IEC 60286-3:2022

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

IEC 60286-3:2022 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This edition includes the following significant technical changes with respect to the previous edition:  
addition terms and definitions.
addition of a table of the classification to symbols concerning drive hole diameter and distance between the reel hole centre and the drive hole centre;
addition of drive hole to the reel (optional);
revision of reel hole diameter tolerances;
revision of 72 mm tape size carrier tape width dimension tolerances;
addition of Annex B (informative);
addition of component size 0201M.

Emballage de composants pour opérations automatisées - Partie 3: Emballage des composants pour montage en surface en bandes continues

L’IEC 60286-3:2022 s’applique à la mise sur bande des composants électroniques sans fils de sortie ou avec tronçons de sortie destinés à être connectés à des circuits électroniques. Elle fournit uniquement les dimensions essentielles pour la mise sur bande des composants destinés aux opérations susmentionnées. Le présent document inclut également des exigences relatives à l’emballage de produits à puce isolée incluant puces nues et puces à contact (puces retournées). Cette édition inclut les modifications techniques majeures suivantes par rapport à l’édition précédente:  
ajout de termes et définitions;
ajout d’un tableau de classification des symboles relatifs au diamètre du trou d’entraînement et à la distance entre le centre de l’orifice de la bobine et le centre du trou d’entraînement;
ajout du trou d’entraînement par rapport à la bobine (facultatif);
révision des tolérances du diamètre de l’orifice de la bobine;
révision des tolérances de dimension de la largeur de la bande d’entraînement de 72 mm;
ajout de l’Annexe B (informative);
ajout de la taille de composant 0201M.

General Information

• Status: Published
• Publication Date: 14-Nov-2022
• ICS: 31.020 - Electronic components in general
• ICS: 31.240 - Mechanical structures for electronic equipment
• Technical Committee: TC 40 - Capacitors and resistors for electronic equipment
• Drafting Committee: MT 60286-3 - TC 40/MT 60286-3
• Current Stage: PPUB - Publication issued
• Start Date: 25-Nov-2022
• Completion Date: 15-Nov-2022

Relations

• Revises: IEC 60286-3:2019 - Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 60286-3 ®
Edition 7.0 2022-11
COMMENTED VERSION
INTERNATIONAL
STANDARD
colour
inside
Packaging of components for automatic handling –
Part 3: Packaging of surface mount components on continuous tapes
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

IEC Secretariat Tel.: [phone]
3, rue de Varembé [e-mail]
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
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International Standards for all electrical, electronic and related technologies.

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IEC 60286-3 ®
Edition 7.0 2022-11
COMMENTED VERSION
INTERNATIONAL
STANDARD
colour
inside
Packaging of components for automatic handling –
Part 3: Packaging of surface mount components on continuous tapes
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.020; 31.240 ISBN 978-2-8322-6100-2

– 2 – IEC 60286-3:2022 CMV © IEC 2022
CONTENTS
FOREWORD .6
INTRODUCTION .8
1 Scope .9
2 Normative references .9
3 Terms, definitions and symbols.9
3.1 Terms and definitions .9
3.2 Symbols . 11
4 Structure of the specification . 13
5 Dimensional requirements for taping . 13
5.1 Component cavity positioning requirements . 13
5.1.1 Requirements for type 1a, type 1b, type 2a, type 2b and type 3. 13
5.1.2 Requirements for type 4. 13
5.2 Component cavity dimension requirements (tape type 1a, type 1b, type 2a,
type 2b and type 3) . 14
5.3 Type 1a – Punched carrier tape, with top and bottom cover tape (tape
widths: 8 mm and 12 mm) . 14
5.4 Type 1b – Pressed carrier tape, with top cover tape (tape width: 8 mm) . 17
5.5 Type 2a – Blister carrier tape, with single round sprocket holes and tape
pitches down to 2 mm (tape widths: 8 mm, 12 mm, 16 mm and 24 mm) . 20
5.6 Type 2b – Blister carrier tape, with single round sprocket holes and with
1mm tape pitch (tape widths: 4 mm) . 22
5.7 Type 3 – Blister carrier tape, with double sprocket holes (32 mm to 200 mm) . 24
5.8 Type 4 – Adhesive-backed punched plastic carrier tape for singled bare die
and other surface mount components (8 mm, 12 mm, 16 mm and 24 mm) . 27
6 Polarity and orientation requirements of components in the tape. 29
6.1 Requirements for all tape types . 29
6.2 Specific requirements for type 1a . 30
6.3 Specific requirements for type 4 . 30
7 Carrier tape requirements . 30
7.1 Taping materials . 30
7.2 Minimum bending radius (for all types) . 30
7.3 Camber . 31
8 Cover tape requirements (for type 1a, type 1b, type 2a, type 2b and type 3) . 32
9 Component taping and additional tape requirements . 34
9.1 All types . 34
9.2 Specific requirements for type 1b . 34
9.3 Specific tape requirements for type 2b. 34
9.4 Specific requirement for type 4 . 35
9.4.1 General . 35
9.4.2 Coordinate system . 35
9.4.3 Component positioning and lateral displacement . 36
9.5 Specific requirements for tapes containing die products . 37
9.5.1 General . 37
9.5.2 Tape design for tapes containing die products . 37
9.5.3 Cleanliness . 37
9.5.4 Die lateral movement (type 1a, type 2a and type 2b). 38

10 Reel requirements . 38
10.1 Dimensions . 38
10.1.1 General . 38
10.1.2 Reel dimensions . 38
10.1.3 Reel hole dimensions . 39
10.1.4 Drive hole dimensions (optional) . 40
10.2 Marking . 41
11 Tape reeling requirements . 42
11.1 All types . 42
11.2 Specific requirements for type 1a . 42
11.3 Specific requirements for type 4 . 42
11.4 Leader and trailer tape . 42
11.4.1 General . 42
11.4.2 Leader . 43
11.4.3 Trailer . 43
11.5 Recycling . 43
11.6 Missing components . 43
Annex A (normative) Recommended measuring methods for type 1b . 44
A.1 Measurement method for carrier tape thickness (T and T ) . 44
A.2 Measurement method for cavity (A and B ) . 44
0 0
A.3 Measurement method for cavity depth (dimension K ) . 45
Annex B (informative) Measuring methods of electrostatic potential and charge decay
performance while cover tape is peeled off from carrier tape containing surface mount
devices . 46
B.1 General . 46
B.2 Method for measuring electrostatic potential and charge decay performance . 47
B.2.1 General . 47
B.2.2 Measurement instrument and device . 49
B.2.3 Sample (test specimen) . 51
B.2.4 Pre-treatment conditions and measurement environment conditions . 51
B.2.5 Measurement conditions . 52
B.2.6 Method for measuring electrostatic potential . 52
B.2.7 Method for measuring the electrostatic charge decay performance . 53
B.3 Items to be described in the test report and items to be specified in the
related standards . 53
B.3.1 Items to be described in the test report . 53
B.3.2 Items specified in related standards . 55
Bibliography . 56
List of comments . 57

Figure 1 – Sectional view of component cavity (type 1b) . 11
Figure 2 – 8 mm and 12 mm punched carrier-tape dimensions (4 mm cavity pitch) . 15
Figure 3 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset . 15
Figure 4 – Maximum component tilt, rotation and lateral movement. 16
Figure 5 – Dimensions (P = 4 mm/P = 2 mm) and (P = 4 mm/P = 1 mm) . 18
0 1 0 1
Figure 6 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset . 18
Figure 7 – Maximum component tilt, rotation and lateral movement. 19

– 4 – IEC 60286-3:2022 CMV © IEC 2022
Figure 8 – Blister carrier tape dimensions (8 mm, 12 mm, 16 mm and 24 mm). 20
Figure 9 – Illustration of 2 mm cavity pitch and pocket offset . 21
Figure 10 – Maximum component tilt, rotation and lateral movement . 21
Figure 11 – Type 2b carrier tape . 23
Figure 12 – Maximum pocket offset . 23
Figure 13 – Maximum component tilt, rotation and lateral movement . 23
Figure 14 – Blister carrier tape . 25
Figure 15 – Elongated sprocket hole skew . 25
Figure 16 – Maximum component tilt, rotation and lateral movement . 25
Figure 17 – Adhesive-backed punched carrier-tape dimensions (4 mm compartment pitch) . 27
Figure 18 – Illustration of 2 mm compartment pitch. 27
Figure 19 – Maximum component plan
...

IEC 60286-3 ®
Edition 7.0 2022-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Packaging of components for automatic handling –
Part 3: Packaging of surface mount components on continuous tapes

Emballage de composants pour opérations automatisées –
Partie 3: Emballage des composants pour montage en surface en bandes
continues
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

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About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.

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Stay up to date on all new IEC publications. Just Published
containing more than 22 300 terminological entries in English
details all new publications released. Available online and once
and French, with equivalent terms in 19 additional languages.
a month by email.
Also known as the International Electrotechnical Vocabulary

(IEV) online.
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IEC 60286-3 ®
Edition 7.0 2022-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Packaging of components for automatic handling –

Part 3: Packaging of surface mount components on continuous tapes

Emballage de composants pour opérations automatisées –

Partie 3: Emballage des composants pour montage en surface en bandes

continues
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.020; 31.240 ISBN 978-2-8322-5899-6

– 2 – IEC 60286-3:2022 © IEC 2022
CONTENTS
FOREWORD . 6
INTRODUCTION . 8
1 Scope . 9
2 Normative references . 9
3 Terms, definitions and symbols. 9
3.1 Terms and definitions . 9
3.2 Symbols . 11
4 Structure of the specification . 13
5 Dimensional requirements for taping . 13
5.1 Component cavity positioning requirements . 13
5.1.1 Requirements for type 1a, type 1b, type 2a, type 2b and type 3 . 13
5.1.2 Requirements for type 4 . 13
5.2 Component cavity dimension requirements (type 1a, type 1b, type 2a, type
2b and type 3) . 14
5.3 Type 1a – Punched carrier tape, with top and bottom cover tape (tape
widths: 8 mm and 12 mm) . 14
5.4 Type 1b – Pressed carrier tape, with top cover tape (tape width: 8 mm) . 17
5.5 Type 2a – Blister carrier tape, with single round sprocket holes and tape
pitches down to 2 mm (tape widths: 8 mm, 12 mm, 16 mm and 24 mm) . 19
5.6 Type 2b – Blister carrier tape, with single round sprocket holes and with
1mm tape pitch (tape widths: 4 mm) . 21
5.7 Type 3 – Blister carrier tape, with double sprocket holes (32 mm to 200 mm). 23
5.8 Type 4 – Adhesive-backed punched plastic carrier tape for singled bare die
and other surface mount components (8 mm, 12 mm, 16 mm and 24 mm) . 26
6 Polarity and orientation requirements of components in the tape . 28
6.1 Requirements for all types . 28
6.2 Specific requirements for type 1a . 29
6.3 Specific requirements for type 4 . 29
7 Carrier tape requirements . 29
7.1 Taping materials . 29
7.2 Minimum bending radius (for all types) . 29
7.3 Camber . 30
8 Cover tape requirements (for type 1a, type 1b, type 2a, type 2b and type 3) . 31
9 Component taping and additional tape requirements. 33
9.1 All types . 33
9.2 Specific requirements for type 1b . 33
9.3 Specific tape requirements for type 2b . 33
9.4 Specific requirement for type 4 . 34
9.4.1 General . 34
9.4.2 Coordinate system . 34
9.4.3 Component positioning and lateral displacement . 35
9.5 Specific requirements for tapes containing die products . 36
9.5.1 General . 36
9.5.2 Tape design for tapes containing die products . 36
9.5.3 Cleanliness . 36
9.5.4 Die lateral movement (type 1a, type 2a and type 2b) . 37

10 Reel requirements . 37
10.1 Dimensions . 37
10.1.1 General . 37
10.1.2 Reel dimensions . 37
10.1.3 Reel hole dimensions . 38
10.1.4 Drive hole dimensions (optional) . 39
10.2 Marking . 40
11 Tape reeling requirements . 41
11.1 All types . 41
11.2 Specific requirements for type 1a . 41
11.3 Specific requirements for type 4 . 41
11.4 Leader and trailer tape . 41
11.4.1 General . 41
11.4.2 Leader . 42
11.4.3 Trailer . 42
11.5 Recycling . 42
11.6 Missing components . 42
Annex A (normative) Recommended measuring methods for type 1b . 43
A.1 Measurement method for carrier tape thickness (T and T ) . 43
A.2 Measurement method for cavity (A and B ) . 43
0 0
A.3 Measurement method for cavity depth (dimension K ) . 44
Annex B (informative) Measuring methods of electrostatic potential and charge decay
performance while cover tape is peeled off from carrier tape containing surface mount

devices . 45
B.1 General . 45
B.2 Method for measuring electrostatic potential and charge decay performance . 46
B.2.1 General . 46
B.2.2 Measurement instrument and device . 48
B.2.3 Sample (test specimen) . 50
B.2.4 Pre-treatment conditions and measurement environment conditions . 50
B.2.5 Measurement
...