EN 61190-1-3:2002

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

Prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, and powder solders, other than solder paste, for electronic soldering applications as well as for special electronic grade solders. This standard is a quality control document (not intended to relate directly to the material performance in the manufacturing process).

Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-3: Anforderungen an Eletroniklote und an Festformlote mit oder ohne Flussmittel für das Löten von Elektronikprodukten

Matériaux de fixation pour les assemblages électroniques - Partie 1-3: Exigences relatives aux alliages à braser de catégorie électronique et brasures solides fluxées et non-fluxées pour les applications de brasage électronique

Prescrit les exigences et méthodes d'essai pour les alliages à braser de catégorie électronique, les brasures en baguette, en ruban et en poudre, fluxées et non fluxées, autres que la crème à braser, pour les applications de brasage électronique ainsi que pour les brasures de catégorie électronique spéciales. Cette norme est un document de contrôle de la qualité (qui n'a pas pour objet de s'intéresser directement à la performance du matériau au cours du procédé de fabrication).

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

General Information

• Status: Withdrawn
• Publication Date: 13-Jun-2002
• Withdrawal Date: 31-May-2005
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Parallel Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 9960 - Withdrawal effective - Withdrawal
• Start Date: 01-May-2010
• Completion Date: 01-May-2010
• Ref Project: SIST EN 61190-1-3:2003 - Attachment materials for electronic assembly -- Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

Relations

• Replaced By: EN 61190-1-3:2007 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
• Effective Date: 29-Jan-2023

Standards Content (Sample)

SLOVENSKI SIST EN 61190-1-3:2003

STANDARD
april 2003
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic
grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering
applications
ICS 25.160.50; 31.190 Referenčna številka
SIST EN 61190-1-3:2003(en)
©  Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

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EUROPEAN STANDARD EN 61190-1-3
NORME EUROPÉENNE
EUROPÄISCHE NORM June 2002
ICS 31.190
English version
Attachment materials for electronic assembly
Part 1-3: Requirements for electronic grade solder alloys
and fluxed and non-fluxed solid solders
for electronic soldering applications
(IEC 61190-1-3:2002)
Matériaux de fixation pour Verbindungsmaterialien für
les assemblages électroniques Baugruppen der Elektronik
Partie 1-3: Exigences relatives aux Teil 1-3: Anforderungen an
alliages à braser de catégorie Eletroniklote und an Festformlote
électronique et brasures solides mit oder ohne Flussmittel für das
fluxées et non-fluxées pour les Löten von Elektronikprodukten
applications de brasage électronique (IEC 61190-1-3:2002)
(CEI 61190-1-3:2002)
This European Standard was approved by CENELEC on 2002-06-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta,
Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2002 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61190-1-3:2002 E

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EN 61190-1-3:2002 - 2 -
Foreword
The text of document 91/279/FDIS, future edition 1 of IEC 61190-1-3, prepared by IEC TC 91,
Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was
approved by CENELEC as EN 61190-1-3 on 2002-06-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2003-03-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2005-06-01
Annexes designated "normative" are part of the body of the standard.
Annexes designated "informative" are given for information only.
In this standard, annexes B and ZA are normative and annex A is informative.
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61190-1-3:2002 was approved by CENELEC as a
European Standard without any modification.
__________

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- 3 - EN 61190-1-3:2002
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
This European Standard incorporates by dated or undated reference, provisions from other
publications. These normative references are cited at the appropriate places in the text and the
publications are listed hereafter. For dated references, subsequent amendments to or revisions of any
of these publications apply to this European Standard only when incorporated in it by amendment or
revision. For undated references the latest edition of the publication referred to applies (including
amendments).
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
IEC 60194 1999 Printed board design, manufacture and--
assembly - Terms and definitions
1) 2)
IEC 61190-1-1 - Attachment materials for electronic EN 61190-1-1 2002
assembly
Part 1-1: Requirements for soldering
fluxes for high-quality interconnections
in electronics assembly
1) 2)
IEC 61190-1-2 - Part 1-2: Requirements for solder EN 61190-1-2 2002
pastes for high-quality interconnections
in electronics assembly
1) 2)
ISO 9002 - Quality systems - Model for
...