EN IEC 61249-2-51:2023
(Main)Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad
Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad
IEC 61249-2-51:2023 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad (hereinafter referred to as IC carrier tape base materials). This document is applicable to IC carrier tape base materials, which is a glue-coated material, one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film.
Werkstoffe für Leiterplatten und andere Verbindungsstrukturen - Teil 2-51: Kaschierte und unkaschierte verstärkte Basismaterialien - Basismaterial als Chipträger, nicht kaschiert
Matériaux pour circuits imprimés et autres structures d’interconnexion - Partie 2-51: Matériaux de base renforcés, plaqués et non plaqués - Matériaux de base pour bande support de carte à circuit intégré, non plaqués
L’IEC 61249-2-51:2023 spécifie les exigences relatives à la construction, aux matériaux et aux propriétés, ainsi qu’à l’assurance qualité, à l’emballage, au marquage et au stockage des matériaux de base pour bande support de carte à circuit intégré, non plaqués (ici désignés par matériaux de base pour bande support de CI). Le présent document s’applique aux matériaux de base pour bande support de CI ; il s’agit d’un matériau recouvert de colle, un côté étant composé d’une sous-couche époxy renforcée en tissu de verre de type E, l’autre côté étant recouvert d’un adhésif et protégé par une pellicule antiadhésive.
Materiali za plošče tiskanih vezij in druge povezovalne strukture - 2-51. del: Ojačeni laminati z bakreno folijo in brez nje - Osnovni materiali za nosilne trakove kartic integriranih vezij, neprevlečeni
Standard IEC 61249-2-51:2023 določa zasnovo, materiale, zahteve glede lastnosti, zagotavljanje kakovosti, pakiranje, označevanje in shranjevanje osnovnih materialov za nosilne trakove kartic integriranih vezij, in sicer neprevlečene.
Ta dokument se uporablja za osnovne materiale za nosilne trakove kartic integriranih vezij, tj. za spodnjo plast iz epoksidne smole, ojačano s tkanim E-steklom, ki sestavlja eno stran, druga stran pa je prekrita z lepilom in zaščitena z zaščitno folijo.
General Information
Standards Content (Sample)
SLOVENSKI STANDARD
01-september-2023
Materiali za plošče tiskanih vezij in druge povezovalne strukture - 2-51. del:
Ojačeni laminati z bakreno folijo in brez nje - Osnovni materiali za nosilne trakove
kartic integriranih vezij, neprevlečeni
Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced
base materials, clad and unclad - Base materials for Integrated Circuit card carrier tape,
unclad
Werkstoffe für Leiterplatten und andere Verbindungsstrukturen – Teil 2-51: Verstärkte
Basismaterialien, kaschiert und nicht kaschiert – Basismaterialien für Trägerbänder für
integrierte Schaltungen, nicht kaschiert
Matériaux pour circuits imprimés et autres structures d’interconnexion - Partie 2-51:
Matériaux de base renforcés, recouverts ou non - Matériaux de base pour bande support
de carte à circuit intégré, non recouverts
Ta slovenski standard je istoveten z: EN IEC 61249-2-51:2023
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN IEC 61249-2-51
NORME EUROPÉENNE
EUROPÄISCHE NORM June 2023
ICS 31.180
English Version
Materials for printed boards and other interconnecting structures
- Part 2-51: Reinforced base materials, clad and unclad - Base
materials for integrated circuit card carrier tape, unclad
(IEC 61249-2-51:2023)
Matériaux pour circuits imprimés et autres structures Werkstoffe für Leiterplatten und andere
d'interconnexion - Partie 2-51: Matériaux de base renforcés, Verbindungsstrukturen - Teil 2-51: Kaschierte und
plaqués et non plaqués - Matériaux de base pour bande unkaschierte verstärkte Basismaterialien - Basismaterial als
support de carte à circuit intégré, non plaqués Chipträger, nicht kaschiert
(IEC 61249-2-51:2023) (IEC 61249-2-51:2023)
This European Standard was approved by CENELEC on 2023-06-15. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2023 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61249-2-51:2023 E
European foreword
The text of document 91/1847/FDIS, future edition 1 of IEC 61249-2-51, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61249-2-51:2023.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2024-03-15
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2026-06-15
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 61249-2-51:2023 was approved by CENELEC as a
European Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standard indicated:
ISO 9000 NOTE Approved as EN ISO 9000
ISO 14001 NOTE Approved as EN ISO 14001
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the
relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cencenelec.eu.
Publication Year Title EN/HD Year
IEC 61189-2 2006 Test methods for electrical materials, EN 61189-2 2006
printed boards and other interconnection
structures and assemblies - Part 2: Test
methods for materials for interconnection
structures
IEC/PAS 61249-6-3 - Specification for finished fabric woven from - -
"E" glass for printed boards
ISO 2813 - Paints and varnishes - Determination of EN ISO 2813 -
gloss value at 20°, 60° and 85°
ISO 8296 - Plastics - Film and sheeting - - -
Determination of wetting tension
ISO 11014 2009 Safety data sheet for chemical products - - -
Content and order of sections
ISO 21920-2 - Geometrical product specifications (GPS) - EN ISO 21920-2 -
Surface texture: Profile - Part 2: Terms,
definitions and surface texture parameters
ASTM D 882 - Standard Test Method for Tensile - -
Properties of Thin Plastic Sheeting
IEC 61249-2-51 ®
Edition 1.0 2023-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Materials for printed boards and other interconnecting structures –
Part 2-51: Reinforced base materials, clad and unclad – Base materials for
integrated circuit card carrier tape, unclad
Matériaux pour circuits imprimés et autres structures d’interconnexion –
Partie 2-51: Matériaux de base renforcés, plaqués et non plaqués – Matériaux de
base pour bande support de carte à circuit intégré, non plaqués
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-6969-5
– 2 – IEC 61249-2-51:2023 © IEC 2023
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Construction and materials . 7
4.1 Construction . 7
4.2 Epoxide woven E-glass underlayer . 7
4.3 Adhesive . 7
4.4 Release film . 7
5 Electrical properties . 7
6 Non-electrical properties . 8
6.1 Appearance of the IC carrier tape base materials . 8
6.1.1 Delamination . 8
6.1.2 Colloidal particles and metallic particles in underlayer . 8
6.1.3 Colloidal particles in adhesive layer . 8
6.1.4 Scratches of adhesive . 8
6.1.5 Bubbles in underlayer . 8
6.1.6 Breakages and exposures of reinforcement fibre in underlayer . 8
6.2 Dimensional of IC carrier tape base materials . 8
6.2.1 Length and width . 8
6.2.2 Thickness of underlayer . 8
6.2.3 Thickness of adhesive layer . 8
6.3 Splices . 8
6.4 Glass transition temperature . 9
6.5 Surface properties of the underlayer side . 9
6.6 Tensile strength and elongation at break . 9
6.7 Water absorption . 9
6.8 Peel strength . 10
6.9 Resin flow . 10
7 Quality assurance . 10
7.1 Quality system . 10
7.2 Responsibility for inspection . 10
7.3 Positions of specimens on the sample . 10
7.4 Qualification inspection . 11
7.4.1 General . 11
7.4.2 Samples . 11
7.4.3 Frequency . 11
7.4.4 Criterion rule . 11
7.5 Quality conformance inspection . 12
7.5.1 General . 12
7.5.2 Inspection lot . 12
7.5.3 Group A inspection . 12
7.5.4 Group B inspection . 12
7.5.5 Group C inspection . 12
7.5.6 Criterion rule . 12
7.5.7 Rejected lots . 12
IEC 61249-2-51:2023 © IEC 2023 – 3 –
7.6 Certificate of conformance . 12
7.7 Safety data sheet . 12
8 Packaging, marking and storage . 13
8.1 Packaging, marking . 13
8.2 Storage, storage condition and shelf life . 13
Annex A (normative) Requirements for the preparation of samples of some
performance items . 14
A.1 Ordering information . 14
Annex B (informative) Engineering information . 15
B.1 General .
...
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