EN IEC 61760-1:2020
(Main)Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
IEC 61760-1:2020 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set of process conditions and related test conditions to be considered when compiling component specifications. The objective of this document is to ensure that a wide variety of SMDs can be subjected to the same placement, mounting and subsequent processes (e.g. cleaning, inspection) during assembly. This document defines tests and requirements that need to be part of any SMD component's general, sectional or detail specification. In addition, this document provides component users and manufacturers with a reference set of typical process conditions used in surface mounting technology. Some of the requirements for component specifications in this document are also applicable to components with leads intended for mounting on a circuit board. Cases for which this is appropriate are indicated in the relevant subclauses. This edition includes the following significant technical changes with respect to the previous edition: a) inclusion of additional mounting methods: conductive glue bonding, sintering and solderless interconnection.
Oberflächenmontagetechnik - Teil 1: Genormtes Verfahren zur Spezifizierung oberflächenmontierbarer Bauelemente (SMDs)
Technique du montage en surface - Partie 1: Méthode normalisée pour la spécification des composants montés en surface (CMS)
L’IEC 61760-1:2020 définit les exigences relatives aux spécifications de composants applicables aux composants électroniques destinés à être utilisés dans la technique du montage en surface. Elle spécifie à cet effet un référentiel composé de conditions de processus et des conditions d’essai associées, à prendre en considération lors de l’élaboration des spécifications de composants. L’objet du présent document est de garantir qu’une grande variété de CMS puisse être soumise à un placement et un montage identiques, ainsi qu’à des processus ultérieurs (par exemple nettoyage, examen) identiques au cours de l’assemblage. Le présent document définit les essais et les exigences devant faire partie de toute spécification de composant CMS générale, intermédiaire ou particulière. En outre, il propose aux utilisateurs et aux fabricants un référentiel des conditions de processus types utilisées dans la technique du montage en surface. Certaines des exigences du présent document relatives aux spécifications de composants s’appliquent également aux composants à fils destinés à être montés sur une carte de circuit imprimé. Une telle applicabilité est alors indiquée dans les paragraphes correspondants. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente: a) ajout de méthodes de montage supplémentaires: liage par colle conductrice, frittage et connexion sans soudure.
Tehnologija površinske montaže - 1. del: Standardna metoda za specifikacijo komponent za površinsko montažo (SMDs)
Ta del standarda IEC 61760 opredeljuje zahteve za specifikacijo elektronskih komponent, ki so namenjene za površinsko montažo. V ta namen določa referenčni niz procesnih pogojev in z njimi povezanih preskusnih pogojev, ki jih je treba upoštevati pri sestavljanju specifikacij komponent. Cilj tega dokumenta je zagotoviti, da je mogoče najrazličnejše komponente za površinsko montažo med sestavljanjem izpostaviti enakim postopkom namestitve, montaže in nadaljnjih postopkov (npr. čiščenje, pregled). Ta dokument opredeljuje preskuse in zahteve, ki morajo biti del splošne, področne ali podrobne specifikacije katere koli komponente za površinsko montažo. Poleg tega ta dokument uporabnikom in proizvajalcem komponent ponuja referenčni niz tipičnih procesnih pogojev, ki se uporabljajo v tehnologiji površinske montaže. Nekatere zahteve za specifikacije komponent v tem dokumentu veljajo tudi za komponente z vodniki, namenjene za montažo na tiskano vezje. Primeri, za katere je to primerno, so navedeni v ustreznih podtočkah.
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Standards Content (Sample)
SLOVENSKI STANDARD
01-junij-2022
Nadomešča:
SIST EN 61760-1:2006
Tehnologija površinske montaže - 1. del: Standardna metoda za specifikacijo
komponent za površinsko montažo (SMDs)
Surface mounting technology - Part 1: Standard method for the specification of surface
mounting components (SMDs)
Oberflächenmontagetechnik - Teil 1: Genormtes Verfahren zur Spezifizierung
oberflächenmontierbarer Bauelemente (SMDs)
Technique du montage en surface - Partie 1: Méthode de normalisation pour la
spécification des composants montés en surface (CMS)
Ta slovenski standard je istoveten z: EN IEC 61760-1:2020
ICS:
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN IEC 61760-1
NORME EUROPÉENNE
EUROPÄISCHE NORM
September 2020
ICS 31.240 Supersedes EN 61760-1:2006 and all of its amendments
and corrigenda (if any)
English Version
Surface mounting technology - Part 1: Standard method for the
specification of surface mounting components (SMDs)
(IEC 61760-1:2020)
Technique du montage en surface - Partie 1: Méthode Oberflächenmontagetechnik - Teil 1: Genormtes Verfahren
normalisée pour la spécification des composants montés en zur Spezifizierung oberflächenmontierbarer Bauelemente
surface (CMS) (SMDs)
(IEC 61760-1:2020) (IEC 61760-1:2020)
This European Standard was approved by CENELEC on 2020-08-18. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2020 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61760-1:2020 E
European foreword
The text of document 91/1648/FDIS, future edition 3 of IEC 61760-1, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61760-1:2020.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2021-05-18
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2023-08-18
document have to be withdrawn
This document supersedes EN 61760-1:2006 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 61760-1:2020 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 60062 NOTE Harmonized as EN 60062
IEC 60068-1 NOTE Harmonized as EN 60068-1
IEC 60068-2-20 NOTE Harmonized as EN 60068-2-20
IEC 60068-2-69 NOTE Harmonized as EN 60068-2-69
IEC 60191-6-19 NOTE Harmonized as EN 60191-6-19
IEC 60352-5 NOTE Harmonized as EN 60352-5
IEC 60749 (series) NOTE Harmonized as EN 60749 (series)
IEC 61188-5-1 NOTE Harmonized as EN 61188-5-1
IEC 61189-5-504 NOTE Harmonized as EN IEC 61189-5-504
IEC 62474 NOTE Harmonized as EN IEC 62474
Annex ZA
(normative)
Normative references to international publications with their
corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60068 - Environmental testing - -
IEC 60068-2-2 - Environmental testing - Part 2-2: Tests - EN 60068-2-2 -
Test B: Dry heat
IEC 60068-2-21 - Environmental testing - Part 2-21: Tests - - -
Test U: Robustness of terminations and
integral mounting devices
IEC 60068-2-45 1980 Basic environmental testing procedures - EN 60068-2-45 1992
Part 2-45: Tests - Test XA and guidance:
Immersion in cleaning solvents
+ A1 1993 + A1 1993
IEC 60068-2-58 - Environmental testing - Part 2-58: Tests - EN 60068-2-58 -
Test Td: Test methods for solderability,
resistance to dissolution of metallization and
to soldering heat of surface mounting
devices (SMD)
IEC 60191-6 - Mechanical standardization of EN 60191-6 -
semiconductor devices - Part 6: General
rules for the preparation of outline drawings
of surface mounted semiconductor device
packages
IEC 60194-2 - Printed boards design, manufacture and - -
assembly - Vocabulary - Part 2: Common
usage in electronic technologies as well as
printed board and electronic assembly
technologies
IEC 60286-3 - Packaging of components for automatic EN IEC 60286-3 -
handling - Part 3: Packaging of surface
mount components on continuous tapes
Publication Year Title EN/HD Year
IEC 60286-4 - Packaging of components for automatic EN 60286-4 -
handling - Part 4: Stick magazines for
electronic components encapsulated in
packages of different forms
IEC 60286-5 - Packaging of components for automatic EN IEC 60286-5 -
handling - Part 5: Matrix trays
IEC 60286-6 - Packaging of components for automatic EN 60286-6 -
handling - Part 6: Bulk case packaging for
surface mounting components
IEC 60749-20 2008 Semiconductor devices - Mechanical and EN 60749-20 2009
climatic test methods - Part 20: Resistance
of plastic encapsulated SMDs to the
combined effect of moisture and soldering
heat
IEC 61188-6-4 - Printed boards and printed board EN IEC 61188-6-4 -
assemblies - Design and use - Part 6-4:
Land pattern design - Generic requirements
for dimensional drawings of surface
mounted components (SMD) from the
viewpoint of land pattern design
IEC 61340-5-1 - Electrostatics - Part 5-1: Protection of EN 61340-5-1 -
electronic devices from electrostatic
phenomena - General requirements
IEC 61340-5-3 - Electrostatics - Part 5-3: Protection of EN 61340-5-3 -
electronic devices from electrostatic
phenomena - Properties and requirements
classification for packaging intended for
electrostatic discharge sensitive devices
IEC 61760-2 - Surface mounting technology - Part 2: - -
Transportation and storage conditions of
surface mounting devices (SMD) -
Application guide
IEC 61760-4 - Surface mounting technology - Part 4: EN 61760-4 -
Classification, packaging, labelling and
handling of moisture sensitive devices
IEC 62090 - Product package labels for electronic EN 62090 -
components using bar code and
twodimensional symbologies
IPC/JEDEC - Moisture/Reflow Sensitivity Classification for - -
J-STD-020E Nonhermetic Solid State Surface Mount
Devices
IPC/JEDEC - Handling, Packing, Shipping and Use of - -
J-STD-033B Moisture/Reflow Sensitive Surface Mount
Devices
IEC 61760-1 ®
Edition 3.0 2020-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Surface mounting technology –
Part 1: Standard method for the specification of surface mounting components
(SMDs)
Technique du montage en surface –
Partie 1: Méthode normalisée pour la spécification des composants montés en
surface (CMS)
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.240 ISBN 978-2-8322-8588-6
– 2 – IEC 61760-1:2020 © IEC 2020
CONTENTS
FOREWORD . 5
INTRODUCTION . 7
1 Scope . 8
2 Normative references . 8
3 Terms and definitions . 9
4 Requirements for component design and component specifications . 11
4.1 General requirement . 11
4.2 Component marking . 11
4.2.1 Marking of multipin components . 11
4.2.2 Marking of components with polarity . 11
4.2.3 Durability of component marking . 12
4.3 Component outline and design . 12
4.3.1 Drawing and specification . 12
4.3.2 Termination design . 13
4.3.3 Pick-up area requirements . 13
4.3.4 Bottom surface requirements . 14
4.3.5 Requirements for terminals . 15
4.3.6 Component height . 17
4.3.7 Component weight . 17
4.4 General requirements for components related to assembly technology . 17
4.4.1 Robustness of components . 17
4.4.2 Recommendation for land pattern design . 18
4.5 Cleanliness of components . 18
4.5.1 General remarks . 18
4.5.2 Particle contaminations . 19
4.5.3 Ionic contamination . 19
4.5.4 Other surface contamination . 19
4.6 Surface roughness . 19
4.7 Requirements related to packaging and transportation . 20
4.7.1 Packaging. 20
4.7.2 Labelling of product packaging . 20
4.7.3 Storage and transportation . 21
4.8 Component reliability assurance . 21
4.9 Compliance information . 21
4.9.1 General . 21
4.9.2 Material declaration . 21
4.9.3 Environmental regulatory compliance . 21
4.9.4 Considerations on the materials’ supply chain . 21
5 Assembly processes . 22
5.1 General . 22
5.2 Placement or insertion . 22
5.3
...
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