EN IEC 63215-2:2023

Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices

IEC 63215-2:2023 applies to the die attach materials and joining system applied to discrete type power electronic devices. This document specifies the temperature cycling test method which takes into account the actual usage conditions of discrete type power electronic devices to evaluate reliability of the die attach joint materials and joining system, and establishes a classification level for joining reliability (reliability performance index). The test method specified in this document is not intended to evaluate power semiconductor devices themselves. The test method specified in this document is not regarded as the one for use to guarantee the reliability of the power semiconductor device packages. NOTE The test result obtained using this document will not be used as absolute quantitative data, but for intercomparison with the other die attach materials results using the same setup.

Verfahren für die Haltbarkeitsprüfung von Werkstoffen zum Chip-Bonden - Teil 2: Verfahren für die Temperaturwechselprüfung von Werkstoffen zum Chip-Bonden von leistungseektronischen Bauelementen

Méthodes d’essai d’endurance pour les matériaux de fixation de puce - Partie 2: Méthode d’essai de cycle thermique pour les matériaux de fixation de puce, appliquée aux dispositifs électroniques de puissance de type discret

L’IEC 63215-2:2023 concerne les matériaux de fixation de puce et le système d’assemblage appliqués aux dispositifs électroniques de puissance de type discret. Le présent document spécifie le procédé d’essai de cycle thermique qui prend en compte les conditions d’usage réelles des dispositifs électroniques de puissance de type discret pour apprécier la fiabilité des matériaux de joint de fixation de puce et du système d’assemblage, et elle établit le niveau de classification concernant la fiabilité des assemblages (indice de performance de fiabilité). La méthode d’essai spécifiée dans le présent document n’a pas pour objectif d’évaluer les dispositifs à semiconducteurs de puissance eux-mêmes. La méthode d’essai spécifiée dans le présent document n’est pas considérée comme étant celle à utiliser pour garantir la fiabilité des boîtiers de dispositifs à semiconducteurs de puissance. NOTE Le résultat d’essai obtenu à l’aide du présent document ne sera pas utilisé comme des données quantitatives absolues, mais comme comparaison entre les résultats des autres matériaux de fixation de puces utilisant le même montage.

Metode za preskušanje vzdržljivosti materialov za bondiranje čipov – 2. del: Metoda s preskusom temperaturnega cikliranja materialov za bondiranje čipov, uporabljenih za diskretne močnostne elektronske elemente

Standard IEC 63215-2:2023 se uporablja za materiale za bondiranje čipov in spajalnih sistemov, uporabljenih za diskretne močnostne elektronske elemente.
Ta dokument določa metodo s preskusom temperaturnega cikliranja, ki upošteva dejanske pogoje uporabe diskretnih močnostnih elektronskih elementov za ocenjevanje zanesljivosti materialov za bondiranje čipov in spajalnih sistemov in določa razvrstitvene stopnje zanesljivosti spajanja (indeks zanesljivosti delovanja).
Preskusna metoda, določena s tem dokumentom, ni namenjena oceni polprevodniških elementov.
Zato preskusna metoda, opisana s tem dokumentom, ni mišljena kot preskus, ki je namenjen zagotavljanju zanesljivosti sklopov polprevodniških elementov.
OPOMBA: Rezultate preskusa, pridobljene z uporabo tega dokumenta, se ne bo uporabljalo kot absolutni količinski podatek, pač pa za medsebojno primerjavo z drugimi rezultati materialov za bondiranje čipov z enako nastavitvijo.

General Information

• Status: Published
• Publication Date: 30-Nov-2023
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 01-Dec-2023
• Completion Date: 01-Dec-2023
• Ref Project: SIST EN IEC 63215-2:2024 - Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices

Standards Content (Sample)

SLOVENSKI STANDARD
01-februar-2024
Metode za preskušanje vzdržljivosti materialov za bondiranje čipov – 2. del:
Metoda s preskusom temperaturnega cikliranja materialov za bondiranje čipov,
uporabljenih za diskretne močnostne elektronske elemente
Endurance test methods for die attach materials - Part 2: Temperature cycling test
method for die attach materials applied to discrete type power electronic devices
Verfahren für die Haltbarkeitsprüfung von Werkstoffen zum Chip-Bonden - Teil 2:
Verfahren für die Temperaturwechselprüfung von Werkstoffen zum Chip-Bonden von
leistungseektronischen Bauelementen
Méthodes d’essai d’endurance pour les matériaux de fixation de puce - Partie 2:
Méthode d’essai de cycle thermique pour les matériaux de fixation de puce, appliquée
aux dispositifs électroniques de puissance de type discret
Ta slovenski standard je istoveten z: EN IEC 63215-2:2023
ICS:
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 63215-2

NORME EUROPÉENNE
EUROPÄISCHE NORM December 2023
ICS 31.190
English Version
Endurance test methods for die attach materials - Part 2:
Temperature cycling test method for die attach materials applied
to discrete type power electronic devices
(IEC 63215-2:2023)
Méthodes d'essai d'endurance pour les matériaux de Verfahren für die Haltbarkeitsprüfung von Werkstoffen zum
fixation de puce - Partie 2: Méthode d'essai de cycle Chip-Bonden - Teil 2: Verfahren für die
thermique pour les matériaux de fixation de puce, appliquée Temperaturwechselprüfung von Werkstoffen zum Chip-
aux dispositifs électroniques de puissance de type discret Bonden von leistungseektronischen Bauelementen
(IEC 63215-2:2023) (IEC 63215-2:2023)
This European Standard was approved by CENELEC on 2023-11-28. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2023 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 63215-2:2023 E

European foreword
The text of document 91/1895/FDIS, future edition 1 of IEC 63215-2, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 63215-2:2023.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2024-08-28
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2026-11-28
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 63215-2:2023 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standard indicated:
IEC 61190-1-3 NOTE Approved as EN IEC 61190-1-3
IEC 61760-1:2020 NOTE Approved as EN IEC 61760-1:2020 (not modified)
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the
relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cencenelec.eu.
Publication Year Title EN/HD Year
IEC 60068-2-14 - Environmental testing - Part 2-14: Tests - EN IEC 60068-2-14 -
Test N: Change of temperature
IEC 60194-1 - Printed boards design, manufacture and - -
assembly - Vocabulary - Part 1: Common
usage in printed board and electronic
assembly technologies
IEC 60194-2 - Printed boards design, manufacture and - -
assembly - Vocabulary - Part 2: Common
usage in electronic technologies as well as
printed board and electronic assembly
technologies
IEC 60747-15 - Semiconductor devices - Discrete devices - EN 60747-15 -
Part 15: Isolated power semiconductor
devices
IEC 63215-2 ®
Edition 1.0 2023-10
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Endurance test methods for die attach materials –

Part 2: Temperature cycling test method for die attach materials applied to

discrete type power electronic devices

Méthodes d’essai d’endurance pour les matériaux de fixation de puce –

Partie 2: Méthode d’essai de cycle thermique pour les matériaux de fixation de

puce, appliquée aux dispositifs électroniques de puissance de type discret

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.190  ISBN 978-2-8322-7677-8

– 2 – IEC 63215-2:2023 © IEC 2023
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms, definitions and abbreviated terms . 7
3.1 Terms and definitions . 7
3.2 Abbreviated terms . 7
4 General . 7
5 Test apparatus . 8
5.1 Die bonding equipment . 8
5.2 Temperature cycling chamber . 8
5.3 Thermal resistance measuring equipment . 8
5.4 Ultrasonic flaw inspection equipment . 8
6 Specimen . 8
6.1 General . 8
6.2 Preparation of specimen . 9
7 Evaluation test . 9
7.1 Test method . 9
7.1.1 General . 9
7.1.2 Temperature cycling test . 9
7.1.3 Test conditions . 10
7.1.4 End of test criteria . 10
7.2 Inspection and measurement . 10
7.2.1 Visual inspection . 10
7.2.2 Thermal resistance measurement . 10
7.2.3 Ultrasonic flaw inspection . 11
7.3 Test procedure . 11
7.3.1 Test preparation . 11
7.3.2 Preconditioning . 11
7.3.3 Initial measurement . 11
7.3.4 Test . 11
7.3.5 Intermediate measurement . 11
7.3.6 Post-test treatment . 11
7.3.7 Final judgment . 11
8 Failure cycle . 12
9 Items to be specified in the product specification . 12
Annex A (normative) Thermal resistance measuring method at die attach region . 13
A.1 Thermal resistance measuring method . 13
A.1.1 General . 13
A.1.2 Temperature characteristics measurement for TEG chip . 13
A.1.3 Thermal resistance measurement method for TEG chip . 14
A.2 Correction of thermal resistance criteria . 15
Annex B (informative) Discrete type specimen preparation using a heating resistor
TEG chip . 18
B.1 Power electronic device specimen . 18
B.1.1 General . 18
B.1.2 Power electronic device chip . 18

IEC 63215-2:2023 © IEC 2023 – 3 –
B.1.3 Base substrate . 18
B.1.4 Package mould . 19
B.1.5 Surface treatment . 19
B.2 Die attach materials . 19
B.3 Specimen preparation . 19
Annex C (informative) Reliability performance index for die attach joint – Discrete type
power electronic device . 22
Bibliography . 23

Figure 1 – Regions for evaluation for discrete type power electronic device . 8
Figure 2 – Temperature cycling test . 9
Figure A.1 – Example of the structure of the specimen using a TEG chip . 13
Figure A.2 – Example of temperature characteristics – TEG chip . 14
Figure A.3 – Example of structure for thermal re
...