IEC TS 62564-1:2011

Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: Integrated circuits and discrete semiconductors

IEC/TS 62564-1:2011(E) defines the minimum requirements for integrated circuits and semiconductors which are to be designated an "Aerospace Qualified Electronic Component (AQEC)". The main change of this new edition consists of adding discrete semiconductors.

General Information

• Status: Published
• Publication Date: 29-Aug-2011
• ICS: 03.100.50 - Production. Production management
• ICS: 31.020 - Electronic components in general
• ICS: 49.060 - Aerospace electric equipment and systems
• Technical Committee: TC 107 - Process management for avionics
• Drafting Committee: WG 2 - TC 107/WG 2
• Current Stage: DELPUB - Deleted Publication
• Completion Date: 13-Jul-2016

Relations

• Revises: IEC TS 62564-1:2009 - Aerospace qualified electronic component (AQEC) - Part 1: Microcircuits
• Effective Date: 05-Sep-2023
• Revised: IEC TS 62564-1:2016 - Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: Integrated circuits and discrete semiconductors
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC/TS 62564-1
®

Edition 2.0 2011-08
TECHNICAL
SPECIFICATION

Process management for avionics – Aerospace qualified electronic components
(AQEC) –
Part 1: Integrated circuits and discrete semiconductors


IEC/TS 62564-1:2011(E)

---------------------- Page: 1 ----------------------
THIS PUBLICATION IS COPYRIGHT PROTECTED
Copyright © 2011 IEC, Geneva, Switzerland

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by
any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or
IEC's member National Committee in the country of the requester.
If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,
please contact the address below or your local IEC member National Committee for further information.


Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite
ni utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie
et les microfilms, sans l'accord écrit de la CEI ou du Comité national de la CEI du pays du demandeur.
Si vous avez des questions sur le copyright de la CEI ou si vous désirez obtenir des droits supplémentaires sur cette
publication, utilisez les coordonnées ci-après ou contactez le Comité national de la CEI de votre pays de résidence.

IEC Central Office
3, rue de Varembé
CH-1211 Geneva 20
Switzerland
Email: [e-mail]
Web: www.iec.ch

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.
 Catalogue of IEC publications: www.iec.ch/searchpub
The IEC on-line Catalogue enables you to search by a variety of criteria (reference number, text, technical committee,…).
It also gives information on projects, withdrawn and replaced publications.
 IEC Just Published: www.iec.ch/online_news/justpub
Stay up to date on all new IEC publications. Just Published details twice a month all new publications released. Available
on-line and also by email.
 Electropedia: www.electropedia.org
The world's leading online dictionary of electronic and electrical terms containing more than 20 000 terms and definitions
in English and French, with equivalent terms in additional languages. Also known as the International Electrotechnical
Vocabulary online.
 Customer Service Centre: www.iec.ch/webstore/custserv
If you wish to give us your feedback on this publication or need further assistance, please visit the Customer Service
Centre FAQ or contact us:
Email: [e-mail]
Tel.: [phone]
Fax: [phone]

---------------------- Page: 2 ----------------------
IEC/TS 62564-1
®

Edition 2.0 2011-08
TECHNICAL
SPECIFICATION

Process management for avionics – Aerospace qualified electronic components
(AQEC) –
Part 1: Integrated circuits and discrete semiconductors


INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
R
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-88912-675-0

® Registered trademark of the International Electrotechnical Commission

---------------------- Page: 3 ----------------------
– 2 – TS 62564-1 © IEC:2011(E)
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms, definitions and abbreviations . 7
3.1 Terms and definitions . 7
3.2 Abbreviations . 8
4 Technical requirements . 9
4.1 AQEC plan . 9
4.2 AQEC documentation . 9
4.2.1 General . 9
4.2.2 AQEC data sheet . 9
4.2.3 Material content . 10
4.2.4 AQEC visibility . 10
4.2.5 AQEC life expectancy . 10
4.2.6 Device technology . 10
4.2.7 SEE data . 10
4.2.8 Termination finish . 11
4.2.9 Third party part numbers . 11
4.3 AQEC performance . 11
4.3.1 Performance . 11
4.3.2 Functional parameters . 12
4.3.3 Known limitations . 12
4.4 Quality system certification . 12
4.5 Component qualification and re-qualification . 12
4.6 AQEC quality assurance and reliability monitoring . 13
4.7 Product Change Notification (PCN) . 13
4.8 Last Time Buy (LTB) notification . 13
4.9 Obsolescence management . 13
4.10 Counterfeit prevention . 13
4.11 User or customer guide . 13
Annex A (informative) AQEC material content and construction table . 15
Annex B (informative) Additional desired data . 17
Bibliography . 19

---------------------- Page: 4 ----------------------
TS 62564-1 © IEC(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

PROCESS MANAGEMENT FOR AVIONICS –
AEROSPACE QUALIFIED ELECTRONIC COMPONENTS (AQEC) –

Part 1: Integrated circuits and discrete semiconductors


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
The main task of IEC technical committees is to prepare International Standards. In
exceptional circumstances, a technical committee may propose the publication of a technical
specification when
• the required support cannot be obtained for the publication of an International Standard,
despite repeated efforts, or
• the subject is still under technical development or where, for any other reason, there is the
future but no immediate possibility of an agreement on an International Standard.
Technical specifications are subject to review within three years of publication to decide
whether they can be transformed into International Standards.
IEC/TS 62564-1, which is a technical specification, has been prepared by IEC technical
committee 107: Process management for avionics.

---------------------- Page: 5 ----------------------
– 4 – TS 62564-1 © IEC:2011(E)
This second edition cancels and replaces the first edition published in 2009. Its main change
consists of adding discrete semiconductors.
The GEIA-STD-0002-001 (June 2006), Aerospace Qualified Electronic Component (AQEC)
Requirements, Volume 1 – Integrated Circuits and Semiconductors, has served as a basis for
the elaboration of this technical specification.
The text of this technical specification is based on the following documents:
Enquiry draft Report on voting
107/144/DTS 107/157/RVC

Full information on the voting for the approval of this technical specification can be found in
the report on voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all the parts in the IEC 62564 series, under the general title Process management for
avionics – Aerospace qualified electronic components (AQEC), can be found on the IEC
website.
Future standards in this series will carry the new general title as cited above. Titles of existing
standards in this series will be updated at the time of the next edition.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• transformed into an International standard,
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

---------------------- Page: 6 ----------------------
TS 62564-1 © IEC(E) – 5 –
INTRODUCTION
Aerospace Qualified Electronic Component (AQEC) plans are developed by manufacturers in
order to document compliance with AQEC requirements. For AQEC designated components,
the intention is to
a) provide AQEC users access to information from the AQEC manufacturers that is
necessary for using commercial-off-the-shelf (COTS) products;
b) better enable AQEC users to assess whether these parts are capable of operating reliably
in their applications;
c) minimize deviations from the AQEC manufacturers’ COTS products;
d) have minimal impact on the AQEC manufacturers’ standard operating or business
procedures;
e) promote communication between the AQEC manufacturers and users.

---------------------- Page: 7 ----------------------
– 6 – TS 62564-1 © IEC:2011(E)
PROCESS MANAGEMENT FOR AVIONICS –
AEROSPACE QUALIFIED ELECTRONIC COMPONENTS (AQEC) –

Part 1: Integrated circuits and discrete semiconductors



1 Scope
This Part of IEC 62564, which is a Technical Specification, defines the minimum requirements
for integrated circuits and semiconductors which are to be designated an “Aerospace
Qualified Electronic Component (AQEC)”. It applies to integrated circuits and semiconductors
exhibiting the following attributes:
a) a minimum set of requirements, or information provided by the part manufacturer, which
will allow a standard COTS component to be designated AQEC by the manufacturer;
b) as a minimum, each COTS component (designated AQEC) will have been designed,
fabricated, assembled, and tested in accordance with the component manufacturer’s
requirements for standard data book components;
c) qualification of, and quality systems for, the COTS components to be designated as AQEC
shall include the manufacturer’s standards, operating procedures, and technical
specifications. This information shall be available when requested;
d) components manufactured before the manufacturer has addressed AQEC requirements,
but utilizing the same processes, are also considered AQEC compliant;
e) additional desired attributes of a device designated AQEC (that will support AQEC users)
are found in Annex B of this technical specification.
NOTE 1 Parts qualified to military specifications (except those identified as being for “logistic support” purposes
only) are considered AQEC; the remainder of this technical specification only addresses non-military specification
parts.
NOTE 2 Parts qualified to AEC-Q100-Rev G, grade 0 through to grade 3 are considered AQEC. For those
applications where a 0 °C to +70 °C temperature range is appropriate, grade 4 is also considered to be AQEC. The
user should document that the grade category used is compatible with the application in accordance with their
IEC/TS 62239 (due to be replaced by future IEC/TS 62239-1) electronic components management plan (ECMP).
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC/TS 62239, Process management for avionics – Preparation of an electronic components
1
management plan
IEC/TS 62396-1, Process management for avionics – Atmospheric radiation effects – Part 1:
Accommodation of atmospheric radiation effects via single event effects within avionics
electronic equipment
ISO 9001:2008, Quality management systems – Requirements
JESD48, Product discontinuance
—————————
1
 IEC/TS 62239-1, Process management for avionics – Management plan − Part 1: Preparation and maintenance
of an electronic components management plan, is currently under study and will supersede IEC/TS 62239.

---------------------- Page: 8 ----------------------
TS 62564-1 © IEC(E) – 7 –
3 Terms, definitions and abbreviations
For the purposes of this document, the following terms, definitions and abbreviations apply.
3.1 Terms and definitions
3.1.1
AQEC specification
document prepared by or for the manufacturer to describe an AQEC product
NOTE It includes a data sheet and may include other documents, such as material descriptions, environmental
test procedures, quality monitoring processes, etc. It may be a stand-alone document or a clearly denoted item
within a larger documentation system. There may be additional data associated with specific applications which
may be requested separately.
3.1.2
AQEC plan
instrument prepared by the plan owner (see 3.1.10) that clearly, concisely, and
unambiguously documents the processes used by the plan owner to satisfy the requirements
of this technical specification
NOTE The plan contains auditable content.
3.1.3
assessment
evaluation of a plan owner’s AQEC plan to determine if it is compliant with this technical
specification
NOTE It may be conducted by IECQ, the customer, the customer’s designee, or by a third party designated by the
customer community.
3.1.4
microcircuit
integrated circuit
microcircuit (device with a high circuit-element density) in which all or some of the circuit
elements are inseparably associated and electrically interconnected (on one or more
substrates, in a unique indivisible package) so that it is considered to be indivisible for the
purpose of construction and commerce
3.1.5
semiconductor
discrete (semiconductor) device
semiconductor device that is specified to perform an elementary function and that is not
divisible into separate components functional in themselves (diodes, transistors,
optocouplers, LEDS and related products)
3.1.6
component
part
either a microcircuit, integrated circuit, semiconductor or discrete semiconductor for the
purpose of this specification
3.1.7
customer
user
designer
original equipment manufacturer (OEM) who procures integrated circuits and/or
semiconductor devices compliant with this technical specification and uses them to design,
produce, and maintain systems

---------------------- Page: 9 ----------------------
– 8 – TS 62564-1 © IEC:2011(E)
3.1.8
customer community
body of customers that may act together to address issues related to this technical
specification
3.1.9
data sheet
document prepared by the manufacturer that describes the electrical, mechanical, and
environmental characteristics of the component
3.1.10
manufacturer
plan owner
producer of integrated circuits, microcircuits, or other semiconductor devices that may be
designated AQEC
NOTE A manufacturer may produce the components directly or may oversee subcontracted manufacturing
according to their own processes. The manufacturer is also the plan owner.
3.1.11
supplier
distributor of components
NOTE A plan for controlling AQEC inventory is in place in order to supply AQECs. A manufacturer can be a
supplier in the case that no distributor is involved.
3.1.12
third party
party designated to act on the behalf of the customer community
3.1.13
termination
element of a component that connects it electrically and mechanically to the next level of
assembly
NOTE A termination includes base materials and coatings (including underplates).
3.1.14
form
shape, arrangement of parts, visible aspect, mode in which a part exists or manifests itself,
the material an item is constructed from
3.1.15
fit
qualified and competent; correct size and shape
3.1.16
function
work to a specification that an item is designed for without degrading reliability
3.2 Abbreviations
AQEC  Aerospace qualified electronic component
BPSG  Borophosphosilicate glass
COTS  Commercial off the shelf
CMOS  Complementary metal oxide semiconductor
DSCC  Defence supply centre Columbus (see http://www.dscc.dla.mil/)
ECMP  Electronic component management plan

---------------------- Page: 10 ----------------------
TS 62564-1 © IEC(E) – 9 –
FFF  Form, fit and function
FIT  Failures in time
GIDEP Government industry data exchange program
HAST  Highly accelerated stress test
HCI  Hot carrier injection
HTOL  High temperature operating life
LED Light Emitting Diode
LTB  Last time buy
NBTI  Negative bias temperature Instability
PCN Product Change Notification.
SEE Single event effect
SEU  Single event upset
SER  Soft error rate
SEL  Single event latch
SEFI  Single event functional interrupt
SOS  Silicon on sapphire
THB  Temperature humidity bias
VID  Vendor item drawing (controlled and released by DSCC)
4 Technical requirements
4.1 AQEC plan
The processes used to ensure compliance with the following requirements shall be
documented by the AQEC manufacturer and included in their AQEC plan. T
...