iTeh StandardsiTeh Standards
EURUSD
Your shopping cart is empty.
CLC

EN 61249-7-1:1995

(Main)

Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/Invar/copper

Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/Invar/copper

Covers copper-clad Invar material of nominal thickness from 0,1 mm to 2,4 mm supplied in rolls or produced in sheets.

Materialien für Verbindungsstrukturen - Teil 7: Rahmenspezifikation für Materialien mit verzugsfreiem Kern - Hauptabschnitt 1: Kupfer/Invar/Kupfer

Matériaux pour les structures d'interconnexion - Partie 7: Collection de spécifications intermédiaires pour matériau à âme réfrénant la dilatation - Section 1: Cuivre/Invar/cuivre

S'applique au matériau Invar recouvert de cuivre d'épaisseur nominale comprise entre 0,1 mm et 2,4 mm livré en rouleaux ou fabriqué en feuilles.

Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/Invar/copper

General Information

Status
Published
Publication Date
17-Jul-1995
Withdrawal Date
31-Mar-1996
ICS
31.180 - Printed circuits and boards
Technical Committee
CLC/SR 91 - Electronics assembly technology
Drafting Committee
IEC/TC 91 - IEC_TC_91
Parallel Committee
IEC/TC 91 - IEC_TC_91
Current Stage
6060 - Document made available - Publishing
Start Date
18-Jul-1995
Completion Date
18-Jul-1995
Ref Project
SIST EN 61249-7-1:2001 - Materials for interconnection structures -- Part 7: Sectional specification set for restraining core materials -- Section 1: Copper/Invar/copper

Buy Standard

EN 61249-7-1:2001EN 61249-7-1:2001
PreviousNext
Standard
EN 61249-7-1:2001
English language
10 pages
sale 10% off
Preview
sale 10% off
Preview
e-Library read for
1 day

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 61249-7-1:2001
01-marec-2001
Materials for interconnection structures - Part 7: Sectional specification set for
restraining core materials - Section 1: Copper/Invar/copper
Materials for interconnection structures -- Part 7: Sectional specification set for
restraining core materials -- Section 1: Copper/Invar/copper
Materialien für Verbindungsstrukturen -- Teil 7: Rahmenspezifikation für Materialien mit
verzugsfreiem Kern -- Hauptabschnitt 1: Kupfer/Invar/Kupfer
Matériaux pour les structures d'interconnexion -- Partie 7: Collection de spécifications
intermédiaires pour matériau à âme réfrénant la dilatation -- Section 1:
Cuivre/Invar/cuivre
Ta slovenski standard je istoveten z: EN 61249-7-1:1995
ICS:
31.180 7LVNDQDYH]MD 7,9 LQWLVNDQH Printed circuits and boards
SORãþH
SIST EN 61249-7-1:2001 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ---------------------
...

Questions, Comments and Discussion

Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.

This May Also Interest You

CLC
EN IEC 63251:2023(Main)
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
SIST EN IEC 63251:2024

This International Standard defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this standard is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this standard specifies a test method to inspect the occurrence of color exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.

  • Standard
    24 pages
    English language
    sale 10% off
    e-Library read for
    1 day
CLC
EN IEC 61189-2-804:2023(Main)
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
SIST EN IEC 61189-2-804:2023

This International Standard specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyzer (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 ºC, but are not limited to these values.

  • Standard
    11 pages
    English language
    sale 10% off
    e-Library read for
    1 day
CLC
EN IEC 61189-2-803:2023(Main)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards
SIST EN IEC 61189-2-803:2023

This International Standard specifies a test method to determine the Z-Axis Expansion of base materials and printed boards using a thermomechanical analyser (TMA).

  • Standard
    11 pages
    English language
    sale 10% off
    e-Library read for
    1 day
CLC
EN IEC 61189-2-801:2023(Main)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials
SIST EN IEC 61189-2-801:2023

This International Standard specifies a test method to be followed for Thermal Performance via carbon ink heating. The method employs a screened-on pattern of carbon ink used to determine the thermal performance of a dielectric layer on a metal base plate.

  • Standard
    13 pages
    English language
    sale 10% off
    e-Library read for
    1 day
CLC
EN IEC 61249-6-3:2023(Main)
Materials for printed boards and other interconnecting structures - Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from "E" glass for printed boards
SIST EN IEC 61249-6-3:2024

This International Standard covers finished fabrics woven from ‘‘E’’ glass electrical grade glass fibre yarns that are intended as a reinforcing material in laminated plastics for electrical and electronic use. All fabrics covered by this specification are plain weave. This specification determines the nomenclature, definitions, general and chemical requirements for the glass, and physical requirements for finished woven glass fibre fabrics. Annex A of this standard provides a style designator for each finished fabric glass style, with specifications on yarn, fabric count, thickness and weight in both SI and US system.

  • Standard
    23 pages
    English language
    sale 10% off
    e-Library read for
    1 day
CLC
EN IEC 61249-2-51:2023(Main)
Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad
SIST EN IEC 61249-2-51:2023

IEC 61249-2-51:2023 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad (hereinafter referred to as IC carrier tape base materials). This document is applicable to IC carrier tape base materials, which is a glue-coated material, one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film.

  • Standard
    19 pages
    English language
    sale 10% off
    e-Library read for
    1 day
CLC
EN IEC 61189-2-501:2022(Main)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
SIST EN IEC 61189-2-501:2022

This part of IEC 61189 establishes a method suitable for testing the softness of FCCL (Flexible Copper Clad Laminate) products and related materials. This method determines the resilience under specified conditions. The test is performed on the sample as manufactured and without conditioning. The test does not apply to the resilience force lower than 10 mN.

  • Standard
    18 pages
    English language
    sale 10% off
    e-Library read for
    1 day
CLC
EN IEC 61189-2-807:2021(Main)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA
SIST EN IEC 61189-2-807:2021

IEC 61189-2-807:2021 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA).

  • Standard
    11 pages
    English language
    sale 10% off
    e-Library read for
    1 day
CLC
EN IEC 62878-2-602:2021(Main)
Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
SIST EN IEC 62878-2-602:2021

IEC 62878-2-602:2021 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules.

  • Standard
    15 pages
    English language
    sale 10% off
    e-Library read for
    1 day
CLC
EN IEC 61189-5-301:2021(Main)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles
SIST EN IEC 61189-5-301:2021

IEC 61189-5-301:2021 specifies methods for testing the characteristics of soldering paste using fine solder particles (hereinafter referred to as solder paste). This document is applicable to the solder paste using fine solder particle such as type 6, type 7 specified in IEC 61190-1-2 or finer particle sizes. This type of solder paste is used for connecting wiring and components in high-density printed circuit boards which are used in electronic or communication equipment and such, equipping fine wiring (e.g., minimum conductor widths and minimum conductor gaps of 60 µm or less). Test methods for the characteristics of solder paste in this document are considering the effect of surface activation force due to the fine sized solder particles which could affect the test result by existing test methods.

  • Standard
    35 pages
    English language
    sale 10% off
    e-Library read for
    1 day