IEC 60286-3:2022

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

IEC 60286-3:2022 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This edition includes the following significant technical changes with respect to the previous edition:  
addition terms and definitions.
addition of a table of the classification to symbols concerning drive hole diameter and distance between the reel hole centre and the drive hole centre;
addition of drive hole to the reel (optional);
revision of reel hole diameter tolerances;
revision of 72 mm tape size carrier tape width dimension tolerances;
addition of Annex B (informative);
addition of component size 0201M.

Emballage de composants pour opérations automatisées - Partie 3: Emballage des composants pour montage en surface en bandes continues

L’IEC 60286-3:2022 s’applique à la mise sur bande des composants électroniques sans fils de sortie ou avec tronçons de sortie destinés à être connectés à des circuits électroniques. Elle fournit uniquement les dimensions essentielles pour la mise sur bande des composants destinés aux opérations susmentionnées. Le présent document inclut également des exigences relatives à l’emballage de produits à puce isolée incluant puces nues et puces à contact (puces retournées). Cette édition inclut les modifications techniques majeures suivantes par rapport à l’édition précédente:  
ajout de termes et définitions;
ajout d’un tableau de classification des symboles relatifs au diamètre du trou d’entraînement et à la distance entre le centre de l’orifice de la bobine et le centre du trou d’entraînement;
ajout du trou d’entraînement par rapport à la bobine (facultatif);
révision des tolérances du diamètre de l’orifice de la bobine;
révision des tolérances de dimension de la largeur de la bande d’entraînement de 72 mm;
ajout de l’Annexe B (informative);
ajout de la taille de composant 0201M.

General Information

• Status: Published
• Publication Date: 14-Nov-2022
• ICS: 31.020 - Electronic components in general
• ICS: 31.240 - Mechanical structures for electronic equipment
• Technical Committee: TC 40 - Capacitors and resistors for electronic equipment
• Drafting Committee: MT 60286-3 - TC 40/MT 60286-3
• Current Stage: PPUB - Publication issued
• Start Date: 15-Nov-2022
• Completion Date: 25-Nov-2022

Relations

• Revises: IEC 60286-3:2019 - Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
• Effective Date: 05-Sep-2023

Overview - IEC 60286-3:2022 (Packaging of surface mount components on continuous tapes)

IEC 60286-3:2022 is the international standard that defines tape-and-reel packaging requirements for surface-mount components, including components without leads, with lead stumps, and singulated die products (bare die and bumped die / flip chips). This 2022 edition (Edition 7.0) updates dimensional tolerances and adds new definitions, optional reel drive-hole information, an informative Annex B on electrostatic measurements, and the new component size 0201M.

Keywords: IEC 60286-3, packaging of surface mount components, tape-and-reel, SMT packaging, bare die, flip chip, carrier tape, reel dimensions, tape packaging standard.

Key technical topics and requirements

The standard focuses on dimensions and requirements essential for automated handling and includes:

• Tape types and cavity geometry: Specifications for tape types (e.g., punched, pressed, blister, adhesive-backed - types 1a, 1b, 2a, 2b, 3, 4) and their cavity dimensions and pitches.
• Component positioning and tolerances: Limits for tilt, rotation, lateral displacement, and pocket offset to ensure reliable pick-and-place operation.
• Carrier and cover tape requirements: Materials, minimum bending radius, camber limits, and peel/adhesion characteristics for different tape types.
• Reel and drive-hole specifications: Reel diameters, hole diameters, optional drive-hole additions, marking and label areas, and updated reel hole tolerances.
• Polarity/orientation and tape reeling: Rules for component orientation in the tape, leader/trailer formats, and reeling best-practices.
• Die-specific requirements: Special guidance for singulated die packaging including cleanliness and lateral movement control.
• Electrostatic considerations (Annex B): Informative measurement methods for electrostatic potential and charge decay during cover-tape peeling.

Practical applications and who uses this standard

IEC 60286-3 is used to ensure compatibility between packaged components and automated assembly equipment. Typical users:

• Component manufacturers - to design compliant tape-and-reel packaging for automated distribution.
• Packaging suppliers - to produce carrier and cover tapes meeting dimensional and ESD criteria.
• Electronics manufacturers / contract manufacturers (EMS) - to specify acceptable packaging formats for incoming parts and to optimize SMT line uptime.
• Pick-and-place and feeder OEMs - to ensure feeder design matches industry-standard tape/reel geometry.
• Quality and procurement teams - for incoming inspection criteria, supplier contracts, and traceability labeling.

Benefits include reduced machine jams, predictable feeder performance, ESD risk mitigation, and standardized supplier requirements - all supporting higher SMT line efficiency.

Related standards

IEC 60286-3 is part of the IEC 60286 series (packaging of components for automatic handling). For implementation, consult the latest IEC publications and national adaptations to ensure full compliance with local and industry requirements.

For authoritative copies and corrigenda, obtain IEC 60286-3:2022 from the IEC webstore or your national IEC member committee.

Standards Content (Sample)

IEC 60286-3 ®
Edition 7.0 2022-11
COMMENTED VERSION
INTERNATIONAL
STANDARD
colour
inside
Packaging of components for automatic handling –
Part 3: Packaging of surface mount components on continuous tapes
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IEC 60286-3 ®
Edition 7.0 2022-11
COMMENTED VERSION
INTERNATIONAL
STANDARD
colour
inside
Packaging of components for automatic handling –
Part 3: Packaging of surface mount components on continuous tapes
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.020; 31.240 ISBN 978-2-8322-6100-2

– 2 – IEC 60286-3:2022 CMV © IEC 2022
CONTENTS
FOREWORD .6
INTRODUCTION .8
1 Scope .9
2 Normative references .9
3 Terms, definitions and symbols.9
3.1 Terms and definitions .9
3.2 Symbols . 11
4 Structure of the specification . 13
5 Dimensional requirements for taping . 13
5.1 Component cavity positioning requirements . 13
5.1.1 Requirements for type 1a, type 1b, type 2a, type 2b and type 3. 13
5.1.2 Requirements for type 4. 13
5.2 Component cavity dimension requirements (tape type 1a, type 1b, type 2a,
type 2b and type 3) . 14
5.3 Type 1a – Punched carrier tape, with top and bottom cover tape (tape
widths: 8 mm and 12 mm) . 14
5.4 Type 1b – Pressed carrier tape, with top cover tape (tape width: 8 mm) . 17
5.5 Type 2a – Blister carrier tape, with single round sprocket holes and tape
pitches down to 2 mm (tape widths: 8 mm, 12 mm, 16 mm and 24 mm) . 20
5.6 Type 2b – Blister carrier tape, with single round sprocket holes and with
1mm tape pitch (tape widths: 4 mm) . 22
5.7 Type 3 – Blister carrier tape, with double sprocket holes (32 mm to 200 mm) . 24
5.8 Type 4 – Adhesive-backed punched plastic carrier tape for singled bare die
and other surface mount components (8 mm, 12 mm, 16 mm and 24 mm) . 27
6 Polarity and orientation requirements of components in the tape. 29
6.1 Requirements for all tape types . 29
6.2 Specific requirements for type 1a . 30
6.3 Specific requirements for type 4 . 30
7 Carrier tape requirements . 30
7.1 Taping materials . 30
7.2 Minimum bending radius (for all types) . 30
7.3 Camber . 31
8 Cover tape requirements (for type 1a, type 1b, type 2a, type 2b and type 3) . 32
9 Component taping and additional tape requirements . 34
9.1 All types . 34
9.2 Specific requirements for type 1b . 34
9.3 Specific tape requirements for type 2b. 34
9.4 Specific requirement for type 4 . 35
9.4.1 General . 35
9.4.2 Coordinate system . 35
9.4.3 Component positioning and lateral displacement . 36
9.5 Specific requirements for tapes containing die products . 37
9.5.1 General . 37
9.5.2 Tape design for tapes containing die products . 37
9.5.3 Cleanliness . 37
9.5.4 Die lateral movement (type 1a, type 2a and type 2b). 38

10 Reel requirements . 38
10.1 Dimensions . 38
10.1.1 General . 38
10.1.2 Reel dimensions . 38
10.1.3 Reel hole dimensions . 39
10.1.4 Drive hole dimensions (optional) . 40
10.2 Marking . 41
11 Tape reeling requirements . 42
11.1 All types . 42
11.2 Specific requirements for type 1a . 42
11.3 Specific requirements for type 4 . 42
11.4 Leader and trailer tape . 42
11.4.1 General . 42
11.4.2 Leader . 43
11.4.3 Trailer . 43
11.5 Recycling . 43
11.6 Missing components . 43
Annex A (normative) Recommended measuring methods for type 1b . 44
A.1 Measurement method for carrier tape thickness (T and T ) . 44
A.2 Measurement method for cavity (A and B ) . 44
0 0
A.3 Measurement method for cavity depth (dimension K ) . 45
Annex B (informative) Measuring methods of electrostatic potential and charge decay
performance while cover tape is peeled off from carrier tape containing surface mount
devices . 46
B.1 General . 46
B.2 Method for measuring electrostatic potential and charge decay performance . 47
B.2.1 General . 47
B.2.2 Measurement instrument and device . 49
B.2.3 Sample (test specimen) . 51
B.2.4 Pre-treatment conditions and measurement environment conditions . 51
B.2.5 Measurement conditions . 52
B.2.6 Method for measuring electrostatic potential . 52
B.2.7 Method for measuring the electrostatic charge decay performance . 53
B.3 Items to be described in the test report and items to be specified in the
related standards . 53
B.3.1 Items to be described in the test report . 53
B.3.2 Items specified in related standards . 55
Bibliography . 56
List of comments . 57

Figure 1 – Sectional view of component cavity (type 1b) . 11
Figure 2 – 8 mm and 12 mm punched carrier-tape dimensions (4 mm cavity pitch) . 15
Figure 3 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset . 15
Figure 4 – Maximum component tilt, rotation and lateral movement. 16
Figure 5 – Dimensions (P = 4 mm/P = 2 mm) and (P = 4 mm/P = 1 mm) . 18
0 1 0 1
Figure 6 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset . 18
Figure 7 – Maximum component tilt, rotation and lateral movement. 19

– 4 – IEC 60286-3:2022 CMV © IEC 2022
Figure 8 – Blister carrier tape dimensions (8 mm, 12 mm, 16 mm and 24 mm). 20
Figure 9 – Illustration of 2 mm cavity pitch and pocket offset . 21
Figure 10 – Maximum component tilt, rotation and lateral movement . 21
Figure 11 – Type 2b carrier tape . 23
Figure 12 – Maximum pocket offset . 23
Figure 13 – Maximum component tilt, rotation and lateral movement . 23
Figure 14 – Blister carrier tape . 25
Figure 15 – Elongated sprocket hole skew . 25
Figure 16 – Maximum component tilt, rotation and lateral movement . 25
Figure 17 – Adhesive-backed punched carrier-tape dimensions (4 mm compartment pitch) . 27
Figure 18 – Illustration of 2 mm compartment pitch. 27
Figure 19 – Maximum component planar rotation and lateral displacement. 28
Figure 20 – Example of polarity and orientation . 30
Figure 21 – Bending radius . 31
Figure 22 – Measuring method and camber . 32
Figure 23 – Dot seals for thin components (as exceptions) . 33
Figure 24 – Type 4 coordinate system . 36
Figure 25 – Component clearance and positioning method . 37
Figure 26 – Reel . 38
Figure 27 – Reel hole presentation . 40
Figure 28 – Drive hole layout . 41
Figure 29 – Tape reeling and label area on the reel . 42
Figure 30 – Leader and trailer . 43
Figure A.1 – Carrier tape thickness measurement points . 44
Figure A.2 – Cavity cross-section . 45
Figure A.3 – Cavity depth dimension . 45
Figure B.1 – Configuration of measurement method using electrostatic potential
measuring system . 47
Figure B.2 – Diagram of measure electrostatic potential when peeling cover tape . 48
Figure B.3 – Configuration of electrostatic charge decay measurement method . 48
Figure B.4 – Diagram of the measurement of electrostatic charge decay performance . 49
Figure B.5 – Dimensions of the sample . 51

Table 1 – Component size codes . 10
Table 2 – Classification to symbols concerning tape, reel and common symbols . 11
Table 3 – Constant dimensions of 8 mm and 12 mm punched carrier tape . 16
Table 4 – Variable dimensions of 8 mm and 12 mm punched carrier tape . 17
Table 5 – Component tilt, planar rotation and lateral movement . 17
Table 6 – Constant dimensions of 8 mm pressed carrier tape . 19
Table 7 – Variable dimensions of 8 mm pressed carrier tape . 19
Table 8 – Component tilt, planar rotation and lateral movement . 20
Table 9 – Constant dimensions of 8 mm to 24 mm blister carrier tape . 21
Table 10 – Variable dimensions of 8 mm to 24 mm blister carrier tape . 22

Table 11 – Component tilt, rotation and lateral movement. 22
Table 12 – Constant dimensions of 4 mm carrier tape . 24
Table 13 – Variable dimensions of 4 mm carrier tape . 24
Table 14 – Component tilt, planar rotation and lateral movements . 24
Table 15 – Constant dimensions of 32 mm to 200 mm blister carrier tape . 26
Table 16 – Variable dimensions of 32 mm to 200 mm blister carrier tape . 26
Table 17 – Component tilt, planar rotation and lateral movements . 27
Table 18 – Dimensions of adhesive backed punched carrier tape. 28
Table 19 – Variable dimensions of adhesive-backed punched carrier tape . 29
Table 20 – Component planar rotation and lateral displacement . 29
Table 21 – Minimum bending radius . 31
Table 22 – Peel force . 33
Table 23 – Absolute referencing data for component target position . 35
Table 24 – Reel dimensions . 39
Table 25 – Reel hole dimensions . 40
Table 26 – Drive hole dimensions . 41
Table B.1 – Conditions of the environment in which the samples are kept and the
conditions of the measurement test environment before measurement . 52

– 6 – IEC 60286-3:2022 CMV © IEC 2022
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –

Part 3: Packaging of surface mount components
on continuous tapes
FOREWORD
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This commented version (CMV) of the official standard IEC 60286-3:2022 edition 7.0
allows the user to identify the changes made to the previous IEC 60286-3:2019 edition
6.0. Furthermore, comments from IEC TC 40 experts are provided to explain the reasons
of the most relevant changes, or to clarify any part of the content.
A vertical bar appears in the margin wherever a change has been made. Additions are in
green text, deletions are in strikethrough red text. Experts' comments are identified by a
blue-background number. Mouse over a number to display a pop-up note with the
comment.
This publication contains the CMV and the official standard. The full list of comments is
available at the end of the CMV.

IEC 60286-3 has been prepared by IEC technical committee 40: Capacitors and resistors for
electronic equipment. It is an International Standard.
This seventh edition cancels and replaces the sixth edition published in 2019. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) addition terms and definitions.
b) addition of a table of the classification to symbols concerning drive hole diameter and
distance between the reel hole centre and the drive hole centre;
c) addition of drive hole to the reel (optional);
d) revision of reel hole diameter tolerances;
e) revision of 72 mm tape size carrier tape width dimension tolerances;
f) addition of Annex B (informative);
g) addition of component size 0201M.
The text of this International Standard is based on the following documents:
Draft Report on voting
40/2972/FDIS 40/2984/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
A list of all parts in the IEC 60268 series, published under the general title Packaging of
components for automatic handling, can be found on the IEC website.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The "colour inside" logo on the cover page of this document indicates that it
contains colours which are considered to be useful for the correct understanding of its
contents. Users should therefore print this document using a colour printer.

– 8 – IEC 60286-3:2022 CMV © IEC 2022
INTRODUCTION
Tape packaging meets the requirements of automatic component placement machines and also
covers the use of tape packaging for components and singulated dies for test purposes and
other operations.
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –

Part 3: Packaging of surface mount components
on continuous tapes
1 Scope
This part of IEC 60286 is applicable to the tape packaging of electronic components without
leads or with lead stumps, intended to be connected to electronic circuits. It includes only those
dimensions that are essential for the taping of components intended for the above-mentioned
purposes.
This document also includes requirements related to the packaging of singulated die products
including bare die and bumped die (flip chips).
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60191-2, Mechanical standardization of semiconductor devices – Part 2: Dimensions
IEC 61340-4-5, Electrostatics – Part 4-5: Standard test methods for specific applications –
Methods for characterizing the electrostatic protection of footwear and flooring in combination
with a person
IEC 61340-4-6, Electrostatics – Part 4-6: Standard test methods for specific applications – Wrist
straps
IEC 61340-4-7, Electrostatics – Part 4-7: Standard test methods for specific applications –
Ionization
IEC 61340-4-9, Electrostatics – Part 4-9: Standard test methods for specific applications –
Garments 1
3 Terms, definitions and symbols
3.1 Terms and definitions
For the purposes of this document, the following terms and definitions apply. Definitions apply
to all tape types, unless specifically mentioned.
ISO and IEC maintain terminology databases for use in standardization at the following
addresses:
• IEC Electropedia: available at https://www.electropedia.org/
• ISO Online browsing platform: available at https://www.iso.org/obp

– 10 – IEC 60286-3:2022 CMV © IEC 2022
3.1.1
component
electronic part of a product that cannot be physically divided into smaller parts without losing
its particular function
Note 1 to entry: This includes singulated die product.
Note 2 to entry: This is applied to all packaging-types for bare die products unless specifically mentioned otherwise.
3.1.2
component size
size of component that is identified with its metric size code
Note 1 to entry: This size code is followed by a capital M.
Note 2 to entry: To avoid possible confusion with inch-based size codes, an equivalency table is shown in Table 1.
Table 1 – Component size codes
Metric size code Inch size code
0201M
008004 2
0402M 01005
0603M 0201
1005M 0402
1608M 0603
2012M 0805
3.1.3
packaging
product made of any material of any nature to be used for the containment, protection,
structured alignment for automatic assembly, handling and delivery
3.1.4
pressed carrier tape
carrier tape with concave cavities formed by compression of the base material
3.1.5
fluff
fibre from the base material attached inside the cavity
Note 1 to entry: See Figure 1.
3.1.6
burr
surface projection of tape unintentially produced when cavity is formed
Note 1 to entry: See Figure 1.
3.1.7
deformation
bulge on the inner wall of the cavity
Note 1 to entry: See Figure 1.

3.1.8
puff
bulge on the reverse side of the cavity
Note 1 to entry: See Figure 1.

Figure 1 – Sectional view of component cavity (type 1b)
3.1.9
blister carrier tape
embossed carrier tape
carrier tape which is identified as tape belonging to type 2a, type 2b and type3
Note 1 to entry These types of carriers are also known as "embossed" carrier types.
3.1.10
punched carrier tape
carrier tape on which the concave cavities are formed by punching a hole on the
base material and covering up the bottom by the cover tape
3.2 Symbols
The symbols used in this document are listed in Table 2.
Table 2 – Classification to symbols concerning tape, reel and common symbols
Symbols Definitions Figure references
A Reel diameter 26
2, 4, 5, 7, 8, 10, 11, 13, 14, 16, 20 and
A
Cavity's bottom dimension in direction of unreeling
A.2
B Reel hole key's groove width 27
2, 4, 5, 7, 8, 10, 11, 13, 14, 16, 20 and
B
Cavity's bottom dimension in direction of tape width
A.2
B
Cavity's rim in direction of tape width 8, 11 and 14
C
Reel hole diameter 26 and 27
C
Distance of puff under cavity in direction of tape width 5
T
Difference of diameter between sprocket hole and round
d 14
foramen
D Reel slot diameter 27
D
Sprocket hole diameter 2, 5, 8, 11, 14 and 17
D
Cavity's bottom hole diameter 8 and 14
D
Drive hole diameter 28
DH
Shorter distance in direction of width between the origin
E
2, 5, 8, 11, 14 and 17
point of round sprocket hole and the edge of a side of tape

– 12 – IEC 60286-3:2022 CMV © IEC 2022
Symbols Definitions Figure references
Longer distance in direction of width between the origin
E
2, 5, 8 and 11
point of round sprocket hole and the edge of a side of tape
Distance in direction of width between the origin point of
F
2, 5, 8, 11 and 14
round sprocket hole and the centre of cavity
Distance in direction of width between the origin point of
F
17, 19, 24 and 25
A
round sprocket hole and the centre of compartment
Shorter distance in direction of width between the cavity
G 2, 5, 8, 11 and 17
and the edge of a side of tape
K
Cavity depth 2, 5, 8 ,11, 14 and A.3
Distance between the reel hole centre and the drive hole
M
centre
N Hub diameter 26
P
Pitch of the sprocket holes 2, 3, 5, 6, 8, 9, 11, 14 and 17
P
Cavity pitch 2, 3, 5, 6, 8, 9, 11, 14, 17 and 18
Pitch between the centre of a cavity on the same line with
P
the origin point of round sprocket hole and the centre of 2, 3, 5, 6, 8, 9, 11 and 14
the next cavity in direction of unreeling
Pitch between the centre line of the origin point of round
P
sprocket hole and the centre line of compartment in 17, 18, 19, 24 and 25
2A
direction of unreeling
Pitch between the centre of a cavity on the same line with
P
the origin point of round sprocket hole and the centre of 3 and 6
the second next cavity in direction of unreeling
Pitch between the centre of a cavity on the same line with
P
the origin point of round sprocket hole and the centre of 3 and 6
the third next cavity in direction of unreeling
S
Sprocket hole pitch in direction of width 14
R Bending radius of carrier tape 21
r Curvature radius of reel hole key's groove 27
T Carrier tape thickness without cover tape 2, 5, 8, 11, 14, 17, 25 and A.1
T
Top cover tape thickness or bottom cover tape thickness 2, 5, 8, 11, and 14 and 17
T
Sum of outer cavity height and top cover tape thickness 8, 11 and 14
T
Thickenss of pressed carrier tape including bulge 5 and A.1
T
Bottom cover tape thickness or Adhesive tape thickness 2 and 17
V
Compartment dimension in direcion of unreeling 17 and 18
V
Compartment dimension in direction of width 17 and 18
W Carrier tape width 2, 5, 8, 11, 14 and 17
W
Distance between adhesive tapes 17
P
W
Reel inner width (measured at hub) 26
W
Reel overall width 26
W
Reel inner width in the rim 26
Z Component thickness 25
4 Structure of the specification
The various types of tapes are as follows.
Type 1 – Punched and pressed carrier tape
Type 1a: Punched carrier tape, with top and bottom cover tape (tape widths:
8 mm and 12 mm)
Type 1b: Pressed carrier tape, with top cover tape (tape width: 8 mm)
Type 2 – Blister carrier tape, with single round sprocket holes
Type 2a: Blister carrier tape, with single round sprocket holes, with top
cover tape and tape pitches down to 2 mm (tape widths: 8 mm,
12 mm, 16 mm and 24 mm)
Type 2b: Blister carrier tape, with single round sprocket holes, with top
cover tape and with 1mm tape pitch (tape widths: 4 mm)
Type 3 – Blister carrier tape, with double sprocket holes (tape widths: 32 mm to
200 mm)
Type 4 – Adhesive-backed punched plastic carrier tape for singulated bare die and
other surface mount components (tape widths: 8 mm, 12 mm, 16 mm, and
24 mm)
5 Dimensional requirements for taping
5.1 Component cavity positioning requirements
5.1.1 Requirements for type 1a, type 1b, type 2a, type 2b and type 3
For defined component positioning, the cavity shall be defined to an origin point. The origin is
the centre of the round sprocket hole, defined by the crosshair of the dimension E and
dimension P . The centre of the compartment shall be defined by P and F, relative to the round
0 2
sprocket hole (see Figure 2, Figure 5, Figure 8, Figure 11 and Figure 14). When dimension P
is smaller or equal to 2 mm, the maximum allowed pocket offset, relative to the centre of the
round sprocket hole, shall be applied (see Figure 3, Figure 6, Figure 9 and Figure 12).
5.1.2 Requirements for type 4
For defined component positioning, the component placement and location shall be defined to
an origin. The origin is the centre of the sprocket hole, defined by the crosshair of the dimension
E and dimension P . The centre of the component location shall be defined by P and F ,
1 0 2A A
relative to the sprocket hole (see Figure 17). Type 4 does not have cavities that are used to
position components. Therefore, all position measurements should be made according to the
principle defined here and not to the compartments or 'pockets', which are virtual boundaries
for component protection only. The term 'pocket offset' does not apply to type 4. The following
applies to tape type 4:
a) rotation and lateral movement of the component is defined by the accuracy to which it has
been placed in the compartment, with reference to the target;
a) the component shall not protrude above the top surface of the carrier tape (see Figure 25a);
b) the components shall not change their orientation within the tape;
c) the component shall be able to be removed from the cavity or compartment in a vertical
direction, without mechanical restriction.

– 14 – IEC 60286-3:2022 CMV © IEC 2022
5.2 Component cavity dimension requirements (tape type 1a, type 1b, type 2a, type
2b and type 3)
The size of the component cavity, including applicable tolerances, is governed by the
dimensions of the component for which the packaging applies, to ensure that the component is
adequately protected and that tilt, rotation and lateral movement of the component complies
with the requirements detailed for each type of tape. The following applies to tape type 1a, type
1b, type 2a, type 2b and type 3:
a) dimension A ≤ dimension B , unless otherwise specified in the component detail
0 0
specification;
b) maximum and minimum dimensions of the component shall be taken from the component
detail specification;
c) the component shall not protrude above the top surface of the carrier tape, except for
type 1a where the component shall not protrude beyond either surface of the carrier tape;
d) the components shall not change their orientation within the tape;
e) the component shall be able to be removed from the cavity or compartment in a vertical
direction, without mechanical restriction, after the top cover has been removed, where a
cover tape is used.
f) Unless otherwise defined in the detail specification, for punched carrier tapes, K shall be
equivalent to T. For pressed and embossed tapes K shall be defined in each detail
specification. 3
5.3 Type 1a – Punched carrier tape, with top and bottom cover tape (tape widths:
8 mm and 12 mm)
For respective dimensional codes, see Figure 2 to Figure 4 and Table 3 to Table 5.

Figure 2 – 8 mm and 12 mm punched carrier-tape dimensions (4 mm cavity pitch)

a) 2 mm cavity pitch b) 1 mm cavity pitch c) Pocket offset

Figure 3 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset

– 16 – IEC 60286-3:2022 CMV © IEC 2022

a) Sketch A b) Sketch B c) Sketch C
Component tilt Component planar rotation Lateral movement
Side view Top view Top view
Figure 4 – Maximum component tilt, rotation and lateral movement
Table 3 – Constant dimensions of 8 mm and 12 mm punched carrier tape
Dimensions in millimetres
Tape D E P G T T T P pitch
0 1 0 1 4 0
size
(each cumulative
T ) tolerance
min. max. max. max.
4,0 ± 0,1
a
1,1 paper
(P ≥ 4)
1,5
8 and ± 0,2 / 10
1,75 ± 0,1 0,75 0,1 0,1
+0,1
12 pitches
4,0 ± 0,05 1,6 non-
(P = 2, P = 1) paper
1 1
For respective dimensional codes, see Figure 2.
a
The paper is the material of the punched carrier tape.

Table 4 – Variable dimensions of 8 mm and 12 mm punched carrier tape
Dimensions in millimetres
Tape E F P P P P W A , B ,
2 1 2 3 4 0 0
size
and K
min.
1,0 ± 0,05 1,0 ± 0,05
(P = 1) (P = 1)
1 1
2,0 ± 0,05 2,0 ± 0,05
2,0 ± 0,05 3,0 ± 0,05
+0,3
8 6,25 3,5 ± 0,05 8,0
−0,1
(P = 2) (P = 2)
= 1) (P = 1)
(P
1 1
1 1
4,0 ± 0,1 2,0 ± 0,05
See 5.2
(P = 4) (P = 4)
1 1
2,0 ± 0,05
(P = 2)
+0,3
12 10,25 5,5 ± 0,05 2,0 ± 0,05 – – 12,0
−0,1
4,0 ± 0,1
(P ≥ 4)
For respective dimensional codes, see Figure 2 to Figure 4.

Table 5 – Component tilt, planar rotation and lateral movement
Tape size Component tilt Component planar rotation Lateral movement
a a
mm mm
(design value) (design value)
0,3 maximum
(P = 1, P = 2)
1 1
8 and 12 10° maximum 20° maximum
0,5 maximum
(P ≥ 4)
For respective dimensional codes, see Figure 4.
The trend for allowed component planar rotation of components with either length or width less than 1,2 mm is
10° maximum.
For components with either length or width dimensions of less than 1,2 mm, market trends are towards a lateral
movement of 0,2 mm maximum.
When handling bare die products in tape size 8 mm, the lateral movement of 0,1 mm maximum for either cavity
dimension should be allowed.
When handling bare die products in tape size 12 mm, the lateral movement of 0,15 mm maximum for either cavity
dimension should be allowed.
a
A design value is a calculated value for design purposes only. For example, component tilt is not intended to
be measured, but is intended to be the calculated value for the pocket design of a carrier tape.

5.4 Type 1b – Pressed carrier tape, with top cover tape (tape width: 8 mm)
For respective dimensional codes, see Figure 5 to Figure 7 and Table 6 to Table 8.

– 18 – IEC 60286-3:2022 CMV © IEC 2022

Figure 5 – Dimensions (P = 4 mm/P = 2 mm) and (P = 4 mm/P = 1 mm)
0 1 0 1
a) 2 mm cavity pitch b) 1 mm cavity pitch c) Pocket offset

Figure 6 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset

a) Sketch D b) Sketch E c) Sketch F
Component tilt Component planar rotation Lateral movement
Side or front sectional view Top view Top view

Figure 7 – Maximum component tilt, rotation and lateral movement
Table 6 – Constant dimensions of 8 mm pressed carrier tape
Dimensions in millimetres
a b
G T
Tape E P T P pitch
D T -T
1 0 1 0
0 3
size
cumulative
tolerance
min. max. max. max.
+0,1
1,5
8 1,75 ± 0,1 0,75 4,0 ± 0,1 1,1 0,1 0,1 ± 0,1 / 10 pitches
For respective dimensional codes, see Figure 5 and Figure 6.
a
If positioning precision is required, for example when components ≤ size 1005M are mounted in a narrow
space, then the tolerance on D should be +0,05 / −0,00 mm.
b
For components with size designation of 1005M or smaller, the puff (T − T) should be limited to 0,05 mm
maximum.
Table 7 – Variable dimensions of 8 mm pressed carrier tape
Dimensions in millimetres
E F P P P P W A , B
Tape C
T 2 1 2 3 4 0 0
size
and K
max. min.
1,0 ± 0,05 1,0 ± 0,05
(P = 1) (P = 1)
1 1
2,0 ± 0,05 2,0 ± 0,05 2,0 ± 0,05 3,0 ± 0,05 8,0
See
8 4,35 6,25 3,5 ± 0,05
+0,3
5.2
(P = 2) (P = 2)
(P = 1) (P = 1)
−0,1
1 1
1 1
4,0 ± 0,1 2,0 ± 0,05
(P = 4) (P = 4)
1 1
For respective dimensional codes, see Figure 5 to Figure 7.

– 20 – IEC 60286-3:2022 CMV © IEC 2022
Table 8 – Component tilt, planar rotation and lateral movement
Tape size Component tilt Component planar rotation Lateral movement
a a
mm mm
(design value) (design value)
0,12 maximum
(Component size ≤ 0603M)
0,20 maximum
8 20° maximum 20° maximum
(Component size 1005M)
0,30 maximum
(Component size ≥ 1608M)
For respective dimensional codes illustration, see Figure 7.
a
A design value is a calculated value for design purposes only. For example, component tilt is not intended to
be measured, but is intended to be the calculated value for the
...

IEC 60286-3 ®
Edition 7.0 2022-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Packaging of components for automatic handling –
Part 3: Packaging of surface mount components on continuous tapes

Emballage de composants pour opérations automatisées –
Partie 3: Emballage des composants pour montage en surface en bandes
continues
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IEC 60286-3 ®
Edition 7.0 2022-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Packaging of components for automatic handling –

Part 3: Packaging of surface mount components on continuous tapes

Emballage de composants pour opérations automatisées –

Partie 3: Emballage des composants pour montage en surface en bandes

continues
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.020; 31.240 ISBN 978-2-8322-5899-6

– 2 – IEC 60286-3:2022 © IEC 2022
CONTENTS
FOREWORD . 6
INTRODUCTION . 8
1 Scope . 9
2 Normative references . 9
3 Terms, definitions and symbols. 9
3.1 Terms and definitions . 9
3.2 Symbols . 11
4 Structure of the specification . 13
5 Dimensional requirements for taping . 13
5.1 Component cavity positioning requirements . 13
5.1.1 Requirements for type 1a, type 1b, type 2a, type 2b and type 3 . 13
5.1.2 Requirements for type 4 . 13
5.2 Component cavity dimension requirements (type 1a, type 1b, type 2a, type
2b and type 3) . 14
5.3 Type 1a – Punched carrier tape, with top and bottom cover tape (tape
widths: 8 mm and 12 mm) . 14
5.4 Type 1b – Pressed carrier tape, with top cover tape (tape width: 8 mm) . 17
5.5 Type 2a – Blister carrier tape, with single round sprocket holes and tape
pitches down to 2 mm (tape widths: 8 mm, 12 mm, 16 mm and 24 mm) . 19
5.6 Type 2b – Blister carrier tape, with single round sprocket holes and with
1mm tape pitch (tape widths: 4 mm) . 21
5.7 Type 3 – Blister carrier tape, with double sprocket holes (32 mm to 200 mm). 23
5.8 Type 4 – Adhesive-backed punched plastic carrier tape for singled bare die
and other surface mount components (8 mm, 12 mm, 16 mm and 24 mm) . 26
6 Polarity and orientation requirements of components in the tape . 28
6.1 Requirements for all types . 28
6.2 Specific requirements for type 1a . 29
6.3 Specific requirements for type 4 . 29
7 Carrier tape requirements . 29
7.1 Taping materials . 29
7.2 Minimum bending radius (for all types) . 29
7.3 Camber . 30
8 Cover tape requirements (for type 1a, type 1b, type 2a, type 2b and type 3) . 31
9 Component taping and additional tape requirements. 33
9.1 All types . 33
9.2 Specific requirements for type 1b . 33
9.3 Specific tape requirements for type 2b . 33
9.4 Specific requirement for type 4 . 34
9.4.1 General . 34
9.4.2 Coordinate system . 34
9.4.3 Component positioning and lateral displacement . 35
9.5 Specific requirements for tapes containing die products . 36
9.5.1 General . 36
9.5.2 Tape design for tapes containing die products . 36
9.5.3 Cleanliness . 36
9.5.4 Die lateral movement (type 1a, type 2a and type 2b) . 37

10 Reel requirements . 37
10.1 Dimensions . 37
10.1.1 General . 37
10.1.2 Reel dimensions . 37
10.1.3 Reel hole dimensions . 38
10.1.4 Drive hole dimensions (optional) . 39
10.2 Marking . 40
11 Tape reeling requirements . 41
11.1 All types . 41
11.2 Specific requirements for type 1a . 41
11.3 Specific requirements for type 4 . 41
11.4 Leader and trailer tape . 41
11.4.1 General . 41
11.4.2 Leader . 42
11.4.3 Trailer . 42
11.5 Recycling . 42
11.6 Missing components . 42
Annex A (normative) Recommended measuring methods for type 1b . 43
A.1 Measurement method for carrier tape thickness (T and T ) . 43
A.2 Measurement method for cavity (A and B ) . 43
0 0
A.3 Measurement method for cavity depth (dimension K ) . 44
Annex B (informative) Measuring methods of electrostatic potential and charge decay
performance while cover tape is peeled off from carrier tape containing surface mount

devices . 45
B.1 General . 45
B.2 Method for measuring electrostatic potential and charge decay performance . 46
B.2.1 General . 46
B.2.2 Measurement instrument and device . 48
B.2.3 Sample (test specimen) . 50
B.2.4 Pre-treatment conditions and measurement environment conditions . 50
B.2.5 Measurement conditions . 51
B.2.6 Method for measuring electrostatic potential . 51
B.2.7 Method for measuring the electrostatic charge decay performance . 52
B.3 Items to be described in the test report and items to be specified in the
related standards . 53
B.3.1 Items to be described in the test report . 53
B.3.2 Items specified in related standards . 54
Bibliography . 55

Figure 1 – Sectional view of component cavity (type 1b) . 11
Figure 2 – 8 mm and 12 mm punched carrier-tape dimensions (4 mm cavity pitch) . 14
Figure 3 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset . 15
Figure 4 – Maximum component tilt, rotation and lateral movement . 15
Figure 5 – Dimensions (P = 4 mm/P = 2 mm) and (P = 4 mm/P = 1 mm) . 17
0 1 0 1
Figure 6 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset . 18
Figure 7 – Maximum component tilt, rotation and lateral movement . 18
Figure 8 – Blister carrier tape dimensions (8 mm, 12 mm, 16 mm and 24 mm) . 19

– 4 – IEC 60286-3:2022 © IEC 2022
Figure 9 – Illustration of 2 mm cavity pitch and pocket offset . 20
Figure 10 – Maximum component tilt, rotation and lateral movement . 20
Figure 11 – Type 2b carrier tape . 22
Figure 12 – Maximum pocket offset . 22
Figure 13 – Maximum component tilt, rotation and lateral movement . 22
Figure 14 – Blister carrier tape . 24
Figure 15 – Elongated sprocket hole skew . 24
Figure 16 – Maximum component tilt, rotation and lateral movement . 24
Figure 17 – Adhesive-backed punched carrier-tape dimensions (4 mm compartment
pitch) . 26
Figure 18 – Illustration of 2 mm compartment pitch . 26
Figure 19 – Maximum component planar rotation and lateral displacement . 27
Figure 20 – Example of polarity and orientation . 29
Figure 21 – Bending radius . 30
Figure 22 – Measuring method and camber . 31
Figure 23 – Dot seals for thin components (as exceptions) . 32
Figure 24 – Type 4 coordinate system . 35
Figure 25 – Component clearance and positioning method . 36
Figure 26 – Reel . 37
Figure 27 – Reel hole presentation . 39
Figure 28 – Drive hole layout . 40
Figure 29 – Tape reeling and label area on the reel . 41
Figure 30 – Leader and trailer . 42
Figure A.1 – Carrier tape thickness measurement points . 43
Figure A.2 – Cavity cross-section . 44
Figure A.3 – Cavity depth dimension . 44
Figure B.1 – Configuration of measurement method using electrostatic potential

measuring system . 46
Figure B.2 – Diagram of measure electrostatic potential when peeling cover tape . 47
Figure B.3 – Configuration of electrostatic charge decay measurement method . 47
Figure B.4 – Diagram of the measurement of electrostatic charge decay performance . 48
Figure B.5 – Dimensions of the sample . 50

Table 1 – Component size codes . 10
Table 2 – Classification to symbols concerning tape, reel and common symbols . 11
Table 3 – Constant dimensions of 8 mm and 12 mm punched carrier tape . 16
Table 4 – Variable dimensions of 8 mm and 12 mm punched carrier tape . 16
Table 5 – Component tilt, planar rotation and lateral movement . 17
Table 6 – Constant dimensions of 8 mm pressed carrier tape . 18
Table 7 – Variable dimensions of 8 mm pressed carrier tape . 19
Table 8 – Component tilt, planar rotation and lateral movement . 19
Table 9 – Constant dimensions of 8 mm to 24 mm blister carrier tape . 20
Table 10 – Variable dimensions of 8 mm to 24 mm blister carrier tape . 21
Table 11 – Component tilt, rotation and lateral movement . 21

Table 12 – Constant dimensions of 4 mm carrier tape . 23
Table 13 – Variable dimensions of 4 mm carrier tape . 23
Table 14 – Component tilt, planar rotation and lateral movements . 23
Table 15 – Constant dimensions of 32 mm to 200 mm blister carrier tape . 25
Table 16 – Variable dimensions of 32 mm to 200 mm blister carrier tape . 25
Table 17 – Component tilt, planar rotation and lateral movements . 26
Table 18 – Dimensions of adhesive backed punched carrier tape . 27
Table 19 – Variable dimensions of adhesive-backed punched carrier tape . 28
Table 20 – Component planar rotation and lateral displacement . 28
Table 21 – Minimum bending radius . 30
Table 22 – Peel force . 32
Table 23 – Absolute referencing data for component target position . 34
Table 24 – Reel dimensions . 38
Table 25 – Reel hole dimensions . 39
Table 26 – Drive hole dimensions . 40
Table B.1 – Conditions of the environment in which the samples are kept and the
conditions of the measurement test environment before measurement . 51

– 6 – IEC 60286-3:2022 © IEC 2022
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –

Part 3: Packaging of surface mount components
on continuous tapes
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC Publication(s)"). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
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4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 60286-3 has been prepared by IEC technical committee 40: Capacitors and resistors for
electronic equipment. It is an International Standard.
This seventh edition cancels and replaces the sixth edition published in 2019. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) addition terms and definitions.
b) addition of a table of the classification to symbols concerning drive hole diameter and
distance between the reel hole centre and the drive hole centre;
c) addition of drive hole to the reel (optional);
d) revision of reel hole diameter tolerances;
e) revision of 72 mm tape size carrier tape width dimension tolerances;

f) addition of Annex B (informative);
g) addition of component size 0201M.
The text of this International Standard is based on the following documents:
Draft Report on voting
40/2972/FDIS 40/2984/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
A list of all parts in the IEC 60268 series, published under the general title Packaging of
components for automatic handling, can be found on the IEC website.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The "colour inside" logo on the cover page of this document indicates that it
contains colours which are considered to be useful for the correct understanding of its
contents. Users should therefore print this document using a colour printer.

– 8 – IEC 60286-3:2022 © IEC 2022
INTRODUCTION
Tape packaging meets the requirements of automatic component placement machines and also
covers the use of tape packaging for components and singulated dies for test purposes and
other operations.
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –

Part 3: Packaging of surface mount components
on continuous tapes
1 Scope
This part of IEC 60286 is applicable to the tape packaging of electronic components without
leads or with lead stumps, intended to be connected to electronic circuits. It includes only those
dimensions that are essential for the taping of components intended for the above-mentioned
purposes.
This document also includes requirements related to the packaging of singulated die products
including bare die and bumped die (flip chips).
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60191-2, Mechanical standardization of semiconductor devices – Part 2: Dimensions
IEC 61340-4-5, Electrostatics – Part 4-5: Standard test methods for specific applications –
Methods for characterizing the electrostatic protection of footwear and flooring in combination
with a person
IEC 61340-4-6, Electrostatics – Part 4-6: Standard test methods for specific applications – Wrist
straps
IEC 61340-4-7, Electrostatics – Part 4-7: Standard test methods for specific applications –
Ionization
IEC 61340-4-9, Electrostatics – Part 4-9: Standard test methods for specific applications –
Garments
3 Terms, definitions and symbols
3.1 Terms and definitions
For the purposes of this document, the following terms and definitions apply. Definitions apply
to all tape types, unless specifically mentioned.
ISO and IEC maintain terminology databases for use in standardization at the following
addresses:
• IEC Electropedia: available at https://www.electropedia.org/
• ISO Online browsing platform: available at https://www.iso.org/obp

– 10 – IEC 60286-3:2022 © IEC 2022
3.1.1
component
electronic part of a product that cannot be physically divided into smaller parts without losing
its particular function
Note 1 to entry: This includes singulated die product.
Note 2 to entry: This is applied to all packaging-types for bare die products unless specifically mentioned otherwise.
3.1.2
component size
size of component that is identified with its metric size code
Note 1 to entry: This size code is followed by a capital M.
Note 2 to entry: To avoid possible confusion with inch-based size codes, an equivalency table is shown in Table 1.
Table 1 – Component size codes
Metric size code Inch size code
0201M 008004
0402M 01005
0603M 0201
1005M 0402
1608M 0603
2012M 0805
3.1.3
packaging
product made of any material of any nature to be used for the containment, protection,
structured alignment for automatic assembly, handling and delivery
3.1.4
pressed carrier tape
carrier tape with concave cavities formed by compression of the base material
3.1.5
fluff
fibre from the base material attached inside the cavity
Note 1 to entry: See Figure 1.
3.1.6
burr
surface projection of tape unintentially produced when cavity is formed
Note 1 to entry: See Figure 1.
3.1.7
deformation
bulge on the inner wall of the cavity
Note 1 to entry: See Figure 1.

3.1.8
puff
bulge on the reverse side of the cavity
Note 1 to entry: See Figure 1.

Figure 1 – Sectional view of component cavity (type 1b)
3.1.9
blister carrier tape
embossed carrier tape
carrier tape which is identified as tape belonging to type 2a, type 2b and type3
3.1.10
punched carrier tape
carrier tape on which the concave cavities are formed by punching a hole on the
base material and covering up the bottom by the cover tape
3.2 Symbols
The symbols used in this document are listed in Table 2.
Table 2 – Classification to symbols concerning tape, reel and common symbols
Symbols Definitions Figure references
A Reel diameter 26
2, 4, 5, 7, 8, 10, 11, 13, 14, 16, 20 and
A
Cavity's bottom dimension in direction of unreeling
A.2
B Reel hole key's groove width 27
2, 4, 5, 7, 8, 10, 11, 13, 14, 16, 20 and
B
Cavity's bottom dimension in direction of tape width
A.2
B
Cavity's rim in direction of tape width 8, 11 and 14
C Reel hole diameter 26 and 27
C
Distance of puff under cavity in direction of tape width 5
T
Difference of diameter between sprocket hole and round
d 14
foramen
D Reel slot diameter 27
D
Sprocket hole diameter 2, 5, 8, 11, 14 and 17
D
Cavity's bottom hole diameter 8 and 14
D
Drive hole diameter 28
DH
Shorter distance in direction of width between the origin
E
2, 5, 8, 11, 14 and 17
point of round sprocket hole and the edge of a side of tape

– 12 – IEC 60286-3:2022 © IEC 2022
Symbols Definitions Figure references
Longer distance in direction of width between the origin
E
2, 5, 8 and 11
point of round sprocket hole and the edge of a side of tape
Distance in direction of width between the origin point of
F 2, 5, 8, 11 and 14
round sprocket hole and the centre of cavity
Distance in direction of width between the origin point of
F
17, 19, 24 and 25
A
round sprocket hole and the centre of compartment
Shorter distance in direction of width between the cavity
G 2, 5, 8, 11 and 17
and the edge of a side of tape
K
Cavity depth 2, 5, 8 ,11, 14 and A.3
Distance between the reel hole centre and the drive hole
M 28
centre
N Hub diameter 26
P
Pitch of the sprocket holes 2, 3, 5, 6, 8, 9, 11, 14 and 17
P
Cavity pitch 2, 3, 5, 6, 8, 9, 11, 14, 17 and 18
Pitch between the centre of a cavity on the same line with
P
the origin point of round sprocket hole and the centre of 2, 3, 5, 6, 8, 9, 11 and 14
the next cavity in direction of unreeling
Pitch between the centre line of the origin point of round
P
sprocket hole and the centre line of compartment in
17, 18, 19, 24 and 25
2A
direction of unreeling
Pitch between the centre of a cavity on the same line with
P
the origin point of round sprocket hole and the centre of 3 and 6
the second next cavity in direction of unreeling
Pitch between the centre of a cavity on the same line with
P
the origin point of round sprocket hole and the centre of 3 and 6
the third next cavity in direction of unreeling
S Sprocket hole pitch in direction of width 14
R Bending radius of carrier tape 21
r Curvature radius of reel hole key's groove 27
T Carrier tape thickness without cover tape 2, 5, 8, 11, 14, 17, 25 and A.1
T
Top cover tape thickness 2, 5, 8, 11 and 14
T
Sum of outer cavity height and top cover tape thickness 8, 11 and 14
T
Thickenss of pressed carrier tape including bulge 5 and A.1
T
Bottom cover tape thickness or Adhesive tape thickness 2 and 17
V
Compartment dimension in direcion of unreeling 17 and 18
V
Compartment dimension in direction of width 17 and 18
W Carrier tape width 2, 5, 8, 11, 14 and 17
W
Distance between adhesive tapes 17
P
W
Reel inner width (measured at hub) 26
W
Reel overall width 26
W
Reel inner width in the rim 26
Z Component thickness 25
4 Structure of the specification
The various types of tapes are as follows.
Type 1 – Punched and pressed carrier tape
Type 1a: Punched carrier tape, with top and bottom cover tape (tape widths:
8 mm and 12 mm)
Type 1b: Pressed carrier tape, with top cover tape (tape width: 8 mm)
Type 2 – Blister carrier tape, with single round sprocket holes
Type 2a: Blister carrier tape, with single round sprocket holes, with top
cover tape and tape pitches down to 2 mm (tape widths: 8 mm,
12 mm, 16 mm and 24 mm)
Type 2b: Blister carrier tape, with single round sprocket holes, with top
cover tape and with 1mm tape pitch (tape widths: 4 mm)
Type 3 – Blister carrier tape, with double sprocket holes (tape widths: 32 mm to
200 mm)
Type 4 – Adhesive-backed punched plastic carrier tape for singulated bare die and
other surface mount components (tape widths: 8 mm, 12 mm, 16 mm, and
24 mm)
5 Dimensional requirements for taping
5.1 Component cavity positioning requirements
5.1.1 Requirements for type 1a, type 1b, type 2a, type 2b and type 3
For defined component positioning, the cavity shall be defined to an origin point. The origin is
the centre of the round sprocket hole, defined by the crosshair of the dimension E and
dimension P . The centre of the compartment shall be defined by P and F, relative to the round
0 2
sprocket hole (see Figure 2, Figure 5, Figure 8, Figure 11 and Figure 14). When dimension P
is smaller or equal to 2 mm, the maximum allowed pocket offset, relative to the centre of the
round sprocket hole, shall be applied (see Figure 3, Figure 6, Figure 9 and Figure 12).
5.1.2 Requirements for type 4
For defined component positioning, the component placement and location shall be defined to
an origin. The origin is the centre of the sprocket hole, defined by the crosshair of the dimension
E and dimension P . The centre of the component location shall be defined by P and F ,
1 0 2A A
relative to the sprocket hole (see Figure 17). Type 4 does not have cavities that are used to
position components. Therefore, all position measurements should be made according to the
principle defined here and not to the compartments or 'pockets', which are virtual boundaries
for component protection only. The term 'pocket offset' does not apply to type 4. The following
applies to type 4:
a) rotation and lateral movement of the component is defined by the accuracy to which it has
been placed in the compartment, with reference to the target;
b) the component shall not protrude above the top surface of the carrier tape (see Figure 25a);
c) the components shall not change their orientation within the tape;
d) the component shall be able to be removed from the cavity or compartment in a vertical
direction, without mechanical restriction.

– 14 – IEC 60286-3:2022 © IEC 2022
5.2 Component cavity dimension requirements (type 1a, type 1b, type 2a, type 2b and
type 3)
The size of the component cavity, including applicable tolerances, is governed by the
dimensions of the component for which the packaging applies, to ensure that the component is
adequately protected and that tilt, rotation and lateral movement of the component complies
with the requirements detailed for each type of tape. The following applies to type 1a, type 1b,
type 2a, type 2b and type 3:
a) dimension A ≤ dimension B , unless otherwise specified in the component detail
0 0
specification;
b) maximum and minimum dimensions of the component shall be taken from the component
detail specification;
c) the component shall not protrude above the top surface of the carrier tape, except for
type 1a where the component shall not protrude beyond either surface of the carrier tape;
d) the components shall not change their orientation within the tape;
e) the component shall be able to be removed from the cavity or compartment in a vertical
direction, without mechanical restriction, after the top cover has been removed, where a
cover tape is used.
f) Unless otherwise defined in the detail specification, for punched carrier tapes, K shall be
equivalent to T. For pressed and embossed tapes K shall be defined in each detail
specification.
5.3 Type 1a – Punched carrier tape, with top and bottom cover tape (tape widths:
8 mm and 12 mm)
For respective dimensional codes, see Figure 2 to Figure 4 and Table 3 to Table 5.
T
Figure 2 – 8 mm and 12 mm punched carrier-tape dimensions (4 mm cavity pitch)

a) 2 mm cavity pitch b) 1 mm cavity pitch c) Pocket offset

Figure 3 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset

a) Sketch A b) Sketch B c) Sketch C
Component tilt Component planar rotation Lateral movement
Side view Top view Top view
Figure 4 – Maximum component tilt, rotation and lateral movement

– 16 – IEC 60286-3:2022 © IEC 2022
Table 3 – Constant dimensions of 8 mm and 12 mm punched carrier tape
Dimensions in millimetres
Tape D E P G T T T P pitch
0 1 0 1 4 0
size
cumulative
tolerance
min. max. max. max.
4,0 ± 0,1
a
1,1 paper
(P ≥ 4)
1,5
8 and ± 0,2 / 10
+0,1 1,75 ± 0,1 0,75 0,1 0,1
12 pitches
4,0 ± 0,05 1,6 non-
(P = 2, P = 1) paper
1 1
For respective dimensional codes, see Figure 2.
a
The paper is the material of the punched carrier tape.

Table 4 – Variable dimensions of 8 mm and 12 mm punched carrier tape
Dimensions in millimetres
E P P P P A , B ,
Tape F W
2 1 2 3 4 0 0
size
and K
min.
1,0 ± 0,05 1,0 ± 0,05
(P = 1) (P = 1)
1 1
2,0 ± 0,05 2,0 ± 0,05
3,0 ± 0,05
2,0 ± 0,05
+0,3
8 6,25 3,5 ± 0,05 8,0
−0,1
(P = 2) (P = 2)
(P = 1) (P = 1)
1 1
1 1
4,0 ± 0,1 2,0 ± 0,05
See 5.2
(P = 4) (P = 4)
1 1
2,0 ± 0,05
(P = 2)
+0,3
12 10,25 5,5 ± 0,05 2,0 ± 0,05 – – 12,0
−0,1
4,0 ± 0,1
(P ≥ 4)
For respective dimensional codes, see Figure 2 to Figure 4.

Table 5 – Component tilt, planar rotation and lateral movement
Tape size Component tilt Component planar rotation Lateral movement
a a
mm mm
(design value)
(design value)
0,3 maximum
(P = 1, P = 2)
1 1
8 and 12 10° maximum 20° maximum
0,5 maximum
(P ≥ 4)
For respective dimensional codes, see Figure 4.
The trend for allowed component planar rotation of components with either length or width less than 1,2 mm is
10° maximum.
For components with either length or width dimensions of less than 1,2 mm, market trends are towards a lateral
movement of 0,2 mm maximum.
When handling bare die products in tape size 8 mm, the lateral movement of 0,1 mm maximum for either cavity
dimension should be allowed.
When handling bare die products in tape size 12 mm, the lateral movement of 0,15 mm maximum for either cavity
dimension should be allowed.
a
A design value is a calculated value for design purposes only. For example, component tilt is not intended to
be measured, but is intended to be the calculated value for the pocket design of a carrier tape.

5.4 Type 1b – Pressed carrier tape, with top cover tape (tape width: 8 mm)
For respective dimensional codes, see Figure 5 to Figure 7 and Table 6 to Table 8.

Figure 5 – Dimensions (P = 4 mm/P = 2 mm) and (P = 4 mm/P = 1 mm)
0 1 0 1
...