SIST EN 62047-10:2011

Semiconductor devices - Microelectromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

This part of IEC 62047 specifies micro-pillar compression test method to measure
compressive properties of MEMS materials with high accuracy, repeatability, and moderate
effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a
specimen is measured, and the compressive modulus of elasticity and yield strength can be
obtained.
The test piece is a cylindrical pillar fabricated on a rigid (or highly stiff) substrate by micromachining
technologies, and its aspect ratio (ratio of pillar diameter to pillar height) should be
more than 3. This standard is applicable to metallic, ceramic, and polymeric materials.

Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 10: Druckprüfverfahren an zylinderförmigen Mikroproben für Werkstoffe der Mikrosystemtechnik

Dispositifs à semiconducteur - Dispositifs microélectromécaniques - Partie 10: Essai de compression utilisant la technique des micro-piliers pour les matériaux des MEMS

La CEI 62047-10:2011 spécifie une méthode d'essai de compression utilisant la technique des micro-piliers destinée à mesurer les propriétés de compression des matériaux des MEMS  avec une précision et une répétabilité élevées et un effort modéré pour la fabrication des éprouvettes. La relation contrainte-déformation de compression uniaxiale d'une éprouvette est mesurée ce qui permet ainsi d'obtenir le module de compression et la limite d'élasticité. La présente norme est applicable aux matériaux métalliques, céramiques, et en polymères. Le contenu du corrigendum de février 2012 a été pris en considération dans cet exemplaire.

Polprevodniški elementi - Mikroelektromehanski elementi - 10. del: Preskusi z mikrostebričnim pritiskom materialov za mikroelektromehanske sisteme (MEMS)

Ta del IEC 62047 določa preskusno metodo z mikrostebričnim pritiskom za merjenje tlačnih lastnosti materialov za mikromehanske sisteme (MEMS) z visoko točnostjo, ponovljivostjo in zmernim naporom pri izdelavi vzorca. Izmeri se razmerje med enoosno napetostjo in raztezkom vzorca in pridobita se tlačni modul elastičnosti in meja prožnosti.
Preskušanec je valjast stebriček, izdelana na togem (ali zelo trdem) substratu s tehnologijo mikoobdelave, razmerje med premerom in višino stebrička pa mora biti večje od 3. Ta standard velja za kovinske, keramične in polimerne materiale.

General Information

• Status: Published
• Publication Date: 08-Nov-2011
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 11-Oct-2011
• Due Date: 16-Dec-2011
• Completion Date: 09-Nov-2011
• Ref Project: EN 62047-10:2011 - Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 62047-10:2011
01-december-2011
3ROSUHYRGQLãNLHOHPHQWL0LNURHOHNWURPHKDQVNLHOHPHQWLGHO3UHVNXVL]
PLNURVWHEULþQLPSULWLVNRPPDWHULDORY]DPLNURHOHNWURPHKDQVNHVLVWHPH0(06
Semiconductor devices - Microelectromechanical devices - Part 10: Micro-pillar
compression test for MEMS materials
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 10:
Druckprüfverfahren an zylinderförmigen Mikroproben für Werkstoffe der
Mikrosystemtechnik
Dispositifs à semiconducteur - Dispositifs microélectromécaniques - Partie 10: Essai de
compression utilisant la technique des micro-piliers pour les matériaux des MEMS
Ta slovenski standard je istoveten z: EN 62047-10:2011
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN 62047-10:2011 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 62047-10:2011

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SIST EN 62047-10:2011

EUROPEAN STANDARD
EN 62047-10

NORME EUROPÉENNE
September 2011
EUROPÄISCHE NORM

ICS 31.080.99


English version


Semiconductor devices -
Micro-electromechanical devices -
Part 10: Micro-pillar compression test for MEMS materials
(IEC 62047-10:2011)


Dispositifs à semiconducteur -  Halbleiterbauelemente -
Dispositifs microélectromécaniques - Bauelemente der Mikrosystemtechnik -
Partie 10: Essai de compression utilisant Teil 10: Druckprüfverfahren an
la technique des micro-piliers pour les zylinderförmigen Mikroproben für
matériaux des MEMS Werkstoffe der Mikrosystemtechnik
(CEI 62047-10:2011) (IEC 62047-10:2011)





This European Standard was approved by CENELEC on 2011-08-30. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

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Spain, Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels


© 2011 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62047-10:2011 E

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SIST EN 62047-10:2011
EN 62047-10:2011 - 2 -
Foreword
The text of document 47F/85/FDIS, future edition 1 of IEC 62047-10, prepared by SC 47F, Micro-
electromechanical systems, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC
parallel vote and approved by CENELEC as EN 62047-10:2011.

The following dates are fixed:
– latest date by which the document has to be implemented at (dop) 2012-05-30
national level by publication of an identical national
standard or by endorsement
– latest date by which the national standards conflicting with the (dow) 2014-08-30
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such patent
rights.

__________
Endorsement notice
The text of the International Standard IEC 62047-10:2011 was approved by CENELEC as a European
Standard without any modification.
__________

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SIST EN 62047-10:2011
- 3 - EN 62047-10:2011
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year

IEC 62047-8 - Semiconductor devices - Micro- EN 62047-8 -
electromechanical devices -
Part 8: Strip bending test method for tensile
property measurement of thin films

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SIST EN 62047-10:2011

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SIST EN 62047-10:2011

IEC 62047-10
®

Edition 1.0 2011-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside


Semiconductor devices – Micro-electromechanical devices –
Part 10: Micro-pillar compression test for MEMS materials

Dispositifs à semiconducteur – Dispositifs microélectromécaniques –
Partie 10: Essai de compression utilisant la technique des micro-piliers pour
les matériaux des MEMS

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX L
ICS 31.080.99 ISBN 978-2-88912-606-4

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN 62047-10:2011
– 2 – 62047-10  IEC:2011
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Symbols and designations . 5
4 Test piece . 6
4.1 General . 6
4.2 Shape of test piece . 6
4.3 Measurement of dimensions . 6
5 Testing method and test apparatus . 7
5.1 Test principle . 7
5.2 Test machine . 7
5.3 Test procedure . 8
5.4 Test environment. 8
6 Test report. 8
Annex A (informative) Error estimation using finite element method . 10
Bibliography . 11

Figure 1 – Shape of cylindrical pillar (See Table 1 for symbols) . 5
Figure 2 – Schematic of Micro-pillar compression test . 7
Figure A.1 – Error estimation with the aspect ratio and friction coefficient in the elastic
modulus measurement . 10

Table 1 – Symbols and designations of test piece . 6

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SIST EN 62047-10:2011
62047-10  IEC:2011 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 10: Micro-pillar compression test for MEMS materials


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
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indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62047-10 has been prepared by subcommittee 47F: Micro-
electromechanical systems, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47F/85/FDIS 47F/94/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts of IEC 62047, under the general title Semiconductor devices – Micro-
electromechanical devices, can be found on the IEC website.

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SIST EN 62047-10:2011
– 4 – 62047-10  IEC:2011
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The “colour inside” logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this publication using a colour printer.

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SIST EN 62047-10:2011
62047-10  IEC:2011 – 5 –
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 10: Micro-
...