IEC 61249-2-13:1999

Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper-clad

Gives requirements for properties of cyanate ester non-woven aramid copper-clad laminate of defined flammability, in thicknesses of 0,05 mm up to 6,4 mm.

Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-13: Collection de spécifications intermédiaires pour les matériaux de base renforcés, recouverts ou non de feuille conductrice - Stratifié à base d'aramide non tissé collé avec de la résine cyanate ester, recouvert de cuivre, d'inflammabilité définie

Définit les caractéristiques des stratifiés à base d'aramide non tissé, collé avec de la résine cyanate ester, recouvert de cuivre, d'inflammabilité définie et dont l'épaisseur est comprise entre 0,05 mm et 6,4 mm.

General Information

• Status: Published
• Publication Date: 25-Feb-1999
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: TC 91 - Electronics assembly technology
• Drafting Committee: WG 4 - TC 91/WG 4
• Current Stage: PPUB - Publication issued
• Start Date: 28-Feb-1999
• Completion Date: 26-Feb-1999

Standards Content (Sample)

INTERNATIONAL
IEC
STANDARD
61249-2-13
First edition
1999-02
Materials for printed boards and other
interconnecting structures –
Part 2-13:
Sectional specification set for reinforced base
materials, clad and unclad –
Cyanate ester non-woven aramid laminate
of defined flammability, copper-clad
Matériaux pour circuits imprimés et autres structures
d’interconnexion –
Partie 2-13:
Collection de spécifications intermédiaires pour les matériaux
de base renforcés, recouverts ou non de feuille conductrice –
Stratifié à base d’aramide non tissé collé avec de la résine
cyanate ester, recouvert de cuivre, d’inflammabilité définie
Reference number
Numbering
As from 1 January 1997 all IEC publications are issued with a designation in the
60000 series.
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Consolidated versions of some IEC publications including amendments are
available. For example, edition numbers 1.0, 1.1 and 1.2 refer, respectively, to the
base publication, the base publication incorporating amendment 1 and the base
publication incorporating amendments 1 and 2.
Validity of this publication
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thus ensuring that the content reflects current technology.
Information relating to the date of the reconfirmation of the publication is available
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publications issued, is to be found at the following IEC sources:
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(On-line catalogue)*
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Terminology, graphical and letter symbols
For general terminology, readers are referred to IEC 60050: International
Electrotechnical Vocabulary (IEV).
For graphical symbols, and letter symbols and signs approved by the IEC for
general use, readers are referred to publications IEC 60027: Letter symbols to be
used in electrical technology, IEC 60417: Graphical symbols for use on equipment.
Index, survey and compilation of the single sheets and IEC 60617: Graphical symbols
for diagrams.
* See web site address on title page.

INTERNATIONAL
IEC
STANDARD
61249-2-13
First edition
1999-02
Materials for printed boards and other
interconnecting structures –
Part 2-13:
Sectional specification set for reinforced base
materials, clad and unclad –
Cyanate ester non-woven aramid laminate
of defined flammability, copper-clad
Matériaux pour circuits imprimés et autres structures
d’interconnexion –
Partie 2-13:
Collection de spécifications intermédiaires pour les matériaux
de base renforcés, recouverts ou non de feuille conductrice –
Stratifié à base d’aramide non tissé collé avec de la résine
cyanate ester, recouvert de cuivre, d’inflammabilité définie
 IEC 1999  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission 3, rue de Varembé Geneva, Switzerland
Telefax: [phone] e-mail: [e-mail] IEC web site http://www.iec.ch
Commission Electrotechnique Internationale
PRICE CODE
P
International Electrotechnical Commission
For price, see current catalogue

– 2 – 61249-2-13 © IEC:1999(E)
CONTENTS
Page
FOREWORD . 3
Clause
1 Scope.4
2 Normative references.4
3 Materials and construction. 4
4 Internal marking.4
5 Electrical properties.5
6 Non-electrical properties of the copper-clad laminate. 5
7 Non-electrical properties of the base material after complete removal of the copper foil . 10
8 Packaging and marking . 12
9 Acceptance testing.12
Annex A (informative) Conversion table for test method reference numbers . 13

61249-2-13 © IEC:1999(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
_________
MATERIALS FOR PRINTED BOARDS AND OTHER
INTERCONNECTING STRUCTURES –
Part 2-13: Sectional specification set for reinforced base materials,
clad and unclad –
Cyanate ester non-woven aramid laminate of defined flammability,
copper-clad
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising with
the IEC also participate in this preparation. The IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical reports or guides and they are accepted by the National Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any divergence
between the IEC Standard and the corresponding national or regional standard shall be clearly indicated in the
latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject of
patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61249-2-13 has been prepared by IEC technical committee 52:
Printed circuits.
The text of this standard is based on the following documents:
FDIS Report on voting
52/791/FDIS 52/802/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
Annex A is for information only.
A bilingual version of this standard may be issued at a later date.

– 4 – 61249-2-13 © IEC:1999(E)
MATERIALS FOR PRINTED BOARDS AND OTHER
INTERCONNECTING STRUCTURES –
Part 2-13: Sectional specification set for reinforced base materials,
clad and unclad –
Cyanate ester non-woven aramid laminate of defined flammability,
copper-clad
1 Scope
This part of IEC 61249 gives requirements for properties of cyanate ester non-woven aramid
copper-clad laminate of defined flammability, in thicknesses of 0,05 mm up to 6,4 mm.
NOTE – To designate this material, the reference: 61249-2-13 – FV1 0– IEC – CE – AP – Cu may be used; if there is
no risk of confusion, the type designation may be abbreviated to read IEC-61249-2-13-FV1.
2 Normative references
The following normative documents contain provisions which, through reference in this text,
constitute provisions of this part of IEC 61249-2. At the time of publication, the editions
indicated were valid. All normative documents are subject to revision, and parties to
agreements based on this part of IEC 61249-2 are encouraged to investigate the possibility of
applying the most recent editions of the normative documents listed below. Members of IEC
and ISO maintain registers of currently valid International standards.
IEC 61189-2:1997, Test methods for electrical materials, interconnection structures and
assemblies – Part 2: Test methods for materials for interconnection structures
IEC 61249-5-1:1995, Materials for printed boards and interconnecting structures – Part 5:
Sectional specification set for conductive foils and films with or without coatings – Section 1:
Copper foils (for the manufacture of copper-clad base materials)
3 Materials and construction
The material consists of an insulating base with metal foil bonded to one side or both.
3.1 Insulating base
Cyanate ester resin bonded non-woven aramid laminate. Its flame resistance is defined in
terms of the flammability requirements of 7.3.
3.2 Metal foil
Copper as specified in IEC 61249-5-1. The preferred foils are type E1 (standard electro-
deposited copper) of standard ductility.
4 Internal marking
Not specified.
61249-2-13 © IEC:1999(E) – 5 –
5 Electrical properties
Table 1 – Electrical properties
Property Test method Requirements
(IEC 61189-2)
Resistance of foil 2E12 As specified in IEC 61249-5-1
Surface resistance after damp heat while in 2E03
10 000 MΩ min.
the humidity chamber (optional)
Surface resistance after damp heat and 2E03
100 000 MΩ min.
recovery
Volume resistivity after damp heat while in the 2E04
1 000 MΩm min.
humidity chamber (optional)
Volume resistivity after damp heat and 2E04
10 000 MΩm min.
recovery
Surface corrosion 2E08 No visible corrosion products in the gap
Corrosion at the edge 2E13 Positive pole: not worse than A/B
Negative pole: not worse than 1,4
Relative permittivity after damp heat and 2E10 The average value shall not exceed 4,0
recovery
Dielectric dissipation factor after damp heat 2E10 The average value shall not exceed 0,03
and recovery
Electrical strength (optional) material 2E11 30 kV/mm min.
thickness not greater than 0,8 mm
Surface resistance at 200 °C 2E07 100 000 MΩ min.
Volume resistivity at 200 °C 2E07
10 000 MΩm min.
6 Non-electrical properties of the copper-clad laminate
6.1 Appearance of the copper-clad face
6.1.1 Normal surface appearance
The copper-clad face shall be substantially free from blisters, wrinkles, pin-holes, deep
scratches, pits and resin. Any discoloration or contamination shall be readily removable with a
hydrochloric acid solution of density 1,02 g/cm with a suitable organic solvent.
6.1.2 Qualified surface appearance (optional)
If a surface of high quality is essential for precious metal plating or fine line etching and is
ordered by the purchaser, the following requirements shall apply in addition to those of 6.1.1
when inspected in accordance with 2M18 of IEC 61189-2.
The surface appearance of the copper-clad face shall be such as not to conceal imperfections.
The surface of the copper foil shall be free from scratches of depth greater than 10 μm or 1/5
of the nominal thickness of the copper foil, whichever is lower.

– 6 – 61249-2-13 © IEC:1999(E)
The total length of scratches of depth greater than 5 μm but not more than 10 μm shall not
exceed 1 m per square metre of the total area of the sheet under test.
2 2
This requirement applies to the surface of 35 μm and 70 μm (305 g/m and 610 g/m ) foils.
Permitted scratches on surfaces of 18 μm (152 g/m ) foil are still under consideration.
2 2
The total area of all pin-holes in an area of 0,5 m shall not exceed 0,012 mm .
No sheet shall have more imperfections of the types listed than those permitted by table 2.
6.1.3 Surface waviness (optional)
Under consideration.
6.2 Appearance of the unclad face
The unclad face of laminate, copper-clad on one side only, shall be free from all materials, for
example release agents, oils or lubricants, that might interfere with its adhesion in the
multilayer fabrication operation.
Table 2 – Types, sizes and permitted number of imperfections
Type Size Number of imperfections permitted
(length unless otherwise indicated)
Above Not above In any sheet of area In any area
about 1 m 300 mm × 300 mm
mm mm
Inclusions – 0,1 Any number Any number
0,1 0,25 30 4
0,25 – 0 0
Indentations – 0,25 Any number Any number
0,25 1,25 13** 3*
1,25 3,0 3** 1*
3,0 or width 1,0 0 0
or width 1,0 –
Bumps – 0,1 Any number Any number
0,1 4,0 10 2
4,0 or height 0,1 0 0
or height 0,1
Wrinkles Of any size 0 0
Blisters
*  The total for these sizes of indentation is 3.
** The total for these sizes of indentation is 13.
2 2
NOTE – For sheets 1 m or greater, the values of the fourth column apply for any area of 1 m ; for the same
sheets in any area of 300 mm × 300 mm, however, the values of the fifth column apply. For sheets smaller than
1 m , the fifth column applies for any area of 300 mm × 300 mm.

61249-2-13 © IEC:1999(E) – 7 –
6.3 Thickness
– Including copper foil
If the copper-clad laminate is tested in accordance with test method 2D01 of IEC 61189-2,
the thickness, including the copper foil, shall not depart from the nominal thickness by more
than the appropriate value shown in table 3. The coarse tolerances shall apply unless the
fine tolerances are ordered.
– Excluding copper foil
If the base material is tested in accordance with test method 2D01 of IEC 61189-2 the
thickness, excluding the copper foil, shall not depart from the nominal thickness by more
than the appropriate value shown in table 3. The coarse tolerances shall apply unless the
fine tolerances are ordered.
Table 3 – Nominal thickness and tolerances of metal-clad laminate
Nominal thickness Tolerance
with copper foil
± mm
mm Coarse (normal) Fine (special)
0,8 0,15 0,09
1,0 0,17 0,11
1,2 0,18 0,12
1,5 0,20 0,14
1,6 0,20 0,14
2,0 0,23 0,15
2,4
...

IEC 61249-2-13
Edition 1.0 1999-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Materials for printed boards and other interconnecting structures –
Part 2-13: Sectional specification set for reinforced base materials, clad and
unclad – Cyanate ester non-woven aramid laminate of defined flammability,
copper-clad
Matériaux pour circuits imprimés et autres structures d’interconnexion –
Partie 2-13: Collection de spécifications intermédiaires pour les matériaux de
base renforcés, recouverts ou non de feuille conductrice – Stratifié à base
d’aramide non tissé collé avec de la résine cyanate ester, recouvert de cuivre,
d’inflammabilité définie
Copyright © 1999 IEC, Geneva, Switzerland

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IEC 61249-2-13
Edition 1.0 1999-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Materials for printed boards and other interconnecting structures –
Part 2-13: Sectional specification set for reinforced base materials, clad and
unclad – Cyanate ester non-woven aramid laminate of defined flammability,
copper-clad
Matériaux pour circuits imprimés et autres structures d’interconnexion –
Partie 2-13: Collection de spécifications intermédiaires pour les matériaux de
base renforcés, recouverts ou non de feuille conductrice – Stratifié à base
d’aramide non tissé collé avec de la résine cyanate ester, recouvert de cuivre,
d’inflammabilité définie
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
N
CODE PRIX
ICS 31.180 ISBN 2-8318-5758-9
– 2 – 61249-2-13 © CEI:1999
SOMMAIRE
AVANT-PROPOS .4

1 Domaine d'application.6
2 Références normatives .6
3 Matériaux et construction.6
4 Marquage interne.6
5 Propriétés électriques .8
6 Propriétés non électriques du stratifié recouvert de cuivre .8
7 Propriétés non électriques du matériau de base après élimination complète
de la feuille de cuivre.16
8 Emballage et marquage .20
9 Essais de réception .20
Annexe A (informative) Tableau de correspondance pour les références
des méthodes d'essai.22
Tableau 1 – Propriétés électriques .8
Tableau 2 – Types, dimensions et nombre d'imperfections admis .10
Tableau 3 – Epaisseur nominale et tolérances du stratifié recouvert d'une feuille métallique .12
Tableau 4 – Résistance à l'arrachement et au pelage .14
Tableau 5 – Stabilité dimensionnelle .14
Tableau 6 – Tolérances sur les dimensions des panneaux découpés .16
Tableau 7 – Perpendicularité des panneaux découpés.16
Tableau 8 – Résistance à la flexion .16
Tableau 9 – Inflammabilité .18
Tableau 10 – Absorption d'eau .18
Tableau 11 – Température de transition vitreuse et degré de polymérisation.20
Tableau 12 – Coefficient d'expansion thermique .20
Tableau 13 – Essais de réception recommandés .20

61249-2-13 © IEC:1999 – 3 –
CONTENTS
FOREWORD.5

1 Scope.7
2 Normative references.7
3 Materials and construction.7
4 Internal marking.7
5 Electrical properties.9
6 Non-electrical properties of the copper-clad laminate .9
7 Non-electrical properties of the base material after complete removal
of the copper foil .17
8 Packaging and marking .21
9 Acceptance testing.21
Annex A (informative) Conversion table for test method numbers .23
Table 1 – Electrical properties .9
Table 2 – Types, sizes and permitted number of imperfections .11
Table 3 – Nominal thickness and tolerances of metal-clad laminate .13
Table 4 – Pull-off and peel strength .15
Table 5 – Dimensional stability .15
Table 6 – Size tolerances for cut panels .17
Table 7 – Rectangularity of cut panels .17
Table 8 – Flexural strength .17
Table 9 – Flammability.19
Table 10 – Water absorption .19
Table 11 – Glass transition temperature and cure factor .21
Table 12 – Thermal coefficient of expansion .21
Table 13 – Recommended acceptance tests .21

– 4 – 61249-2-13 © CEI:1999
COMMISSION ÉLECTROTECHNIQUE INTERNATIONALE
____________
MATÉRIAUX POUR CIRCUITS IMPRIMÉS
ET AUTRES STRUCTURES D'INTERCONNEXION –
Partie 2-13: Collection de spécifications intermédiaires pour les matériaux
de base renforcés, recouverts ou non de feuille conductrice –
Stratifié à base d'aramide non tissé collé avec de la résine cyanate ester,
recouvert de cuivre, d'inflammabilité définie

AVANT-PROPOS
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n’est pas engagée quand un matériel es
...