IEC 61189-3:2007

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

IEC 61189-3:2007 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. The major technical changes with regard to the previous edition concern the addition of 25 new tests, as follows:
- 6 V: Visual test methods: 3V01, 3V02 and 3V03;
- 7 D: Dimensional test methods: 3D03;
- 8 C: Chemical test methods: 3C02, 3C13 and 3C14;
- 9 M: Mechanical test methods: 3M01, 3M03, 3M04, 3M07 and 3M09;
- 10 E: Electrical test methods: 3E03, 3E04, 3E05, 3E11, 3E12, 3E13, 3E16, 3E17 and 3E18;
- 11 N: Environmental test methods: 3N03, 3N07 and 3N12;
- 12 X: Miscellaneous test methods: 3X01.

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 3: Méthodes d'essai des structures d'interconnexion (cartes imprimées)

La CEI 61189-3:2007 constitue un recueil de méthodes d'essai représentant les méthodologies et les modes opératoires qui peuvent être appliqués pour soumettre à essais les matériaux utilisés pour fabriquer des structures d'interconnexion (cartes imprimées) et des ensembles. Les modifications techniques majeures par rapport à l'édition précédente concernent l'ajout de 25 nouveaux essais, comme suit:
- 6 V: Méthodes d'essais visuels: 3V01, 3V02 et 3V03;
- 7 D: Méthodes d'essais dimensionnels: 3D03;
- 8 C: Méthodes d'essais chimiques: 3C02, 3C13 et 3C14;
- 9 M: Méthodes d'essais mécaniques: 3M01, 3M03, 3M04, 3M07 et 3M09;
- 10 E: Méthodes d'essais électriques: 3E03, 3E04, 3E05, 3E11, 3E12, 3E13, 3E16, 3E17 et 3E18;
- 11 N: Méthodes d'essais d'environnement: 3N03, 3N07 et 3N12;
- 12 X: Méthodes d'essais divers: 3X01.

General Information

• Status: Published
• Publication Date: 08-Oct-2007
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: TC 91 - Electronics assembly technology
• Drafting Committee: WG 10 - TC 91/WG 10
• Current Stage: PPUB - Publication issued
• Start Date: 15-Dec-2007
• Completion Date: 09-Oct-2007

Relations

• Revises: IEC 61189-3:1997/AMD1:1999 - Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
• Effective Date: 05-Sep-2023
• Revises: IEC 61189-3:1997 - Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 61189-3
Edition 2.0 2007-10
INTERNATIONAL
STANDARD
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies –
Part 3: Test methods for interconnection structures (printed boards)

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester.
If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,
please contact the address below or your local IEC member National Committee for further information.

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About the IEC
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International Standards for all electrical, electronic and related technologies.

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IEC 61189-3
Edition 2.0 2007-10
INTERNATIONAL
STANDARD
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies –
Part 3: Test methods for interconnection structures (printed boards)

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
XE
ICS 31.180 ISBN 2-8318-9324-0
– 2 – 61189-3 © IEC:2007(E)
CONTENTS
FOREWORD.4
INTRODUCTION.6

1 Scope and object .7
2 Normative references.7
3 Accuracy, precision and resolution .8
4 Catalogue of approved test methods .11
5 P: Preparation/conditioning test methods .11
6 V: Visual test methods .11
7 D: Dimensional test methods .14
8 C: Chemical test methods .17
9 M: Mechanical test methods.30
10 E: Electrical test methods .48
11 N: Environmental test methods .75
12 X: Miscellaneous test methods.93

Annex A (informative) Worked examples. 117

Figure 1 – Glow wire .19
Figure 2 – Test apparatus .20
Figure 3a – Horizontal specimen – Flame applied to surface.24
Figure 3b – Horizontal specimen – Flame applied to edge .24
Figure 3c – Vertical specimen – Lower edge horizontal – Flame applied to edge .25
Figure 3d – Vertical specimen – Lower edge horizontal – Flame applied to surface .25
Figure 3e – Needle burner test – Side views of test board and burner .26
Figure 3 – Needle burner test .26
Figure 4 – Flux type classification by copper mirror test .30
Figure 5 – Copper foil for peel test .33
Figure 5a – Hold down clamping system.32
Figure 5b – Single load mode .32
Figure 5c – Multiple load mode.32
Figure 5d – Keyhole hold down fixture .33
Figure 6 – Bow.36
Figure 7 – Twist .36
Figure 8 – Test set-up for bow measurement.37
Figure 9 – Specimen set-up for twist measurement.37
Figure 10a – Specimen set-up for referee test for twist, raised parallel surfaces .39
Figure 10b – Specimen setup for referee test for twist, supporting jacks or blocks .39
Figure 10c – Specimen setup for referee test for twist measurements.39
Figure 10 – Specimen setup for referee test .39
Figure 11 – Bow measurement .40

61189-3 © IEC:2007(E) – 3 –
Figure 12 – Twist measurement .40
Figure 13 – Measuring equipment for peel strength of flexible printed boards.43
Figure 14 – Pencil holder.46
Figure 15a – Location of test specimens.54
Figure 15b – Location of test specimens.55
Figure 15 – Composite test pattern.55
Figure 16 – Test specimen artwork.61
Figure 17 – Fluidized sand bath.64
Figure 18 – Possible equipment configuration.68
Figure 19 – Schematic showing undisturbed interval.68
Figure 20 – Test wave form example .70
Figure 21 – Incident wave voltage showing (2 X) air line delay .70
Figure 22 – Details of test specimen.72
Figure 23 – Circuit diagram for measurement of contact resistance .73
Figure 24 – Keypad contact patterns .75
Figure 25 – Plier fixture for thermal shock test, dip soldering .82
Figure 26 – Temperature cycles for moisture and insulation resistance test graph.92
Figure 27 – Insulation resistance coupon (μm).92
Figure 28 – Typical ‘‘comb pattern’’ .93
Figure 29 – Suggested test specimen for surface mount features . 104
Figure 30 – Suggested test specimen for plated through holes. 104
Figure 31 – Rotary dip solderability test equipment . 107
Figure 32 – Effectiveness of solder wetting of plated through holes. 110
Figure 33 – Test specimen . 116

Table 1 – Student’s "t" distribution.10
Table 2 – Preferred land, hole and wire dimensions.44
Table 3 – Resistance values.61
Table 4 – Chamber temperatures for one cycle.86
Table 5 – Accelerated ageing and test requirements. 105
Table 6 – Maximum limits of solder bath contaminants . 106

– 4 – 61189-3 © IEC:2007(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
______________
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 3: Test methods for interconnection structures
(printed boards)
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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International Standard IEC 61189-3 has been prepared by IEC technical committee 91:
Electronics assembly technology.
This second edition cancels and replaces the first edition, published in 1997, its amendment 1
...

IEC 61189-3 ®
Edition 2.0 2007-10
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies –
Part 3: Test methods for interconnection structures (printed boards)

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles –
Partie 3: Méthodes d'essai des structures d'interconnexion (cartes imprimées)

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester.
If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,
please contact the address below or your local IEC member National Committee for further information.

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About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.

Useful links:
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by a variety of criteria (reference number, text, technical electrical terms containing more than 30 000 terms and
committee,…). definitions in English and French, with equivalent terms in
It also gives information on projects, replaced and additional languages. Also known as the International
withdrawn publications. Electrotechnical Vocabulary (IEV) on-line.

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IEC 61189-3 ®
Edition 2.0 2007-10
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, printed boards and other interconnection

structures and assemblies –
Part 3: Test methods for interconnection structures (printed boards)

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres

structures d'interconnexion et ensembles –

Partie 3: Méthodes d'essai des structures d'interconnexion (cartes imprimées)

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX XE
ICS 31.180 ISBN 978-2-83220-349-1

– 2 – 61189-3 © IEC:2007
CONTENTS
FOREWORD . 4
INTRODUCTION . 6

1 Scope and object . 7
2 Normative references. 7
3 Accuracy, precision and resolution . 8
4 Catalogue of approved test methods . 11
5 P: Preparation/conditioning test methods . 11
6 V: Visual test methods . 11
7 D: Dimensional test methods . 14
8 C: Chemical test methods . 17
9 M: Mechanical test methods . 30
10 E: Electrical test methods . 48
11 N: Environmental test methods . 75
12 X: Miscellaneous test methods . 93

Annex A (informative) Worked examples . 117

Figure 1 – Glow wire . 19
Figure 2 – Test apparatus . 20
Figure 3a – Horizontal specimen – Flame applied to surface . 24
Figure 3b – Horizontal specimen – Flame applied to edge . 24
Figure 3c – Vertical specimen – Lower edge horizontal – Flame applied to edge . 25
Figure 3d – Vertical specimen – Lower edge horizontal – Flame applied to surface . 25
Figure 3e – Needle burner test – Side views of test board and burner . 26
Figure 3 – Needle burner test . 26
Figure 4 – Flux type classification by copper mirror test . 30
Figure 5a – Hold down clamping system . 32
Figure 5b – Single load mode . 32
Figure 5c – Multiple load mode . 32
Figure 5d – Keyhole hold down fixture . 33
Figure 5 – Copper foil for peel test . 33
Figure 6 – Bow . 36
Figure 7 – Twist . 36
Figure 8 – Test set-up for bow measurement . 37
Figure 9 – Specimen set-up for twist measurement . 37
Figure 10a – Specimen set-up for referee test for twist, raised parallel surfaces . 38
Figure 10b – Specimen set-up for referee test for twist, supporting jacks or blocks . 39
Figure 10c – Specimen set-up for referee test for twist measurements . 39
Figure 10 – Specimen set-up for referee test . 39
Figure 11 – Bow measurement . 39
Figure 12 – Twist measurement . 40

61189-3 © IEC:2007 – 3 –
Figure 13 – Measuring equipment for peel strength of flexible printed boards . 43
Figure 14 – Pencil holder. 46
Figure 15a – Location of test specimens . 54
Figure 15b – Location of test specimens . 55
Figure 15 – Composite test pattern . 55
Figure 16 – Test specimen artwork . 61
Figure 17 – Fluidized sand bath . 64
Figure 18 – Possible equipment configuration . 68
Figure 19 – Schematic showing undisturbed interval . 68
Figure 20 – Test wave form example . 70
Figure 21 – Incident wave voltage showing (2 X) air line delay . 70
Figure 22 – Details of test specimen . 72
Figure 23 – Circuit diagram for measurement of contact resistance . 73
Figure 24 – Keypad contact patterns . 75
Figure 25 – Plier fixture for thermal shock test, dip soldering . 82
Figure 26 – Temperature cycles for moisture and insulation resistance test graph . 92
Figure 27 – Insulation resistance coupon (µm) . 92
Figure 28 – Typical ‘‘comb pattern’’ . 93
Figure 29 – Suggested test specimen for surface mount features . 104
Figure 30 – Suggested test specimen for plated through holes . 104
Figure 31 – Rotary dip solderability test equipment . 107
Figure 32 – Effectiveness of solder wetting of plated through holes . 110
Figure 33 – Test specimen . 116

Table 1 – Student’s "t" distribution . 10
Table 2 – Preferred land, hole and wire dimensions . 44
Table 3 – Resistance values . 61
Table 4 – Chamber temperatures for one cycle . 86
Table 5 – Accelerated ageing and test requirements . 105
Table 6 – Maximum limits of solder bath contaminants . 106

– 4 – 61189-3 © IEC:2007
INTERNATIONAL ELECTROTECHNICAL COMMISSION
______________
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 3: Test methods for interconnection structures
(printed boards)
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical
...