EN IEC 61760-1:2026
(Main)Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
General Information
- Abstract
This part of IEC 61760 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set of process conditions and related test conditions to be considered when compiling component specifications.
The objective of this document is to ensure that a wide variety of SMDs can be subjected to the same placement, mounting and subsequent processes (e.g. cleaning, inspection) during assembly. This document defines tests and requirements that are included in any SMD component’s general, sectional or detail specification. In addition, this document provides component users and manufacturers with a reference set of typical process conditions used in surface mounting technology.
Some of the requirements for component specifications in this document are also applicable to components with leads intended for mounting on a circuit board, including solderless interconnection technology. Cases for which this is appropriate are indicated in the relevant subclauses.
NOTE Solderless interconnection technology refers to a mounting method which is not part of the surface-mounting process and the components do not undergo a soldering operation. Such components are included in this document because the mounting of components for solderless interconnection commonly occurs after the mounting of SMDs.
- Status
- Published
- Publication Date
- 20-Aug-2026
- Technical Committee
- CLC/SR 91 - Electronics assembly technology
- Current Stage
- 6060 - Document made available - Publishing
- Start Date
- 21-Aug-2026
- Due Date
- 31-Dec-2025
- Completion Date
- 21-Aug-2026
Overview
EN IEC 61760-1:2026 provides a comprehensive standard method for the specification of surface mounting components (SMDs) utilized within surface mounting technology (SMT). Developed by CLC and based on international consensus under IEC TC 91, this standard establishes uniform requirements for component design, performance, assembly, marking, and testing. By defining a consistent framework for SMD specifications, EN IEC 61760-1:2026 supports compatibility across the electronics industry, facilitates reliable electronic assemblies, and underpins interoperability for global supply chains.
Manufacturers, designers, procurement specialists, and quality assurance professionals rely on this standard to ensure SMDs meet relevant benchmarks for quality, reliability, and compliance.
Key Topics
EN IEC 61760-1:2026 encompasses several crucial areas for the standardization and practical application of surface mounting components:
- Component Specification Requirements: Provides requirements for general, sectional, and detail specification of SMDs, addressing mechanical, electrical, and environmental factors critical to performance and reliability.
- Component Classification: Defines electronic assemblies into three general end-product levels (A: general electronics, B: dedicated service electronics, C: high-performance electronics) to match application needs.
- Marking and Labelling: Sets guidelines for component identification, including terminal finishes and polarity, to support traceability and ease of assembly.
- Outline and Design: Covers requirements for dimensions, drawing standards, termination design, and pick-up areas that affect automated assembly processes.
- Assembly Process Considerations: Specifies requirements for placement, mounting, cleaning, post-assembly processes, and handling of SMDs, ensuring compatibility with modern manufacturing lines.
- Mounting Methods: Details process conditions and requirements for mounting methods such as soldering, conductive glue bonding, sintering, and solderless interconnection.
- Reliability and Compliance: Outlines requirements for component robustness, material declaration, environmental compliance, and supply chain considerations.
- Packaging and Transportation: Includes requirements for packaging, labelling, storage, and transport to maintain SMD integrity.
Applications
This standard is essential for:
- Electronics Manufacturers: Ensuring surface mount components conform to industry-recognized specifications, reducing risk of assembly defects and field failures.
- Design Engineers: Utilizing standardized component data to accurately design and layout PCBs for high yield in surface mount assembly processes.
- Quality Assurance: Aligning testing procedures and acceptance criteria for inspection and qualification of SMDs.
- Procurement: Specifying and sourcing components that are compliant, ensuring seamless integration and reducing supply disruptions.
- Product Compliance Teams: Demonstrating adherence to international standards, supporting certifications and market access.
By applying EN IEC 61760-1:2026, organizations enhance product quality, support environmental responsibility, and achieve global compatibility in electronics manufacturing.
Related Standards
For broader compliance and seamless workflow integration, EN IEC 61760-1:2026 references and is supported by several related standards:
- IEC 60068 Series - Environmental testing procedures for electronic components
- IEC 60191 and 60194 Series - Semiconductor device outlines and PCB terminology
- IEC 60286 Series - Packaging standards for automatic component handling
- IEC 60664-1 - Insulation coordination for low-voltage electronic equipment
- IEC 61340 Series - Electrostatic protection requirements and classifications
- IEC 61760-2 and 61760-4 - Guidelines for transportation, storage, and handling of SMDs
- ISO 14040, ISO 14044 - Life cycle assessment for environmental management
- IPC-2221, IPC-7711/7721 - Printed board design, rework, and repair standards
- IEC 62474 - Material declaration requirements for electrotechnical products
Adopting EN IEC 61760-1:2026 together with these referenced standards ensures thorough compliance, reliable electronic assemblies, and robust quality management in surface mounting technology.
Relations
- Effective Date
- 04-Apr-2023
- Effective Date
- 04-Aug-2026
- Effective Date
- 04-Aug-2026
- Effective Date
- 04-Aug-2026
- Effective Date
- 04-Aug-2026
- Effective Date
- 04-Aug-2026
- Effective Date
- 04-Aug-2026
- Effective Date
- 04-Aug-2026
- Effective Date
- 04-Aug-2026
- Effective Date
- 28-Jul-2026
- Effective Date
- 21-Jul-2026
- Effective Date
- 21-Jul-2026
- Effective Date
- 21-Jul-2026
- Effective Date
- 21-Jul-2026
- Effective Date
- 21-Jul-2026
Frequently Asked Questions
EN IEC 61760-1:2026 is a standard published by CLC. Its full title is "Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)". This standard covers: This part of IEC 61760 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set of process conditions and related test conditions to be considered when compiling component specifications. The objective of this document is to ensure that a wide variety of SMDs can be subjected to the same placement, mounting and subsequent processes (e.g. cleaning, inspection) during assembly. This document defines tests and requirements that are included in any SMD component’s general, sectional or detail specification. In addition, this document provides component users and manufacturers with a reference set of typical process conditions used in surface mounting technology. Some of the requirements for component specifications in this document are also applicable to components with leads intended for mounting on a circuit board, including solderless interconnection technology. Cases for which this is appropriate are indicated in the relevant subclauses. NOTE Solderless interconnection technology refers to a mounting method which is not part of the surface-mounting process and the components do not undergo a soldering operation. Such components are included in this document because the mounting of components for solderless interconnection commonly occurs after the mounting of SMDs.
This part of IEC 61760 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set of process conditions and related test conditions to be considered when compiling component specifications. The objective of this document is to ensure that a wide variety of SMDs can be subjected to the same placement, mounting and subsequent processes (e.g. cleaning, inspection) during assembly. This document defines tests and requirements that are included in any SMD component’s general, sectional or detail specification. In addition, this document provides component users and manufacturers with a reference set of typical process conditions used in surface mounting technology. Some of the requirements for component specifications in this document are also applicable to components with leads intended for mounting on a circuit board, including solderless interconnection technology. Cases for which this is appropriate are indicated in the relevant subclauses. NOTE Solderless interconnection technology refers to a mounting method which is not part of the surface-mounting process and the components do not undergo a soldering operation. Such components are included in this document because the mounting of components for solderless interconnection commonly occurs after the mounting of SMDs.
EN IEC 61760-1:2026 is classified under the following ICS (International Classification for Standards) categories: 31.240 - Mechanical structures for electronic equipment. The ICS classification helps identify the subject area and facilitates finding related standards.
EN IEC 61760-1:2026 has the following relationships with other standards: It is inter standard links to EN IEC 61760-1:2020, EN IEC 60749-20:2020, EN IEC 61340-5-1:2024, EN 60286-6:2004, EN IEC 60664-1:2020, EN 62090:2017, EN IEC 61188-6-4:2019, EN IEC 61340-5-3:2022, EN IEC 61760-2:2021, EN IEC 61760-4:2026, EN IEC 60068-2-2:2025, EN IEC 60068-2-88:2025, EN IEC 60286-3:2022, EN IEC 60068-2-21:2021, EN 60068-2-58:2015. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.
EN IEC 61760-1:2026 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.
Standards Content (Sample)
SLOVENSKI STANDARD
01-oktober-2026
Nadomešča:
SIST EN IEC 61760-1:2022
Tehnologija površinske montaže - 1. del: Standardna metoda za specifikacijo
komponent za površinsko montažo (SMDs)
Surface mounting technology - Part 1: Standard method for the specification of surface
mounting components (SMDs).
Oberflächenmontagetechnik - Teil 1: Genormtes Verfahren zur Spezifizierung
oberflächenmontierbarer Bauelemente (SMDs)
Technique du montage en surface - Partie 1: Méthode normalisée pour la spécification
des composants pour montage en surface (CMS)
Ta slovenski standard je istoveten z: EN IEC 61760-1:2026
ICS:
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN IEC 61760-1
NORME EUROPÉENNE
EUROPÄISCHE NORM August 2026
ICS 31.240 Supersedes EN IEC 61760-1:2020
English Version
Surface mounting technology - Part 1: Standard method for the
specification of surface mounting components (SMDs)
(IEC 61760-1:2026)
Technologie de montage en surface - Partie 1: Méthode Oberflächenmontagetechnik - Teil 1: Genormtes Verfahren
normalisée pour la spécification des composants pour zur Spezifizierung oberflächenmontierbarer Bauelemente
montage en surface (CMS) (SMDs)
(IEC 61760-1:2026) (IEC 61760-1:2026)
This European Standard was approved by CENELEC on 2026-07-28. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2026 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61760-1:2026 E
European foreword
The text of document 91/2103/FDIS, future edition 4 of IEC 61760-1, prepared by TC 91 "Electronics
assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by CENELEC
as EN IEC 61760-1:2026.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2027-08-31
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2029-08-31
document have to be withdrawn
This document supersedes EN IEC 61760-1:2020 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 61760-1:2026 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standard indicated:
IEC 60664-4 NOTE Approved as EN 60664-4
IEC 61188-6-2 NOTE Approved as EN IEC 61188-6-2
IEC 61189-5-504 NOTE Approved as EN IEC 61189-5-504
IEC 60062 NOTE Approved as EN 60062
IEC 63378 (series) NOTE Approved as EN IEC 63378 (series)
IEC 60068-2-45:1980 NOTE Approved as EN 60068-2-45:1992 (not modified)
IEC 60068-2-45:1980/A1:1993 NOTE Approved as EN 60068-2-45:1992/A1:1993 (not modified)
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cencenelec.eu.
Publication Year Title EN/HD Year
IEC 60068-2-2 - Environmental testing - Part 2-2: Tests - Test EN IEC 60068-2-2 -
B: Dry heat
IEC 60068-2-21 - Environmental testing - Part 2-21: Tests - Test EN IEC 60068-2-21 -
U: Robustness of terminations and integral
mounting devices
IEC 60068-2-58 - Environmental testing - Part 2-58: Tests - Test EN 60068-2-58 -
Td: Test methods for solderability, resistance
to dissolution of metallization and to soldering
heat of surface mounting devices (SMD)
IEC 60068-2-88 - Environmental testing - Part 2-88: Tests - Test EN IEC 60068-2-88 -
XD: Resistance of components and
assemblies to liquid cleaning media
IEC 60191-6 - Mechanical standardization of semiconductor EN 60191-6 -
devices - Part 6: General rules for the
preparation of outline drawings of surface
mounted semiconductor device packages
IEC 60194-2 - Printed boards design, manufacture and - -
assembly - Vocabulary - Part 2: Common
usage in electronic technologies as well as
printed board and electronic assembly
technologies
IEC 60286-3 - Packaging of components for automatic EN IEC 60286-3 -
handling - Part 3: Packaging of surface mount
components on continuous tapes
IEC 60286-4 - Packaging of components for automatic EN 60286-4 -
handling - Part 4: Stick magazines for
electronic components encapsulated in
packages of different forms
IEC 60286-5 - Packaging of components for automatic EN IEC 60286-5 -
handling - Part 5: Matrix trays
IEC 60286-6 - Packaging of components for automatic EN 60286-6 -
handling - Part 6: Bulk case packaging for
surface mounting components
Publication Year Title EN/HD Year
IEC 60664-1 - Insulation coordination for equipment within EN IEC 60664-1 -
low-voltage supply systems - Part 1: Principles,
requirements and tests
IEC 60749-20 - Semiconductor devices - Mechanical and EN IEC 60749-20 -
climatic test methods - Part 20: Resistance of
plastic encapsulated SMDs to the combined
effect of moisture and soldering heat
IEC 61188-6-4 - Printed boards and printed board assemblies - EN IEC 61188-6-4 -
Design and use - Part 6-4: Land pattern design
- Generic requirements for dimensional
drawings of surface mounted components
(SMD) from the viewpoint of land pattern
design
IEC 61340-5-1 - Electrostatics - Part 5-1: Protection of EN IEC 61340-5-1 -
electronic devices from electrostatic
phenomena - General requirements
IEC 61340-5-3 - Electrostatics - Part 5-3: Protection of EN IEC 61340-5-3 -
electronic devices from electrostatic
phenomena - Properties and requirements
classification for packaging intended for
electrostatic discharge sensitive devices
IEC 61760-2 - Surface mounting technology - Part 2: EN IEC 61760-2 -
Transportation and storage conditions of
surface mounting devices (SMD) - Application
guide
IEC 61760-4 - Surface mounting technology - Part 4: EN IEC 61760-4 -
Classification, packaging, labelling and
handling of moisture sensitive devices
IEC 62090 - Product package labels for electronic EN 62090 -
components using bar code and two-
dimensional symbologies
IPC/JEDEC J-ST - Moisture/reflow classification for nonhermetic - -
D-020 solid state surface mount devices
IPC/JEDEC - Handling, Packing, Shipping and Use of - -
J-STD-033 oisture/Reflow Sensitive Surface Mount
Devices
IEC 61760-1 ®
Edition 4.0 2026-06
INTERNATIONAL
STANDARD
Surface mounting technology -
Part 1: Standard method for the specification of surface mounting components
(SMDs)
ICS 31.240 ISBN 978-2-8327-1309-9
IEC 61760-1:2026-06(en)
IEC 61760-1:2026 © IEC 2026
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 8
4 Requirements for component design and component specifications . 10
4.1 General requirements . 10
4.2 Classification of electronic assemblies . 10
4.2.1 General . 10
4.2.2 Level A: General electronics products . 10
4.2.3 Level B: Dedicated service electronics products . 11
4.2.4 Level C: High-performance electronics products . 11
4.3 Component marking and labelling . 11
4.3.1 General . 11
4.3.2 Marking of multipin components. 11
4.3.3 Marking of components with polarity . 11
4.3.4 Durability of component marking . 11
4.4 Component outline and design . 12
4.4.1 Drawing and specification . 12
4.4.2 Termination design . 13
4.4.3 Pick-up area requirements . 13
4.4.4 Bottom surface requirements . 14
4.4.5 Requirements for terminals . 15
4.4.6 Component height . 17
4.4.7 Component weight . 17
4.4.8 Creepage and clearance distances - Insulation coordination . 17
4.5 General requirements for components related to assembly technology . 18
4.5.1 Robustness of components . 18
4.5.2 Recommendation for land pattern design . 19
4.6 Cleanliness of components . 19
4.6.1 General remarks . 19
4.6.2 Particle contaminations. 19
4.6.3 Ionic contamination . 20
4.6.4 Other surface contamination . 20
4.7 Surface roughness . 20
4.8 Requirements related to packaging and transportation . 20
4.8.1 Packaging . 20
4.8.2 Labelling of product packaging . 21
4.8.3 Storage and transportation . 21
4.9 Thermal and electrical performance . 21
4.9.1 Relevant parameters . 21
4.9.2 Applicable standards . 22
4.10 Component reliability assurance . 22
4.11 Compliance information . 22
4.11.1 General . 22
4.11.2 Material declaration . 22
4.11.3 Environmental regulatory compliance . 22
IEC 61760-1:2026 © IEC 2026
4.11.4 Considerations on the materials’ supply chain . 22
5 Assembly processes . 23
5.1 General . 23
5.2 Placement or insertion . 23
5.3 Mounting . 23
5.4 Cleaning (where applicable) . 23
5.4.1 Purpose . 23
5.4.2 Cleaning methods . 23
5.4.3 Typical cleaning conditions for assemblies . 24
5.5 Post assembly processes . 24
5.6 Removal and replacement of SMDs . 25
5.6.1 Removal and replacement of soldered SMDs . 25
5.6.2 Removal and replacement of glued SMDs. 25
6 Soldering . 26
6.1 General . 26
6.1.1 Mounting by soldering . 26
6.1.2 Securing the component on the substrate prior to soldering . 27
6.1.3 Reflow soldering . 27
6.1.4 Wave soldering . 28
6.1.5 Other soldering methods . 28
6.2 Process conditions . 28
6.2.1 General . 28
6.2.2 Commonly used solder alloys . 29
6.2.3 Reflow soldering . 29
6.2.4 Wave soldering . 31
6.3 Requirements for components and component specifications . 31
6.3.1 General . 31
6.3.2 Requirements for temperature sensitive devices . 32
6.3.3 Solderability . 32
6.3.4 Resistance to dissolution of metallization . 33
6.3.5 Resistance to soldering heat . 33
6.3.6 Resistance to vacuum during soldering . 33
6.3.7 Resistance to cleaning media and processes . 34
6.3.8 Warpage during reflow soldering . 35
6.3.9 Rework of soldered components . 35
7 Conductive glue bonding . 36
7.1 Mounting . 36
7.2 Bonding strength test for the component glue interface test . 36
7.3 Requirements to components for conductive glue bonding . 37
7.3.1 Components for conductive glue bonding . 37
7.3.2 Cleanliness of the surface . 37
7.3.3 Terminal surface defects . 37
7.3.4 Outgassing of halogenic substances . 37
7.3.5 Coplanarity . 38
7.3.6 Stand-off . 38
7.3.7 Terminal dimensions and tolerances . 38
7.3.8 Resistance to curing heat . 39
8 Sintering . 39
IEC 61760-1:2026 © IEC 2026
8.1 General . 39
8.2 Typical process conditions for wet silver-sintering processes . 40
8.3 Requirements for components and component specifications . 40
9 Solderless interconnection . 41
9.1 General . 41
9.2 Typical process conditions . 41
9.3 Requirements for components and component specifications . 41
9.4 Rework of components with solderless interconnections . 42
Annex A (informative) Details on compliance information . 43
A.1 Material declaration . 43
A.2 Environmental regulatory compliance . 44
A.3 Considerations on the materials' supply chain . 45
Annex B (informative) Sustainability . 46
B.1 General . 46
B.2 Programs to support sustainable products and production . 46
B.2.1 Eco-design of products (electronic equipment) . 46
B.2.2 Life Cycle Assessment (or analysis) (LCA) . 46
B.2.3 Product Carbon Footprint (PCF) . 47
B.2.4 GHG (greenhouse gases), including CO emissions in manufacturing . 47
2,
B.2.5 Energy usage in the production . 47
B.2.6 Recycling, recovering and repair. 47
B.2.7 Sustainability of work conditions . 47
Bibliography . 48
Figure 1 – Example of a component with marked specific orientation put in tape (top)
and tray (bottom) . 12
Figure 2 – Vacuum pipette, pick-up area and component compartment . 14
Figure 3 – Coplanarity of terminals . 15
Figure 4 – Stable seating of component . 15
Figure 5 – Unstable seating of component . 16
Figure 6 – Terminals arranged peripherally in two rows . 16
Figure 7 – Good contrast between component body and surroundings . 16
Figure 8 – Component weight and pipette suction strength . 17
Figure 9 – Process steps for soldering . 26
Figure 10 – Generic reflow temperature profile . 30
Figure 11 – Generic wave soldering profile . 31
Figure 12 – Process steps for gluing . 36
Figure 13 – Stand-off definition . 38
Figure 14 – Sinter process on one side, both sides, and both sides including
presintering. 40
Table 1 – Typical roughness requirements . 20
Table 2 – Basic cleaning processes . 24
Table 3 – Examples of substances proposed to be included in risk evaluation and
customer reporting . 38
Table 4 – Examples of typical curing conditions . 39
IEC 61760-1:2026 © IEC 2026
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
Surface mounting technology -
Part 1: Standard method for the specification of surface mounting
components (SMDs)
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) IEC draws attention to the possibility that the implementation of this document may involve the use of (a) patent(s).
IEC takes no position concerning the evidence, validity or applicability of any claimed patent rights in respect
thereof. As of the date of publication of this document, IEC had not received notice of (a) patent(s), which may
be required to implement this document. However, implementers are cautioned that this may not represent the
latest information, which may be obtained from the patent database available at https://patents.iec.ch. IEC shall
not be held responsible for identifying any or all such patent rights.
IEC 61760-1 has been prepared by IEC technical committee 91: Electronics assembly
technology. It is an International Standard.
This fourth edition cancels and replaces the third published in 2020. This edition constitutes a
technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) added new subclause 4.2 – Classification of electronic assemblies;
b) added new subclause 4.4.8 – Creepage and clearance distances - Insulation coordination;
c) added new subclause 4.9 – Thermal and electrical performance;
d) updated Clause 6 – Soldering: now including requirements related to application of low
temperature solders;
IEC 61760-1:2026 © IEC 2026
e) added new subclause 6.2.2 – Commonly used solder alloys;
f) updated subclause 6.3.6 – Resistance to vacuum during soldering;
g) updated subclause 6.3.7 – Resistance to cleaning media and processes - now includes the
tests in IEC 60068-2-88, Tests – Test XD: Resistance of components and assemblies to
liquid cleaning media;
h) added new subclause 6.3.9 – Rework of soldered components;
i) added new Annex B – Sustainability.
The text of this International Standard is based on the following documents:
FDIS Report on voting
91/2103/FDIS 91/2113/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
A list of all parts in the IEC 61760 series, published under the general title Surface mounting
technology, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
– reconfirmed,
– withdrawn, or
– replaced.
IEC 61760-1:2026 © IEC 2026
INTRODUCTION
Specifications for electronic components have in the past been formulated for each component
family. The regulations for environmental tests have been selected from IEC 60068 and other
IEC and ISO publications. The intention for this procedure was that all components, once
installed in a piece of equipment, had to satisfy certain criteria.
The introduction and increasing use of different mounting processes on one assembly make it
essential to extend the existing requirements to include those arising from processing during
assembly.
Nevertheless, there existed no harmonized standard that prescribes the content of a component
specification before the publication of this document. It is the purpose of this document to define
the general requirements for component specifications derived from the assembly processes.
This is done in three steps.
In the first step, general requirements for component specifications and component design
related to the handling and placement of the component on the substrate are given (Clause 4).
In the second step, the requirements related to assembly processes are given (Clause 5). In
the third step, additional requirements resulting from specific mounting methods are given (from
Clause 6 to Clause 9).
Additional consideration with respect to the through-hole components are crucial to mixed
technology boards, i.e. boards containing through-hole components and SMDs. These can be
subject to the same requirements as the SMDs. Persons responsible for drafting specifications
for "non-surface mounting components" wishing to include a statement on their ability to
withstand surface mounting conditions should use the classifications and tests set out in the
present document.
IEC 61760-1:2026 © IEC 2026
1 Scope
This part of IEC 61760 defines requirements for component specifications of electronic
components that are intended for usage in surface mounting technology. To this end, it specifies
a reference set of process conditions and related test conditions to be considered when
compiling component specifications.
The objective of this document is to ensure that a wide variety of SMDs can be subjected to the
same placement, mounting and subsequent processes (e.g. cleaning, inspection) during
assembly. This document defines tests and requirements that are included in any SMD
component’s general, sectional or detail specification. In addition, this document provides
component users and manufacturers with a reference set of typical process conditions used in
surface mounting technology.
Some of the requirements for component specifications in this document are also applicable to
components with leads intended for mounting on a circuit board, including solderless
interconnection technology. Cases for which this is appropriate are indicated in the relevant
subclauses.
NOTE Solderless interconnection technology refers to a mounting method which is not part of the surface-mounting
process and the components do not undergo a soldering operation. Such components are included in this document
because the mounting of components for solderless interconnection commonly occurs after the mounting of SMDs.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60068–2–2, Environmental testing – Part 2-2: Tests – Test B: Dry heat
IEC 60068–2–21, Environmental testing – Part 2-21: Tests – Test U: Robustness of
terminations and integral mounting devices
IEC 60068–2–58, Environmental testing – Part 2-58: Tests – Test Td: Test methods for
solderability, resistance to dissolution of metallization and to soldering heat of surface mounting
devices (SMDs)
IEC 60068-2-88, Environmental testing - Part 2-88: Tests – Test XD: Resistance of components
and assemblies to liquid cleaning media
IEC 60191–6, Mechanical standardization of semiconductor devices – Part 6: General rules for
the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60194–2, Printed boards design, manufacture and assembly – Vocabulary – Part 2:
Common usage in electronic technologies as well as printed board and electronic assembly
technologies
IEC 60286-3, Packaging of components for automatic handling - Part 3: Packaging of surface
mount components on continuous tapes
IEC 60286-4, Packaging of components for automatic handling - Part 4: Stick magazines for
electronic components encapsulated in packages of different forms
IEC 60286–5, Packaging of components for automatic handling – Part 5: Matrix trays
IEC 61760-1:2026 © IEC 2026
IEC 60286–6, Packaging of components for automatic handling – Part 6: Bulk case packaging
for surface mounting components
IEC 60664-1, Insulation coordination for equipment within low-voltage supply systems - Part 1:
Principles, requirements and tests
IEC 60749-20, Semiconductor devices - Mechanical and climatic test methods - Part 20:
Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
IEC 61188–6–4, Printed boards and printed board assemblies – Design and use – Part 6-4:
Land pattern design – Generic requirements for dimensional drawings of surface mounted
components (SMD) from the viewpoint of land pattern design
IEC 61340–5–1, Electrostatics – Part 5-1: Protection of electronic devices from electrostatic
phenomena – General requirements
IEC 61340–5–3, Electrostatics – Part 5-3: Protection of electronic devices from electrostatic
phenomena – Properties and requirements classification for packaging intended for
electrostatic discharge sensitive devices
IEC 61760–2, Surface mounting technology – Part 2: Transportation and storage conditions of
surface mounting devices (SMD) – Application guide
IEC 61760–4, Surface mounting technology – Part 4: Classification, packaging, labelling and
handling of moisture sensitive devices
IEC 62090, Product package labels for electronic components using bar code and two-
dimensional symbologies
IPC/JEDEC J-STD-020, Moisture/Reflow Sensitivity Classification for Non-hermetic Surface
Mount Devices (SMDs)
IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive
Surface Mount Devices
3 Terms and definitions
For the purposes of this document, the terms and definitions of IEC 60194–2 and the following
apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses
– IEC Electropedia: available at http://www.electropedia.org/
– ISO Online browsing platform: available at http://www.iso.org/obp
IEC 61760-1:2026 © IEC 2026
3.1
adhesive
substance such as glue or cement used to bond objects together
Note 1 to entry: In surface mounting technology different gluing systems are used:
– nonconductive adhesive (only for mechanical connection);
– electrically conductive adhesive (for electrical and mechanical connection);
– thermally conductive adhesive (for thermal and mechanical connection);
– combination of electrically and thermally conductive adhesive.
Most used adhesives are thermal curing systems, but there are also UV-curing systems in use.
3.2
compliant press-fit pin
press-fit pin with at least one compliant press-fit zone designed to be inserted into a plated-
through hole of a circuit board
3.3
compliant press-fit zone
specifically shaped section of a press-fit pin which is elastically and plastically deformed during
pin insertion
Note 1 to entry: A compliant press-fit zone is characterized by its base material, surface finish and geometry.
3.4
coplanarity
distance in height between the lowest and highest leads when the component is in its seating
plane
3.5
dewetting
condition that results when molten solder coats a surface and then recedes to leave irregularly
shaped mounds of solder that are separated by areas that are covered with a thin film of solder
and with the basis metal not exposed
3.6
dissolution of metallization
process of dissolving metal or a plated metal alloy, usually by introduction of chemicals
Note 1 to entry: For the purposes of this document, the dissolution of metallization also includes dissolution by
exposure to molten solder.
3.7
immersion attitude
positioning of an object when immersed in a solder bath
3.8
Montreal Protocol
agreement by industrialized nations, at a meeting held in Montreal, Canada, to eliminate
chlorofluorocarbons from all processes by 1995
3.9
placement force
dynamic force exerted on the component body (generally from above) and its seating plane
Note 1 to entry: This occurs during the period between the component’s first contact with the substrate (or the
soldering paste or adhesive, etc.) and its coming to rest. The maximum level is normally taken into account.
IEC 61760-1:2026 © IEC 2026
3.10
resistance to soldering heat
ability of a component to withstand the effects of the heat generated by the soldering process
3.11
seating plane
surface on which a component rests
3.12
stand-off
distance between seating plane of the component and the seating plane of the terminations
3.13
substrate
basic material that forms the support structure of an electronic circuit
3.14
surface mounting device
SMD
electronic component designed for mounting on to terminal pads or conducting tracks on the
surface of substrate
3.15
wetting
physical phenomenon in which surface tension of a liquid, usually when in contact with solids,
is reduced to the point where the liquid diffuses and makes intimate contact with the entire
substrate surface in the form of a thin layer
4 Requirements for component design and component specifications
4.1 General requirements
A component specification for surface mounting devices (SMDs) shall, in addition to the
requirements listed in 4.3 to 4.11, contain specifications of the relevant tests and requirements
from Clause 5 to Clause 9.
4.2 Classification of electronic assemblies
4.2.1 General
This document recognizes that electrical and electronic assemblies are subject to
classifications by intended end-item use. Three general end-product levels have been
established to reflect differences in producibility, functional performance requirements, and
verification (inspection/test) frequency.
It should be recognized that there can be overlaps of equipment between levels. The user of
the assemblies is responsible for determining the level to which the product belongs. The
contract shall specify the level required and indicate any exceptions or additional requirements
to the parameters, where appropriate.
4.2.2 Level A: General electronics products
This level includes consumer products, some computers and computer peripherals, and
hardware suitable for applications where the major requirement is function of the completed
assembly.
IEC 61760-1:2026 © IEC 2026
4.2.3 Level B: Dedicated service electronics products
This level includes communications equipment, sophisticated business machines, and
instruments where high performance and extended life is required, and for which uninterrupted
service is desired but not mandatory. Typically, the end-use environment would not cause
failures.
4.2.4 Level C: High-performance electronics products
This level includes all equipment where continued performance or performance-on-demand is
mandatory. Equipment downtime cannot be tolerated, end-use environment can be
uncommonly harsh, and the equipment shall function when required, such as life support
systems and other critical systems.
4.3 Component marking and labelling
4.3.1 General
In general, marking should identify 2nd level terminal finish or material and should follow J-
STD-609 [1]. This is critical because assembly reflow operations can be dependent on the
specific solder alloys per 6.1.3.
4.3.2 Marking of multipin components
Pin 1 (see Figure 1) shall be clea
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