EN 62047-1:2006

Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions

This part of EN 62047 defines terms for micro-electromechanical devices including the process of production of such devices.

Halbleiterbauelemente - Bauteile der Mikrosystemtechnik - Teil 1: Begriffe und Definitionen

Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 1: Termes et définitions

This part of EN 62047 defines terms for micro-electromechanical devices including the process of production of such devices.

Polprevodniški elementi - Mikroelektromehanski elementi - 1. del: Izrazi in definicije (IEC 62047-1:2005)

General Information

• Status: Withdrawn
• Publication Date: 15-Jun-2006
• Withdrawal Date: 31-May-2009
• ICS: 31.080.99 - Other semiconductor devices
• Technical Committee: CLC/SR 47 - Semiconductor devices
• Drafting Committee: IEC/TC 47 - IEC_TC_47
• Parallel Committee: IEC/TC 47 - IEC_TC_47
• Current Stage: 9960 - Withdrawal effective - Withdrawal
• Start Date: 10-Feb-2019
• Completion Date: 10-Feb-2019
• Ref Project: SIST EN 62047-1:2007 - Semiconductor devices - Micro-electromechanical devices -- Part 1: Terms and definitions

Relations

• Replaced By: EN 62047-1:2016 - Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
• Effective Date: 07-Jun-2022

Standards Content (Sample)

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EUROPEAN STANDARD EN 62047-1 NORME EUROPÉENNE
EUROPÄISCHE NORM June 2006
CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2006 CENELEC -
All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62047-1:2006 E
ICS 31.080.99
English version
Semiconductor devices - Micro-electromechanical devices
Part 1: Terms and definitions (IEC 62047-1:2005)
Dispositifs à semiconducteurs - Dispositifs microélectromécaniques
Partie 1: Termes et définitions (CEI 62047-1:2005)
Halbleiterbauelemente - Bauteile der Mikrosystemtechnik
Teil 1: Begriffe und Definitionen
(IEC 62047-1:2005)
This European Standard was approved by CENELEC on 2006-06-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom.



EN 62047-1:2006
- 2 -
Foreword The text of the International Standard IEC 62047-1:2005, prepared by IEC TC 47, Semiconductor devices, was submitted to the Unique Acceptance Procedure and was approved by CENELEC as EN 62047-1 on 2006-06-01 without any modification. The following dates were fixed: – latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement
(dop)
2007-06-01 – latest date by which the national standards conflicting
with the EN have to be withdrawn
(dow)
2009-06-01 __________ Endorsement notice The text of the International Standard IEC 62047-1:2005 was approved by CENELEC as a European Standard without any modification. __________



NORME INTERNATIONALECEIIEC INTERNATIONAL STANDARD 62047-1Première éditionFirst edition2005-09 Dispositifs à semiconducteurs – Dispositifs microélectromécaniques – Partie 1: Termes et définitions
Semiconductor devices – Micro-electromechanical devices – Part 1: Terms and definitions
Pour prix, voir catalogue en vigueur For price, see current catalogue IEC 2005
Droits de reproduction réservés

Copyright - all rights reserved Aucune partie de cette publication ne peut être reproduite ni utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie et les microfilms, sans l'accord écrit de l'éditeur. No part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from the publisher. International Electrotechnical Commission,
3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, SwitzerlandTelephone: [phone] Telefax: [phone] E-mail: [e-mail]
Web: www.iec.ch CODE PRIX PRICE CODE T Commission Electrotechnique InternationaleInternational Electrotechnical Commission



62047-1  IEC:2005 – 3 –
CONTENTS FOREWORD.5
1 Scope.9 2 Terms and definitions.9 2.1 General terms.9 2.2 Terms relating to science and engineering.11 2.3 Terms relating to material science.13 2.4 Terms relating to functional element.15 2.5 Terms relating to machining technology.
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