EN 62047-8:2011
(Main)Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
IEC 62047-8:2011 specifies the strip bending test method to measure tensile properties of thin films with high accuracy, repeatability, moderate effort of alignment and handling compared to the conventional tensile test. This testing method is valid for test pieces with a thickness between 50 nm and several mum, and with an aspect ratio (ratio of length to thickness) of more than 300. The hanging strip (or bridge) between two fixed supports are widely adopted in MEMS or micro-machines. It is much easier to fabricate these strips than the conventional tensile test pieces. The test procedures are so simple to be readily automated. This international standard can be utilized as a quality control test for MEMS production since its testing throughput is very high compared to the conventional tensile test.
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 8: Streifen-Biege-Prüfverfahren zur Messung von Zugbeanspruchungsmerkmalen dünner Schichten
Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 8: Méthode d'essai de la flexion de bandes en vue de la mesure des propriétés de traction des couches minces
La CEI 62047-8:2011 spécifie la méthode d'essai de flexion de bandes, afin de mesurer les propriétés de traction des couches minces avec une haute précision, répétabilité, un effort modéré d'alignement et de manipulation en comparaison de l'essai de traction conventionnel. La méthode d'essai est valable pour les éprouvettes d'essai dont l'épaisseur est comprise entre 50 nm et plusieurs mum, et dont le rapport, (soit le rapport de la longueur de l'éprouvette à son épaisseur) est supérieur 300. La bande suspendue (ou le pont) entre deux supports fixés est largement adoptée dans les MEMS ou dans les micromachines. Ces bandes sont bien plus faciles à fabriquer que les éprouvettes d'essai à la traction conventionnelles. Les procédures d'essai sont si simples qu'elles sont aisément automatisées. La présente norme internationale peut être utilisée en tant qu'essai de contrôle de la qualité pour la production des MEMS étant donné que son débit d'essai est très élevé comparé à l'essai de traction conventionnel.
Polprevodniški elementi - Mikroelektromehanski elementi - 8. del: Preskusna metoda z upogibanjem traku za merjenje nateznih lastnosti tankih plasti
Ta mednarodni standard opredeljuje preskusno metodo z upogibanjem traku za merjenje nateznih lastnosti tankih plasti z visoko natančnostjo, ponovljivostjo, zmernim naporom pri naravnavi in ravnanju v primerjavi s konvencionalnim nateznim preskusom. Ta metoda preskušanja velja za preskušance debeline med 50 nm in nekaj mm in z razmerjem dolžina/debelina več kot 300. Viseči trak (ali most) med dvema pritrjenima oporama se široko uporablja pri MEMS ali mikrostrojih. Mnogo lažje je proizvesti te trakove kot preskušance za konvencionalni natezni preskus. Postopki preskušanja so tako preprosti, da jih je mogoče hitro avtomatizirati. Ta mednarodni standard se lahko uporabi kot kontrolni preskus kakovosti za proizvodnjo MEMS, saj je njegova prepustnost količine na enoto časa zelo visoka v primerjavi s konvencionalnim nateznim preskusom.
General Information
Standards Content (Sample)
SLOVENSKI STANDARD
SIST EN 62047-8:2011
01-julij-2011
Polprevodniški elementi - Mikroelektromehanski elementi - 8. del: Preskusna
metoda z upogibanjem traku za merjenje nateznih lastnosti tankih plasti
Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test
method for tensile property measurement of thin films
Ta slovenski standard je istoveten z: EN 62047-8:2011
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN 62047-8:2011 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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SIST EN 62047-8:2011
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SIST EN 62047-8:2011
EUROPEAN STANDARD
EN 62047-8
NORME EUROPÉENNE
May 2011
EUROPÄISCHE NORM
ICS 31.080.99
English version
Semiconductor devices -
Micro-electromechanical devices -
Part 8: Strip bending test method for tensile property measurement of thin
films
(IEC 62047-8:2011)
Dispositifs à semiconducteurs - Halbleiterbauelemente -
Dispositifs microélectromécaniques - Bauelemente der Mikrosystemtechnik -
Partie 8: Méthode d'essai de la flexion de Teil 8: Streifen-Biege-Prüfverfahren zur
bandes en vue de la mesure des Messung von
propriétés de traction des couches minces Zugbeanspruchungsmerkmalen dünner
(CEI 62047-8:2011) Schichten
(IEC 62047-8:2011)
This European Standard was approved by CENELEC on 2011-04-18. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Management Centre: Avenue Marnix 17, B - 1000 Brussels
© 2011 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62047-8:2011 E
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SIST EN 62047-8:2011
EN 62047-8:2011 - 2 -
Foreword
The text of document 47F/71/FDIS, future edition 1 of IEC 62047-8, prepared by SC 47F,
Micro-electromechanical systems, of IEC TC 47, Semiconductor devices, was submitted to the IEC-
CENELEC parallel vote and was approved by CENELEC as EN 62047-8 on 2011-04-18.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent
rights.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2012-01-18
national standard or by endorsement
– latest date by which the national standards conflicting
(dow) 2014-04-18
with the EN have to be withdrawn
__________
Endorsement notice
The text of the International Standard IEC 62047-8:2011 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 62047-2:2006 NOTE Harmonized as EN 62047-2:2006 (not modified).
IEC 62047-3:2006 NOTE Harmonized as EN 62047-3:2006 (not modified).
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SIST EN 62047-8:2011
IEC 62047-8
®
Edition 1.0 2011-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Micro-electromechanical devices –
Part 8: Strip bending test method for tensile property measurement of thin films
Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –
Partie 8: Méthode d’essai de la flexion de bandes en vue de la mesure des
propriétés de traction des couches minces
INTERNATIONAL
ELECTROTECHNICAL
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COMMISSION
ELECTROTECHNIQUE
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ICS 31.080.99 ISBN 978-2-88912-395-7
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