IEC/TR 61000-5-1
(Main)IEC 62228-2 Ed.1: Integrated circuits - EMC Evaluation of LIN transceivers
IEC 62228-2 Ed.1: Integrated circuits - EMC Evaluation of LIN transceivers
This technical report covers general considerations and guidelines on mitigation methods aimed at ensuring electromagnetic compatibility (EMC) among electrical and electronic apparatus or systems used in industrial, commercial, and residential installations. This technical report is intended for use by installers and users, and to some extent manufacturers, of sensitive electrical or electronic installations and systems, and equipment with high emission levels that could degrade the overall electromagnetic (EM) environment. It applies primarily to new installations, but where economically feasible, it may be applied to extensions or modifications to existing facilities.
Compatibilité électromagnétique (CEM) - Partie 5: Guides d'installation et d'atténuation - Section 1: Considérations générales - Publication fondamentale en CEM
Le présent rapport technique recouvre des considérations générales et des recommandations sur les méthodes d'atténuation destinées à assurer la compatibilité électromagnétique (CEM) parmi les appareils ou systèmes électriques et électroniques utilisés dans des installations industrielles, commerciales et domestiques. Ce rapport est destiné à être utilisé par les installateurs et utilisateurs, et dans une certaine mesure par les constructeurs d'installations et systèmes électriques ou électroniques sensibles et d'équipements à niveaux d'émission élevés qui pourraient dégrader l'environnement électromagnétique (EM) global. Il s'applique en premier lieu aux installations nouvelles, mais quand cela est économiquement possible, également aux extensions et aux modifications d'installations existantes.
Electromagnetic compatibility (EMC) - Part 5: Installation and mitigation guidelines - Section 1: General considerations - Basic EMC publication
General Information
Standards Content (Sample)
SLOVENSKI SIST-TP IEC/TR3 61000-5-
1:2004
STANDARD
april 2004
Electromagnetic compatibility (EMC) - Part 5: Installation and mitigation guidelines -
Section 1: General considerations - Basic EMC publication
ICS 33.100.01 Referenčna številka
SIST-TP IEC/TR3 61000-5-1:2004(en)
© Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno
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RAPPORT
CEI
TECHNIQUE – TYPE 3
IEC
1000-5-1
TECHNICAL
Première édition
REPORT – TYPE 3
First edition
1996-12
Compatibilité électromagnétique (CEM) –
Partie 5:
Guides d’installation et d’atténuation –
Section 1: Considérations générales
Publication fondamental en CEM
Electromagnetic compatibility (EMC) –
Part 5:
Installation and mitigation guidelines –
Section 1: General considerations
Basic EMC publication
CEI 1996 Droits de reproduction réservés Copyright - all rights reserved
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microfilms, sans l'accord écrit de l'éditeur. in writing from the publisher
Bureau central de la Commission Electrotechnique Internationale 3, rue de Varembé Genève Suisse
CODE PRIX
Commission Electrotechnique Internationale
V
International Electrotechnical Commission PRICE CODE
Pour prix, voir catalogue en vigueur
For price, see current catalogue
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1000-5-1 © IEC:1996 – 3 –
CONTENTS
Page
FOREWORD . 5
INTRODUCTION. 9
Clause
1 Scope . 11
2 Reference documents . 11
3 Definitions. 13
4 General considerations on electromagnetic compatibility (EMC) of installations. 15
4.1 Aim of proper installation and design. 19
4.2 Emitter, coupling, susceptor . 19
4.3 Overview of EM disturbances . 21
4.4 EMC and safety (insulation) installation requirements. 25
4.5 Selection/characterization of EM environments. 25
4.6 Immunity of equipment . 25
4.7 Mitigation methods: specification and evaluation. 25
Figures
1 Electromagnetic influence representation. 19
2 Representation of equipment ports interfacing with the electromagnetic
environment . 27
3 Principle of global protection by single barrier. 29
4 Principle of global protection by multiple barriers. 29
5 Principle of distributed protection. 31
Annexes
A Examples of system protection . 35
B Mitigation of low-frequency disturbances. 39
C Example of an installation check-list . 43
D Bibliography. 61
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1000-5-1 © IEC:1996 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
_________
ELECTROMAGNETIC COMPATIBILITY (EMC) –
Part 5: Installation and mitigation guidelines –
Section 1: General considerations
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International Organization
for Standardization (ISO) in accordance with conditions determined by agreement between the two
organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical reports or guides and they are accepted by the National Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject
of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
The main task of IEC technical committees is to prepare International Standards. In
exceptional circumstances, a technical committee may propose the publication of a technical
report of one of the following types:
• type 1, when the required support cannot be obtained for the publication of an
International Standard, despite repeated efforts;
• type 2, when the subject is still under technical development or where for any other
reason there is the future but no immediate possibility of an agreement on an International
Standard;
• type 3, when a technical committee has collected data of a different kind from that
which is normally published as an International Standard, for example "state of the art".
Technical reports of types 1 and 2 are subject to review within three years of publication to
decide whether they can be transformed into International Standards. Technical reports of
type 3 do not necessarily have to be reviewed until the data they provide are considered to be
no longer valid or useful.
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1000-5-1 © IEC:1996 – 7 –
IEC 1000-5-1, which is a technical report of type 3, has been prepared by subcommittee 77B:
High-frequency phenomena, of IEC technical committee 77: Electromagnetic compatibility.
The text of this technical report is based on the following documents:
Committee draft Report on voting
77B/155/CDV 77B/177/RVC
Full information on the voting for the approval of this technical report can be found in the report
on voting indicated in the above table.
This document is issued in the type 3 technical report series of publications (according to
G.3.2.3 of part 1 of the IEC/ISO Directives) as a purely informative document.
This document is not to be regarded as an International Standard.
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1000-5-1 © IEC:1996 – 9 –
INTRODUCTION
IEC 1000-5 is a part of the IEC 1000 series, according to the following structure:
Part 1: General
General considerations (introduction, fundamental principles)
Definitions, terminology
Part 2: Environment
Description of the environment
Classification of the environment
Compatibility levels
Part 3: Limits
Emission limits
Immunity limits (in so far as they do not fall under the responsibility of the product
committees)
Part 4: Testing and measurement techniques
Measurement techniques
Testing techniques
Part 5: Installation and mitigation guidelines
Installation guidelines
Mitigation methods and devices
Part 6: Generic standards
Part 9: Miscellaneous
Each part is further subdivided into sections which are to be published either as international
standards or as technical reports.
These sections of IEC 1000-5 will be published in chronological order and numbered
accordingly.
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1000-5-1 © IEC:1996 – 11 –
ELECTROMAGNETIC COMPATIBILITY (EMC) –
Part 5: Installation and mitigation guidelines –
Section 1: General considerations
1 Scope
This technical report covers general considerations and guidelines on mitigation methods
aimed at ensuring electromagnetic compatibility (EMC) among electrical and electronic
apparatus or systems used in industrial, commercial, and residential installations. This
technical report is intended for use by installers and users, and to some extent manufacturers,
of sensitive electrical or electronic installations and systems, and equipment with high emission
levels that could degrade the overall electromagnetic (EM) environment. It applies primarily to
new installations, but where economically feasible, it may be applied to extensions or
modifications to existing facilities.
Specific topics, such as recommendations on the design and implementation of the earthing
system, including the earth electrode and the earth network, the design and implementation of
bonding apparatus or systems to earth or to the earth network, the selection and installation of
appropriate cables, and the design and implementation mitigation means involving shielded
enclosures, high-frequency filters, isolating transformers, surge-protective devices, etc. will be
addressed in other sections of part 5.
The recommendations presented in this report address the EMC concerns of the installation,
not the safety aspects of the installation nor the efficient transportation of power within the
installation. Nevertheless, these two prime objectives are taken into consideration in the
recommendations concerning EMC. These two primary objectives can be implemented
concurrently for enhanced EMC of the installed sensitive apparatus or systems without conflict
by applying the recommended practices presented in this report and the relevant safety
requirements such as those of IEC 364. As each installation is unique, it is the responsibility of
the designer and the installer to select the relevant recommendations most appropriate to a
particular installation.
2 Reference documents
IEC 50(161): 1990, International Electrotechnical Vocabulary (IEV) – Chapter 161: Electromagnetic
compatibility
IEC 50(826): 1982, International Electrotechnical Vocabulary (IEV) – Chapter 826: Electrical
installations of buildings
IEC 1000-1-1: 1992, Electromagnetic compatibility (EMC) – Part 1: General – Section 1: Application
and interpretation of fundamental definitions and terms
IEC 1000-2-5: 1995, Electromagnetic compatibility (EMC) – Part 2: Environment – Section 5:
Classification of electromagnetic environments – Basic EMC publication
IEC 1000-4: Electromagnetic compatibility (EMC) – Part 4: Testing and measurement techniques
IEC 1024-1: 1990, Protection of structures against lightning – Part 1: General principles
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1000-5-1 © IEC:1996 – 13 –
3 Definitions
For the purpose of this technical report, the definitions given in IEC 50(161) and IEC 50(826)
apply, as well as the definitions listed below.
A list of acronyms is provided at the end of this clause.
3.1 bonding: The act of connecting together exposed conductive parts and extraneous
conductive parts of apparatus, systems, or installations that are at essentially the same
potential. [new, WG2]
3.2 disturbance level: The level of a given electromagnetic disturbance existing at a given
location, which results from all contributing disturbance sources. [IEV 161-03-09A]
3.3 earth; ground (USA): The conductive mass of the earth, whose electric potential at any
point is conventionally taken as equal to zero. [IEV 826-04-01]
3.4 earth electrode: A conductive part or a group of conductive parts in intimate contact with
and providing an electrical connection with earth. [IEV 826-04-02]
3.5 earthing network: Conductors of the earthing system, not in contact with the soil,
connecting apparatus, systems, or installations to the earth electrode or to other means of
earthing. [new, WG2]
3.6 earthing: The act of connecting exposed conductive parts or other selected conductors of
apparatus, systems or installations to the earth electrode or earth arrangement. [new, WG2]
3.7 earthing system: The three-dimensional electrical circuit which performs the earthing.
NOTE – The earthing system includes two parts: the earth electrode and the earth network. [new, WG2]
3.8 (electromagnetic) compatibility level: The specified disturbance level at which an
acceptable, high probability of electromagnetic compatibility should exist. [IEV 161-03-10]
3.9 facility: Something (like a hospital, factory, machinery, etc.) that is built, constructed,
installed or established to perform some particular function or to serve or facilitate some
particular end. [new WG2)]
3.10 immunity margin: The ratio of the immunity limit to the electromagnetic compatibility
level. [IEV 161-03-16]
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1000-5-1 © IEC:1996 – 15 –
3.11 immunity level: The maximum level of a given electromagnetic disturbance, incident in
a specified way on a particular device, equipment or system, at which no degradation of
operation occurs. [IEV 161/A 1.2.2]
3.12 in-plant point of coupling; (abbreviation IPC): The point of coupling inside the system
or installation to be studied. [future IEV 161-03-26]
3.13 point of common coupling; (abbreviation PCC): The point of the public supply
network, electrically nearest to a particular consumer's installation, and at which other
consumers’ installations are, or may be, connected. [IEV 161-07-15]
3.14 port: Specific interface of the specified apparatus with the external electromagnetic
environment.
3.15 Acronyms
a.c. alternating current ESD electrostatic discharge
d.c. direct current HF high frequency
EM electromagnetic IPC in-plant point of coupling
EMC electromagnetic compatibility PCC point of common coupling
4 General considerations on electromagnetic compatibility (EMC) of installations
Different types of standards are available to define conditions for compliance with EMC
requirements for electrical and electronic products:
– dedicated product standards;
– product family standards;
– generic standards;
– basic standards.
Definitions and characteristics of these standards have been established by the Advisory
Committee on Electromagnetic Compatibility (ACEC). One essential aspect of a standard is the
availability of suitable tests to verify compliance with the standard. In the case of an
installation, however, testing the complete installation is generally not practical or appropriate,
when EMC for sensitive installations and systems is concerned. Therefore, installation
guidelines are necessary to adapt to a maximum of situations. There are many types of
installations and successful EMC has been achieved through different approaches. Thus, this
technical report recommends a general approach, while not precluding other approaches
if appropriate. Special mitigation methods might not be necessary when the equipment
satisfies applicable emissions and immunity standards.
The process adopted for ensuring electromagnetic compatibility of installations may take two
approaches, depending on how early in the design the EMC specialist is offered an opportunity
to contribute.
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1000-5-1 © IEC:1996 – 17 –
a) At the early stages of a major installation, each compatibility level (specific for a given
electromagnetic disturbance) can be assigned for the particular environment of the
installation. Through specification of overall mitigation schemes, apparatus and its
installation practice are then specified with immunity and emission levels corresponding to
the predetermined compatibility level.
b) At later stages of the design, for the installation of additional apparatus or the initial
installation of commercially available apparatus for which no opportunity exists to modify its
EMC characteristics, a mismatch may occur between the overall, de facto compatibility level
of the site and the capability of the apparatus. In such a case, mitigation methods shall be
selected to close the gap between the environment and the apparatus immunity levels to a
minimum.
The first approach has been successfully applied for installations where a single engineering
entity has the authority to prescribe and enforce a certain compatibility level. As a general
principle, this approach is illustrated by the global protection topology of figures 3 and 4. A
concrete example of this very successful approach is the insulation coordination of high-
voltage apparatus applied by electric utilities where the maximum overvoltage level to be
expected is determined by the prior choice of surge arresters, followed by specification of
apparatus with an insulation level consistent with the protective level provided by the arresters.
The second approach is generally applied in existing installations where the owner or designer
lacks the leverage to impose a predetermined compatibility level for the environment or
immunity/emission level for the apparatus. Figure 5 shows the typical topology associated with
this approach. This situation is encountered in low-voltage, end-user commercial or industrial
facilities, and in residential environments.
In this second approach, the task of the EMC specialist then becomes one of matching the
equipment and environment after the fact. In favourable cases, this matching can still be done
before problems occur – the very purpose of the present series of publications is indeed to
make this matching happen. However, this approach is often applied to correct problems after
they have occurred. That approach is not the most cost-effective or time-effective method.
Regardless of the applicable approach, several steps shall be taken. The sequence of the
steps depends on the approach selected, as shown below. (Complementary information on the
related case of low-frequency conducted disturbances on the power supply system is given in
annex B.)
Approach a:
1) Environment characterization
2) Specification of mitigation method
3) Evaluation of mitigation performance
4) Specification of apparatus immunity/emissions
5) Verification of apparatus immunity/emissions
6) Verification of EMC (if possible)
Approach b:
1) Environment characterization
2) Passive acceptance of apparatus immunity
3) Identification of mismatch
4) Specification of mitigation method
5) Evaluation of the quality of installations
6) Verification of EMC (if possible)
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1000-5-1 © IEC:1996 – 19 –
4.1 Aim of proper installation and design
Depending on the electromagnetic environment of an installation site and for a given
phenomenon, there is a high probability of having a certain level of EM disturbances. According
to the concepts of EM environment classification, there should be a determined (or specified)
compatibility level. Furthermore, each apparatus has an intrinsic immunity level which can be
sufficient or not sufficient in view of the disturbances occurring on the site. As environmental
conditions and performance criteria for immunity of apparatus can vary for each installation,
the information given in the IEC 1000-5 series will serve as recommendations. Consequently,
the IEC 1000-5 series should serve:
– to plan and check installations of new apparatus and systems;
– to check and improve installations already existing.
Actions taken by applying these installation guidelines should:
– reduce disturbances below the immunity level of apparatus;
– not introduce other disturbances.
Finally, the proposed method should help obtain EMC in an effective manner, especially when
technical compromises have to be sought to reach an economical solution.
4.2 Emitter, coupling, susceptor
EM disturbances are caused by conducted or radiated phenomena. Figure 1 depicts in a
general manner how EM disturbances may affect sensitive apparatus. An apparatus can be
both the emitter and susceptor (potential victim) at the same time.
Emitter
Radiated
disturbances
Conducted
disturbances
Susceptor
Figure 1 – Electromagnetic influence representation
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1000-5-1 © IEC:1996 – 21 –
Three main areas can be considered with regard to EMC:
– emitters: the sources of the disturbances, influenced by the apparatus design;
– coupling paths: influenced by installation practices;
– susceptors: the potential victims, influenced by the apparatus design.
In order to assure EMC, three types of steps should be applied as necessary:
– at the emitter: reduction of emissions;
– at the coupling: reduction of coupling;
– at the susceptor: increase of immunity.
4.3 Overview of EM disturbances
The sources of electromagnetic disturbances and their main characteristics are described in
detail in IEC 1000-2. Table 1, below, lists the phenomena causing these disturbances.
They are classified according to:
– frequency range;
– propagation mode;
– duration time (continuous or transients).
Generally, five main groups of disturbances are considered in EMC work:
– low-frequency conducted phenomena (e.g., harmonics, voltage dips and fluctuations);
– low-frequency radiated phenomena (e.g., magnetic fields at power frequency);
– high-frequency conducted phenomena (e.g., fast transients);
– high-frequency radiated phenomena (e.g., electromagnetic fields);
– electrostatic discharges (ESD).
The following specific points should be made in connection with the general listing of table 1:
a) Mitigation of low-frequency disturbances is briefly discussed in annex B.
b) The ESD phenomenon should be considered as a combined phenomenon (conducted
and radiated). Its occurrence is greatly influenced by physical characteristics of the local
environment (floor covering, worker's clothing, atmospheric conditions, etc.). Mitigation of
ESD effects is not included in the scope of this report.
c) High-altitude nuclear electromagnetic pulse is a very specific phenomenon which is not
included in the scope of this report.
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1000-5-1 © IEC:1996 – 23 –
d) Disturbances are direct or indirect.
– direct disturbances:
� radiated: an external field radiates on the sensitive susceptor;
� conducted: the source is connected to the installation;
– indirect disturbances:
� radiated: a field exists after penetrating a shield and radiates on the sensitive
electronics;
� conducted: an electromagnetic field may induce currents and/or voltages into
conductors that can be within the installation.
e) Transient voltages appearing downstream of protective devices can also be a source of
disturbances in some cases.
f) The effects of lightning electromagnetic pulse (LEMP) are included in the conducted and
radiated phenomena listed in the table, which are grouped by their physical characteristics
rather than the specific source (excluding the ESD and NEMP phenomena mentioned in the
table). Thus, there is no special entry for the LEMP source.
Table 1 – Principal phenomena causing electromagnetic disturbances
Conducted low-frequency phenomena
Harmonics, interharmonics
Signalling voltages
Voltage fluctuations
Voltage dips and interruptions
Voltage unbalance
Power-frequency variations
Induced low-frequency voltages
DC in a.c. networks
Radiated low-frequency phenomena
Magnetic fields
Electric fields
Conducted high-frequency phenomena
Induced continuous-wave voltages or currents
Unidirectional transients
Oscillatory transients
Radiated high-frequency phenomena
Magnetic fields
Electric fields
Electromagnetic fields
- continuous waves
- transients
Electrostatic discharge phenomena (ESD)
Contact
Air
Discharge to adjacent objects
Nuclear electromagnetic pulse (NEMP)
*
* Not included in the scope of IEC 1000-5
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1000-5-1 © IEC:1996 – 25 –
4.4 EMC and safety (insulation) installation requirements
Attention is drawn to the fact that EMC protection and insulation/safety requirements can have
common aspects, such as earthing and protection against overvoltages and lightning. It is
important to bear in mind that the safety aspects procedures for personnel protection take
precedence over EMC protection procedures. In some cases, there might be an alleged conflict
between safety-related procedures and EMC-related procedures. Safety shall always prevail,
so that in such cases alternate EMC-related measures shall be sought (see also annexes A
and B and the IEC 364 publications cited as references).
4.5 Selection/characterization of EM environments
The recommendations of IEC 1000-2 should be considered. These publications give a set of
tables presenting a matrix of recommendations for selecting appropriate disturbance degrees
as compatibility levels for the various electromagnetic phenomena expected to be significant in
the types of locations listed. Note that in some cases, the EM environment can be determined
by measurements before implementing an installation.
4.6 Immunity of equipment
Ideally, the apparatus supplier should state the apparatus immunity level(s). Realistically, in the
absence of such statement, there are three possibilities to obtain it:
a) The immunity level(s) is (are) determined on the basis of tests, specified in the product
standard, that have been properly documented.
b) If no product standard exists, then the immunity level is obtained by implicit application of
the relevant generic standard.
c) If no test result is available then it is necessary to postulate a level taking into account
the technologies used, based on experiment, manufacturer's data or publications. The
validity of this postulate can be checked by application of the relevant IEC 1000-4 standards
concerning testing and measurement techniques.
4.7 Mitigation methods: specification and evaluation
4.7.1 Equipment and installation ports
To provide a transition from the overall concept of coupling between environment and
apparatus to the detailed specifics, it is useful to consider the concept of ports, as defined
in 3.14. The various EM disturbances enter or exit the apparatus through these ports. By
identifying such ports, protective steps can be specifically related to the nature of the EM
phenomenon, its coupling path, and its impact on the functional elements of the apparatus
(immunity) or its impact on the environment (emissions).
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Figure 2 shows how ports can be identified for the entry of EM disturbances into apparatus.
From its initial definition in the case of apparatus, this concept can be generalized to all cases,
including systems and installations. Figure 2 shows the case of EM disturbances impinging on
the apparatus through six ports, for immunity evaluation. Conversely, the case for emissions
evaluation is obtained by reversing the direction of the arrows and the orientation of the
radiation.
Enclosure port
a.c. power Control
port port
Apparatus
d.c. power Signal
port port
Earth
port
Figure 2 – Representation of equipment ports interfacing
with the electromagnetic environment
NOTE – For instance, a water pipe galvanically connected to the earthing network should be considered as an
earth port. If the metallic pipe is interrupted and not galvanically connected to the earthing network, it should be
considered as a part of the enclosure and as an unintentional antenna.
Appropriate mitigation steps should be applied on every port of the apparatus (system,
installation). For the a.c. and d.c. power ports, this protection typically involves the use of
surge-protective devices, sometimes complemented by filters or specific cabling. For the
control and signal ports, the protection might involve a surge-protective device or a filter, or
both, even a shielded cable.
The concept of earth port is not as simple as the four other conducted ports beca
...
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