EN IEC 61189-5-501:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes

IEC 61189-5-501:2021 is used to quantify the deleterious effects of flux residues on surface insulation resistance (SIR) in the presence of moisture.

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen – Teil 5-501: Allgemeine Prüfverfahren für Materialien und Baugruppen – Prüfung des Oberflächenisolationswiderstands (SIR) von Lotflussmitteln

Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres structures d’interconnexion et ensembles - Partie 5-501: Méthodes d’essai générales pour les matériaux et les ensembles - Essais de résistance d’isolement en surface (RIS) des flux de brasage

L’IEC 61189-5-501:2021 est utilisée pour quantifier les effets délétères des résidus de flux sur la résistance d’isolement en surface (RIS) en présence d’humidité.

Preskusne metode za električne materiale, tiskane plošče ter druge povezovalne strukture in sestave - 5-501. del: Splošne preskusne metode za materiale in sestave - Preskušanje površinske izolacijske upornosti spajkalne paste

General Information

• Status: Published
• Publication Date: 04-Mar-2021
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 05-Mar-2021
• Completion Date: 05-Mar-2021
• Ref Project: SIST EN IEC 61189-5-501:2021 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes

Standards Content (Sample)

SLOVENSKI STANDARD
01-junij-2021
Preskusne metode za električne materiale, tiskane plošče ter druge povezovalne
strukture in sestave - 5-501. del: Splošne preskusne metode za materiale in
sestave - Preskušanje površinske izolacijske upornosti spajkalne paste
Test methods for electrical materials, printed boards and other interconnection structures
and assemblies - Part 5-501: General test methods for materials and assemblies -
Surface insulation resistance (SIR) testing of solder fluxes
Ta slovenski standard je istoveten z: EN IEC 61189-5-501:2021
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 61189-5-501

NORME EUROPÉENNE
EUROPÄISCHE NORM
March 2021
ICS 31.180
English Version
Test methods for electrical materials, printed boards and other
interconnection structures and assemblies - Part 5-501: General
test methods for materials and assemblies - Surface insulation
resistance (SIR) testing of solder fluxes
(IEC 61189-5-501:2021)
Méthodes d'essai pour les matériaux électriques, les cartes Prüfverfahren für Elektromaterialien, Leiterplatten und
imprimées et autres structures d'interconnexion et andere Verbindungsstrukturen und Baugruppen - Teil 5-
ensembles - Partie 5-501: Méthodes d'essai générales pour 501: Allgemeine Prüfverfahren für Materialien und
les matériaux et les ensembles - Essais de résistance Baugruppen - Prüfung des
d'isolement en surface (RIS) des flux de brasage Oberflächenisolationswiderstands (SIR) von Lotflussmitteln
(IEC 61189-5-501:2021) (IEC 61189-5-501:2021)
This European Standard was approved by CENELEC on 2021-03-02. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2021 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61189-5-501:2021 E

European foreword
The text of document 91/1645/CDV, future edition 1 of IEC 61189-5-501, prepared by IEC/TC 91
“Electronics assembly technology” was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61189-5-501:2021.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2021-12-02
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2024-03-02
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 61189-5-501:2021 was approved by CENELEC as a
European Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 61189-1 NOTE Harmonized as EN 61189-1
IEC 61189-3 NOTE Harmonized as EN 61189-3
IEC 61190-1-1 NOTE Harmonized as EN 61190-1-1
IEC 61190-1-2:2014 NOTE Harmonized as EN 61190-1-2:2014 (not modified)
IEC 61191-1 NOTE Harmonized as EN IEC 61191-1
ISO 9455-1 NOTE Harmonized as EN 29455-1
ISO 9455-2 NOTE Harmonized as EN ISO 9455-2
ISO 9455-17 NOTE Harmonized as EN ISO 9455-17
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the
relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60068-1 2013 Environmental testing - Part 1: EN 60068-1 2014
General and guidance
IEC 60068-2-58 - Environmental testing - Part 2–58: EN 60068-2-58 -
Tests - Test Td: Test methods for
solderability, resistance to dissolution
of metallization and to soldering heat
of surface mounting devices (SMD)
IEC 60068-2-67 - Environmental testing - Part 2–67: EN 60068-2-67 -
Tests - Test Cy: Damp heat, steady-
state, accelerated test primarily
intended for components
IEC 60068-2-78 - Environmental testing - Part 2–78: EN 60068-2-78 -
Tests - Test Cab: Damp heat, steady-
state
IEC 60194-2 - Printed boards design, manufacture - -
and assembly - Vocabulary - Part 2:
Common usage in electronic
technologies as well as printed board
and electronic assembly technologies
IEC 61189-5-504 - Test methods for electrical materials, EN -
printed boards and other IEC 61189-5-504
interconnection structures and
assemblies - Part 5–504: General test
methods for materials and assemblies
- Process ionic contamination testing
(PICT)
IEC/TR 61189-5-506 - Test methods for electrical materials, - -
printed boards and other
interconnection structures and
assemblies - Part 5–506: General test
methods for materials and assemblies
- An intercomparison evaluation to
implement the use of fine-pitch test
structures for surface insulation
resistance (SIR) testing of solder
fluxes in accordance with
IEC 61189-5-501
IEC 61190-1-3 - Attachment materials for electronic EN IEC 61190-1-3 -
assembly - Part 1–3: Requirements
for electronic grade solder alloys and
fluxed and non-fluxed solid solder for
electronic soldering applications
IEC 61249-2-7 - Materials for printed boards and other EN 61249-2-7 -
interconnecting structures - Part 2–7:
Reinforced base materials clad and
unclad - Epoxide woven E-glass
laminated sheet of defined
flammability (vertical burning test),
copper-clad
IEC 61189-5-501 ®
Edition 1.0 2021-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Test methods for electrical materials, printed boards and other interconnection

structures and assemblies –
Part 5-501: General test methods for materials and assemblies – Surface

insulation resistance (SIR) testing of solder fluxes

Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres

structures d’interconnexion et ensembles –

Partie 5-501: Méthodes d’essai générales pour les matériaux et les ensembles –

Essais de résistance d’isolement en surface (RIS) des flux de brasage

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-9289-1

– 2 – IEC 61189-5-501:2021 © IEC 2021
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 7
4 Equipment/Apparatus . 7
4.1 Measurement instrument . 7
4.2 Resistor verification coupon . 8
4.3 Damp heat chamber . 8
4.4 Additional apparatus . 9
4.4.1 Ionic contamination test system . 9
4.4.2 Drying oven . 9
4.4.3 Camera . 9
4.4.4 Backlight panel . 9
5 Test coupons . 9
5.1 General . 9
5.2 IEC TB144 (IPC B53) test coupon . 9
5.3 Laminate . 10
5.4 Coupons for testing . 10
5.5 Chamber controls . 10
5.6 Blank process controls . 11
5.7 Test conditions . 11
5.7.1 Fluxes not intended for cleaning . 11
5.7.2 Fluxes intended for cleaning . 11
5.8 Test duration. 11
5.9 Test voltage . 11
5.10 Connecting the test coupons . 11
5.10.1 General . 11
5.10.2 Connector/test rack . 11
5.10.3 Direct wiring . 12
5.11 Cable connection . 12
5.12 Coupon orientation in the chamber . 12
6 Coupon preparation . 13
6.1 General . 13
6.2 Coupon cleaning . 13
6.3 Identification . 13
6.4 Inspection . 13
6.5 Storage . 13
6.6 No clean fluxes . 14
6.7 Cleanable type fluxes . 14
6.8 Solder paste coupons . 14
6.8.1 Coupon preparation . 14
6.8.2 Cleaning of coupons . 15
6.9 Preparation of coupons for chamber . 15
7 Test procedure . 15
8 Measurements .
...