EN IEC 60749-37:2022
(Main)Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
IEC 60749-37:2022 is available as IEC 60749-37:2022 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-37:2022 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test. This edition includes the following significant technical changes with respect to the previous edition: - correction of a previous technical error concerning test conditions; - updates to reflect improvements in technology.
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 37: Prüfverfahren Fall der Leiterplatte unter Verwendung eines Beschleunigungs-Messgerätes
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 37: Méthode d'essai de chute au niveau de la carte avec utilisation d’un accéléromètre
IEC 60749-37:2022 est disponible sous forme de IEC 60749-37:2022 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.L’IEC 60749-37:2022 fournit une méthode d’essai destinée à évaluer et comparer la performance de chute des composants électroniques à montage en surface dans des applications de produits électroniques portatifs dans un environnement d’essai accéléré, où une flexion excessive d’une carte de circuit imprimé provoque une défaillance de produit. Le but est de normaliser la carte d'essai et la méthodologie d'essai pour fournir une évaluation reproductible de la performance d'essai de chute des composants à montage en surface, en reproduisant les mêmes modes de défaillances que ceux observés normalement au cours d'un essai au niveau du produit. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente: - correction d’une erreur technique précédente concernant les conditions d’essai; - mises à jour afin de refléter les progrès technologiques.
Polprevodniški elementi - Mehanske in klimatske preskusne metode - 37. del: Metoda preskušanja s padcem z namizne višine z uporabo pospeševalnika (IEC 60749-37:2022)
Ta del standarda IEC 60749 podaja preskusno metodo, ki je namenjena ocenjevanju in primerjavi učinka padca površinsko nameščenih elektronskih komponent za uporabo v ročnih elektronskih izdelkih v pospešenem preskusnem okolju, v katerem upogibanje plošče s tiskanim vezjem povzroči okvaro izdelka. Namen je standardizirati preskusno ploščo in preskusno metodologijo, da se zagotovi ponovljiva ocena uspešnosti preskusa padca površinsko nameščenih komponent, ter obenem ustvariti enake vrste okvar, kot so običajno opažene med preskusom na ravni izdelka.
Namen tega dokumenta je predpisati standardizirano preskusno metodo in postopek poročanja. Ta dokument ni preskus ustreznosti komponent in naj ne bi nadomeščal katerega koli preskusa na ravni sistema, ki se včasih uporablja za preverjanje ustreznosti določenega ročnega električnega izdelka. Standard naj ne bi zajemal preskusa padca, ki je potreben za simulacijo udarcev elektronskih komponent ali sestavov tiskanih vezij, povezanih z odpremo in rokovanjem. Te zahteve so že obravnavane v preskusnih metodah, kot je standard IEC 60749-10. Metoda se uporablja tako za površinsko nameščene komponente z okrovi z matričnimi priključki v ravnini kot površinsko nameščene komponente s svinčenim obodom.
Ta preskusna metoda uporablja pospeševalnik za merjenje trajanja mehanskega udarca in uporabljene stopnje, ki je sorazmerna z obremenitvijo dane komponente, nameščene na standardno ploščo. Preskusna metoda, opisana v standardu IEC 60749-40 uporablja merilnik deformacije za merjenje deformacije stopnje deformacije plošče v bližini komponente. Specifikacija stranke določa, katera preskusna metoda mora biti uporabljena.
General Information
Relations
Standards Content (Sample)
SLOVENSKI STANDARD
01-januar-2023
Nadomešča:
SIST EN 60749-37:2008
Polprevodniški elementi - Mehanske in klimatske preskusne metode - 37. del:
Metoda preskušanja s padcem z namizne višine z uporabo pospeševalnika (IEC
60749-37:2022)
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level
drop test method using an accelerometer (IEC 60749-37:2022)
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 37:
Prüfverfahren Fall der Leiterplatte unter Verwendung eines Beschleunigungs-
Messgerätes (IEC 60749-37:2022)
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie
37: Méthode d'essai de chute au niveau de la carte avec utilisation d’un accéléromètre
(IEC 60749-37:2022)
Ta slovenski standard je istoveten z: EN IEC 60749-37:2022
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN IEC 60749-37
NORME EUROPÉENNE
EUROPÄISCHE NORM November 2022
ICS 31.080.01 Supersedes EN 60749-37:2008
English Version
Semiconductor devices - Mechanical and climatic test methods -
Part 37: Board level drop test method using an accelerometer
(IEC 60749-37:2022)
Dispositifs à semiconducteurs - Méthodes d'essais Halbleiterbauelemente - Mechanische und klimatische
mécaniques et climatiques - Partie 37: Méthode d'essai de Prüfverfahren - Teil 37: Prüfverfahren Fall der Leiterplatte
chute au niveau de la carte avec utilisation d'un unter Verwendung eines Beschleunigungs-Messgerätes
accéléromètre (IEC 60749-37:2022)
(IEC 60749-37:2022)
This European Standard was approved by CENELEC on 2022-11-16. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
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Türkiye and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2022 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 60749-37:2022 E
European foreword
The text of document 47/2651/CDV, future edition 2 of IEC 60749-37, prepared by IEC/TC 47
"Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 60749-37:2022.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2023-08-16
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2025-11-16
document have to be withdrawn
This document supersedes EN 60749-37:2008 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 60749-37:2022 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated:
IEC 60749-40 NOTE Harmonized as EN 60749-40
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60749-10 2022 Semiconductor devices - Mechanical and EN IEC 60749-10 2022
climatic test methods - Part 10: Mechanical
shock - device and subassembly
IEC 60749-20 - Semiconductor devices - Mechanical and EN IEC 60749-20 -
climatic test methods - Part 20: Resistance
of plastic encapsulated SMDs to the
combined effect of moisture and soldering
heat
IEC 60749-20-1 - Semiconductor devices - Mechanical and EN 60749-20-1 -
climatic test methods - Part 20-1: Handling,
packing, labelling and shipping of surface-
mount devices sensitive to the combined
effect of moisture and soldering heat
IEC 60749-37 ®
Edition 2.0 2022-10
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Mechanical and climatic test methods –
Part 37: Board level drop test method using an accelerometer
Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et climatiques –
Partie 37: Méthode d'essai de chute au niveau de la carte avec utilisation d'un
accéléromètre
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.01 ISBN 978-2-8322-5837-8
– 2 – IEC 60749-37:2022 © IEC 2022
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Test apparatus and components . 7
4.1 Test apparatus . 7
4.2 Test components . 8
4.3 Test board . 8
4.4 Test board assembly . 8
4.5 Number of components and sample size . 9
5 Test procedure . 9
5.1 Test equipment and parameters . 9
5.2 Pre-test characterization . 11
5.3 Drop testing . 12
6 Failure criteria and failure analysis . 13
7 Summary . 14
Annex A (informative) Preferred board construction, material, design and layout . 15
A.1 Preferred board construction, material and design . 15
A.2 Preferred test board size, layout, and component locations . 17
Bibliography . 20
Figure 1 – Drop test apparatus detail . 10
Figure 2 – Calculation of velocity change . 11
Figure 3 – Typical shock test half-sine pulse graphic and formulae . 12
Figure A.1 – Board footprint and BGA layout . 18
Figure A.2 – Test vehicle with 4 component placement (top side – left) and
1 component at center location (bottom side – right). . 19
Table 1 – Quantity of test boards and components required for testing . 9
Table A.1 – Test board stack-up and material . 15
Table A.2 – Mechanical property requirements for dielectric materials . 16
Table A.3 – Recommended test board pad sizes and solder mask openings . 17
IEC 60749-37:2022 © IEC 2022 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 37: Board level drop test method using an accelerometer
FOREWORD
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IEC 60749-37 has been prepared by IEC technical committee 47:
...
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