EN 61190-1-2:2007

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

IEC 61190-1-2:2007 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an explanation of solder ball test standards.

Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-2: Anforderungen an Lotpaste für hochwertige Verbindungen in der Elektronikmontage

Matériaux de fixation pour les assemblages électroniques - Partie 1-2: Exigences relatives aux pâtes à braser pour les interconnexions de haute qualité dans les assemblages de composants électroniques

La CEI 61190-1-2:2007 spécifie les exigences d'ordre général relatives à la caractérisation et au contrôle des pâtes à braser utilisées pour obtenir des interconnexions de haute qualité dans l'assemblage de composants électroniques. La présente norme sert de document de contrôle de la qualité et n'a pas pour objet de s'intéresser directement à la performance du matériau au cours du procédé de fabrication. Les modifications principales par rapport à la première édition concernent une définition de l'alliage à braser sans plomb et une explication des normes relatives à l'essai de bille de soudure.

Povezovalni materiali za elektronske sestave - 1-2. del: Zahteve za spajkalne paste za visoko kakovostne povezave v elektronskih sestavih (IEC 61190-1-2:2007)

General Information

• Status: Withdrawn
• Publication Date: 27-Jun-2007
• Withdrawal Date: 30-Apr-2010
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Parallel Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 9960 - Withdrawal effective - Withdrawal
• Start Date: 26-Mar-2017
• Completion Date: 26-Mar-2017
• Ref Project: SIST EN 61190-1-2:2007 - Attachment materials for electronic assembly -- Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

Relations

• Replaces: EN 61190-1-2:2002 - Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly
• Effective Date: 29-Jan-2023
• Replaced By: EN 61190-1-2:2014 - Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
• Effective Date: 29-Jan-2023

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 61190-1-2:2007
01-oktober-2007
1DGRPHãþD
SIST EN 61190-1-2:2003
Povezovalni materiali za elektronske sestave - 1-2. del: Zahteve za spajkalne paste
za visoko kakovostne povezave v elektronskih sestavih (IEC 61190-1-2:2007)
Attachment materials for electronic assembly -- Part 1-2: Requirements for soldering
pastes for high-quality interconnects in electronics assembly
Verbindungsmaterialien für Baugruppen der Elektronik -- Teil 1-2: Anforderungen an
Lotpaste für hochwertige Verbindungen in der Elektronikmontage
Matériaux de fixation pour les assemblages électroniques -- Partie 1-2: Exigences
relatives aux crèmes de brasage pour les interconnexions de haute qualité dans les
assemblages de composants électroniques
Ta slovenski standard je istoveten z: EN 61190-1-2:2007
ICS:
25.160.50 Trdo in mehko lotanje Brazing and soldering
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN 61190-1-2:2007 en,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 61190-1-2:2007

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SIST EN 61190-1-2:2007


EUROPEAN STANDARD
EN 61190-1-2

NORME EUROPÉENNE
June 2007
EUROPÄISCHE NORM

ICS 31.190 Supersedes EN 61190-1-2:2002


English version


Attachment materials for electronic assembly -
Part 1-2: Requirements for soldering pastes
for high-quality interconnects in electronics assembly
(IEC 61190-1-2:2007)


Matériaux de fixation  Verbindungsmaterialien
pour les assemblages électroniques - für Baugruppen der Elektronik -
Partie 1-2: Exigences relatives Teil 1-2: Anforderungen an Lotpaste
aux crèmes de brasage für hochwertige Verbindungen
pour les interconnexions de haute qualité in der Elektronikmontage
dans les assemblages de composants (IEC 61190-1-2:2007)
électroniques
(CEI 61190-1-2:2007)




This European Standard was approved by CENELEC on 2007-05-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the
Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61190-1-2:2007 E

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SIST EN 61190-1-2:2007
EN 61190-1-2:2007 - 2 -
Foreword
The text of document 91/646/FDIS, future edition 2 of IEC 61190-1-2, prepared by IEC TC 91, Electronics
assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC
as EN 61190-1-2 on 2007-05-01.
This European Standard supersedes EN 61190-1-2:2002.
The main changes with regard to EN 61190-1-2:2002 concern a definition of lead-free solder alloy and an
explanation of solder ball test standards.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2008-02-01
national standard or by endorsement
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2010-05-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61190-1-2:2007 was approved by CENELEC as a European
Standard without any modification.
__________

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SIST EN 61190-1-2:2007
- 3 - EN 61190-1-2:2007
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the reference
...