IEC 60286-4:2013

• Abstract:

  IEC 60286-4:2013 is applicable to stick magazines (including end stoppers) intended to be used for storage of electronic components, for transport from the manufacturer to the customer and for in-house use in the manufacturing plant. They are also used to feed automatic placement machines for surface mounting as well as for through-hole mounting of electronic components. This edition includes the following significant technical changes with respect to the previous edition: Clause 4 describes the guidelines for customer specific stick magazine design. It replaces the magazine design rules for IEC outlined components and rules for orientation of components in stick magazines which have been moved to Annexes A to D.

• Status: Published
• Publication Date: 25-Jul-2013
• ICS: 31.020 - Electronic components in general
• ICS: 31.240 - Mechanical structures for electronic equipment
• Technical Committee: TC 40 - Capacitors and resistors for electronic equipment
• Drafting Committee: MT 60286-4 - TC 40/MT 60286-4
• Current Stage: PPUB - Publication issued
• Start Date: 26-Jul-2013
• Completion Date: 15-Aug-2013

• Revises: IEC 60286-4:1997 - Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of form E and G
• Effective Date: 05-Sep-2023

Overview

IEC 60286-4:2013 is an internationally recognized standard developed by the International Electrotechnical Commission (IEC). It specifically addresses the packaging of electronic components in stick magazines designed for automatic handling processes. This part of the IEC 60286 series focuses on the design, dimensions, and functional requirements of stick magazines used for storage, transportation, and feeding of electronic components into automatic placement machines-covering both surface mount and through-hole mounting technologies.

This standard applies to stick magazines-including essential accessories like end stoppers-that ensure safe storage, secure transport from manufacturers to customers, and efficient in-house handling within manufacturing environments. The 2013 edition introduces updated guidelines for customer-specific stick magazine designs and reorganizes component orientation rules into informative annexes.

Key Topics

• Stick Magazine Design and Cross-Section
  IEC 60286-4 outlines various shapes and cross-sectional profiles suitable for different electronic component packages. Customization options accommodate a wide range of component geometries while safeguarding against damage and maintaining stable orientation.

• Dimensional Tolerances
  The standard specifies precise dimensional tolerances for package profiles to ensure compatibility with automated handling systems. These tolerances consider body height, overall package dimensions, and other critical measures to optimize fit and function.

• Material Requirements
  Stick magazines must be made from conductive, static-dissipative, or antistatic materials to prevent electrostatic discharge (ESD) damage to components. Additionally, materials should avoid releasing vapors or contaminants that could impair solderability or component integrity.

• Mechanical Stability
  Magazines should maintain stable positioning and allow components to slide efficiently when tilted at angles between 0.5° to 1.5°, with an elevation minimum of 30° for proper feeding into machines. This ensures smooth automated placement without jamming or damage.

• End Stoppers and Orientation
  The standard defines the use of end stoppers to secure components within the magazines and provides clear orientation rules-moved to annexes-to streamline assembly and handling processes.

• Marking and Identification
  Markings on the stick magazines are required to facilitate efficient identification of component types and manufacturers, aiding traceability throughout the supply chain.

Applications

IEC 60286-4:2013 serves critical practical roles in the electronics manufacturing industry, particularly in:

• Automatic Placement Machines
  Feeding electronic components accurately to surface mount technology (SMT) and through-hole mounting (THM) machines relies on standardized stick magazine designs to ensure seamless automation.

• Component Storage and Logistics
  Stick magazines complying with this standard provide robust solutions for safe storage and transport between manufacturers, suppliers, and customers, minimizing component damage and contamination.

• Custom Packaging Solutions
  The updated guidelines for customer-specific designs assist manufacturers in tailoring stick magazines to unique component specifications or handling requirements, improving operational efficiency.

• Static Sensitivity Protection
  Use of prescribed conductive and antistatic magazine materials reduces the risks of electrostatic discharge which can cause critical damage during handling and assembly.

By following IEC 60286-4, companies can optimize their component packaging for automated handling environments, reduce downtime caused by packaging failures, and increase the quality and reliability of assembled electronic products.

Related Standards

• IEC 60286 Series
  The series covers comprehensive packaging standards for automatic handling of electronic components, including tape packaging, reel packaging, and bulk packaging.

• IEC 60191-3:1999
  This standard provides general rules for preparing outline drawings of integrated circuits, referenced within IEC 60286-4 for package design and orientation criteria.

• IEC 60747-1:2006
  Outlines general requirements for semiconductor devices, supplementing the packaging guidelines to ensure device integrity.

• Industry ESD Standards
  Standards addressing electrostatic discharge protection complement IEC 60286-4 to safeguard sensitive electronic components during packaging and handling.

Conclusion

IEC 60286-4:2013 is essential for manufacturers and suppliers involved in the packaging and automated handling of electronic components. Adherence to this standard ensures protected transport, efficient feeding into placement equipment, and compliance with international best practices for stick magazine design and material use. It supports high-volume electronic manufacturing, reducing defects and enhancing the overall product supply chain reliability.

Keywords: IEC 60286-4, stick magazines, electronic components packaging, automated handling, surface mount technology, through-hole mounting, electronic component transport, electrostatic discharge protection, component orientation, packaging standards.

IEC 60286-4 ®
Edition 3.0 2013-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Packaging of components for automatic handling –
Part 4: Stick magazines for electronic components encapsulated in packages of
different forms
Emballage des composants pour opérations automatisées –
Partie 4: Magasins chargeurs pour composants électroniques encapsulés dans
des boîtiers de différentes formes

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester.
If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,
please contact the address below or your local IEC member National Committee for further information.

Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite ni
utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie et les
microfilms, sans l'accord écrit de la CEI ou du Comité national de la CEI du pays du demandeur.
Si vous avez des questions sur le copyright de la CEI ou si vous désirez obtenir des droits supplémentaires sur cette
publication, utilisez les coordonnées ci-après ou contactez le Comité national de la CEI de votre pays de résidence.

IEC Central Office Tel.: [phone]
3, rue de Varembé Fax: [phone]
CH-1211 Geneva 20 [e-mail]
Switzerland www.iec.ch
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.

Useful links:
IEC publications search - www.iec.ch/searchpub Electropedia - www.electropedia.org
The advanced search enables you to find IEC publications The world's leading online dictionary of electronic and
by a variety of criteria (reference number, text, technical electrical terms containing more than 30 000 terms and
committee,…). definitions in English and French, with equivalent terms in
It also gives information on projects, replaced and additional languages. Also known as the International
withdrawn publications. Electrotechnical Vocabulary (IEV) on-line.

IEC Just Published - webstore.iec.ch/justpublished Customer Service Centre - webstore.iec.ch/csc
Stay up to date on all new IEC publications. Just Published If you wish to give us your feedback on this publication
details all new publications released. Available on-line and or need further assistance, please contact the
also once a month by email. Customer Service Centre: [e-mail].

A propos de la CEI
La Commission Electrotechnique Internationale (CEI) est la première organisation mondiale qui élabore et publie des
Normes internationales pour tout ce qui a trait à l'électricité, à l'électronique et aux technologies apparentées.

A propos des publications CEI
Le contenu technique des publications de la CEI est constamment revu. Veuillez vous assurer que vous possédez
l’édition la plus récente, un corrigendum ou amendement peut avoir été publié.

Liens utiles:
Recherche de publications CEI - www.iec.ch/searchpub Electropedia - www.electropedia.org
La recherche avancée vous permet de trouver des Le premier dictionnaire en ligne au monde de termes
publications CEI en utilisant différents critères (numéro de électroniques et électriques. Il contient plus de 30 000
référence, texte, comité d’études,…). termes et définitions en anglais et en français, ainsi que
Elle donne aussi des informations sur les projets et les les termes équivalents dans les langues additionnelles.
publications remplacées ou retirées. Egalement appelé Vocabulaire Electrotechnique
International (VEI) en ligne.
Just Published CEI - webstore.iec.ch/justpublished
Service Clients - webstore.iec.ch/csc
Restez informé sur les nouvelles publications de la CEI.
Just Published détaille les nouvelles publications parues. Si vous désirez nous donner des commentaires sur
Disponible en ligne et aussi une fois par mois par email. cette publication ou si vous avez des questions
contactez-nous: [e-mail].
IEC 60286-4 ®
Edition 3.0 2013-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Packaging of components for automatic handling –

Part 4: Stick magazines for electronic components encapsulated in packages of

different forms
Emballage des composants pour opérations automatisées –

Partie 4: Magasins chargeurs pour composants électroniques encapsulés dans

des boîtiers de différentes formes

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX P
ICS 31.020; 31.240 ISBN 978-2-8322-0947-9

– 2 – 60286-4  IEC:2013
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms, definitions and conventions . 5
3.1 Terms and definitions . 5
3.2 Conventions . 5
4 Shape and cross-section of stick magazine . 6
5 Dimensions of stick magazines . 7
5.1 General . 7
5.2 Materials . 8
5.3 Recycling . 8
6 Mechanical stability . 8
7 End stoppers and spacers . 9
8 Orientation of the components in the stick magazine . 9
9 Marking . 9
Annex A (informative) DIL packages for through-hole mount . 10
Annex B (informative) SO packages for surface mounting . 12
Annex C (informative) Leaded chip carrier packages (PLCC) for surface mounting . 13
Annex D (normative) Rule for the orientation of integrated circuit packages in handling and
shipping carriers such as stick magazines and rails (from IEC 60191-3:1999, Annex G) . 14
Bibliography . 16

Figure 1 – Shape and cross-sections of stick magazines . 6
Figure 2 – Schematic of stick magazine design and schematic of package profile . 7
Figure A.1 – DIL packages for through-hole mounting . 10
Figure B.1 – SO packages for surface mounting . 12
Figure C.1 – Leaded chip carrier packages (PLCC) for surface mounting . 13
Figure D.1 – Five examples of the terminal No. 1 marking locations . 15

Table 1 – Tolerances to the package profile dimensions . 7
Table 2 – Principle of stick magazine requirements . 8
Table 3 – Material reference for magazines and stoppers . 8
Table A.1 – e = 3 modules e . 10
Table A.2 – e = 4 modules e . 11
Table A.3 – e = 6 modules e . 11
Table B.1 – Stick magazine dimensions for SO packages . 12
Table C.1 – Stick magazine dimensions for PLCC packages . 13

60286-4  IEC:2013 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –

Part 4: Stick magazines for electronic components encapsulated
in packages of different forms

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60286-4 has been prepared by IEC technical committee 40:
Capacitors and resistors for electronic equipment.
This third edition cancels and replaces the second edition published in 1997 and constitutes a
technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
– Clause 4 describes the guidelines for customer specific stick magazine design. It replaces
the magazine design rules for IEC outlined components and rules for orientation of
components in stick magazines which have been moved to Annexes A to D.

– 4 – 60286-4  IEC:2013
The text of this standard is based on the following documents:
FDIS Report on voting
40/2230/FDIS 40/2241/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 60286 series, published under the general title Packaging of
components for automatic handling, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until the
stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data related to
the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
60286-4  IEC:2013 – 5 –
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –

Part 4: Stick magazines for electronic components encapsulated
in packages of different forms

1 Scope
This part of IEC 60286 is applicable to stick magazines (including end stoppers) intended to be
used for storage of electronic components, for transport from the manufacturer to the customer
and for in-house use in the manufacturing plant. They are also used to feed automatic
placement machines for surface mounting as well as for through-hole mounting of electronic
components.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
IEC 60191-3:1999, Mechanical standardization of semiconductor devices – Part 3: General
rules for the preparation of outline drawings of integrated circuits
IEC 60747-1:2006, Semiconductor devices – Part 1: General
Amendment 1:2010
3 Terms, definitions and conventions
3.1 Terms and definitions
For the purposes of this document, the following definitions apply.
3.1.1
stick magazine
elongated container which has an appropriate cross section designed to accommodate devices
Note 1 to entry: Alternative terms such as tube, rail and magazine may be used.
3.1.2
end stoppers
mechanism placed at each end of the stick magazine to keep the devices from falling out of the
stick magazine
Note 1 to entry: Alternative terms such as pins, plugs, end plugs, nails, retainers etc. may be used, but for the
purposes of this standard "end stopper" shall be used.
3.2 Conventions
All dimensions in tables and figures representing sizes are in millimetres. All dimensions in
tables and figures representing angles or radii are in degrees.

– 6 – 60286-4  IEC:2013
4 Shape and cross-section of stick magazine
Examples of typical and customized cross-sections for stick magazines are given in Figure 1.

Customized form
IEC  1734/13
Figure 1 – Shape and cross-sections of stick magazines
Internal stick magazine configuration shall be such that the individual component is protected
from damage, maintains a fixed orientation and slides freely when one end is elevated at a
minimum angle of 30°.
As magazine material over time is changing, the level of elevation of 30° may not be sufficient
for freely sliding of components. In this case, to allow proper transition of the component from
the magazine to a horizontal surface, the level of elevation should be kept to a minimum.

60286-4  IEC:2013 – 7 –
5 Dimensions of stick magazines
5.1 General
Because the shape of the cross-section varies, the controlled distance tolerances should
conform to the values in Table 1, Table 2 and Figure 2. This table provides the tolerances to
the package profile dimensions, which is a summary of the tolerances for various standard
outlines (see Annexes A, B and C).

A
T
H
D
A
B
A
e
E
H
E
C
IEC  1735/13
Schematic of stick magazine design             Schematic of package profile
L
IEC  1736/13
Figure 2 – Schematic of stick magazine design and schematic of package profile
Table 1 – Tolerances to the package profile dimensions
Functional cross reference Tolerances to package
profile dimensions
Stick magazine Package profile

A H
+ 0,5
B A
3 Package dimension
− 0,0
C H
E
D A
Package dimension ± 0,2
E e
NOTE 1 A is the body height of the component.
NOTE 2 A is the total package height of the component.
NOTE Additional protection of the component can be given by individual design to prevent cross traversing to the
stick magazine length (prevention of bend leads).

– 8 – 60286-4  IEC:2013
Table 2 – Principle of stick magazine requirements
Dimension Nominal value and
tolerances
0,5° to 1,5°
All radii
L 530 mm max.
T 0,6 mm –0,15 / +0,2
5.2 Materials
The material shall be conductive, static dissipative or antistatic (a measuring method and
requirements are under consideration).
The loaded magazines shall be suitable to withstand transport and storage without danger of
giving off vapours or of contaminating the surface of the terminations, which could make
soldering difficult or deteriorate the component properties or terminations by chemical action.
As a minimum, the component device type, manufacturer's name or trade mark and date code
shall be legible without removal of the components from the stick magazine. Where the stick
material is not transparent, a suitable window or a series of windows/holes shall be provided
for inspection purposes.
5.3 Recycling
Stick magazines should be made of recyclable material. When such material is used the
magazine shall be permanently marked with the recycling symbol.
The end-stoppers should be of the same material as the stick magazine. This does not apply to
PVC-free type stick magazines, see Table 3.
Table 3 – Material reference for magazines and stoppers
Magazine type Magazine material Stopper material
PVC type PVC (hard type) PVC (soft type)
PVC free type PVC free PVC free
(e.g. PC or PET) (e.g. Elastomer (thermoplastic))

ISO 11469 should be used.
6 Mechanical stability
The mechanical stability of a loaded magazine during storage, transport and use shall be such
that the components are adequately retained, without deformation of the terminations or other
damage, in order to maintain their orientation within the magazine, yet enabling them to be
easily removed.
The magazine, which should not exceed 530 mm in length, shall also be suitable for use with
automatic placement machines or test equipment, and should be capable of bending in the
length axis through a radius of 600 mm. They shall be so designed that they can be stacked in
the machines and shall not overturn.

60286-4  IEC:2013 – 9 –
7 End stoppers and spacers
End stoppers may be used to close the ends of the stick magazines, and spacers may be used
to limit the movement of the components within the stick magazines.
For end stoppers and spacers the following rules apply:
a) They shall be of any suitable material, preferably recyclable. When such a material is used
and size permits, end stoppers and spacers shall be marked with the recycling symbol.
b) They shall be of static dissipative or antistatically-coated material, and spacers shall be of
adequate compliance to prevent component damage.
c) End stoppers shall stay in place at the ends of the magazines until they are intentionally
removed, and shall be easily removable to disperse the devices without damaging the stick
magazines.
8 Orientation of the components in the stick magazine
See IEC 60191-3:1999, Annex G.
Rule (see also Annex D).
Integrated circuit packages shall be put in stick magazines with the terminal No. 1 mark
orientation. The side with the mark has to exit first from the carrier.
When the packages are in the carrier and viewed from the top, the terminal No. 1 mark shall be
left or in the lower left corner, and component marking shall be readable from the left to right.
9 Marking
The magazines shall be marked "Dissipative" or "Antistatic" as applicable.
The direction of unloading shall be marked on the magazines.
If the components are electrostatically sensitive and require special precautions during
handling, the magazines shall also be marked as required in Clause 8 of IEC 60747-1:2006,
Amendment 1:2010.
– 10 – 60286-4  IEC:2013
Annex A
(informative)
DIL packages for through-hole mount

See IEC 60191-2, code 050G:1978, code 51G:1987 and code 60G:1987.
The principle of the functional dimensions of stick magazines for DIL package outlines with 6
to 48 terminals, and with a terminal row spacing of 3, 4 or 6 modules (module e = 2,54 mm =
0,1 inch) is as shown in Figure A.1. The functional dimensions, derived from outer and inner
dimensions, are given in Tables A.1, A.2 and A.3. These dimensions apply to ceramic, plastic
and side brazed termination packages.

+ 0,1
A
mm
0,6
- 0,2
D
E
A
B
+ 2°
- 0°
C e
IEC  1737/13
Magazine section    Component cross-section
All radii: 0,5 mm to 1,5 mm.
Figure A.1 – DIL packages for through-hole mounting
Other shapes are permitted within the dimensions given for outline families covered by this
standard.
Stick magazine dimensions for DIL packages with terminal row spacing e are given below.
Table A.1 – e = 3 modules e
Dimensions Low profile Regular profile
package height A package height A
2 2
mm
2,0 to 3,5 >3,5 to 4,6
A 9,3 ± 0,5 9,3 ± 0,5
B
12,0 ± 0,5 13,5 ± 0,5
C 13,5 ± 0,5 15,5 ± 0,5
D
4,0 ± 0,2 5,1 ± 0,2
E 5,4 ± 0,2 5,4 ± 0,2
60286-4  IEC:2013 – 11 –
Table A.2 – e = 4 modules e
Low profile Regular profile
Dimensions
package height A package height A
mm
2,0 to 3,5 >3,5 to 4,6
A 12,0 ± 0,5 12,0 ± 0,5
B
12,0 ± 0,5 13,5 ± 0,5
C 18,0 ± 0,5 18,0 ± 0,5
D
4,0 ± 0,2 5,1 ± 0,2
E 8,2 ± 0,2 8,2 ± 0,2
Table A.3 – e = 6 modules e
Regular profile
Low profile
Dimensions
package height A package height A
2 2
mm
2,0 to 3,5 > 3,5 to 4,6
A
17,3 ± 0,5 17,3 ± 0,5
B 12,0 ± 0,5 13,5 ± 0,5
C
23,0 ± 0,5 23,0 ± 0,5
D 4,0 ± 0,2 5,1 ± 0,2
E
12,5 ± 0,2 12,5 ± 0,2
Preferred maximum magazine length: 530 mm.

– 12 – 60286-4  IEC:2013
Annex B
(informative)
SO packages for surface mounting

See IEC 60191-2, code 075E:1990 and code 076E:1990.
The principle of the functional dimensions of stick magazines for SO packages with 4 to 28
terminals, and with a maximum width H of 6,7 mm or 10,7 mm and a maximum height A
E
of 1,8 mm or 2,45 mm respectively, is as given in Figure B.1 and in Table B.1.

A
D
A
B 2
E
H
E
C
IEC  1738/13
Magazine section Component cross-section
Figure B.1 – SO packages for surface mounting
Table B.1 – Stick magazine dimensions for SO packages
Package outline type
Dimensions
(see IEC 60191-2)
mm 076E01 – 076E07 075E01 – 075E06
A 7,0 min. 11,0 min.
B 110 % to 135 % of A . 110 % to 135 % of A .
2 2
C 110 % to 135 % of H 110 % to 135 % of H
E E
D 2,8 min. 3,8 min.
E 3,3 max. 7,1 max.
Magazine material 0,45 – 0,8 0,45 – 0,8
thickness
Length 530 max. 530 max.
60286-4  IEC:2013 – 13 –
Annex C
(informative)
Leaded chip carrier packages (PLCC) for surface mounting

See IEC 60191-2, code 102E:2001 and code 112E:1990.
The principle of the functional dimensions for PLCC stick magazines is shown in Figure C.1
with variants of cross-sections. The functional dimensions derived from outer and inner
dimensions are given in Table C.1.

A
45°
B
A A
D
C F
H
E
IEC  1739/13
Magazine section Component cross-section
Figure C.1 – Leaded chip carrier packages (PLCC) for surface mounting
Table C.1 – Stick magazine dimensions for PLCC packages
Package outline type
Dimensions
(see IEC 60191-2)
mm 102E02 – 102E07 112E01 – 112E05
C Package width F Package width H
E
+ allowance of + allowance of
0,6 min. to 0,9 max. 0,6 min. to 0,9 max.
B, D 110 % to 135 % of package thickness A
A A equals the length where at the set dimension D. the tube is
curved inward by 45° until it reaches height B
Magazine material 0,5 – 1,0
thickness
Length 530 max.
– 14 – 60286-4  IEC:2013
Annex D
(normative)
Rule for the orientation of integrated circuit packages in handling
and shipping carriers such as stick magazines and rails
(from IEC 60191-3:1999, Annex G)

D.1 Overview
The users of integrated circuits which are supplied by different manufacturers need to have
integrated circuit packages oriented in a standard way in handling and shipping carriers such
as stick magazines and rails.
For this reason a rule is required to designate the orientations of the integrated circuit
packages relative to their stick magazines or rails and code mark in stick magazines or rails.
D.2 Rule
Integrated circuit packages shall be put in carrier packages such as stick magazines and rails
with the terminal No. 1 mark oriented so that the side with the mark exits first from the carrier.
When the packages are in the carrier and viewed from the top, the terminal No. 1 mark shall be
to the left or in the lower left corner, and marking shall be right side up and readable from the
left to the right.
For examples: see Figure D.1.
Terminal No. 1 exits as first terminal of the row which contains ter
...