IEC 61188-5-5:2007

Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides

IEC 61188-5-5:2007 provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on four sides. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of those solder joints.
This publication is to be read in conjunction with IEC 61188-5-1 :2002.

Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 5-5: Considérations sur les liaisons pistes-soudures - Composants à sorties en aile de mouette sur quatre côtés

La CEI 61188-5-5:2007 fournit des informations sur la géométrie des plages d'accueil utilisées pour la fixation en surface des composants électronique à sorties en aile de mouette sur quatre côtés. Le but des informations indiquées dans la présente norme est de fournir les dimensions, formes et tolérances appropriées des plages d'accueil pour montage en surface afin de garantir une surface suffisante pour le raccord de brasure, mais également pour permettre l'inspection, la mise en essai et les retouches des joints de brasure.
Cette publication doit être lue conjointement avec la CEI 61188-5-1 :2002.

General Information

• Status: Published
• Publication Date: 29-Oct-2007
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: TC 91 - Electronics assembly technology
• Drafting Committee: WG 12 - TC 91/WG 12
• Current Stage: PPUB - Publication issued
• Start Date: 15-Nov-2007
• Completion Date: 30-Oct-2007

Relations

• Replaced By: IEC 61188-6-2:2021 - Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 61188-5-5
Edition 1.0 2007-10
INTERNATIONAL
STANDARD
Printed boards and printed board assemblies – Design and use –
Part 5-5: Attachment (land/joint) considerations – Components with gull-wing
leads on four sides
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester.
If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,
please contact the address below or your local IEC member National Committee for further information.

IEC Central Office
3, rue de Varembé
CH-1211 Geneva 20
Switzerland
Email: [e-mail]
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About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
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Vocabulary online.
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IEC 61188-5-5
Edition 1.0 2007-10
INTERNATIONAL
STANDARD
Printed boards and printed board assemblies – Design and use –
Part 5-5: Attachment (land/joint) considerations – Components with gull-wing
leads on four sides
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
X
ICS 31.180 ISBN 2-8318-9342-9
– 2 – 61188-5-5 © IEC:2007(E)
CONTENTS
FOREWORD.4
INTRODUCTION.6

1 Scope.7
2 Normative references .7
3 General information.7
3.1 General component description .7
3.2 Marking .7
3.3 Carrier packaging format .8
3.4 Process considerations .8
4 PQFP (square) .8
4.1 Field of application .8
4.2 Component descriptions .8
4.3 Component dimensions .9
4.4 Solder joint fillet design .13
4.5 Land pattern dimensions .14
5 PQFP (rectangular) .17
5.1 Field of application .17
5.2 Component descriptions .18
5.3 Component dimensions .19
5.4 Solder joint fillet design .19
5.5 Land pattern dimensions .21
6 PLQFP (square) .23
6.1 Field of application .23
6.2 Component descriptions .23
6.3 Component dimensions .24
6.4 Solder joint fillet design .26
6.5 Land pattern dimensions .28
7 PLQFP (rectangular) .31
7.1 Field of application .31
7.2 Component descriptions .31
7.3 Component dimensions .32
7.4 Solder joint fillet design .33
7.5 Land pattern dimensions .34
8 PTQFP (square) .35
8.1 Field of application .35
8.2 Component descriptions .35
8.3 Component dimensions .36
8.4 Solder joint fillet design .39
8.5 Land pattern dimensions .40

Figure 1 – PQFP (square).9
Figure 2 – PQFP (square) component dimensions .10
Figure 3 – Solder joint fillet design.14
Figure 4 – PQFP (square) land pattern dimensions.17

61188-5-5 © IEC:2007(E) – 3 –
Figure 5 – PQFP (rectangular) .18
Figure 6 – PQFP (rectangular) component dimensions .19
Figure 7 – Solder joint fillet design.21
Figure 8 – PQFP (rectangular) land pattern dimensions .22
Figure 9 – PLQFP (square) .23
Figure 10 – PLQFP (square) component dimensions .24
Figure 11 – Solder joint fillet design.28
Figure 12 – PLQFP (square) land pattern dimensions .31
Figure 13 – PLQFP (rectangular) .32
Figure 14 – PLQFP (rectangular) component dimensions.32
Figure 15 – Solder joint fillet design.34
Figure 16 – PLQFP (rectangular) land pattern dimensions .35
Figure 17 – PTQFP (square).36
Figure 18 – PTQFP component dimensions .37
Figure 19 – Solder joint fillet design.40
Figure 20 – PTQFP land pattern dimensions.42

– 4 – 61188-5-5 © IEC:2007(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES –
DESIGN AND USE –
Part 5-5: Attachment (land/joint) considerations –
Components with gull-wing leads on four sides

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61188-5-5 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/704/FDIS 91/736/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
IEC 61188-5-5 is to be read in conjunction with IEC 61188-5-1.

61188-5-5 © IEC:2007(E) – 5 –
A list of all parts of the IEC 61188 series, under the general title Printed boards and printed
board assemblies – Design and use, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.
...

IEC 61188-5-5 ®
Edition 1.0 2007-10
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Printed boards and printed board assemblies – Design and use –
Part 5-5: Attachment (land/joint) considerations – Components with gull-wing
leads on four sides
Cartes imprimées et cartes imprimées équipées – Conception et utilisation –
Partie 5-5: Considérations sur les liaisons pistes-soudures – Composants à
sorties en aile de mouette sur quatre côtés

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by
any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or
IEC's member National Committee in the country of the requester.
If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,
please contact the address below or your local IEC member National Committee for further information.

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publication, utilisez les coordonnées ci-après ou contactez le Comité national de la CEI de votre pays de résidence.

IEC Central Office
3, rue de Varembé
CH-1211 Geneva 20
Switzerland
Email: [e-mail]
Web: www.iec.ch
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.
ƒ Catalogue of IEC publications: www.iec.ch/searchpub
The IEC on-line Catalogue enables you to search by a variety of criteria (reference number, text, technical committee,…).
It also gives information on projects, withdrawn and replaced publications.
ƒ IEC Just Published: www.iec.ch/online_news/justpub
Stay up to date on all new IEC publications. Just Published details twice a month all new publications released. Available
on-line and also by email.
ƒ Electropedia: www.electropedia.org
The world's leading online dictionary of electronic and electrical terms containing more than 20 000 terms and definitions
in English and French, with equivalent terms in additional languages. Also known as the International Electrotechnical
Vocabulary online.
ƒ Customer Service Centre: www.iec.ch/webstore/custserv
If you wish to give us your feedback on this publication or need further assistance, please visit the Customer Service
Centre FAQ or contact us:
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IEC 61188-5-5 ®
Edition 1.0 2007-10
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Printed boards and printed board assemblies – Design and use –
Part 5-5: Attachment (land/joint) considerations – Components with gull-wing
leads on four sides
Cartes imprimées et cartes imprimées équipées – Conception et utilisation –
Partie 5-5: Considérations sur les liaisons pistes-soudures – Composants à
sorties en aile de mouette sur quatre côtés

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
X
CODE PRIX
ICS 31.180 ISBN 978-2-88910-435-2
– 2 – 61188-5-5 © IEC:2007
CONTENTS
FOREWORD.4
INTRODUCTION.6
1 Scope.7
2 Normative references .7
3 General information.7
3.1 General component description .7
3.2 Marking .7
3.3 Carrier packaging format .8
3.4 Process considerations .8
4 PQFP (square) .8
4.1 Field of application .8
4.2 Component descriptions .8
4.3 Component dimensions .9
4.4 Solder joint fillet design .13
4.5 Land pattern dimensions .14
5 PQFP (rectangular) .17
5.1 Field of application .17
5.2 Component descriptions .18
5.3 Component dimensions .19
5.4 Solder joint fillet design .19
5.5 Land pattern dimensions .21
6 PLQFP (square) .23
6.1 Field of application .23
6.2 Component descriptions .23
6.3 Component dimensions .24
6.4 Solder joint fillet design .26
6.5 Land pattern dimensions .28
7 PLQFP (rectangular) .31
7.1 Field of application .31
7.2 Component descriptions .31
7.3 Component dimensions .32
7.4 Solder joint fillet design .33
7.5 Land pattern dimensions .34
8 PTQFP (square) .35
8.1 Field of application .35
8.2 Component descriptions .35
8.3 Component dimensions .36
8.4 Solder joint fillet design .39
8.5 Land pattern dimensions .40
Bibliography.43

Figure 1 – PQFP (square).9
Figure 2 – PQFP (square) component dimensions .10
Figure 3 – Solder joint fillet design.14
Figure 4 – PQFP (square) land pattern dimensions.17

61188-5-5 © IEC:2007 – 3 –
Figure 5 – PQFP (rectangular) .18
Figure 6 – PQFP (rectangular) component dimensions .19
Figure 7 – Solder joint fillet design.21
Figure 8 – PQFP (rectangular) land pattern dimensions .22
Figure 9 – PLQFP (square) .23
Figure 10 – PLQFP (square) component dimensions .24
Figure 11 – Solder joint fillet design.28
Figure 12 – PLQFP (square) land pattern dimensions .31
Figure 13 – PLQFP (rectangular) .32
Figure 14 – PLQFP (rectangular) component dimensions.32
Figure 15 – Solder joint fillet design.34
Figure 16 – PLQFP (rectangular) land pattern dimensions .35
Figure 17 – PTQFP (square).36
Figure 18 – PTQFP component dimensions .37
Figure 19 – Solder joint fillet design.40
Figure 20 – PTQFP land pattern dimensions.42

– 4 – 61188-5-5 © IEC:2007
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES –
DESIGN AND USE –
Part 5-5: Attachment (land/joint) considerations –
Components with gull-wing leads on four sides

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the
...