IEC TR 62240-1:2018
(Main)Process management for avionics - Electronic components capability in operation - Part 1: Temperature uprating
Process management for avionics - Electronic components capability in operation - Part 1: Temperature uprating
IEC TR 62240-1:2018 is available as IEC TR 62240-1:2018 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC TR 62240-1:2018 is a technical report, which provides information when using semiconductor devices in wider temperature ranges than those specified by the device manufacturer. The uprating solutions described herein are considered exceptions, when no reasonable alternatives are available; otherwise devices are utilized within the manufacturers’ specifications. This document describes the methods and processes for implementing this special case of thermal uprating. All of the elements of these methods and processes employ existing, commonly used best engineering practices. No new or unique engineering knowledge is needed to follow these processes, only a rigorous application of the overall approach. The terms “uprating” and “thermal uprating” are being used increasingly in avionics industry discussions and meetings, and clear definitions are included in the present IEC Technical Report. They were coined as shorthand references to a special case of methods commonly used in selecting electronic components for circuit design. This new edition cancels and replaces the first edition published in 2013 and includes a revised wording for subclause 4.1 (Introduction to selection provisions) and the associated flowchart.
General Information
Standards Content (Sample)
IEC TR 62240-1
Edition 2.0 2018-03
TECHNICAL
REPORT
colour
inside
Process management for avionics – Electronic components capability in
operation –
Part 1: Temperature uprating
IEC TR 62240-1:2018-03(en)
---------------------- Page: 1 ----------------------
THIS PUBLICATION IS COPYRIGHT PROTECTED
Copyright © 2018 IEC, Geneva, Switzerland
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.IEC Central Office Tel.: +41 22 919 02 11
3, rue de Varembé info@iec.ch
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.IEC Catalogue - webstore.iec.ch/catalogue Electropedia - www.electropedia.org
The stand-alone application for consulting the entire The world's leading online dictionary of electronic and
bibliographical information on IEC International Standards, electrical terms containing 21 000 terms and definitions in
Technical Specifications, Technical Reports and other English and French, with equivalent terms in 16 additional
documents. Available for PC, Mac OS, Android Tablets and languages. Also known as the International Electrotechnical
iPad. Vocabulary (IEV) online.IEC publications search - webstore.iec.ch/advsearchform IEC Glossary - std.iec.ch/glossary
The advanced search enables to find IEC publications by a 67 000 electrotechnical terminology entries in English and
variety of criteria (reference number, text, technical French extracted from the Terms and Definitions clause of
committee,…). It also gives information on projects, replaced IEC publications issued since 2002. Some entries have been
and withdrawn publications. collected from earlier publications of IEC TC 37, 77, 86 and
CISPR.IEC Just Published - webstore.iec.ch/justpublished
Stay up to date on all new IEC publications. Just Published IEC Customer Service Centre - webstore.iec.ch/csc
details all new publications released. Available online and If you wish to give us your feedback on this publication or
also once a month by email. need further assistance, please contact the Customer Service
Centre: sales@iec.ch.---------------------- Page: 2 ----------------------
IEC TR 62240-1
Edition 2.0 2018-03
TECHNICAL
REPORT
colour
inside
Process management for avionics – Electronic components capability in
operation –
Part 1: Temperature uprating
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-5364-9
Warning! Make sure that you obtained this publication from an authorized distributor.
® Registered trademark of the International Electrotechnical Commission---------------------- Page: 3 ----------------------
– 2 – IEC TR 62240-1:2018 © IEC 2018
CONTENTS
FOREWORD ........................................................................................................................... 5
INTRODUCTION ..................................................................................................................... 7
1 Scope .............................................................................................................................. 8
2 Normative references ...................................................................................................... 8
3 Terms, definitions and abbreviated terms ........................................................................ 8
3.1 Terms and definitions .............................................................................................. 8
3.2 Abbreviated terms ................................................................................................. 12
4 Selection provisions ...................................................................................................... 12
4.1 General ................................................................................................................. 12
4.2 Device selection, usage and alternatives .............................................................. 14
4.2.1 General ......................................................................................................... 14
4.2.2 Alternatives ................................................................................................... 14
4.2.3 Device technology ......................................................................................... 14
4.2.4 Compliance with the electronic component management plan ........................ 15
4.3 Device capability assessment ............................................................................... 15
4.3.1 General ......................................................................................................... 15
4.3.2 Device package and internal construction capability assessment ................... 15
4.3.3 Risk assessment (assembly level) ................................................................. 15
4.3.4 Device uprating methods ............................................................................... 16
4.3.5 Device reliability assurance ........................................................................... 17
4.4 Device quality assurance (QA) over wider temperature ranges.............................. 18
4.4.1 Decision for the optimum QA method ............................................................. 18
4.4.2 Device level testing ....................................................................................... 19
4.4.3 Higher level assembly testing ........................................................................ 19
4.5 QA process ........................................................................................................... 19
4.5.1 General ......................................................................................................... 19
4.5.2 Semiconductor device change monitoring ...................................................... 19
4.5.3 Failure data collection and analysis ............................................................... 19
4.6 Final electronic equipment assurance ................................................................... 20
4.7 Documentation and identification .......................................................................... 20
4.7.1 Documentation .............................................................................................. 20
4.7.2 Device identification ...................................................................................... 20
4.7.3 Customer notification ..................................................................................... 20
Annex A (informative) Device parameter re-characterisation ................................................ 22
A.1 Glossary of symbols .............................................................................................. 22
A.2 Rationale for parameter re-characterisation .......................................................... 23
A.2.1 General ......................................................................................................... 23
A.2.2 Assessment for uprateability .......................................................................... 23
A.3 Capability assurance ............................................................................................. 24
A.3.1 Description .................................................................................................... 24
A.3.2 Parameter re-characterisation process .......................................................... 24
A.3.3 Application capability assessment ................................................................. 29
A.4 Quality assurance ................................................................................................. 30
A.5 Factors to be considered in parameter re-characterisation .................................... 30
A.6 Report form for documenting device parameter re-characterisation ....................... 32
Annex B (informative) Stress balancing................................................................................ 34
---------------------- Page: 4 ----------------------IEC TR 62240-1:2018 © IEC 2018 – 3 –
B.1 General ................................................................................................................. 34
B.2 Glossary of symbols .............................................................................................. 34
B.3 Stress balancing ................................................................................................... 34
B.3.1 General ......................................................................................................... 34
B.3.2 Determine the ambient temperature extremes ................................................ 35
B.3.3 Determine parameter relationship to power dissipation .................................. 35
B.3.4 Determine the dissipated power versus ambient temperaturerelationship .................................................................................................... 35
B.3.5 Assess applicability of the method ................................................................. 37
B.3.6 Determine the new parameter values ............................................................. 37
B.3.7 Conduct parametric and functional tests ........................................................ 38
B.4 Application example .............................................................................................. 38
B.4.1 General ......................................................................................................... 38
B.4.2 Determine the ambient temperature extremes ................................................ 39
B.4.3 Select the parameters that can be derated..................................................... 39
B.4.4 Construct an Iso-T plot ................................................................................. 40
B.4.5 Determine whether or not the device can be uprated ..................................... 40
B.4.6 Determine the new parameter values ............................................................. 40
B.4.7 Conduct parametric and functional tests ........................................................ 41
B.5 Other notes ........................................................................................................... 41
B.5.1 Margins ......................................................................................................... 41
B.5.2 Cautions and limitations................................................................................. 41
Annex C (informative) Parameter conformance assessment ................................................. 44
C.1 General ................................................................................................................. 44
C.2 Test plan ............................................................................................................... 44
C.2.1 General ......................................................................................................... 44
C.2.2 Critical parameters ........................................................................................ 44
C.2.3 Minimum allowable test margins .................................................................... 44
C.2.4 Test options ................................................................................................... 45
C.2.5 Quality assurance .......................................................................................... 48
Annex D (informative) Higher assembly level testing ............................................................ 51
D.1 General ................................................................................................................. 51
D.2 Process ................................................................................................................ 51
D.2.1 General ......................................................................................................... 51
D.2.2 Analysis of assembly test definition ............................................................... 51
D.2.3 Perform assembly test ................................................................................... 51
D.2.4 Document results ........................................................................................... 52
D.2.5 Maintenance notification ................................................................................ 52
Bibliography .......................................................................................................................... 54
Figure 1 – Flow chart for semiconductor devices over wider temperature ranges .................. 13
Figure 2 – Report form for documenting device usage over wider temperature ranges .......... 21
Figure A.1 – Parameter re-characterisation ........................................................................... 23
Figure A.2 – Flow diagram of parameter re-characterisation capability assuranceprocess ................................................................................................................................. 25
Figure A.3 – Margin in electrical parameter measurement based on the results of the
sample test ........................................................................................................................... 28
Figure A.4 – Schematic diagram of parameter limit modifications .......................................... 29
---------------------- Page: 5 ----------------------– 4 – IEC TR 62240-1:2018 © IEC 2018
Figure A.5 – Parameter re-characterisation device quality assurance ................................... 30
Figure A.6 – Schematic of outlier products that can invalidate sample testing ....................... 31
Figure A.7 – Example of intermediate peak of an electrical parameter: Voltagefeedback input threshold change for Motorola MC34261 power factor controller, see [4] ....... 32
Figure A.8 – Report form for documenting device parameter re-characterisation ................... 33
Figure B.1 – Iso-T curve: Relationship between ambient temperature and dissipated
power ................................................................................................................................... 36
Figure B.2 – Graph of electrical parameters versus dissipated power.................................... 38
Figure B.3 – Iso-T curve for the Fairchild MM74HC244 ....................................................... 40
Figure B.4 – Power versus frequency curve for the Fairchild MM74HC244 ............................ 41
Figure B.5 – Flow chart for stress balancing ......................................................................... 42
Figure B.6 – Report form for documenting stress balancing .................................................. 43
Figure C.1 – Relationship of temperature ratings, requirements and margins ........................ 45
Figure C.2 – Typical fallout distribution versus T ...................................................... 47
req-maxFigure C.3 – Parameter conformance assessment flow ......................................................... 49
Figure C.4 – Report form for documenting parameter conformance testing ........................... 50
Figure D.1 – Flow chart of higher level assembly testing ....................................................... 52
Figure D.2 – Report form for documenting higher level assembly test at temperature
extremes ............................................................................................................................... 53
Table A.1 – Example of sample size calculation .................................................................... 26
Table A.2 – Parameter re-characterisation example: SN74ALS244 octal buffer/driver ........... 29
---------------------- Page: 6 ----------------------IEC TR 62240-1:2018 © IEC 2018 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PROCESS MANAGEMENT FOR AVIONICS – ELECTRONIC
COMPONENTS CAPABILITY IN OPERATION –
Part 1: Temperature uprating
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
The main task of IEC technical committees is to prepare International Standards. However, a
technical committee may propose the publication of a technical report when it has collected
data of a different kind from that which is normally published as an International Standard, for
example "state of the art".IEC TR 62240-1, which is a Technical Report, has been prepared by IEC technical committee
107: Process management for avionics.This second edition cancels and replaces the first edition published in 2013. This edition
constitutes a technical revision. This edition includes the following significant technical
changes with respect to the previous edition:a) Revised the wording in 4.1 and the corresponding Figure 1 to reflect current industry
practices.---------------------- Page: 7 ----------------------
– 6 – IEC TR 62240-1:2018 © IEC 2018
The text of this Technical Report is based on the following documents:
CDTR Report on voting
107/313/DTR 107/322/RVDTR
Full information on the voting for the approval of this Technical Report can be found in the
report on voting indicated in the above table.This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 62240 series, published under the general title Process
management for avionics – Electronic components capability in operation, can be found on
the IEC website.The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correctunderstanding of its contents. Users should therefore print this document using a
colour printer.---------------------- Page: 8 ----------------------
IEC TR 62240-1:2018 © IEC 2018 – 7 –
INTRODUCTION
Traditionally, industries that produced electronic equipment for ADHP (aerospace, defence
and high performance) applications have relied on the military specification system for
semiconductor device standards and upon manufacturers of military-specified devices as
device sources. This assured the availability of semiconductor devices specified to operate
over the temperature ranges required for electronic equipment in ADHP applications. In the
past, several device manufacturers have exited the military market, resulting in the decreased
availability of devices specified to operate over wide temperature ranges. Following are some
typical ambient temperature ranges at which devices are marketed:Military:
–55 °C to + 125 °C
Automotive:
–40 °C to + 125 °C
Industrial:
–40 °C to + 85 °C
Commercial:
0 °C to + 70 °C
If there are no reasonable or practical alternatives, then a potential response is for electronic
equipment manufacturers to use devices at temperature ranges that are wider than those
specified by the device manufacturer.This document provides information on selecting semiconductor devices, assessing their
capability to operate, and assuring their intended quality in the wider temperature ranges. It
also reports the need for documentation of such usage.This can be supported by exchanging technical information with the original device
manufacturer.Operation of the device beyond the manufacturer’s limits can result normally in loss of
warranty by the device manufacturer.---------------------- Page: 9 ----------------------
– 8 – IEC TR 62240-1:2018 © IEC 2018
PROCESS MANAGEMENT FOR AVIONICS – ELECTRONIC
COMPONENTS CAPABILITY IN OPERATION –
Part 1: Temperature uprating
1 Scope
This part of IEC 62240, which is a technical report, provides information when using
semiconductor devices in wider temperature ranges than those specified by the device
manufacturer. The uprating solutions described herein are considered exceptions, when no
reasonable alternatives are available; otherwise devices are utilized within the manufacturers’
specifications.The terms “uprating” and “thermal uprating” are being used increasingly in avionics industry
discussions and meetings, and clear definitions are included in Clause 3. They were coined
as shorthand references to a special case of methods commonly used in selecting electronic
components for circuit design.This document describes the methods and processes for implementing this special case of
thermal uprating. All of the elements of these methods and processes employ existing,
commonly used best engineering practices. No new or unique engineering knowledge is
needed to follow these processes, only a rigorous application of the overall approach.
Even though the device is used at wider temperatures, the wider temperatures usage will be
limited to those that do not compromise applications performance and reliability, particularly
for devices with narrow feature size geometries (for example, 90 nm and less). This document
does not imply that applications use the device to function beyond the absolute maximum
rating limits specified by the original device manufacturer and assumes that:– device usage outside the original device manufacturers’ specified temperature ranges is
done only when no reasonable alternative approach is available and is performed with
appropriate justification;– if it is necessary to use devices outside the original device manufacturers’ specified
temperature ranges, it is done with documented and controlled processes that assure
integrity of the electronic equipment.2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.IEC TS 62239-1, Process management for avionics – Management plan – Part 1: Preparation
and maintenance of an electronic components management plan3 Terms, definitions and abbreviated terms
3.1 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
---------------------- Page: 10 ----------------------
IEC TR 62240-1:2018 © IEC 2018 – 9 –
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1.1
absolute maximum ratings
limiting values of operating and environmental conditions applicable to any semiconductor
device of a specific type as defined by its published specification data, which should not be
exceeded under the worst possible conditions[SOURCE: IEC 60134:1961, Clause 4]
3.1.2
ambient temperature
temperature of the environment in which a semiconductor device is operating
3.1.3
case temperature
temperature of the surface of a semiconductor device package during operation
3.1.4
circuit element functional mode analysis
documented analysis that determines minimum ranges and maximums of all functional
characteristics of the assembly with respect to the related functional parameters of devices
being uprated3.1.5
COTS product
commercial off-the-shelf product
one or more components, assembled and developed for multiple commercial consumers,
whose design and/or configuration is controlled by the manufacturer’s specification or industry
standardNote 1 to entry: COTS products can include electronic components, subassemblies or assemblies, or top level
assemblies. Electronic COTS subassemblies or assemblies include circuit card assemblies, power supplies, hard
drives, and memory modules. Top-level COTS assemblies include a fully integrated rack of equipment such as raid
arrays, file servers to individual switches, routers, personal computers, or similar equipment.
[SOURCE: IEC TS 62668-1:2016, 3.1.3]3.1.6
device capability assessment
process of demonstrating that the device design is capable of providing the specified
functionality and operation over the wider temperature range, for the required length of time
Note 1 to entry: It assumes that the device has been qualified to operate within its specified temperature range,
and includes additional testing or analysis to evaluate expected performance at the wider temperature range.
Device capability assessment includes both performance and application-specific reliability.
3.1.7device quality assurance over the wider temperature range
additional testing or analysis required to assure that each individual device is capable of
operating successfully in the required wider temperature range3.1.8
device
component
material element or assembly of such elements intended to perform a required function
---------------------- Page: 11 ----------------------– 10 – IEC TR 62240-1:2018 © IEC 2018
Note 1 to entry: A device may form part of a larger device.
[SOURCE: IEC 60050-151:2001, 151-11-20, modified – The term "component" has been
added as a synonym to "device".]
3.1.8.1
semiconductor device
electrical or e
...
Questions, Comments and Discussion
Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.