EN 62047-21:2014

Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials

IEC 62047-21:2014 specifies the determination of Poisson's ratio from the test results obtained by the application of uniaxial and biaxial loads to thin-film micro-electromechanical systems (MEMS) materials with lengths and widths less than 10 mm and thicknesses less than 10 µm.

Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 21: Prüfverfahren zur Querkontraktionszahl von Dünnschichtwerkstoffen der Mikrosystemtechnik

Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 21: Méthode d'essai relative au coefficient de Poisson des matériaux MEMS en couche mince

L'IEC 62047-21:2014 spécifie la détermination du coefficient de Poisson à partir des résultats obtenus par l'application d'essais de charges uniaxiales et biaxiales aux matériaux pour systèmes microélectromécaniques (MEMS, Micro-Electrical-Mechanical Systems) à couche mince dont les longueurs et les largeurs sont inférieures à 10 mm et les épaisseurs sont inférieures à 10 µm.

Polprevodniški elementi - Mikroelektromehanski elementi - 21. del: Preskusne metode za Poissonovo razmerje tankoplastnih materialov MEMS (IEC 62047-21:2014)

Standard EN IEC 62047-21 določa ugotavljanje Poissonovega razmerja na podlagi preskusnih rezultatov, pridobljenih z uporabo enoosnih in dvoosnih obremenitev pri tankoplastnih materialih mikroelektromehanskih sistemov (MEMS) z dolžinami in širinami pod 10 mm ter debelinami pod 10 μm.

General Information

• Status: Published
• Publication Date: 25-Sep-2014
• Withdrawal Date: 23-Jul-2017
• ICS: 31.080.99 - Other semiconductor devices
• Technical Committee: CLC/TC 47X - Semiconductor devices and trusted chips
• Drafting Committee: IEC/SC 47F - IEC_SC_47F
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 26-Sep-2014
• Completion Date: 26-Sep-2014
• Ref Project: SIST EN 62047-21:2014 - Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials

Standards Content (Sample)

SLOVENSKI STANDARD
01-november-2014
Polprevodniški elementi - Mikroelektromehanski elementi - 21. del: Preskusne
metode za Poissonovo razmerje tankoplastnih materialov MEMS (IEC 62047-
21:2014)
Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for
Poisson's ratio of thin film MEMS materials
/
Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 21: Méthode
d'essai relative au coefficient de Poisson des matériaux MEMS en couche mince
Ta slovenski standard je istoveten z: EN 62047-21:2014
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN 62047-21

NORME EUROPÉENNE
EUROPÄISCHE NORM
September 2014
ICS 31.080.99
English Version
Semiconductor devices - Micro-electromechanical devices -
Part 21: Test method for Poisson's ratio of thin film MEMS
materials
(IEC 62047-21:2014)
Dispositifs à semiconducteurs - Dispositifs Halbleiterbauelemente - Bauelemente der
microélectromécaniques - Mikrosystemtechnik -
Partie 21: Méthode d'essai relative au coefficient de Teil 21: Prüfverfahren zur Querkontraktionszahl von
Poisson des matériaux MEMS en couche mince Dünnschichtwerkstoffen der Mikrosystemtechnik
(CEI 62047-21:2014) (IEC 62047-21:2014)
This European Standard was approved by CENELEC on 2014-07-24. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2014 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 62047-21:2014 E
Foreword
The text of document 47F/185/FDIS, future edition 1 of IEC 62047-21, prepared by SC 47F
“Microelectromechanical systems” of IEC/TC 47 “Semiconductor devices" was submitted to the
IEC-CENELEC parallel vote and approved by CENELEC as EN 62047-21:2014.

The following dates are fixed:
(dop) 2015-04-24
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2017-07-24
standards conflicting with the
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.
Endorsement notice
The text of the International Standard IEC 62047-21:2014 was approved by CENELEC as a European
Standard without any modification.

- 3 - EN 62047-21:2014
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu
Publication Year Title EN/HD Year

IEC 62047-8 2011 Semiconductor devices - Micro- EN 62047-8
electromechanical devices -
Part 8: Strip bending test method for
tensile property measurement of thin films
-
ASTM E132-04 2010 Standard test method for Poisson's ratio -
at room temperature
IEC 62047-21 ®
Edition 1.0 2014-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Micro-electromechanical devices –

Part 21: Test method for Poisson's ratio of thin film MEMS materials

Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –

Partie 21: Méthode d'essai relative au coefficient de Poisson des matériaux

MEMS en couche mince
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX M
ICS 31.080.99 ISBN 978-2-8322-1650-7

– 2 – IEC 62047-21:2014 © IEC 2014
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms, definitions, symbols and designations . 5
3.1 Terms and definitions. 5
3.2 Symbols and designations . 5
4 Test piece . 6
4.1 General . 6
4.2 Shape of the test piece . 7
4.3 Measurement of dimensions . 7
5 Testing method and test apparatus . 7
5.1 Test principle . 7
5.2 Test machine . 7
5.3 Test procedure. 7
5.3.1 Test procedure for type 1 test piece . 7
5.3.2 Test procedure for type 2 test piece . 8
5.4 Test environment . 8
6 Test report . 8
Annex A (informative) Measurement example of Poisson's ratio using type 1 test piece . 9
A.1 Fabrication of the test piece . 9
A.2 Dimensions of the test piece . 9
A.3 Test procedures . 9
A.4 Test results . 10
Annex B (informative) Analysis of test results obtained from a type 2 test piece . 11
B.1 General . 11
B.2 Evaluation of stress and strain in circular and rectangular membranes . 11
B.3 Evaluation of Poisson’s ratio . 12
Bibliography . 13

Figure 1 – Two types of test pieces for the measurement of Poisson's ratio . 6
Figure A.1 − Optical images of markers for strain measurement by DIC . 9
Figure A.2 – Graphs of load and strain in the longitudinal and transverse directions . 10

Table 1 – Symbols and designations of a test piece . 6

IEC 62047-21:2014 © IEC 2014 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 21: Test method for Poisson's ratio
of thin film MEMS materials
FOREWORD
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International Standard IEC 62047-21 has been prepared by subcommittee 47F: Micro-
electromechanical systems, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47F/185/FDIS 47F/189/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

– 4 – IEC 62047-21:2014 © IEC 2014
A list of all parts in the IEC 62047 series, published under the general title Semiconductor
devices – Micro-electromechanical devices, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web sit
...