EN 62047-1:2016
(Main)Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
IEC 62047-1:2016 defines terms for micro-electromechanical devices including the process of production of such devices. This edition includes the following significant technical changes with respect to the previous edition: a) removal of ten terms; b) revision of twelve terms; c) addition of sixteen new terms.
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 1: Begriffe
Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 1: Termes et définitions
L'IEC 62047-1:2016 définit des termes pour les dispositifs microélectromécaniques en incluant le procédé de production de ces dispositifs. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente: a) retrait de dix termes; b) révision de douze termes; c) ajout de seize nouveaux termes.
Polprevodniški elementi - Mikroelektromehanski elementi - 1. del: Izrazi in definicije (IEC 62047-1:2016)
Ta del standarda IEC 62047 opredeljuje izraze za mikroelektromehanske elemente, vključno s postopkom proizvodnje takšnih elementov.
General Information
Relations
Standards Content (Sample)
SLOVENSKI STANDARD
01-julij-2016
1DGRPHãþD
SIST EN 62047-1:2007
Polprevodniški elementi - Mikroelektromehanski elementi - 1. del: Izrazi in
definicije (IEC 62047-1:2016)
Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
(IEC 62047-1:2016)
Ta slovenski standard je istoveten z: EN 62047-1:2016
ICS:
01.040.31 Elektronika (Slovarji) Electronics (Vocabularies)
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN 62047-1
NORME EUROPÉENNE
EUROPÄISCHE NORM
April 2016
ICS 31.080.99 Supersedes EN 62047-1:2006
English Version
Semiconductor devices - Micro-electromechanical devices - Part
1: Terms and definitions
(IEC 62047-1:2016)
Dispositifs à semi-conducteurs - Dispositifs Halbleiterbauelemente - Bauelemente der
microélectromécaniques - Partie 1: Termes et définitions Mikrosystemtechnik - Teil 1: Begriffe
(IEC 62047-1:2016) (IEC 62047-1:2016)
This European Standard was approved by CENELEC on 2016-02-10. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2016 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 62047-1:2016 E
European foreword
The text of document 47F/232/FDIS, future edition 2 of IEC 62047-1, prepared by SC 47F
“Microelectromechanical systems” of IEC/TC 47 “Semiconductor devices" was submitted to the
IEC-CENELEC parallel vote and approved by CENELEC as EN 62047-1:2016.
The following dates are fixed:
(dop) 2016-11-10
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2019-02-10
standards conflicting with the
document have to be withdrawn
This document supersedes EN 62047-1:2006.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.
Endorsement notice
The text of the International Standard IEC 62047-1:2016 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated:
IEC 62047-1:2005 NOTE Harmonized as EN 62047-1:2006.
IEC 62047-1 ®
Edition 2.0 2016-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Micro-electromechanical devices –
Part 1: Terms and definitions
Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –
Partie 1: Termes et définitions
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.99 ISBN 978-2-8322-3099-2
– 2 – IEC 62047-1:2016 © IEC 2016
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Terms and definitions . 5
2.1 General terms and definitions . 5
2.2 Terms and definitions relating to science and engineering . 6
2.3 Terms and definitions relating to materials science . 7
2.4 Terms and definitions relating to functional element . 7
2.5 Terms and definitions relating to machining technology . 12
2.6 Terms and definitions relating to bonding and assembling technology . 19
2.7 Terms and definitions relating to measurement technology . 21
2.8 Terms and definitions relating to application technology . 23
Annex A (informative) Standpoint and criteria in editing this glossary . 27
A.1 Guidelines for selecting terms . 27
A.2 Guidelines for writing the definitions . 27
A.3 Guidelines for writing the notes . 27
Annex B (informative) Clause cross-references of IEC 62047-1:2005 and IEC 62047-
1:2015 . 28
Bibliography . 32
Table B.1 – Clause cross-reference of IEC 62047-1: 2005 and IEC 62047-1:2015 . 28
IEC 62047-1:2016 © IEC 2016 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –
Part 1: Terms and definitions
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62047-1 has been prepared by subcommittee 47F: Micro-
electromechanical systems, of IEC technical committee 47: Semiconductor devices.
This second edition cancels and replaces the first edition published in 2005. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) removal of ten terms;
b) revision of twelve terms;
c) addition of sixteen new terms.
– 4 – IEC 62047-1:2016 © IEC 2016
The text of this standard is based on the following documents:
FDIS Report on voting
47F/232/FDIS 47F/238/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 62047 series, published under the general title Semiconductor
devices – Micro-electromechanical devices, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IEC 62047-1:2016 © IEC 2016 – 5 –
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –
Part 1: Terms and definitions
1 Scope
This part of IEC 62047 defines terms for micro-electromechanical devices including the
process of production of such devices.
2 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
2.1 General terms and definitions
2.1.1
micro-electromechanical device
microsized device, in which sensors, actuators, transducers, resonators, oscillators,
mechanical components and/or electric circuits are integrated
Note 1 to entry: Related technologies are extremely diverse from fundamental technologies such as design,
material, processing, functional element, system control, energy supply, bonding and assembly, electric circuit, and
evaluation to basic science such as micro-science and engineering as well as thermodynamics and tribology in a
micro-scale. If the devices constitute a system, it is sometimes called as MEMS which is an acronym standing for
"micro-electromechanical systems"
2.1.2
MST
microsystem technology
technology to realize microelectrical, optical and machinery systems and even their
components by using micromachining
Note 1 to entry: The term MST is mostly used in Europe.
Note 2 to entry: This note applies to the French language only.
2.1.3
micromachine
2.1.3.1
micromachine,
miniaturized device, the components of which are several millimetres or smaller in size
Note 1 to entry: Various functional device (such as a sensor that utilizes the micromachine technology) is
included.
2.1.3.2
micromachine,
microsystem that consists of an integration of micromachine devices
Note 1 to entry: A molecular machine called a nanomachine is included.
– 6 – IEC 62047-1:2016 © IEC 2016
2.2 Terms and definitions relating to science and engineering
2.2.1
micro-science and engineering
science and engineering for the microscopic world of MEMS
Note 1 to entry: When mechanical systems are miniaturized, various physical parameters change. Two cases
prevail: 1) these changes can be predicted by extrapolating the changes of the macro-world, and 2) the peculiarity
of the microscopic world becomes apparent and extrapolation is not possible. In the latter case, it is necessary to
establish new theoretical and empirical equations for the explanation of phenomena in the microscopic world.
Moreover, new methods of analysis and synthesis to deal with engineering proble
...
Questions, Comments and Discussion
Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.