IEC 60747-4-2:2000

Semiconductor devices - Discrete devices - Part 4-2: Microwave diodes and transistors - Integrated-circuit microwave amplifiers - Blank detail specification

General Information

• Status: Withdrawn
• Publication Date: 06-Apr-2000
• Withdrawal Date: 14-Dec-2006
• ICS: 31.080.10 - Diodes
• ICS: 31.080.30 - Transistors
• Technical Committee: SC 47E - Discrete semiconductor devices
• Current Stage: WPUB - Publication withdrawn
• Completion Date: 06-Oct-2006

Standards Content (Sample)

INTERNATIONAL IEC
STANDARD
60747-4-2
QC 750116
First edition
2000-04
Semiconductor devices – Discrete devices –
Part 4-2:
Microwave diodes and transistors –
Integrated-circuit microwave amplifiers –
Blank detail specification
Dispositifs à semiconducteurs – Dispositifs discrets –
Partie 4-2:
Diodes et transistors hyperfréquences –
Amplificateurs hyperfréquences pour circuits intégrés –
Spécification particulière-cadre

Reference number
Numbering
As from 1 January 1997 all IEC publications are issued with a designation in the
60000 series.
Consolidated publications
Consolidated versions of some IEC publications including amendments are

available. For example, edition numbers 1.0, 1.1 and 1.2 refer, respectively, to the
base publication, the base publication incorporating amendment 1 and the base

publication incorporating amendments 1 and 2.

Validity of this publication
The technical content of IEC publications is kept under constant review by the IEC,
thus ensuring that the content reflects current technology.
Information relating to the date of the reconfirmation of the publication is available
in the IEC catalogue.
Information on the subjects under consideration and work in progress undertaken
by the technical committee which has prepared this publication, as well as the list
of publications issued, is to be found at the following IEC sources:
• IEC web site*
•
Catalogue of IEC publications
Published yearly with regular updates
(On-line catalogue)*
• IEC Bulletin
Available both at the IEC web site* and as a printed periodical
Terminology, graphical and letter symbols
For general terminology, readers are referred to IEC 60050: International
Electrotechnical Vocabulary (IEV).
For graphical symbols, and letter symbols and signs approved by the IEC for
general use, readers are referred to publications IEC 60027: Letter symbols to be
used in electrical technology, IEC 60417: Graphical symbols for use on equipment.
Index, survey and compilation of the single sheets and IEC 60617: Graphical symbols
for diagrams.
* See web site address on title page.

INTERNATIONAL IEC
STANDARD
60747-4-2
QC 750116
First edition
2000-04
Semiconductor devices – Discrete devices
Part 4-2:
Microwave diodes and transistors –
Integrated-circuit microwave amplifiers –
Blank detail specification
Dispositifs à semiconducteurs – Dispositifs discrets –
Partie 4-2:
Diodes et transistors hyperfréquences –
Amplificateurs hyperfréquences pour circuits intégrés –
Spécification particulière-cadre

 IEC 2000  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission 3, rue de Varembé Geneva, Switzerland
Telefax: [phone] e-mail: [e-mail] IEC web site http://www.iec.ch
Commission Electrotechnique Internationale
PRICE CODE
Q
International Electrotechnical Commission
For price, see current catalogue

– 2 – 60747-4-2 © IEC:2000(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION

___________
SEMICONDUCTOR DEVICES – DISCRETE DEVICES –

Part 4-2: Microwave diodes and transistors –

Integrated-circuit microwave amplifiers –

Blank detail specification
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising all
national electrotechnical committees (IEC National Committees). The object of the IEC is to promote international co-
operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition
to other activities, the IEC publishes International Standards. Their preparation is entrusted to technical committees;
any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International,
governmental and non-governmental organizations liaising with the IEC also participate in this preparation. The IEC
collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions
determined by agreement between the two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all interested
National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form of
standards, technical specifications, technical reports or guides and they are accepted by the National Committees in
that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International Standards
transparently to the maximum extent possible in their national and regional standards. Any divergence between the IEC
Standard and the corresponding national or regional standard shall be clearly indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment
declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject of
patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60747-4-2 has been prepared by subcommittee 47E: Discrete
semiconductor devices, of IEC technical committee 47: Semiconductor devices.
This standard is a blank detail specification for integrated-circuit microwave amplifiers.
The text of this standard is based on the following documents:

FDIS Report on voting
47E/142/FDIS 47E/148/RVD
Full information on the voting for the approval of this standard can be found in the report on voting
indicated in the above table.
This publication has not been drafted in complete accordance with the ISO/IEC Directives, Part 3.
The QC number that appears on the front cover of this publication is the specification number in the
IEC Quality Assessment System for Electronic Components (IECQ).
A bilingual version of this standard may be issued at a later date.

60747-4-2 © IEC:2000(E) – 3 –
The committee has decided that the contents of this publication will remain unchanged until 2005.
At this date, the publication will be

• reconfirmed;
• withdrawn;
• replaced by a revised edition, or

• amended.
Other IEC publications quoted in this standard:

Publication Nos. IEC 60068-2-17:1994, Basic environmental testing procedures – Part 2: Tests – Test Q:

Sealing
IEC 60747-1:1983, Semiconductor devices – Discrete devices – Part 1: General
IEC 60747-4:1991, Semiconductor devices – Discrete devices – Part 4: Microwave diodes
and transistors
IEC 60747-10:1991, Semiconductor devices – Part 10: Generic specification for discrete
devices and integrated circuits
IEC 60748-1:1984, Semiconductor devices – Integrated circuits – Part 1: General
IEC 60748-11:1990, Semiconductor devices – Integrated circuits – Part 11: Sectional
specification for semiconductor integrated circuit excluding hybrid circuits
IEC 60749:1996, Semiconductor devices – Mechanical and climatic test methods
IEC QC 001002:1986, Rules of Procedure of the IEC Quality Assessment System for
Electronic Components (IECQ)
– 4 – 60747-4-2 © IEC:2000(E)
SEMICONDUCTOR DEVICES – DISCRETE DEVICES –

Part 4-2: Microwave diodes and transistors –

Integrated-circuit microwave amplifiers –

Blank detail specification
INTRODUCTION
The IEC Quality Assessment System for Electronic Components is operated in accordance with the

statutes of the IEC and under the authority of the IEC. The object of this system is to define quality
assessment procedures in such a manner that electronic components released by one participating
country as conforming with the requirements of an applicable specification are equally acceptable in
all other participating countries without the need for further testing.
This blank detail specification is one of a series of blank detail specifications for semiconductor
devices and shall be used with the following IEC publications:
IEC 60747-10/QC 700000:1991, Semiconductor devices – Part 10: Generic specification for
discrete devices and integrated circuits
IEC 60748-11/QC 790100:1990, Semiconductor devices – Integrated circuits – Part 11: Sectional
specification for semiconductor integrated circuits excluding hybrid circuits
Required information
Numbers shown in brackets on this and the following pages correspond to the following items of
required information, which should be entered in the spaces provided.
Identification of the detail specification
[1] The name of the national standards organization under whose authority the detail specification is
issued.
[2] The IECQ number of the detail specification.
[3] The numbers and issue numbers of the generic and sectional specifications.
[4] The national number of the detail specification, date of issue and any further information
required by the national system.
Identification of the component
[5] Main function and type number.

[6] Information on typical construction (materials, main technology) and package. If the device has
several kinds of derivative products, these differences shall be indicated, for example features in
the comparison table.
For electrostatic sensitive devices, a note of caution regarding electrostatic sensitivity shall be
added in the detail specification.
[7] Outline drawing, terminal identification, marking and/or reference to the relevant document for
outlines.
[8] Category of assessed quality according to 2.6 of the generic specification.
[9] Reference data.
---------------------------------------------------------------------------------------------------------------------------------
[Throughout this standard, the texts given in square brackets are intended to serve as guidance for
the specification writer and shall not be included in the detail specification.]
[When confusion may arise as to whether a paragraph is meant as an instruction to the writer or not,
it shall be given in brackets.]

60747-4-2 © IEC:2000(E) – 5 –
[Name (address) of responsible NAI [1] [Number of IECQ detail specification, [2]

(and possibly of the body from which the plus issue number and/or date.]

specification is available.) QC 750116

ELECTRONIC COMPONENT OF ASSESSED [3] National number of detail specification [4]

QUALITY IN ACCORDANCE WITH:
[This box need not be used if national number
Generic specification: 60747-10/QC 700000

repeats IECQ number.]
Sectional specification: 60748-11/QC 790100

[and national references if different.]

BLANK DETAIL SPECIFICATION FOR: INTEGRATED-CIRCUIT MICROWAVE AMPLIFIERS [5]
[Type number(s) of the relevant device(s).]
Ordering information: see 1.2 of this standard.
Mechanical description [7] Short description [6]
Outline references:
[Standard package reference should be given,
Monolithic microwave-integrated circuits
IEC number (mandatory, if available) and/or
national number.] Semiconductor material: [GaAs, Si]
Encapsulation: [cavity or non-cavity].
Application(s): see clause 5 of this standard.
Outline drawing:
Caution: observe precautions for handling
[May be transferred to or given with more details
ELECTROSTATIC-SENSITIVE DEVICES
in clause 8 of this standard.]
[if applicable]
Terminal identification:
[Drawing showing pin assignments, including
graphical symbols.]
Categories of assessed quality [8]
[To be chosen from 2.6 of the generic
specification.]
Marking: [Letters and figures, or color code.]
[The detail specification shall prescribe the
information to be marked on the device, if any.]
[See 2.5 of the generic specification and/or 1.1 of
this standard.]
Reference data [9]
[Reference data on the most important properties
to permit comparison between component types.]

Information about manufacturers who have components qualified to this detail specification is
available in the current Qualified Products List.

– 6 – 60747-4-2 © IEC:2000(E)
1 Marking and ordering information

1.1 Marking
[See 2.5 of generic specification.

The detail specification shall state the information marked for the relevant types, such as letters,

figures and/or codes.
When the marking contains items other than those specified in 2.5 of the generic specification, such

as used for the manufacturer's internal use, this should be indicated.
If all the information has already appeared in box [7] on the front page, this shall be indicated.]
1.2 Ordering information
[The following minimum information is necessary to order a specific device, unless otherwise
specified:
– precise type reference (and nominal voltage value, if required);
– IECQ reference of detail specification with issue number and/or date when relevant;
– category of assessed quality as defined in clause 9 of the sectional specification and, if required,
screening sequence as defined in clause 8 of the same;
– packaging for delivery;
– any other particulars.]
2 Application-related description
[Information regarding application in equipments or in circuits, and the relation with the associated
devices shall be given here. See IEC 60748-1, Chapter VI.]
3 Specification of the function
[Information regarding the function of the device shall be given here. Items to be given here shall be
selected from IEC 60748-1, Chapter VI.]
4 Limiting values (absolute maximum rating system)

These values apply over the operating temperature range, unless otherwise specified.
[Repeat only subclause numbers used, together with title. Any additional values shall be given at the
appropriate place, but without subclause number.]
[Curves shall preferably be given in clause 9 of the detail specification.]

60747-4-2 © IEC:2000(E) – 7 –
Categories Type A: low-noise
Type B: auto-gain control
Type C: limiting
Type D: power
Subclause Limiting value Symbol Type A Type B Type C Type D

Min. Max. Min. Max. Min. Max. Min. Max.

4.1 Ambient or case temperature T or T
amb case ×× ×× ×× ××
4.2 Storage temperature T ×× ×× ×× ××
stg
4.3 Power supply voltage(s) V ××××
xxi
[note 1]
4.4 Power supply current(s) I
xxi ××××
[note
...