EN IEC 61190-1-3:2018
(Main)Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
IEC 61190-1-3:2017 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. This edition includes the following significant technical changes with respect to the previous edition: a) The maximum impurity level of Pb has been revised and the table of lead free solder alloys includes some additional lead free solder alloys.
Verbindungsmaterialien für Baugruppen der Elektronik – Teil 1-3: Anforderungen an Elektroniklote und an Festformlote mit oder ohne Flussmittel für das Löten von Elektronikprodukten
Matériaux de fixation pour les assemblages électroniques - Partie 1-3: Exigences relatives aux alliages à braser de catégorie électronique et brasure solide fluxée et non-fluxée pour les applications de brasage électronique
L'IEC 61190-1-3:2017 prescrit les exigences et méthodes d'essai pour les alliages à braser de catégorie électronique, les brasures en baguette, en ruban et en poudre fluxées et non fluxées et les pâtes à braser, pour les applications de brasage électronique et pour les brasures de catégorie électronique "spéciales". Pour les spécifications génériques relatives aux alliages et aux flux à braser, voir l'ISO 9453. Le présent document est un document de contrôle de la qualité et n'a pas pour objet de s'intéresser directement à la performance du matériau au cours du procédé de fabrication. La présente édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente: a) Le niveau maximal d'impureté du plomb a été révisé et le tableau d'alliages à braser sans plomb qui comporte des alliages à braser sans plomb supplémentaires.
Povezovalni materiali za elektronske sestave - 1-3. del: Zahteve za spajkalne zlitine ter za spajkalne žice s spajkalno tekočino in brez nje za uporabo v elektroniki
Ta del standarda IEC 61190 predpisuje zahteve in preskusne metode za spajkalne zlitine, spajkalne palice, trakove in praške s talilom ali brez njega ter spajkalne paste za uporabo v elektroniki in »posebne« spajke. Za splošne specifikacije spajkalnih zlitin in talil glej standard ISO 9453. Ta dokument se uporablja kot dokument za nadzor kakovosti in ni namenjen neposredni povezavi z zmogljivostjo materiala med proizvodnim postopkom.
Posebne spajke za uporabo v elektroniki vključujejo vse spajke, ki niso povsem skladne z zahtevami standardnih spajkalnih zlitin in spajkalnih materialov, ki so navedeni v tem delu standarda. Primeri posebnih spajk vključujejo anode, ingote, predoblikovance, palice, zaključene s kljuko in ušesom, ter spajkalne praške z več zlitinami.
General Information
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Standards Content (Sample)
SLOVENSKI STANDARD
01-oktober-2018
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SIST EN 61190-1-3:2007
SIST EN 61190-1-3:2007/A1:2010
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Attachment materials for electronic assembly - Part 1-3: Requirements for electronic
grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering
applications
Ta slovenski standard je istoveten z: EN IEC 61190-1-3:2018
ICS:
25.160.50 Trdo in mehko lotanje Brazing and soldering
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN IEC 61190-1-3
NORME EUROPÉENNE
EUROPÄISCHE NORM
March 2018
ICS 31.190 Supersedes EN 61190-1-3:2007
English Version
Attachment materials for electronic assembly - Part 1-3:
Requirements for electronic grade solder alloys and fluxed and
non-fluxed solid solder for electronic soldering applications
(IEC 61190-1-3:2017)
Matériaux de fixation pour les assemblages électroniques - Verbindungsmaterialien für Baugruppen der Elektronik - Teil
Partie 1-3: Exigences relatives aux alliages à braser de 1-3: Anforderungen an Elektroniklote und an Festformlote
catégorie électronique et brasure solide fluxée et non-fluxée mit oder ohne Flussmittel für das Löten von
pour les applications de brasage électronique Elektronikprodukten
(IEC 61190-1-3:2017) (IEC 61190-1-3:2017)
This European Standard was approved by CENELEC on 2018-01-17. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2018 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61190-1-3:2018 E
European foreword
The text of document 91/1468/FDIS, future edition 3 of IEC 61190-1-3, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61190-1-3:2018.
The following dates are fixed:
(dop) 2018-10-17
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2021-01-17
standards conflicting with the
document have to be withdrawn
This document supersedes EN 61190-1-3:2017 and EN 61190-1-3:2017/A1:2010.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 61190-1-3:2017 was approved by CENELEC as a
European Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 61189-5 (series) NOTE Harmonized as EN 61189-5 (series).
IEC 61189-6 NOTE Harmonized as EN 61189-6
ISO 9453 NOTE Harmonized as EN ISO 9453.
ISO 9454-1 NOTE Harmonized as EN ISO 9454-1.
ISO 9454-2 NOTE Harmonized as EN ISO 9454-2.
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60194 2015 Printed board design, manufacture and - -
assembly - Terms and definitions
IEC 61189-5-2 2015 Test methods for electrical materials, EN 61189-5-2 2015
interconnection structures and assemblies
- Part 5-2: Test methods for printed board
assemblies: Soldering flux
IEC 61189-5-3 2015 Test methods for electrical materials, EN 61189-5-3 2015
interconnection structures and assemblies
- Part 5-3: Test methods for printed board
assemblies: Soldering paste
IEC 61189-5-4 2015 Test methods for electrical materials, EN 61189-5-4 2015
interconnection structures and assemblies
- Part 5-4: Test methods for printed board
assemblies: Solder alloys and fluxed and
non-fluxed solid wire
IEC 61190-1-1 2002 Attachment materials for electronic EN 61190-1-1 2002
assembly - Part 1-1: Requirements for
soldering fluxes for high-quality
interconnections in electronics assembly
IEC 61190-1-2 - Attachment materials for electronic EN 61190-1-2 -
assembly - Part 1-2: Requirements for
soldering pastes for high-quality
interconnects in electronics assembly
IEC 61190-1-3 ®
Edition 3.0 2017-12
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Attachment materials for electronic assembly –
Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-
fluxed solid solder for electronic soldering applications
Matériaux de fixation pour les assemblages électroniques –
Partie 1-3: Exigences relatives aux alliages à braser de catégorie électronique et
brasure solide fluxée et non-fluxée pour les applications de brasage
électronique
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.190 ISBN 978-2-8322-5127-0
– 2 – IEC 61190-1-3:2017 © IEC 2017
CONTENTS
FOREWORD . 5
INTRODUCTION . 7
1 Scope . 8
2 Normative references . 8
3 Terms and definitions . 8
4 Classification . 11
4.1 General . 11
4.2 Alloy composition . 11
4.3 Solder form . 12
4.4 Flux type . 12
4.5 Flux percentage and metal content . 13
4.6 Other characteristics . 14
5 Requirements . 14
5.1 Materials . 14
5.2 Alloys . 14
5.2.1 General . 14
5.2.2 Variation D alloys . 14
5.3 Solder forms . 15
5.3.1 General . 15
5.3.2 Bar solder . 15
5.3.3 Wire solder . 15
5.3.4 Ribbon solder . 15
5.3.5 Solder powder . 15
5.3.6 Special solder . 16
5.4 Flux type and form . 16
5.4.1 General . 16
5.4.2 Flux percentage . 16
5.4.3 Solder cores . 17
5.4.4 Solder coatings . 17
5.5 Flux residue dryness . 17
5.6 Spitting . 17
5.7 Solder pool . 17
5.8 Labelling for product identification. 17
5.9 Workmanship . 18
6 Quality assurance provisions . 18
6.1 Responsibility for inspection and compliance . 18
6.1.1 General . 18
6.1.2 Quality assurance programme . 18
6.1.3 Test equipment and inspection facilities . 18
6.1.4 Inspection conditions . 18
6.2 Classification of inspections . 18
6.3 Inspection of materials . 23
6.4 Qualification inspections . 23
6.4.1 General . 23
6.4.2 Sample size . 23
6.4.3 Inspection routine . 23
IEC 61190-1-3:2017 © IEC 2017 – 3 –
6.5 Quality conformance . 24
6.5.1 General . 24
6.5.2 Inspection routine . 24
6.5.3 Sampling plan . 24
6.5.4 Rejected lots . 24
6.6 Preparation of solder alloy for test . 24
6.6.1 General . 24
6.6.2 Wire solder up to approximately 6 mm diameter.
...
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