EN IEC 61189-2-801:2023
(Main)Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials
This International Standard specifies a test method to be followed for Thermal Performance via carbon ink heating. The method employs a screened-on pattern of carbon ink used to determine the thermal performance of a dielectric layer on a metal base plate.
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 2-801: Prüfung der thermischen Leitfähigkeit für Grundwerkstoffe
Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres structures d’interconnexion et ensembles - Partie 2-801: Essai de conductivité thermique pour matériaux de base
L’IEC 61189-2-801:2023 spécifie une méthode d’essai à suivre pour évaluer la performance thermique par chauffage d’encre à base de carbone. La méthode utilise un motif sérigraphié d’encre à base de carbone pour déterminer la performance thermique d’une couche diélectrique sur une plaque de base métallique.
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne strukture in sestave - 2-801. del: Preskus toplotne prevodnosti osnovnih materialov
Ta mednarodni standard določa preskusno metodo za uporabo pri določanju toplotne učinkovitosti s segrevanjem ogljikovega črnila. Metoda uporablja sitotiskan vzorec ogljikovega črnila, ki se uporablja za določanje toplotne učinkovitosti dielektrične plasti na kovinski osnovni plošči.
General Information
Standards Content (Sample)
SLOVENSKI STANDARD
01-november-2023
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne
strukture in sestave - 2-801. del: Preskus toplotne prevodnosti osnovnih
materialov
Test methods for electrical materials, printed board and other interconnection structures
and assemblies - Part 2-801: Thermal conductivity test for base materials
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen
und Baugruppen – Teil 2-801: Prüfung der thermischen Leitfähigkeit für Grundwerkstoffe
Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres
structures d’interconnexion et ensembles - Partie 2-801: Essai de conductivité thermique
pour matériaux de base
Ta slovenski standard je istoveten z: EN IEC 61189-2-801:2023
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN IEC 61189-2-801
NORME EUROPÉENNE
EUROPÄISCHE NORM September 2023
ICS 31.180
English Version
Test methods for electrical materials, printed boards and other
interconnection structures and assemblies - Part 2-801: Thermal
conductivity test for base materials
(IEC 61189-2-801:2023)
Méthodes d'essai pour les matériaux électriques, les cartes Prüfverfahren für Elektromaterialien, Leiterplatten und
imprimées et autres structures d'interconnexion et andere Verbindungsstrukturen und Baugruppen - Teil 2-
ensembles - Partie 2-801: Essai de conductivité thermique 801: Prüfung der thermischen Leitfähigkeit für
pour matériaux de base Grundwerkstoffe
(IEC 61189-2-801:2023) (IEC 61189-2-801:2023)
This European Standard was approved by CENELEC on 2023-08-30. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2023 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61189-2-801:2023 E
European foreword
The text of document 91/1757/CDV, future edition 1 of IEC 61189-2-801, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61189-2-801:2023.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2024-05-30
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2026-08-30
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 61189-2-801:2023 was approved by CENELEC as a
European Standard without any modification.
IEC 61189-2-801 ®
Edition 1.0 2023-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies –
Part 2-801: Thermal conductivity test for base materials
Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres
structures d’interconnexion et ensembles –
Partie 2-801: Essai de conductivité thermique pour matériaux de base
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-7258-9
– 2 – IEC 61189-2-801:2023 © IEC 2023
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Applicability and use of data . 5
5 Test specimens . 5
5.1 Number . 5
5.2 Form . 5
5.3 Preparation of the test specimen . 6
6 Materials and equipment. 8
7 Procedure . 9
7.1 Pre-conditioning . 9
7.2 Test conditions . 9
7.3 Equipment set-up . 9
7.4 Equipment calibration . 9
7.5 Test method . 10
8 Calculations . 10
9 Report . 10
Bibliography . 11
Figure 1 – Specimen dimensions . 6
Figure 2 – Location of 0,55 mm hole . 6
Figure 3 – Example of carbon ink deposited on a screen prior to printing . 7
Figure 4 – Specimen after first screen printing . 7
Figure 5 – Finished specimen . 8
Figure 6 – Set-up of the sensor calibration . 10
IEC 61189-2-801:2023 © IEC 2023 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –
Part 2-801: Thermal conductivity test for base materials
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
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2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 61189-2-801 has been prepared by IEC technical committee TC 91: Electronics assembly
technology. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
91/1757/CDV 91/1862/RVC
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
– 4 – IEC 61189-2-801:2023 © IEC 2023
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.
A list of all parts in the IEC 61189 series, published under the general title Test methods for
electrical materials, printed boards and other interconnection structures and assemblies, can
be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The "colour inside" logo on the cover page of this document indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this document using a colour printer.
IEC 61189-2-801:2023 © IEC 2023 – 5 –
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –
Part 2-801: Thermal conductivity test for base materials
1 Scope
This part of IEC 61189 defines a test method to be followed for thermal performance via carbon
ink heating. The method employs a screened-on pattern of ca
...
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