EN 62047-3:2006

Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing

Specifies a standard test piece, which is used to guarantee the propriety and accuracy of a tensile testing system for thin film materials with length and width under 1 mm and thickness under 10 m, which are main structural materials for microelectromechanical systems (MEMS), micromachines and similar devices. It is based on such a concept that a tensile testing system can be guaranteed in propriety and accuracy, when the measured tensile strengths of the standard test pieces, whose tensile strength is pre-determined, are within the designated range. It also specifies the test pieces to minimize characteristics deviation among the pieces.

Halbleiterbauelemente - Bauteile der Mikrosystemtechnik - Teil 3: Dünnschicht-Standardmikroprobe für die Prüfung der Zugbeanspruchung

Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 3: Eprouvette d'essai normalisée en couche mince pour l'essai de traction

Cette norme internationale specifie une eprouvette d fessai normalisee, qui est utilisee pour garantir le bien-fonde et la precision du systeme d fessais de traction pour les materiaux en couche mince avec une longueur et une largeur inferieures a 1 mm et une epaisseur inferieure a 10 Êm, et qui sont des materiaux de structure principaux pour les systemes microelectromecaniques (MEMS), les micromachines et dispositifs analogues. Cette norme internationale repose sur un concept tel qu fun systeme d fessais de traction puisse etre garanti du point de vue du bien-fonde et de la precision, lorsque les resistances a la traction mesurees des eprouvettes d fessai normalisees, dont la resistance a la traction est predeterminee, se situent dans la plage designee. Elle specifie egalement les eprouvettes d fessai pour minimiser les ecarts de caracteristiques parmi les eprouvettes.

Polprevodniški elementi - Mikroelektromehanski elementi - 3. del: Standardni tankoplastni preskušanec za preskušanje razteznosti (IEC 62047-3:2006)

General Information

• Status: Published
• Publication Date: 19-Sep-2006
• Withdrawal Date: 31-Aug-2009
• ICS: 31.080.99 - Other semiconductor devices
• Technical Committee: CLC/TC 47X - Semiconductor devices and trusted chips
• Drafting Committee: IEC/SC 47F - IEC_SC_47F
• Parallel Committee: IEC/TC 47 - IEC_TC_47
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 20-Sep-2006
• Completion Date: 20-Sep-2006
• Ref Project: SIST EN 62047-3:2007 - Semiconductor devices - Micro-electromechanical devices -- Part 3: Thin film standard test piece for tensile testing

Overview

EN 62047-3:2006 is a European standard developed by CLC that specifies a thin film standard test piece designed for tensile testing of micro-electromechanical systems (MEMS) structural materials. This standard focuses on guaranteeing the accuracy and reliability of tensile testing systems applied to thin film materials used in MEMS, micromachines, and similar semiconductor devices. It defines the dimensions, materials, fabrication processes, and testing protocols for test pieces with dimensions under 1 mm in length and width, and thickness below 10 µm.

The standard supports industry efforts to maintain consistent mechanical characterization of thin films essential for MEMS development. By using standard test pieces with predetermined tensile strength, testing systems can be validated to ensure precise, reproducible measurements.

Key Topics

• Scope & Purpose
  EN 62047-3 targets tensile testing of thin films with ultra-small dimensions typical in MEMS components, ensuring test systems yield accurate tensile strength, Young’s modulus, and elongation values.

• Test Piece Design

  • Length and width under 1 mm
  • Thickness below 10 µm
  • Parallel section length at least 2.5 times the width
  • Smooth curved transition regions to reduce stress concentration
  • Gauge marks for elongation measurement with minimal thickness impact (<1% of specimen thickness)

• Materials
  Single crystal silicon is the primary candidate material due to its well-known mechanical properties; ductile materials may be used to validate ductile testing systems.

• Fabrication
  Requires controlled deposition and microfabrication processes to minimize variability and ensure reproducibility.

• Thickness Measurement
  Non-contact methods such as optical or interferometric techniques are preferred to avoid damaging specimens, with accuracy targets of ±1%.

• Testing Procedures
  Tensile tests are conducted on at least 10 specimens from the same fabrication lot or wafer to enable statistically relevant evaluation of average tensile strength, Young’s modulus, and elongation.

• Documentation
  Standard test pieces come with detailed attached documentation referencing the standard, material, dimensions, and expected mechanical properties.

Applications

EN 62047-3 is critical for industries and research fields engaged in MEMS design, micromachinery, and thin film semiconductor devices including:

• MEMS Device Fabrication: Verifying the mechanical integrity of structural thin films to ensure device reliability.
• Material Characterization Labs: Standardizing tensile testing procedures for thin films to achieve consistent mechanical data.
• Quality Control: Validating tensile testing equipment accuracy for production monitoring in MEMS manufacturing.
• Research & Development: Developing new thin film materials and reliable testing protocols for next-generation microdevices.

This standard’s emphasis on precise dimensions and statistical validation supports repeatable measurements, crucial for product certification and innovation in microelectronics and microsystems.

Related Standards

• IEC 62047-2: “Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials”
  Describes detailed tensile testing methodologies complementary to the test piece specifications in EN 62047-3.

• ISO 17561: “Fine ceramics (advanced ceramics, technical ceramics) - Test method for elastic moduli of monolithic ceramics at room temperature by sonic resonance”
  Provides alternative methods for determining Young’s modulus when linear stress-strain relationships are absent.

• Other Parts of IEC 62047 Series: Cover broader aspects of micro-electromechanical device testing and standardization.

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Keywords: EN 62047-3, thin film tensile testing, MEMS, micro-electromechanical systems, standard test piece, semiconductor devices, tensile strength, Young’s modulus, microfabrication, test piece thickness, gauge marks, mechanical properties, quality control, thin film materials, IEC 62047 series.

Standards Content (Sample)

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EUROPEAN STANDARD
EN 62047-3
NORME EUROPÉENNE
September 2006
EUROPÄISCHE NORM
ICS 31.080.99
English version
Semiconductor devices -
Micro-electromechanical devices
Part 3: Thin film standard test piece for tensile testing
(IEC 62047-3:2006)
Dispositifs à semiconducteurs -  Halbleiterbauelemente -
Dispositifs microélectromécaniques Bauteile der Mikrosystemtechnik
Partie 3: Eprouvette d'essai normalisée Teil 3: Dünnschicht-Standardmikroprobe
en couche mince pour l'essai de traction für die Prüfung der Zugbeanspruchung
(CEI 62047-3:2006) (IEC 62047-3:2006)

This European Standard was approved by CENELEC on 2006-09-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2006 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62047-3:2006 E
Foreword
The text of document 47/1866/FDIS, future edition 1 of IEC 62047-3, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 62047-3 on 2006-09-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2007-06-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2009-09-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 62047-3:2006 was approved by CENELEC as a European
Standard without any modification.
__________
- 3 - EN 62047-3:2006
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year

1) 2)
IEC 62047-2 - Semiconductor devices - Micro- EN 62047-2 2006
electromechanical devices
Part 2: Tensile testing method of thin film
materials
1)
ISO 17561 - Fine ceramics (advanced ceramics, advanced - -
technical ceramics) - Test method for elastic
moduli of monolithic ceramics at room
temperature by sonic resonance

1)
Undated reference.
2)
Valid edition at date of issue.

NORME CEI
INTERNATIONALE
IEC
62047-3
INTERNATIONAL
Première édition
STANDARD
First edition
2006-08
Dispositifs à semiconducteurs –
Dispositifs microélectromécaniques –
Partie 3:
Eprouvette d'essai normalisée en
couche mince pour l'essai de traction

Semiconductor devices –
Micro-electromechanical devices –
Part 3:
Thin film standard test piece for tensile testing

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62047-3  IEC:2006 – 3 –
CONTENTS
FOREWORD.5

1 Scope.9
2 Normative references .9
3 Test piece materials .9
4 Test piece fabrications .9
5 Plane shape of test piece .11
6 Test piece thickness.11
7 Gauge mark.11
8 Test.11
9 Document attached to standard test pieces .13

Annex A (informative) Test piece .15

62047-3  IEC:2006 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 3: Thin film standard test piece
for tensile testing
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