EN IEC 60749-10:2022

Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly

IEC 60749-10:2022 is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility of devices and subassemblies to withstand moderately severe shocks. The use of subassemblies is a means to test devices in usage conditions as assembled to printed wiring boards. Mechanical shock due to suddenly applied forces, or abrupt change in motion produced by handling, transportation or field operation can disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test intended for device qualification. This edition cancels and replaces the first edition published in 2002. This edition includes the following significant technical changes with respect to the previous edition:
covers both unattached components and components attached to printed wiring boards;
tolerance limits modified for peak acceleration and pulse duration;
mathematical formulae added for velocity change and equivalent drop height.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 10: Mechanischer Schock - Bauelemente und Unterbaugruppe

Dispositifs à semiconducteurs - Méthodes d’essais mécaniques et climatiques - Partie 10: Chocs mécaniques - Dispositif et sous-ensemble

L’IEC 60749-10:2022 est destinée à évaluer les dispositifs à l’état libre et ceux qui sont assemblés à des cartes à câblage imprimé pour être utilisés dans des matériels électriques. Cette méthode est destinée à déterminer la capacité des dispositifs et des sous‑ensembles à résister à des chocs d’une sévérité modérée. L’utilisation de sous‑ensembles est un moyen de soumettre aux essais des dispositifs dans des conditions d’utilisation identiques à celles des dispositifs montés sur des cartes à câblage imprimé. Les chocs mécaniques dus à l’application soudaine de forces ou à de brusques modifications de déplacements au cours de manipulations, du transport ou du fonctionnement sur le terrain peuvent perturber les caractéristiques de fonctionnement, en particulier si les impulsions de choc sont répétitives. Il s’agit ici d’un essai destructif destiné à la qualification des dispositifs. Cette édition annule et remplace la première édition parue en 2002. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente: a) Elle couvre à la fois les composants qui sont fixés sur des cartes à câblage imprimé et ceux qui ne le sont pas; b) les limites des tolérances ont été modifiées pour l'accélération de crête et la durée d’impulsion; c) des formules mathématiques ont été ajoutées concernant la variation de vitesse et la hauteur de chute équivalente.

Polprevodniški elementi - Metode za mehansko in klimatsko preskušanje - 10. del: Mehanski udarci - Naprava in podsklop (IEC 60749-10:2022)

Ta del standarda IEC 60749 je namenjen vrednotenju naprav, ki so v prostem stanju ali pritrjene na plošče tiskanih vezij za uporabo v električni opremi. Metoda je predvidena za določanje združljivosti naprav in podsklopov, tako da prenesejo zmerno močne udarce. Podsklopi se uporabljajo za preskušanje naprav v pogojih uporabe, ko so pritrjene na plošče tiskanih vezij. Mehanski udarci zaradi nenadne sile ali nagle spremembe gibanja pri rokovanju, prevažanju ali uporabi na terenu lahko povzročajo spremembe v značilnostih delovanja, zlasti če se udarci ponavljajo. Gre za porušitveni preskus, ki je namenjen kvalifikaciji naprav.

General Information

• Status: Published
• Publication Date: 09-Jun-2022
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: CLC/SR 47 - Semiconductor devices
• Drafting Committee: IEC/TC 47 - IEC_TC_47
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 10-Jun-2022
• Completion Date: 10-Jun-2022
• Ref Project: SIST EN IEC 60749-10:2022 - Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly (IEC 60749-10:2022)

Relations

• Replaces: EN 60749-10:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
• Effective Date: 23-Jan-2023

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN IEC 60749-10:2022
01-september-2022
Nadomešča:
SIST EN 60749-10:2004
Polprevodniški elementi - Metode za mehansko in klimatsko preskušanje - 10. del:
Mehanski udarci - Naprava in podsklop (IEC 60749-10:2022)
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical
shock - Device and subassembly (IEC 60749-10:2022)
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 10:
Mechanischer Schock - Bauelemente und Unterbaugruppe (IEC 60749-10:2022)
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie
10: Chocs mécaniques (IEC 60749-10:2022)
Ta slovenski standard je istoveten z: EN IEC 60749-10:2022
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN IEC 60749-10:2022 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN IEC 60749-10:2022

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SIST EN IEC 60749-10:2022


EUROPEAN STANDARD EN IEC 60749-10

NORME EUROPÉENNE

EUROPÄISCHE NORM June 2022
ICS 31.080.01 Supersedes EN 60749-10:2002
English Version
Semiconductor devices - Mechanical and climatic test methods -
Part 10: Mechanical shock - Device and subassembly
(IEC 60749-10:2022)
Dispositifs à semiconducteurs - Méthodes d'essais Halbleiterbauelemente - Mechanische und klimatische
mécaniques et climatiques - Partie 10: Chocs mécaniques - Prüfverfahren - Teil 10: Mechanischer Schock -
Dispositif et sous-ensemble Bauelemente und Unterbaugruppe
(IEC 60749-10:2022) (IEC 60749-10:2022)
This European Standard was approved by CENELEC on 2022-06-01. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2022 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN IEC 60749-10:2022 E

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SIST EN IEC 60749-10:2022
EN IEC 60749-10:2022 (E)
European foreword
The text of document 47/2752/FDIS, future edition 2 of IEC 60749-10, prepared by IEC/TC 47
"Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 60749-10:2022.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2023-03-01
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2025-06-01
document have to be withdrawn
This document supersedes EN 60749-10:2002 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 60749-10:2022 was approved by CENELEC as a European
Standard without any modification.

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IEC 60749-10

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Edition 2.0 2022-04




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Semiconductor devices – Mechanical and climatic test methods –

Part 10: Mechanical shock – Device and subassembly



Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et climatiques –
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