Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a specimen is measured, and the compressive modulus of elasticity and yield strength can be obtained. This standard is applicable to metallic, ceramic, and polymeric materials. The contents of the corrigendum of February 2012 have been included in this copy.

Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 10: Druckprüfverfahren an zylinderförmigen Mikroproben für Werkstoffe der Mikrosystemtechnik

Dispositifs à semiconducteur - Dispositifs microélectromécaniques - Partie 10: Essai de compression utilisant la technique des micro-piliers pour les matériaux des MEMS

La CEI 62047-10:2011 spécifie une méthode d'essai de compression utilisant la technique des micro-piliers destinée à mesurer les propriétés de compression des matériaux des MEMS avec une précision et une répétabilité élevées et un effort modéré pour la fabrication des éprouvettes. La relation contrainte-déformation de compression uniaxiale d'une éprouvette est mesurée ce qui permet ainsi d'obtenir le module de compression et la limite d'élasticité. La présente norme est applicable aux matériaux métalliques, céramiques, et en polymères. Le contenu du corrigendum de février 2012 a été pris en considération dans cet exemplaire.

Polprevodniški elementi - Mikroelektromehanski elementi - 10. del: Preskusi z mikrostebričnim pritiskom materialov za mikroelektromehanske sisteme (MEMS)

Ta del IEC 62047 določa preskusno metodo z mikrostebričnim pritiskom za merjenje tlačnih lastnosti materialov za mikromehanske sisteme (MEMS) z visoko točnostjo, ponovljivostjo in zmernim naporom pri izdelavi vzorca. Izmeri se razmerje med enoosno napetostjo in raztezkom vzorca in pridobita se tlačni modul elastičnosti in meja prožnosti.
Preskušanec je valjast stebriček, izdelana na togem (ali zelo trdem) substratu s tehnologijo mikoobdelave, razmerje med premerom in višino stebrička pa mora biti večje od 3. Ta standard velja za kovinske, keramične in polimerne materiale.

General Information

Status
Published
Publication Date
08-Sep-2011
Withdrawal Date
29-Aug-2014
Technical Committee
Drafting Committee
Current Stage
6060 - Document made available - Publishing
Start Date
09-Sep-2011
Completion Date
09-Sep-2011

Buy Standard

Standard
EN 62047-10:2011 - BARVE
English language
14 pages
sale 10% off
Preview
sale 10% off
Preview
e-Library read for
1 day

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 62047-10:2011
01-december-2011
3ROSUHYRGQLãNLHOHPHQWL0LNURHOHNWURPHKDQVNLHOHPHQWLGHO3UHVNXVL]
PLNURVWHEULþQLPSULWLVNRPPDWHULDORY]DPLNURHOHNWURPHKDQVNHVLVWHPH 0(06
Semiconductor devices - Microelectromechanical devices - Part 10: Micro-pillar
compression test for MEMS materials
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 10:
Druckprüfverfahren an zylinderförmigen Mikroproben für Werkstoffe der
Mikrosystemtechnik
Dispositifs à semiconducteur - Dispositifs microélectromécaniques - Partie 10: Essai de
compression utilisant la technique des micro-piliers pour les matériaux des MEMS
Ta slovenski standard je istoveten z: EN 62047-10:2011
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN 62047-10:2011 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------

SIST EN 62047-10:2011

---------------------- Page: 2 ----------------------

SIST EN 62047-10:2011

EUROPEAN STANDARD
EN 62047-10

NORME EUROPÉENNE
September 2011
EUROPÄISCHE NORM

ICS 31.080.99


English version


Semiconductor devices -
Micro-electromechanical devices -
Part 10: Micro-pillar compression test for MEMS materials
(IEC 62047-10:2011)


Dispositifs à semiconducteur -  Halbleiterbauelemente -
Dispositifs microélectromécaniques - Bauelemente der Mikrosystemtechnik -
Partie 10: Essai de compression utilisant Teil 10: Druckprüfverfahren an
la technique des micro-piliers pour les zylinderförmigen Mikroproben für
matériaux des MEMS Werkstoffe der Mikrosystemtechnik
(CEI 62047-10:2011) (IEC 62047-10:2011)





This European Standard was approved by CENELEC on 2011-08-30. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels


© 2011 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62047-10:2011 E

---------------------- Page: 3 ----------------------

SIST EN 62047-10:2011
EN 62047-10:2011 - 2 -
Foreword
The text of document 47F/85/FDIS, future edition 1 of IEC 62047-10, prepared by SC 47F, Micro-
electromechanical systems, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC
parallel vote and approved by CENELEC as EN 62047-10:2011.

The following dates are fixed:
– latest date by which the document has to be implemented at (dop) 2012-05-30
national level by publication of an identical national
standard or by endorsement
– latest date by which the national standards conflicting with the (dow) 2014-08-30
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such patent
rights.

__________
Endorsement notice
The text of the International Standard IEC 62047-10:2011 was approved by CENELEC as a European
Standard without any modification.
__________

---------------------- Page: 4 ----------------------

SIST EN 62047-10:2011
- 3 - EN 62047-10:2011
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year
...

Questions, Comments and Discussion

Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.