IEC 61190-1-2:2007

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

IEC 61190-1-2:2007 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an explanation of solder ball test standards.

Matériaux de fixation pour les assemblages électroniques - Partie 1-2: Exigences relatives aux pâtes à braser pour les interconnexions de haute qualité dans les assemblages de composants électroniques

La CEI 61190-1-2:2007 spécifie les exigences d'ordre général relatives à la caractérisation et au contrôle des pâtes à braser utilisées pour obtenir des interconnexions de haute qualité dans l'assemblage de composants électroniques. La présente norme sert de document de contrôle de la qualité et n'a pas pour objet de s'intéresser directement à la performance du matériau au cours du procédé de fabrication. Les modifications principales par rapport à la première édition concernent une définition de l'alliage à braser sans plomb et une explication des normes relatives à l'essai de bille de soudure.

General Information

• Status: Published
• Publication Date: 25-Apr-2007
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: TC 91 - Electronics assembly technology
• Drafting Committee: PT 61190 - TC 91/PT 61190
• Current Stage: DELPUB - Deleted Publication
• Completion Date: 19-Feb-2014

Relations

• Revised: IEC 61190-1-2:2014 - Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
• Effective Date: 05-Sep-2023
• Revises: IEC 61190-1-2:2002 - Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly
• Effective Date: 05-Sep-2023

Standards Content (Sample)

INTERNATIONAL IEC
STANDARD 61190-1-2
Second edition
2007-04
Attachment materials for electronic assembly –
Part 1-2:
Requirements for soldering pastes
for high-quality interconnects
in electronics assembly
Reference number
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form

or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester.
If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,
please contact the address below or your local IEC member National Committee for further information.

IEC Central Office
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CH-1211 Geneva 20
Switzerland
Email: [e-mail]
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About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.
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INTERNATIONAL IEC
STANDARD 61190-1-2
Second edition
2007-04
Attachment materials for electronic assembly –
Part 1-2:
Requirements for soldering pastes
for high-quality interconnects
in electronics assembly
PRICE CODE
Commission Electrotechnique Internationale R
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue

– 2 – 61190-1-2 © IEC:2007(E)
CONTENTS
FOREWORD.3

INTRODUCTION.5

1 Scope.6

2 Normative references .6

3 Terms and definitions .7
4 Standardized description for products.7
5 Test methods .7
6 Requirements .8
6.1 Conflict.8
6.2 Alloy composition .8
6.3 Flux characterization and inspection.8
6.4 Solder powder particle size .9
6.5 Metal per cent .10
6.6 Viscosity.10
6.7 Slump and smear test.10
6.8 Solder ball test .12
6.9 Tack test .12
6.10 Wetting.12
6.11 Labelling .13
7 Quality assurance provisions .14
7.1 Responsibility for inspection .14
7.2 Classification for inspections .15
7.3 Inspection report form .15
7.4 Qualification inspection .15
7.5 Quality conformance .16
8 Preparation for delivery .16
9 Additional information – Performance and shelf-life extension inspections.16

Annex A (normative) Test report on solder paste .18

Figure 1 – Slump test stencil thickness, 0,20 mm.11
Figure 2 – Slump test stencil thickness, 0,10 mm.12
Figure 3 – Solder ball test standards.14

Table 1 – Standardized solder paste description.7
Table 2 – Standard solder powders.9
Table 3 – Test methods for particle size distribution .10
Table 4 – Solder paste qualification inspection .16
Table 5 – User inspection for solder paste prior to use .17
Table A.1 – Solder paste inspection report form.18

61190-1-2 © IEC:2007(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION

___________
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY –

Part 1-2: Requirements for soldering pastes

for high-quality interconnects in electronics assembly

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61190-1-2 has been prepared by IEC technical committee 91:
Electronics assembly technology.
This second edition cancels and replaces the first edition, published in 2002, and constitutes
a technical revision. The main changes with regard to the first edition concern a definition of
lead-free solder alloy and an explanation of solder ball test standards.
The text of this standard is based on the following documents:
FDIS Report on voting
91/646/FDIS 91/678/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

– 4 – 61190-1-2 © IEC:2007(E)
A list of all parts in the IEC 61190 series, under the general title Attachment materials for

electronic assembly, can be found on the IEC website.

The committee has decided that the contents of this publication will remain unchanged until

the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in

the data related to the specific publication. At this date, the publication will be

• reconfirmed;
• withdrawn;
• replaced by a revised edition, or

• amended.
A bilingual version of this publication may be issued at a later date.

61190-1-2 © IEC:2007(E) – 5 –
INTRODUCTION
This part of IEC 61190 defines the characteristics of solder paste through the definitions of

properties and specification of test methods and inspection criteria. Materials include solder

powder and solder paste flux blended to produce solder paste. Solder powders are classified

according to both shape and size distribution of the particles. It is not the intention of this

standard to exclude those particle sizes or distributions not specifically listed. For flux

properties of solder paste, including classification and testing, see IEC 61190-1-1.

The requirements for solder paste are defined in general terms. In practice, where more

stringent requirements are necessary, additional requirements may be defined by mutual

agreement between the user and supplier. Users are cautioned to perform tests (beyond the
scope of this specification) to determine the acceptability of the solder paste for specific
processes.
This standard is intended to be applicable to all types of solder paste used for soldering in
general, as well as for soldering in electronics assembly. The solder pastes involved relate to
all aspects of application. Generic specifications for soldering pastes are given in ISO 9454-2.

– 6 – 61190-1-2 © IEC:2007(E)
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY –

Part 1-2: Requirements for soldering pastes

for high-quality interconnects in electronics assembly

1 Scope
This part of IEC 61190 specifies general requirements for the characterization and testing of
solder pastes used to make high-quality electronic interconnections in electronics assembly.
This standard serves as a quality control document and is not intended to relate directly to the
material's performance in the manufacturing process.
Related information on flux characterization, quality control and procurement documentation
for solder flux and flux containing material may be found in IEC 61190-1-1.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60194, Printed board design, manufacture and assembly – Terms and definitions
IEC 61189-5, Test methods for electrical materials, interconnection
...

IEC 61190-1-2
Edition 2.0 2007-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Attachment materials for electronic assembly –
Part 1-2: Requirements for soldering pastes for high-quality interconnects in
electronics assembly
Matériaux de fixation pour les assemblages électroniques –
Partie 1-2: Exigences relatives aux pâtes à braser pour les interconnexions de
haute qualité dans les assemblages de composants électroniques

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by

any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or

IEC's member National Committee in the country of the requester.
If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,
please contact the address below or your local IEC member National Committee for further information.

Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite
ni utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie
et les microfilms, sans l'accord écrit de la CEI ou du Comité national de la CEI du pays du demandeur.

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publication, utilisez les coordonnées ci-après ou contactez le Comité national de la CEI de votre pays de résidence.

IEC Central Office
3, rue de Varembé
CH-1211 Geneva 20
Switzerland
Email: [e-mail]
Web: www.iec.ch
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.
ƒ Catalogue of IEC publications: www.iec.ch/searchpub
The IEC on-line Catalogue enables you to search by a variety of criteria (reference number, text, technical committee,…).
It also gives information on projects, withdrawn and replaced publications.
ƒ IEC Just Published: www.iec.ch/online_news/justpub
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IEC 61190-1-2
Edition 2.0 2007-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Attachment materials for electronic assembly –
Part 1-2: Requirements for soldering pastes for high-quality interconnects in
electronics assembly
Matériaux de fixation pour les assemblages électroniques –
Partie 1-2: Exigences relatives aux pâtes à braser pour les interconnexions de
haute qualité dans les assemblages de composants électroniques

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
R
CODE PRIX
ICS 31.190 ISBN 2-8318-9827-7
– 2 – 61190-1-2 © IEC:2007
CONTENTS
FOREWORD.3

INTRODUCTION.5

1 Scope.6

2 Normative references .6

3 Terms and definitions .7

4 Standardized description for products.7

5 Test methods .8

6 Requirements .8
6.1 Conflict.8
6.2 Alloy composition .8
6.3 Flux characterization and inspection.9
6.4 Solder powder particle size .9
6.5 Metal per cent .10
6.6 Viscosity.10
6.7 Slump and smear test.10
6.8 Solder ball test .12
6.9 Tack test .12
6.10 Wetting.12
6.11 Labelling .13
7 Quality assurance provisions .14
7.1 Responsibility for inspection .14
7.2 Classification for inspections .15
7.3 Inspection report form .15
7.4 Qualification inspection .15
7.5 Quality conformance .16
8 Preparation for delivery .16
9 Additional information – Performance and shelf-life extension inspections.16
Annex A (normative) Test report on solder paste .18

Figure 1 – Slump test stencil thickness, 0,20 mm.11
Figure 2 – Slump test stencil thickness, 0,10 mm.12
Figure 3 – Solder ball test standards.14

Table 1 – Standardized solder paste description.7
Table 2 – Standard solder powders.9
Table 3 – Test methods for particle size distribution .10
Table 4 – Solder paste qualification inspection .16
Table 5 – User inspection for solder paste prior to use .17
Table A.1 – Solder paste inspection report form.18

61190-1-2 © IEC:2007 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION

___________
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY –

Part 1-2: Requirements for soldering pastes

for high-quality interconnects in electronics assembly

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61190-1-2 has been prepared by IEC technical committee 91:
Electronics assembly technology.
This second edition cancels and replaces the first edition, published in 2002, and constitutes
a technical revision. The main changes with regard to the first edition concern a definition of
lead-free solder alloy and an explanation of solder ball test standards.
This bilingual version, published in 2008-05, corresponds to the English version.

– 4 – 61190-1-2 © IEC:2007
The text of this standard is based on the following documents:

FDIS Report on voting
91/646/FDIS 91/678/RVD
Full information on the voting for the approval of this standard can be found in the report on

voting indicated in the above table.

The French version of this standard has not been voted upon.

This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 61190 series, under the general title Attachment materials for
electronic assembly, can be found on the IEC website.
The committee has decided that
...