EN IEC 60286-3:2022
(Main)Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).
Gurtung und Magazinierung von Bauelementen für automatische Verarbeitung - Teil 3: Gurtung von oberflächenmontierbaren Bauelementen auf Endlosgurten
Emballage de composants pour opérations automatisées - Partie 3: Emballage des composants pour montage en surface en bandes continues
L’IEC 60286-3:2022 s’applique à la mise sur bande des composants électroniques sans fils de sortie ou avec tronçons de sortie destinés à être connectés à des circuits électroniques. Elle fournit uniquement les dimensions essentielles pour la mise sur bande des composants destinés aux opérations susmentionnées. Le présent document inclut également des exigences relatives à l’emballage de produits à puce isolée incluant puces nues et puces à contact (puces retournées). Cette édition inclut les modifications techniques majeures suivantes par rapport à l’édition précédente:
ajout de termes et définitions;
ajout d’un tableau de classification des symboles relatifs au diamètre du trou d’entraînement et à la distance entre le centre de l’orifice de la bobine et le centre du trou d’entraînement;
ajout du trou d’entraînement par rapport à la bobine (facultatif);
révision des tolérances du diamètre de l’orifice de la bobine;
révision des tolérances de dimension de la largeur de la bande d’entraînement de 72 mm;
ajout de l’Annexe B (informative);
ajout de la taille de composant 0201M.
Pakiranje komponent za avtomatsko obdelavo - 3. del: Pakiranje komponent za površinsko montažo na neprekinjenih trakovih (IEC 60286-3:2022)
Ta del standarda IEC 60286 se uporablja za tračno pakiranje elektronskih komponent brez vodov ali ostankov vodov, namenjenih za povezavo z elektronskimi vezji. Vključuje samo tiste dimenzije, ki so bistvene za tračno pakiranje komponent, predvidenih za zgoraj navedene namene.
Ta dokument vključuje tudi zahteve glede pakiranja proizvodov s singularnimi polprevodniškimi integriranimi vezji, vključno s tistimi brez ohišja in tistimi z izboklinami (»flip chip«).
General Information
Relations
Standards Content (Sample)
SLOVENSKI STANDARD
01-februar-2023
Nadomešča:
SIST EN IEC 60286-3:2019
Pakiranje komponent za avtomatsko obdelavo - 3. del: Pakiranje komponent za
površinsko montažo na neprekinjenih trakovih (IEC 60286-3:2022)
Packaging of components for automatic handling - Part 3: Packaging of surface mount
components on continuous tapes (IEC 60286-3:2022)
Gurtung und Magazinierung von Bauelementen für automatische Verarbeitung - Teil 3:
Gurtung von oberflächenmontierbaren Bauelementen auf Endlosgurten (IEC 60286-
3:2022)
Emballage de composants pour opérations automatisées - Partie 3: Emballage des
composants pour montage en surface en bandes continues (IEC 60286-3:2022)
Ta slovenski standard je istoveten z: EN IEC 60286-3:2022
ICS:
31.020 Elektronske komponente na Electronic components in
splošno general
55.060 Tulci. Vretena Spools. Bobbins
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN IEC 60286-3
NORME EUROPÉENNE
EUROPÄISCHE NORM December 2022
ICS 31.020; 31.240 Supersedes EN IEC 60286-3:2019
English Version
Packaging of components for automatic handling - Part 3:
Packaging of surface mount components on continuous tapes
(IEC 60286-3:2022)
Emballage de composants pour opérations automatisées - Gurtung und Magazinierung von Bauelementen für
Partie 3: Emballage des composants pour montage en automatische Verarbeitung - Teil 3: Gurtung von
surface en bandes continues oberflächenmontierbaren Bauelementen auf Endlosgurten
(IEC 60286-3:2022) (IEC 60286-3:2022)
This European Standard was approved by CENELEC on 2022-12-20. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2022 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 60286-3:2022 E
European foreword
The text of document 40/2972/FDIS, future edition 7 of IEC 60286-3, prepared by IEC/TC 40
"Capacitors and resistors for electronic equipment" was submitted to the IEC-CENELEC parallel vote
and approved by CENELEC as EN IEC 60286-3:2022.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2023-09-20
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2025-12-20
document have to be withdrawn
This document supersedes EN IEC 60286-3:2019 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 60286-3:2022 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standard indicated:
IEC 60068-1 NOTE Harmonized as EN 60068-1
IEC 60068-2-45 NOTE Harmonized as EN 60068-2-45
IEC 61340 (series) NOTE Harmonized as EN IEC 61340 (series)
IEC/TR 62258-3 NOTE Harmonized as CLC/TR 62258-3
ISO 11469 NOTE Harmonized as EN ISO 11469
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the
relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60191-2 - Mechanical standardization of - -
semiconductor devices - Part 2:
Dimensions
IEC 61340-4-5 - Electrostatics - Part 4-5: Standard test EN IEC 61340-4-5 -
methods for specific applications - Methods
for characterizing the electrostatic
protection of footwear and flooring in
combination with a person
IEC 61340-4-6 - Electrostatics - Part 4-6: Standard test EN 61340-4-6 -
methods for specific applications - Wrist
straps
IEC 61340-4-7 - Electrostatics - Part 4-7: Standard test EN 61340-4-7 -
methods for specific applications -
Ionization
IEC 61340-4-9 - Electrostatics - Part 4-9: Standard test EN 61340-4-9 -
methods for specific applications -
Garments
IEC 60286-3 ®
Edition 7.0 2022-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Packaging of components for automatic handling –
Part 3: Packaging of surface mount components on continuous tapes
Emballage de composants pour opérations automatisées –
Partie 3: Emballage des composants pour montage en surface en bandes
continues
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.020; 31.240 ISBN 978-2-8322-5899-6
– 2 – IEC 60286-3:2022 © IEC 2022
CONTENTS
FOREWORD . 6
INTRODUCTION . 8
1 Scope . 9
2 Normative references . 9
3 Terms, definitions and symbols. 9
3.1 Terms and definitions . 9
3.2 Symbols . 11
4 Structure of the specification . 13
5 Dimensional requirements for taping . 13
5.1 Component cavity positioning requirements . 13
5.1.1 Requirements for type 1a, type 1b, type 2a, type 2b and type 3 . 13
5.1.2 Requirements for type 4 . 13
5.2 Component cavity dimension requirements (type 1a, type 1b, type 2a, type
2b and type 3) . 14
5.3 Type 1a – Punched carrier tape, with top and bottom cover tape (tape
widths: 8 mm and 12 mm) . 14
5.4 Type 1b – Pressed carrier tape, with top cover tape (tape width: 8 mm) . 17
5.5 Type 2a – Blister carrier tape, with single round sprocket holes and tape
pitches down to 2 mm (tape widths: 8 mm, 12 mm, 16 mm and 24 mm) . 19
5.6 Type 2b – Blister carrier tape, with single round sprocket holes and with
1mm tape pitch (tape widths: 4 mm) . 21
5.7 Type 3 – Blister carrier tape, with double sprocket holes (32 mm to 200 mm). 23
5.8 Type 4 – Adhesive-backed punched plastic carrier tape for singled bare die
and other surface mount components (8 mm, 12 mm, 16 mm and 24 mm) . 26
6 Polarity and orientation requirements of components in the tape . 28
6.1 Requirements for all types . 28
6.2 Specific requirements for type 1a . 29
6.3 Specific requirements for type 4 . 29
7 Carrier tape requirements . 29
7.1 Taping materials . 29
7.2 Minimum bending radius (for all types) . 29
7.3 Camber . 30
8 Cover tape requirements (for type 1a, type 1b, type 2a, type 2b and type 3) . 31
9 Component taping and additional tape requirements. 33
9.1 All types . 33
9.2 Specific requirements for type 1b . 33
9.3 Specific tape requirements for type 2b . 33
9.4 Specific requirement for type 4 . 34
9.4.1 General . 34
9.4.2 Coordinate system . 34
9.4.3 Component positioning and lateral displacement . 35
9.5 Specific requirements for tapes containing die products . 36
9.5.1 General . 36
9.5.2 Tape design for tapes containing die products . 36
9.5.3 Cleanliness . 36
9.5.4 Die lateral movement (type 1a, type 2a and type 2b) . 37
IEC 60286-3:2022 © IEC 2022 – 3 –
10 Reel requirements . 37
10.1 Dimensions . 37
10.1.1 General . 37
10.1.2 Reel dimensions . 37
10.1.3 Reel hole dimensions . 38
10.1.4 Drive hole dimensions (optional) . 39
10.2 Marking . 40
11 Tape reeling requirements . 41
11.1 All types . 41
11.2 Specific requirements for type 1a . 41
11.3 Specific requirements for type 4 . 41
11.4 Leader and trailer tape . 41
11.4.1 General . 41
11.4.2 Leader . 42
11.4.3 Trailer . 42
11.5 Recycling .
...
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