EN 60749-26:2014

Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)

IEC 60749-26:2013 establishes the procedure for testing, evaluating, and classifying components and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined human body model (HBM) electrostatic discharge (ESD). The purpose (objective) of this standard is to establish a test method that will replicate HBM failures and provide reliable, repeatable HBM ESD test results from tester to tester, regardless of component type. Repeatable data will allow accurate classifications and comparisons of HBM ESD sensitivity levels. ESD testing of semiconductor devices is selected from this test method, the machine model (MM) test method (see IEC 60749-27) or other ESD test methods in the IEC 60749 series. The HBM and MM test methods produce similar but not identical results; unless otherwise specified, this test method is the one selected. This edition includes the following significant technical changes with respect to the previous edition: a) descriptions of oscilloscope and current transducers have been refined and updated; b) the HBM circuit schematic and description have been improved; c) the description of stress test equipment qualification and verification has been completely re-written; d) qualification and verification of test fixture boards has been revised; e) a new section on the determination of ringing in the current waveform has been added; f) some alternate pin combinations have been included; g) allowance for non-supply pins to stress to a limited number of supply pin groups (associated non-supply pins) and allowance for non-supply to non-supply (i.e., I/O to I/O) stress to be limited to a finite number of 2 pin pairs (coupled non-supply pin pairs); h) explicit allowance for HBM stress using 2 pin HBM testers for die only shorted supply groups.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 26: Prüfung der Empfindlichkeit gegen elektrostatische Entladungen (ESD) - Human Body Model (HBM)

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 26: Essai de sensibilité aux décharges électrostatiques (DES) - Modèle du corps humain (HBM)

La CEI 60749-26:2013 établit une procédure pour les essais, l'évaluation et la classification des composants et des microcircuits en fonction de leur susceptibilité (sensibilité) aux dommages ou de leur dégradation suite à leur exposition à des décharges électrostatiques (DES) sur un modèle de corps humain (HBM) défini. Le but (objectif) de cette norme est de déterminer une méthode d'essai permettant de reproduire les défaillances du HBM et de fournir des résultats d'essais de DES de HBM fiables et reproductibles d'un appareil d'essai à un autre, sans tenir compte du type de composant. Des données reproductibles autoriseront des classifications et des comparaisons précises des niveaux de sensibilité de DES de HBM. Les essais de DES des dispositifs à semiconducteurs sont choisis entre la présente méthode d'essai, celle du modèle de machine (MM) (voir CEI 60749-27) ou toute autre méthode d'essai de la série CEI 60749. Les méthodes d'essai HBM et MM produisent des résultats similaires mais non identiques; sauf indication contraire, la présente méthode d'essai est celle qui prévaut. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente: a) les descriptions de l'oscilloscope et des transducteurs de courant ont été améliorées et mises à jour; b) le schéma de circuit et la description du HBM ont été améliorés; c) la description de la qualification et de la vérification du matériel d'essai de contrainte a été entièrement réécrite; d) la qualification et la vérification des cartes de montage d'essai ont été révisées; e) une nouvelle section concernant la détermination de l'oscillation de la forme d'onde de courant a été ajoutée; f) certaines variantes de combinaisons de broches ont été incluses; g) autorisation de contrainte pour les broches n'assurant pas l'alimentation jusqu'à un nombre limité de groupes de broches d'alimentation (broches associées n'assurant pas l'alimentation) et autorisation de limiter les contraintes entre broches n'assurant pas l'alimentation et broches n'assurant pas l'alimentation (c'est-à-dire, E/S vers E/S) à un nombre fini de 2 paires de broches (paires de broches couplées n'assurant pas l'alimentation); - h) autorisation explicite de contrainte de HBM utilisant des appareils d'essai de HBM à 2 broches pour puce seulement pour des groupes d'alimentations court-circuitées.

Polprevodniški elementi - Mehanske in klimatske preskusne metode - 26. del: Preskušanje občutljivosti na elektrostatične izpraznitve (ESD) - Model človeškega telesa (HBM)

EN IEC 60749-26 določa standardni postopek za preskušanje, ocenjevanje in razvrščanje sestavnih delov in mikrovezij glede na občutljivost na poškodbe in degradacijo, ki so posledica izpostavljenosti določenim elektrostatičnim izpraznitvam (ESD) modela človeškega telesa (HBM). Namen (cilj) tega standarda je določiti preskusno metodo, ki bo ponovila napake modela človeškega telesa in zagotovila zanesljive in ponovljive preskusne rezultate elektrostatičnih izpraznitev (ESD) modela človeškega telesa (HBM) pri vseh preskuševalcih ne glede na vrsto sestavnega dela. Ponovljivi podatki bodo omogočili natančne opredelitve in primerjave ravni občutljivosti na elektrostatične izpraznitve (ESD) modela človeškega telesa (HBM). Preskus elektrostatične izpraznitve elementov se izbere iz te preskusne metode, preskusne metode modela stroja (MM; glej standard IEC 60749-27) ali drugih testnih metod iz serije standardov IEC 60749. Preskusni metodi HBM in MM dajeta podobne, toda ne enakih rezultatov; če ni navedeno drugače, je izbrana ta preskusna metoda.

General Information

• Status: Withdrawn
• Publication Date: 22-May-2014
• Withdrawal Date: 13-Apr-2017
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: CLC/SR 47 - Semiconductor devices
• Drafting Committee: IEC/TC 47 - IEC_TC_47
• Current Stage: 9960 - Withdrawal effective - Withdrawal
• Start Date: 19-Feb-2021
• Completion Date: 19-Feb-2021
• Ref Project: SIST EN 60749-26:2014 - Semiconductor devices - Mechanical and climatic test methods -- Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)

Relations

• Replaces: EN 60749-26:2006 - Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
• Effective Date: 29-Jan-2023
• Replaced By: EN IEC 60749-26:2018 - Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
• Effective Date: 07-Jun-2022

Standards Content (Sample)

SLOVENSKI STANDARD
01-julij-2014
1DGRPHãþD
SIST EN 60749-26:2007
3ROSUHYRGQLãNLHOHPHQWL0HKDQVNHLQNOLPDWVNHSUHVNXVQHPHWRGHGHO
3UHVNXãDQMHREþXWOMLYRVWLQDHOHNWURVWDWLþQHL]SUD]QLWYH(6'0RGHOþORYHãNHJD
WHOHVD+%0
Semiconductor devices - Mechanical and climatic test methods -- Part 26: Electrostatic
discharge (ESD) sensitivity testing - Human body model (HBM)
Halbleiterbauelemente – Mechanische und klimatische Prüfverfahren -- Teil 26: Prüfung
der Empfindlichkeit gegen elektrostatische Entladungen (ESD) - Human Body Model
(HBM)
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques -- Partie
26: Essai de sensibilité aux décharges électrostatiques (DES) - Modèle du corps humain
(HBM)
Ta slovenski standard je istoveten z: EN 60749-26:2014
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN 60749-26

NORME EUROPÉENNE
EUROPÄISCHE NORM
May 2014
ICS 31.080.01 Supersedes EN 60749-26:2006
English Version
Semiconductor devices - Mechanical and climatic test methods -
Part 26: Electrostatic discharge (ESD) sensitivity testing -
Human body model (HBM)
(IEC 60749-26:2013)
Dispositifs à semiconducteurs - Méthodes d'essais Halbleiterbauelemente - Mechanische und klimatische
mécaniques et climatiques - Partie 26: Essai de sensibilité Prüfverfahren - Teil 26: Prüfung der Empfindlichkeit gegen
aux décharges électrostatiques (DES) - Modèle du corps elektrostatische Entladungen (ESD) - Human Body Model
humain (HBM) (HBM)
(CEI 60749-26:2013) (IEC 60749-26:2013)
This European Standard was approved by CENELEC on 2014-04-14. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2014 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 60749-26:2014 E
Foreword
This document (EN 60749-26:2014) consists of the text of IEC 60749-26:2013 prepared by IEC/TC 47
"Semiconductor devices", in collaboration with Technical Committee 101.

The following dates are fixed:
(dop) 2015-04-14
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
(dow) 2017-04-14
• latest date by which the national
standards conflicting with the
document have to be withdrawn
This document supersedes EN 60749-26:2006.

EN 60749-26:2006:
a) descriptions of oscilloscope and current transducers have been refined and updated;
b) the HBM circuit schematic and description have been improved;
c) the description of stress test equipment qualification and verification has been completely re-
written;
d) qualification and verification of test fixture boards has been revised;
e) a new section on the determination of ringing in the current waveform has been added;
f) some alternate pin combinations have been included;
g) allowance for non-supply pins to stress to a limited number of supply pin groups (associated non-
supply pins) and allowance for non-supply to non-supply (i.e., I/O to I/O) stress to be limited to a
finite number of 2 pin pairs (coupled non-supply pin pairs);
h) explicit allowance for HBM stress using 2 pin HBM testers for die only shorted supply groups.

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.
Endorsement notice
The text of the International Standard IEC 60749-26:2013 was approved by CENELEC as a European
Standard without any modification.

- 3 - EN 60749-26:2014
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu
Publication Year Title EN/HD Year

IEC 60749-27 - Semiconductor devices - Mechanical and EN 60749-27 -
climatic test methods -
Part 27: Electrostatic discharge (ESD)
sensitivity testing - Machine model (MM)

IEC 60749-26 ®
Edition 3.0 2013-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Mechanical and climatic test methods –

Part 26: Electrostatic discharge (ESD) sensitivity testing – Human body model

(HBM)
Dispositifs à semiconducteurs – Méthodes d'essais mécaniques et climatiques –

Partie 26: Essai de sensibilité aux décharges électrostatiques (DES) – Modèle du

corps humain (HBM)
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX X
ICS 31.080.01 ISBN 978-2-83220-746-8

– 2 – 60749-26 © IEC:2013
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Apparatus and required equipment . 9
4.1 Waveform verification equipment . 9
4.2 Oscilloscope . 10
4.3 Additional requirements for digital oscilloscopes . 10
4.4 Current transducer (inductive current probe) . 10
4.5 Evaluation loads . 10
4.6 Human body model simulator . 10
4.7 HBM test equipment parasitic properties . 11
5 Stress test equipment qualification and routine verification . 11
5.1 Overview of required HBM tester evaluations . 11
5.2 Measurement procedures . 11
5.2.1 Reference pin pair determination . 11
5.2.2 Waveform capture with current probe . 12
5.2.3 Determination of waveform parameters . 12
5.2.4 High voltage discharge path test . 15
5.3 HBM tester qualification . 15
5.3.1 HBM ESD tester qualification requirements . 15
5.3.2 HBM tester qualification procedure . 15
5.4 Test fixture board qualification for socketed testers . 16
5.5 Routine waveform check requirements . 17
5.5.1 Standard routine waveform check description . 17
5.5.2 Waveform check frequency . 17
5.5.3 Alternate routine waveform capture procedure . 18
5.6 High voltage discharge path check . 18
5.6.1 Relay testers . 18
5.6.2 Non-relay testers . 18
5.7 Tester waveform records . 18
5.7.1 Tester and test fixture board qualification records . 18
5.7.2 Periodic waveform check records . 18
5.8 Safety. 19
5.8.1 Initial set-up . 19
5.8.2 Training . 19
5.8.3 Personnel safety . 19
6 Classification procedure . 19
6.1 Devices for classification . 19
6.2 Parametric and functional testing . 19
6.3 Device stressing . 19
6.4 Pin categorization . 20
6.4.1 General . 20
6.4.2 No connect pins . 20
6.4.3 Supply pins . 20
6.4.4 Non–supply pins . 21

60749-26 © IEC:2013 – 3 –
6.5 Pin groupings . 21
6.5.1 Supply pin groups . 21
6.5.2 Shorted non-supply pin groups . 22
6.6 Pin stress combinations . 22
6.6.1 Pin stress combination categorisation . 22
6.6.2 Non-supply and supply to supply combinations (1, 2, … N) . 24
6.6.3 Non-supply to non-supply combinations . 25
6.7 Testing after stressing . 26
7 Failure criteria . 26
8 Component classification . 26
Annex A (informative) HBM test method flow chart . 27
Annex B (informative) HBM test equipment parasitic properties . 30
Annex C (informative) Example of testing a product using Table 2, Table 3, or Table 2
with a two-pin HBM tester . 34
Annex D (informative) Examples of coupled non-supply pin pairs . 40

Fig
...