the jurisdiction of ASTM Committee F01 on For referenced ASTM standards, visit the ASTM website, www.astm.org, or
Electronics and is the direct responsibility of Subcommittee F01.11 on Nuclear and contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
Space Radiation Effects. Standards volume information, refer to the standard’s Document Summary page on
Current edition approved May 1, 2010. Published June 2010. Originally the ASTM website.
3
approved in 1981. Last previous edition approved in 2003 as F744M–97 (2003). Withdrawn. The last approved version of this historical standard is referenced
DOI: 10.1520/F0744M-10. on www.astm.org.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
1

---------------------- Page: 1 ----------------------
F744M − 10
3.1.4 non-determined integrated circuit—integrated circuit irradiating the test fixture in the absence of a test device. Air
whose output or internal operating conditions are not unique ionization contributions to the observed signal are generally
functions of the inputs (for example, flip-flops, shift registers, proportional to the applied field, while those due to secondary
and RAMs). emission effects (6.2) are not. The effects of air ionization
external to the device may be minimized by coating exposed
4. Summary
...

This document is not anASTM standard and is intended only to provide the user of anASTM standard an indication of what changes have been made to the previous version. Because
it may not be technically possible to adequately depict all changes accurately, ASTM recommends that users consult prior editions as appropriate. In all cases only the current version
of the standard as published by ASTM is to be considered the official document.
Designation:F744M–97 (Reapproved 2003) Designation:F744M–10
Standard Test Method for
Measuring Dose Rate Threshold for Upset of Digital
1
Integrated Circuits (Metric)
This standard is issued under the fixed designation F744M; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision.Anumber in parentheses indicates the year of last reapproval.A
superscript epsilon (´) indicates an editorial change since the last revision or reapproval.
1. Scope
1.1 This test method covers the measurement of the threshold level of radiation dose rate that causes upset in digital integrated
circuits under static operating conditions. The radiation source is either a flash X-ray machine (FXR) or an electron linear
accelerator (LINAC).
1.2 The precision of the measurement depends on the homogeneity of the radiation field and on the precision of the radiation
dosimetry and the recording instrumentation.
1.3 The test may be destructive either for further tests or for purposes other than this test if the integrated circuit being tested
absorbsatotalradiationdoseexceedingsomepredeterminedlevel.Becausethisleveldependsbothonthekindofintegratedcircuit
and on the application, a specific value must be agreed upon by the parties to the test (6.8).
1.4 Setup, calibration, and test circuit evaluation procedures are included in this test method.
1.5 Procedures for lot qualification and sampling are not included in this test method.
1.6 Because of the variability of the response of different device types, the initial dose rate for any specific test is not given in
this test method but must be agreed upon by the parties to the test.
1.7
1.7 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.
1.8 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility
of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory
limitations prior to use.
2. Referenced Documents
2
2.1 ASTM Standards:
E665 Practice for Determining Absorbed Dose Versus Depth in Materials Exposed to the X-Ray Output of Flash X-Ray
3
Machines
E666 Practice for Calculating Absorbed Dose From Gamma or X Radiation
E668 Practice for Application of Thermoluminescence-Dosimetry (TLD) Systems for Determining Absorbed Dose in
Radiation-Hardness Testing of Electronic Devices
E1894 Guide for Selecting Dosimetry Systems for Application in Pulsed X-Ray Sources
F526 Test Method for Measuring Dose for Use in Linear Accelerator Pulsed Radiation Effects Tests
3. Terminology
3.1 Definitions of Terms Specific to This Standard:
3.1.1 determinedintegratedcircuit—integratedcircuitwhoseoutputisauniquefunctionoftheinputs;theoutputchangesifand
only if the input changes (for example, AND- and OR-gates).
3.1.2 dose rate—energy absorbed per unit time and per unit mass by a given material from the radiation to which it is exposed.
3.1.3 dose rate threshold for upset—minimum dose rate that causes either: (1) the instantaneous output voltage of an operating
1
This test method is under the jurisdiction of ASTM Committee F01 on Electronics and is the direct responsibility of Subcommittee F01.11 on Nuclear and Space
Radiation Effects.
Current edition approved June 10, 2003. Published June 2003. Originally approved in 1981. Last previous edition approved in 1997 as F744M–97. DOI:
10.1520/F0744M-97R03.
Current edition approved May 1, 2010. Published June 2010. Originally approved in 1981. Last previous edition approved in 2003 as F744M–97 (2003). DOI:
10.1520/F0744M-10.
2
ForreferencedASTMstandards,visittheASTMwebsite,www.astm.org,orcontactASTMCustomerServiceatservice@astm.org.For Annual Book ofASTM Standards
volume information, refer to the standard’s Document Summary page on the ASTM website.
3
Withdrawn.
3
Withdrawn. The last approved version of this historical standard is referenced on www.astm.org.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.
1

---------------------- Page: 1 ----------------------
F744M–10
digital integrated circuit to be greater than the specified maximum LOWvalue (for a LOWoutput level) or less than the specified
minimum HIGH value (for a HIGH output level), or (2) a change of state of any stored data.
3.1.4 nondetermined integrated circuitnon-determined integrated circuit—integrated circuit whose output or
...

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