EN 62047-16:2015
(Main)Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films – Wafer curvature and cantilever beam deflection methods
Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films – Wafer curvature and cantilever beam deflection methods
IEC 62047-16:2015 specifies the test methods to measure the residual stresses of films with thickness in the range of 0,01 μ to 10 μ in MEMS structures fabricated by wafer curvature or cantilever beam deflection methods.
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 16: Messverfahren zur Ermittlung der Eigenspannungen in Dünnschichten von MEMS-Bauteilen - Substratkrümmungs- und Biegebalken-Verfahren
Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 16: Méthodes d'essai pour déterminer les contraintes résiduelles des films de MEMS - Méthodes de la courbure de la plaquette et de déviation de poutre en porte-à-faux
L'IEC 62047-16:2015 définit les méthodes d'essai permettant de mesurer les contraintes résiduelles des films dont l'épaisseur se situe dans la plage de 0,01 μ à 10 μ dans des structures fabriquées de microsystèmes électromécaniques (MEMS) au moyen des méthodes de la courbure de la plaquette ou de déviation de poutre en porte-à-faux.
Polprevodniški elementi - Mikroelektromehanski elementi - 16. del: Preskusne metode za ugotavljanje preostalih mehanskih napetosti v tankih plasteh (filmih) MEMS - Metode z odklanjanjem merilne konzole za merjenje ukrivljenosti rezine
Ta del standarda IEC 62047 določa preskusne metode za merjenje preostalih mehanskih napetosti filmov debeline med 0,01 μm in 10 μm v strukturah MEMS, proizvedenih z metodami z odklanjanjem merilne konzole za merjenje ukrivljenosti rezine. Filmi morajo biti odloženi na substrat z znanimi mehanskimi lastnostmi Youngovega modula in Poissonovega razmerja. Te metode se uporabljajo za določanje preostalih mehanskih napetosti v tankih filmih, odloženih na substratu [1]1.
General Information
Standards Content (Sample)
SLOVENSKI STANDARD
01-september-2015
Polprevodniški elementi - Mikroelektromehanski elementi - 16. del: Preskusne
metode za ugotavljanje preostalih mehanskih napetosti v tankih plasteh (filmih)
MEMS - Metode z odklanjanjem merilne konzole za merjenje ukrivljenosti rezine
Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for
determining residual stresses of MEMS films - wafer curvature and cantilever beam
deflection methods
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 16: Messverfahren
zur Ermittlung der Eigenspannungen in Dünnschichten von MEMS-Bauteilen -
Substratkrümmungs- und Biegebalken-Verfahren
Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 16:
Méthodes d'essai pour déterminer les contraintes résiduelles des films de MEMS -
Méthodes de la courbure de la plaquette et de déviation de poutre en porte-à-faux
Ta slovenski standard je istoveten z: EN 62047-16:2015
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN 62047-16
NORME EUROPÉENNE
EUROPÄISCHE NORM
July 2015
ICS 31.080.99
English Version
Semiconductor devices - Micro-electromechanical devices - Part
16: Test methods for determining residual stresses of MEMS
films - Wafer curvature and cantilever beam deflection methods
(IEC 62047-16:2015)
Dispositifs à semiconducteurs - Dispositifs Halbleiterbauelemente - Bauelemente der
microélectromécaniques - Partie 16: Méthodes d'essai pour Mikrosystemtechnik - Teil 16: Messverfahren zur Ermittlung
déterminer les contraintes résiduelles des films de MEMS - der Eigenspannungen in Dünnschichten von MEMS-
Méthodes de la courbure de la plaquette et de déviation de Bauteilen - Substratkrümmungs- und Biegebalken-
poutre en porte-à-faux Verfahren
(IEC 62047-16:2015) (IEC 62047-16:2015)
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Ref. No. EN 62047-16:2015 E
European foreword
The text of document 47F/209/FDIS, future edition 1 of IEC 62047-16, prepared by SC 47F
“Microelectromechanical systems” of IEC/TC 47 “Semiconductor devices" was submitted to the
IEC-CENELEC parallel vote and approved by CENELEC as EN 62047-16:2015.
The following dates are fixed:
(dop) 2016-01-10
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2018-04-09
standards conflicting with the
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.
Endorsement notice
The text of the International Standard IEC 62047-16:2015 was approved by CENELEC as a European
Standard without any modification.
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.
NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 62047-21 - Semiconductor devices -- Micro- EN 62047-21 -
electromechanical devices -- Part 21: Test
method for Poisson's ratio of thin film MEMS
materials
IEC 62047-16 ®
Edition 1.0 2015-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Micro-electromechanical devices –
Part 16: Test methods for determining residual stresses of MEMS films – Wafer
curvature and cantilever beam deflection methods
Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –
Partie 16: Méthodes d'essai pour déterminer les contraintes résiduelles des
films de MEMS – Méthodes de la courbure de la plaquette et de déviation de
poutre en porte-à-faux
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.99 ISBN 978-2-8322-2294-2
– 2 – IEC 62047-16:2015 © IEC 2015
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Testing methods . 6
4.1 General . 6
4.2 Wafer curvature method . 6
4.2.1 General . 6
4.2.2 Test apparatus . 7
4.2.3 Measurement procedures . 7
4.2.4 Reports. 7
4.3 Cantilever beam deflection method . 8
4.3.1 General . 8
4.3.2 Test apparatus . 9
4.3.3 Measurement procedures . 9
4.3.4 Reports. 9
Bibliography . 11
Figure 1 – Schematic drawing of compressive residual stress induced curvature after
depositing thin film on substrate. 6
Figure 2 – Scheme for comprehensive residual stress induced curvature . 9
Table 1 – Mandatory details for the test of wafer curvature method . 8
Table 2 – Mandatory details for the report of beam deflection method . 10
IEC 62047-16:2015 © IEC 2015 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –
Part 16: Test methods for determining residual stresses of MEMS films –
Wafer curvature and cantilever beam deflection methods
FOREWORD
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International Standard IEC 62047-16 has been prepared by subcommittee 47F: Micro-
electromechanical systems, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47F/209/FDIS 47F/214/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
– 4 – IEC 62047-16:2015 © IEC 2015
A list of all parts in the IEC 62047 series, published under the general title Semiconductor
devices – Micro-electromechanical devices, can be found on the IEC website.
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