EN 62047-10:2011

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a specimen is measured, and the compressive modulus of elasticity and yield strength can be obtained. This standard is applicable to metallic, ceramic, and polymeric materials. The contents of the corrigendum of February 2012 have been included in this copy.

Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 10: Druckprüfverfahren an zylinderförmigen Mikroproben für Werkstoffe der Mikrosystemtechnik

Dispositifs à semiconducteur - Dispositifs microélectromécaniques - Partie 10: Essai de compression utilisant la technique des micro-piliers pour les matériaux des MEMS

La CEI 62047-10:2011 spécifie une méthode d'essai de compression utilisant la technique des micro-piliers destinée à mesurer les propriétés de compression des matériaux des MEMS avec une précision et une répétabilité élevées et un effort modéré pour la fabrication des éprouvettes. La relation contrainte-déformation de compression uniaxiale d'une éprouvette est mesurée ce qui permet ainsi d'obtenir le module de compression et la limite d'élasticité. La présente norme est applicable aux matériaux métalliques, céramiques, et en polymères. Le contenu du corrigendum de février 2012 a été pris en considération dans cet exemplaire.

Polprevodniški elementi - Mikroelektromehanski elementi - 10. del: Preskusi z mikrostebričnim pritiskom materialov za mikroelektromehanske sisteme (MEMS)

Ta del IEC 62047 določa preskusno metodo z mikrostebričnim pritiskom za merjenje tlačnih lastnosti materialov za mikromehanske sisteme (MEMS) z visoko točnostjo, ponovljivostjo in zmernim naporom pri izdelavi vzorca. Izmeri se razmerje med enoosno napetostjo in raztezkom vzorca in pridobita se tlačni modul elastičnosti in meja prožnosti.
Preskušanec je valjast stebriček, izdelana na togem (ali zelo trdem) substratu s tehnologijo mikoobdelave, razmerje med premerom in višino stebrička pa mora biti večje od 3. Ta standard velja za kovinske, keramične in polimerne materiale.

General Information

• Status: Published
• Publication Date: 08-Sep-2011
• Withdrawal Date: 29-Aug-2014
• ICS: 31.080.99 - Other semiconductor devices
• Technical Committee: CLC/TC 47X - Semiconductor devices and trusted chips
• Drafting Committee: IEC/SC 47F - IEC_SC_47F
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 09-Sep-2011
• Completion Date: 09-Sep-2011
• Ref Project: SIST EN 62047-10:2011 - Semiconductor devices - Microelectromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

Standards Content (Sample)

SLOVENSKI STANDARD
01-december-2011
3ROSUHYRGQLãNLHOHPHQWL0LNURHOHNWURPHKDQVNLHOHPHQWLGHO3UHVNXVL]
PLNURVWHEULþQLPSULWLVNRPPDWHULDORY]DPLNURHOHNWURPHKDQVNHVLVWHPH0(06
Semiconductor devices - Microelectromechanical devices - Part 10: Micro-pillar
compression test for MEMS materials
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 10:
Druckprüfverfahren an zylinderförmigen Mikroproben für Werkstoffe der
Mikrosystemtechnik
Dispositifs à semiconducteur - Dispositifs microélectromécaniques - Partie 10: Essai de
compression utilisant la technique des micro-piliers pour les matériaux des MEMS
Ta slovenski standard je istoveten z: EN 62047-10:2011
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 62047-10
NORME EUROPÉENNE
September 2011
EUROPÄISCHE NORM
ICS 31.080.99
English version
Semiconductor devices -
Micro-electromechanical devices -
Part 10: Micro-pillar compression test for MEMS materials
(IEC 62047-10:2011)
Dispositifs à semiconducteur -  Halbleiterbauelemente -
Dispositifs microélectromécaniques - Bauelemente der Mikrosystemtechnik -
Partie 10: Essai de compression utilisant Teil 10: Druckprüfverfahren an
la technique des micro-piliers pour les zylinderförmigen Mikroproben für
matériaux des MEMS Werkstoffe der Mikrosystemtechnik
(CEI 62047-10:2011) (IEC 62047-10:2011)

This European Standard was approved by CENELEC on 2011-08-30. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels

© 2011 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62047-10:2011 E
Foreword
The text of document 47F/85/FDIS, future edition 1 of IEC 62047-10, prepared by SC 47F, Micro-
electromechanical systems, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC
parallel vote and approved by CENELEC as EN 62047-10:2011.

The following dates are fixed:
– latest date by which the document has to be implemented at (dop) 2012-05-30
national level by publication of an identical national
standard or by endorsement
– latest date by which the national standards conflicting with the (dow) 2014-08-30
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such patent
rights.
__________
Endorsement notice
The text of the International Standard IEC 62047-10:2011 was approved by CENELEC as a European
Standard without any modification.
__________
- 3 - EN 62047-10:2011
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year

IEC 62047-8 - Semiconductor devices - Micro- EN 62047-8 -
electromechanical devices -
Part 8: Strip bending test method for tensile
property measurement of thin films

IEC 62047-10 ®
Edition 1.0 2011-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Micro-electromechanical devices –
Part 10: Micro-pillar compression test for MEMS materials

Dispositifs à semiconducteur – Dispositifs microélectromécaniques –
Partie 10: Essai de compression utilisant la technique des micro-piliers pour
les matériaux des MEMS
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX L
ICS 31.080.99 ISBN 978-2-88912-606-4

– 2 – 62047-10  IEC:2011
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Symbols and designations . 5
4 Test piece . 6
4.1 General . 6
4.2 Shape of test piece . 6
4.3 Measurement of dimensions . 6
5 Testing method and test apparatus . 7
5.1 Test principle . 7
5.2 Test machine . 7
5.3 Test procedure . 8
5.4 Test environment. 8
6 Test report. 8
Annex A (informative) Error estimation using finite element method . 10
Bibliography . 11

Figure 1 – Shape of cylindrical pillar (See Table 1 for symbols) . 5
Figure 2 – Schematic of Micro-pillar compression test . 7
Figure A.1 – Error estimation with the aspect ratio and friction coefficient in the elastic
modulus measurement . 10

Table 1 – Symbols and designations of test piece . 6

62047-10  IEC:2011 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 10: Micro-pillar compression test for MEMS materials

FOREWORD
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indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62047-10 has been prepared by subcommittee 47F: Micro-
electromechanical systems, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47F/85/FDIS 47F/94/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts of IEC 62047, under the general title Semiconductor devices – Micro-
electromechanical devices, can be found on the IEC website.

– 4 – 62047-10  IEC:2011
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
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IMPORTANT – The “colour inside” logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this publication using a colour printer.

62047-10  IEC:2011 – 5 –
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 10: Micro-pillar compression test for MEMS materials

1 Scope
This part of IEC 62047 specifies micro-pillar compression test method to measure
compressive properties of MEMS materials with high accuracy, repeatability, and moderate
effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a
specimen is measured, and the compressive modulus of elasticity and yield strength can be
obtained.
The test piece is a cylindrical pillar fabricated on a rigid (or highly stiff) substrate by micro-
machining technologies, and its aspect ratio (ratio of pillar diameter to pillar height) should be
more than 3. This standard is applicable to metallic, ceramic, and polymeric materials.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 62047-8, Semiconductor devices – Micro-electromechanical devices – Part 8: Strip
bending test method for tensile property measurem
...