EN 62047-3:2006

Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing

Specifies a standard test piece, which is used to guarantee the propriety and accuracy of a tensile testing system for thin film materials with length and width under 1 mm and thickness under 10 m, which are main structural materials for microelectromechanical systems (MEMS), micromachines and similar devices. It is based on such a concept that a tensile testing system can be guaranteed in propriety and accuracy, when the measured tensile strengths of the standard test pieces, whose tensile strength is pre-determined, are within the designated range. It also specifies the test pieces to minimize characteristics deviation among the pieces.

Halbleiterbauelemente - Bauteile der Mikrosystemtechnik - Teil 3: Dünnschicht-Standardmikroprobe für die Prüfung der Zugbeanspruchung

Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 3: Eprouvette d'essai normalisée en couche mince pour l'essai de traction

Cette norme internationale specifie une eprouvette d fessai normalisee, qui est utilisee pour garantir le bien-fonde et la precision du systeme d fessais de traction pour les materiaux en couche mince avec une longueur et une largeur inferieures a 1 mm et une epaisseur inferieure a 10 Êm, et qui sont des materiaux de structure principaux pour les systemes microelectromecaniques (MEMS), les micromachines et dispositifs analogues. Cette norme internationale repose sur un concept tel qu fun systeme d fessais de traction puisse etre garanti du point de vue du bien-fonde et de la precision, lorsque les resistances a la traction mesurees des eprouvettes d fessai normalisees, dont la resistance a la traction est predeterminee, se situent dans la plage designee. Elle specifie egalement les eprouvettes d fessai pour minimiser les ecarts de caracteristiques parmi les eprouvettes.

Polprevodniški elementi - Mikroelektromehanski elementi - 3. del: Standardni tankoplastni preskušanec za preskušanje razteznosti (IEC 62047-3:2006)

General Information

• Status: Published
• Publication Date: 19-Sep-2006
• Withdrawal Date: 31-Aug-2009
• ICS: 31.080.99 - Other semiconductor devices
• Technical Committee: CLC/SR 47 - Semiconductor devices
• Drafting Committee: IEC/SC 47F - IEC_SC_47F
• Parallel Committee: IEC/TC 47 - IEC_TC_47
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 20-Sep-2006
• Completion Date: 20-Sep-2006
• Ref Project: SIST EN 62047-3:2007 - Semiconductor devices - Micro-electromechanical devices -- Part 3: Thin film standard test piece for tensile testing

Standards Content (Sample)

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EUROPEAN STANDARD
EN 62047-3

NORME EUROPÉENNE
September 2006
EUROPÄISCHE NORM

ICS 31.080.99


English version


Semiconductor devices -
Micro-electromechanical devices
Part 3: Thin film standard test piece for tensile testing
(IEC 62047-3:2006)


Dispositifs à semiconducteurs -  Halbleiterbauelemente -
Dispositifs microélectromécaniques Bauteile der Mikrosystemtechnik
Partie 3: Eprouvette d'essai normalisée Teil 3: Dünnschicht-Standardmikroprobe
en couche mince pour l'essai de traction für die Prüfung der Zugbeanspruchung
(CEI 62047-3:2006) (IEC 62047-3:2006)




This European Standard was approved by CENELEC on 2006-09-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2006 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62047-3:2006 E

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EN 62047-3:2006 - 2 -
Foreword
The text of document 47/1866/FDIS, future edition 1 of IEC 62047-3, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 62047-3 on 2006-09-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2007-06-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2009-09-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 62047-3:2006 was approved by CENELEC as a European
Standard without any modification.
__________

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- 3 - EN 62047-3:2006

Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year

1) 2)
IEC 62047-2 - Semiconductor devices - Micro- EN 62047-2 2006
electromechanical devices
Part 2: Tensile testing method of thin film
materials


1)
ISO 17561 - Fine ceramics (advanced ceramics, advanced - -
technical ceramics) - Test method for elastic
moduli of monolithic ceramics at room
temperature by sonic resonance




1)
Undated reference.
2)
Valid edition at date of issue.

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NORME CEI
INTERNATIONALE
IEC



62047-3
INTERNATIONAL


Première édition
STANDARD

First edition

2006-08


Dispositifs à semiconducteurs –
Dispositifs microélectromécaniques –
Partie 3:
Eprouvette d'essai normalisée en
couche mince pour l'essai de traction

Semiconductor devices –
Micro-electromechanical devices –
Part 3:
Thin film standard test piece for tensile testing

 IEC 200
...