IEC 61191-2:2013

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

IEC 61191-2:2013 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.). This edition includes the following significant technical changes with respect to the previous edition:
- IPC-A-610 on workmanship has been included as a normative reference;
- some of the terminology used in the document has been updated;
- references to IEC standards have been corrected;
- the use of lead-free solder paste and plating are addressed.

Ensembles de cartes imprimées - Partie 2: Spécification intermédiaire - Exigences relatives à l'assemblage par brasage pour montage en surface

La CEI 61191-2:2013 donne les exigences relatives aux connexions brasées pour montage en surface. Les exigences se rapportent aux ensembles intégrant uniquement le montage en surface ou aux portions d'ensembles pour montage en surface incluant d'autres technologies associées (par exemple montage par trous traversants, montage à puce, à borne, etc.). Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
- inclusion du document IPC-A-610 sur la qualité d'exécution en tant que référence normative;
- mise à jour d'une partie de la terminologie utilisée dans le présent document;
- correction des références aux normes CEI;
- prise en compte de l'utilisation de crème de brasage et de métallisation sans plomb.

General Information

• Status: Published
• Publication Date: 04-Jun-2013
• ICS: 31.190 - Electronic component assemblies
• ICS: 31.240 - Mechanical structures for electronic equipment
• Technical Committee: TC 91 - Electronics assembly technology
• Drafting Committee: WG 2 - TC 91/WG 2
• Current Stage: DELPUB - Deleted Publication
• Completion Date: 23-May-2017

Relations

• Revised: IEC 61191-2:2017 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
• Effective Date: 05-Sep-2023
• Revises: IEC 61191-2:1998 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 61191-2 ®
Edition 2.0 2013-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Printed board assemblies –
Part 2: Sectional specification – Requirements for surface mount soldered
assemblies
Ensembles de cartes imprimées –
Partie 2: Spécification intermédiaire – Exigences relatives à l’assemblage par
brasage pour montage en surface

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IEC 61191-2 ®
Edition 2.0 2013-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Printed board assemblies –
Part 2: Sectional specification – Requirements for surface mount soldered

assemblies
Ensembles de cartes imprimées –

Partie 2: Spécification intermédiaire – Exigences relatives à l’assemblage par

brasage pour montage en surface

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX U
ICS 31.190; 31.240 ISBN 978-2-83220-856-4

– 2 – 61191-2 © IEC:2013
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Conventions . 6
4 General requirements . 6
5 Classification . 6
6 Surface mounting of components . 7
6.1 General . 7
6.2 Alignment requirements . 7
6.3 Process control . 7
6.4 Surface mounted component requirements . 7
6.5 Flatpack lead forming . 7
6.5.1 General . 7
6.5.2 Surface mounted device lead bends . 8
6.5.3 Surface mounted device lead deformation . 8
6.5.4 Flattened leads . 8
6.5.5 Dual-in-line packages (DIPs) . 8
6.5.6 Parts not configured for surface mounting . 9
6.6 Small devices with two terminations . 9
6.6.1 General . 9
6.6.2 Stack mounting . 9
6.6.3 Devices with external deposited elements . 9
6.7 Lead component body positioning . 9
6.7.1 General . 9
6.7.2 Axial-leaded components . 9
6.7.3 Other components . 9
6.8 Parts configured for butt lead mounting . 9
6.9 Non-conductive adhesive coverage limits . 10
7 Acceptance requirements . 10
7.1 General . 10
7.2 Control and corrective actions . 10
7.3 Surface soldering of leads and terminations . 10
7.3.1 General . 10
7.3.2 Solder fillet height and heel fillets . 10
7.3.3 Flat ribbon L and gull-wing leads . 13
7.3.4 Round or flattened (coined) leads . 13
7.3.5 J leads. 15
7.3.6 Rectangular or square end components . 16
7.3.7 Cylindrical end cap terminations . 17
7.3.8 Bottom only terminations . 18
7.3.9 Leadless chip carriers with castellated terminations . 19
7.3.10 Butt joints . 20
7.3.11 Inward L-shaped ribbon leads . 21
7.3.12 Flat lug leads . 22
7.4 General post-soldering requirements applicable to all surface-mounted
assemblies . 23

61191-2 © IEC:2013 – 3 –
7.4.1 Dewetting . 23
7.4.2 Leaching. 23
7.4.3 Pits, voids, blowholes, and cavities . 23
7.4.4 Solder wicking . 23
7.4.5 Solder webs and skins . 23
7.4.6 Bridging . 23
7.4.7 Degradation of marking . 23
7.4.8 Solder spikes . 23
7.4.9 Disturbed joint . 23
7.4.10 Component damage . 24
7.4.11 Open circuit, non-wetting . 24
7.4.12 Component tilting . 24
7.4.13 Non-conducting adhesive encroachment . 24
7.4.14 Open circuit, no solder available (skip) . 24
7.4.15 Component on edge . 24
8 Rework and repair . 24
Annex A (normative) Placement requirements for surface mounted devices . 26

Figure 1 – Lead formation for surface mounted device . 8
Figure 2 – Fillet height . 12
Figure 3 – Flat ribbon L and gull-wing leads . 13
Figure 4 – Round or flattened (coined) lead joint . 14
Figure 5 – J lead joint . 15
Figure 6 – Rectangular or square end components . 16
Figure 7 – Cylindrical end-cap terminations . 17
Figure 8 – Bottom only terminations . 18
Figure 9 – Leadless chip carriers with castellated terminations . 19
Figure 10 – Butt joints . 20
Figure 11 – Inward L-shaped ribbon leads . 21
Figure 12 – Flat lug leads . 22

Table 1 – Surface mounted solder joint defects . 25

– 4 – 61191-2 © IEC:2013
INTERNATIONAL ELECTROTECHNICAL COMMISSION
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