EN 60068-2-58:2015

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

IEC 60068-2-58:2015 outlines test Td, applicable to surface mounting devices (SMD). This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow systems. The solder bath method is applicable to SMDs designed for flow soldering and SMDs designed for reflow soldering when the solder bath (dipping) method is appropriate. The reflow method is applicable to the SMD designed for reflow soldering, to determine the suitability of SMDs for reflow soldering and when the solder bath (dipping) method is not appropriate. This edition includes the following significant technical changes with respect to the previous edition: - the addition of Sn-Bi low temperature solder alloy; - the addition of several reflow test conditions in Table 7 - Resistance to soldering heat - Test conditions and severity, reflow method; - introduction of reflow test method for Test Td3: Dewetting and resistance to dissolution of metallization; - implementation of guidance for the choice of a test severity in Clause B.3.

Umweltprüfungen - Teil 2-58: Prüfungen - Prüfung Td: Prüfverfahren für Lötbarkeit, Widerstandsfähigkeit gegenüber Auflösen der Metallisierung und Lötwärmebeständigkeit bei oberflächenmontierbaren Bauelementen (SMD)

Essais d'environnement - Partie 2-58: Essais - Essai Td: Méthodes d'essai de la soudabilité, résistance de la métallisation à la dissolution et résistance à la chaleur de brasage des composants pour montage en surface (CMS)

L'IEC 60068-2-58:2015 décrit l'essai Td applicable aux composants pour montage en surface (CMS). La présente norme fournit des procédures pour déterminer la brasabilité et la résistance à la chaleur de brasage des composants dans les applications qui utilisent des alliages de brasure, qui sont des alliages étain-plomb eutectiques ou quasi eutectiques (Pb), ou des alliages sans plomb. Les procédures utilisent soit une méthode du bain de brasage, soit une méthode de brasage par fusion, et sont applicables uniquement aux éprouvettes ou produits conçus pour résister à une immersion de courte durée dans une brasure fondue ou à une exposition limitée aux systèmes de brasage par fusion. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente: - ajout d'un alliage de brasure Sn-Bi à faible température; - ajout de plusieurs conditions d'essai de brasage par fusion dans le Tableau 7 - Résistance à la chaleur de brasage - Conditions d'essai et sévérité, méthode de brasage par fusion; - introduction d'une méthode d'essai de brasage par fusion pour l'essai Td3: Démouillage et résistance de la métallisation à la dissolution; - application de lignes directrices pour le choix de la sévérité d'essai à l'article B.3.

Okoljsko preskušanje - 2-58. del: Preskusi - Preskus Td: preskusna metoda za spajkanje, odpornost površinsko montiranih komponent (SMD) proti razkrajanju pokovinjenja in vročini spajke

Ta del standarda IEC 60068 opisuje preskus Td, ki velja za površinsko montirane komponente (SMD). Ta standard določa postopke za določanje spajkanja in odpornosti naprav proti vročini spajke pri uporabi zlitin za spajke, ki so evtektične zlitine, skoraj evtektične zlitine kositer-svinec ali zlitine brez svinca.
V postopkih se uporablja staljena spajkalna zlitina ali metoda pretaljevanja z vročim zrakom ali v dušikovi atmosferi, veljajo pa samo za preskušance ali izdelke, ki so zasnovani, da zdržijo kratkotrajno potopitev v staljeno spajkalno zlitino ali omejeno izpostavljenost sistemom za pretaljevanje z vročim zrakom.
Metoda staljene spajkalne zlitine velja za površinsko montirane komponente, zasnovane za valovno spajkanje, in površinsko montirane komponente, zasnovane za pretaljevanje z vročim zrakom ali v dušikovi atmosferi, ko je primerna metoda s staljeno spajkalno zlitino. Metoda pretaljevanja z vročim zrakom ali v dušikovi atmosferi velja za površinsko montirane komponente, zasnovane za pretaljevanje z vročim zrakom ali v dušikovi atmosferi, za določanje primernosti površinsko montiranih komponent za pretaljevanje z vročim zrakom ali v dušikovi atmosferi, in kadar metoda s staljeno spajkalno zlitino ni primerna.
Cilj tega standarda je zagotoviti spajkanje elektrod ali končnikov komponent. Preskusne metode zagotavljajo tudi, da je telo komponente odporno proti toplotni obremenitvi, ki ji je izpostavljeno med spajkanjem.

General Information

• Status: Published
• Publication Date: 07-May-2015
• Withdrawal Date: 30-Apr-2018
• ICS: 19.040 - Environmental testing
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 08-May-2015
• Completion Date: 08-May-2015
• Ref Project: SIST EN 60068-2-58:2015 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Relations

• Replaces: EN 60068-2-58:2004 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
• Effective Date: 28-Jan-2023
• Amended By: EN 60068-2-58:2015/A1:2018 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
• Effective Date: 23-Jan-2023

Standards Content (Sample)

SLOVENSKI STANDARD
01-september-2015
1DGRPHãþD
SIST EN 60068-2-58:2005
2NROMVNRSUHVNXãDQMHGHO3UHVNXVL3UHVNXV7GSUHVNXVQDPHWRGD]D
VSDMNDQMHRGSRUQRVWSRYUãLQVNRPRQWLUDQLKNRPSRQHQW60'SURWLUD]NUDMDQMX
SRNRYLQMHQMDLQYURþLQLVSDMNH
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability,
resistance to dissolution of metallization and to soldering heat of surface mounting
devices (SMD)
Umweltprüfungen - Teil 2-58: Prüfungen - Prüfung Td: Prüfverfahren für Lötbarkeit,
Widerstandsfähigkeit gegenüber Auflösen der Metallisierung und Lötwärmebeständigkeit
bei oberflächenmontierbaren Bauelementen (SMD)
Essais d'environnement - Partie 2-58: Essais - Essai Td: Méthodes d'essai de la
soudabilité, résistance de la métallisation à la dissolution et résistance à la chaleur de
brasage des composants pour montage en surface (CMS)
Ta slovenski standard je istoveten z: EN 60068-2-58:2015
ICS:
19.040 Preskušanje v zvezi z Environmental testing
okoljem
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN 60068-2-58

NORME EUROPÉENNE
EUROPÄISCHE NORM
May 2015
ICS 19.040; 31.190 Supersedes EN 60068-2-58:2004
English Version
Environmental testing - Part 2-58: Tests - Test Td: Test methods
for solderability, resistance to dissolution of metallization and to
soldering heat of surface mounting devices (SMD)
(IEC 60068-2-58:2015)
Essais d'environnement - Partie 2-58: Essais - Essai Td: Umweltprüfungen - Teil 2-58: Prüfungen - Prüfung Td:
Méthodes d'essai de la soudabilité, résistance de la Prüfverfahren für Lötbarkeit, Widerstandsfähigkeit
métallisation à la dissolution et résistance à la chaleur de gegenüber Auflösen der Metallisierung und
brasage des composants pour montage en surface (CMS) Lötwärmebeständigkeit bei oberflächenmontierbaren
(IEC 60068-2-58:2015) Bauelementen (SMD)
(IEC 60068-2-58:2015)
This European Standard was approved by CENELEC on 2015-05-01. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2015 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 60068-2-58:2015 E
Foreword
The text of document 91/1222/FDIS, future edition 4 of IEC 60068-2-58, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN 60068-2-58:2015.
The following dates are fixed:
(dop) 2016-02-01
• latest date by which the document has to be implemented at
national level by publication of an identical national
standard or by endorsement
(dow) 2018-05-01
• latest date by which the national standards conflicting with
the document have to be withdrawn

This document supersedes EN 60068-2-58:2004.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.
Endorsement notice
The text of the International Standard IEC 60068-2-58:2015 was approved by CENELEC as a
European Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60068-2-54 NOTE Harmonized as EN 60068-2-54.
IEC 60068-2-69 NOTE Harmonized as EN 60068-2-69.
IEC 60749-20 NOTE Harmonized as EN 60749-20.
IEC 61760-3 NOTE Harmonized as EN 61760-3.
1)
IEC 61760-4 NOTE Harmonized as EN 61760-4 .

1) To be published.
- 3 - EN 60068-2-58:2015
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.
NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is
available here: www.cenelec.eu.

Publication Year Title EN/HD Year
IEC 60068-1 -  Environmental testing - EN 60068-1 -
Part 1: General and guidance
IEC 60068-2-20 2008 Environmental testing - EN 60068-2-20 2008
Part 2-20: Tests - Test T: Test methods for
solderability and resistance to soldering
heat of devices with leads
IEC 60194 -  Printed board design, manufacture and EN 60194 -
assembly - Terms and definitions
IEC 61190-1-1 -  Attachment materials for electronic EN 61190-1-1 -
assembly -
Part 1-1: Requirements for soldering fluxes
for high-quality interconnections in
electronics assembly
IEC 61190-1-2 2014 Attachment materials for electronic EN 61190-1-2 2014
assembly -
Part 1-2: Requirements for soldering
pastes for high-quality interconnects in
electronics assembly
IEC 61190-1-3 2007 Attachment materials for electronic EN 61190-1-3 2007
assembly -
+ A1 2010 + A1 2010
Part 1-3: Requirements for electronic grade
solder alloys and fluxed and non-fluxed
solid solders for electronic soldering
applications
IEC 61191-2 -  Printed board assemblies - EN 61191-2 -
Part 2: Sectional specification -
Requirements for surface mount soldered
assemblies
Publication Year Title EN/HD Year
IEC 61249-2-22 -  Materials for printed boards and other EN 61249-2-22 -
interconnecting structures -
Part 2-22: Reinforced base materials, clad
and unclad - Modified non-halogenated
epoxide woven E-glass laminated sheets of
defined flammability (vertical burning test),
copper-clad
IEC 61249-2-35 -  Materials for printed boards and other EN 61249-2-35 -
interconnecting structures -
Part 2-35: Reinforced base materials, clad
and unclad - Modified epoxide woven
E-glass laminate sheets of defined
flammability (vertical burning test), copper-
clad for lead-free assembly
IEC 61760-1 -  Surface mounting technology - EN 61760-1 -
Part 1: Standard method for the
specification of surface mounting
components (SMDs)
ISO 9454-2 1998 Soft soldering fluxes - Classification and EN ISO 9454-2 2000
requirements -
Part 2: Performance requirements

IEC 60068-2-58 ®
Edition 4.0 2015-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Environmental testing –
Part 2-58: Tests – Test Td: Test methods for solderability, resistance to

dissolution of metallization and to soldering heat of surface mounting devices

(SMD)
Essais d’environnement –
Partie 2-58: Essais – Essai Td: Méthodes d’essai de la soudabilité, résistance de

la métallisation à la dissolution et résistance à la chaleur de brasage des

composants pour montage en surface (CMS)

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 19.040; 31.190 ISBN 978-2-8322-2436-6

– 2 – IEC 60068-2-58:2015 © IEC 2015
CONTENTS
FOREWORD . 5
1 Scope . 7
2 Normative references. 7
3 Terms and definitions . 8
4 Grouping of soldering processes and related test severities . 9
5 Test equipment . 10
5.1 Solder bath . 10
5.2 Reflow equipment . 10
6 Test Td : Solderability of terminations . 11
6.1 Object and general description of the test . 11
6.2 Specimen preparation . 11
6.3 Accelerated ageing . 11
6.4 Initial measurements . 11
6.5 Method 1: Solder bath . 11
6.5.1 Solder bath . 11
6.5.2 Solder and flux . 11
6.5.3 Test procedure and conditions . 12
6.6 Method 2: Reflow . 14
6.6.1 Reflow equipment . 14
6.6.2 Solder paste . 14
6.6.3 Test substrates . 14
6.6.4 Test procedure . 14
6.6.5 Reflow temperature profile for Test Td . 15
6.6.6 Test conditions . 16
7 Test Td : Resistance to soldering heat . 16
7.1 Object and general description of the test . 16
7.2 Specimen preparation . 16
7.3 Preconditioning . 16
7.4 Initial measurements . 16
7.5 Method 1: Solder bath . 17
7.5.1 Solder bath . 17
7.5.2 Solder and flux . 17
7.5.3 Test procedure and conditions . 17
7.6 Method 2: Reflow . 19
7.6.1 Reflow equipment . 19
7.6.2 Solder paste . 19
7.6.3 Test substrates . 19
7.6.4 Test procedure and conditions . 19
8 Test Td : Dewetting and resistance to dissolution of metallization . 21
8.1 Object and general description of the test . 21
8.2 Specimen preparation . 21
8.3 Initial measurements . 22
8.4 Method 1: Solder bath . 22
8.4.1 Solder bath . 22
8.4.2 Solder and flux .
...