ISO 8181:2023
(Main)Atomic layer deposition — Vocabulary
Atomic layer deposition — Vocabulary
This document defines general terms and film growth processes for atomic layer deposition (ALD). ALD technique is classified into conventional time separated ALD and spatial ALD according to the separation between sequential surface reactions of precursors on substrate. Besides planar substrate, ALD can be used for coating on micro-nano particles, which is developed as powder ALD. Some energy enhanced ALD techniques are also included. This document specifies the processes of different ALD methods. This document applies to the process of ALD. This document does not apply to the deposited materials or specific nanostructures. This document applies to industrial production, scientific research, teaching, publishing and scientific and technological communications related to ALD.
Dépôt de couches atomiques — Vocabulaire
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INTERNATIONAL ISO
STANDARD 8181
First edition
2023-10
Atomic layer deposition — Vocabulary
Dépôt de couches atomiques — Vocabulaire
Reference number
ISO 8181:2023(E)
© ISO 2023
---------------------- Page: 1 ----------------------
ISO 8181:2023(E)
COPYRIGHT PROTECTED DOCUMENT
© ISO 2023
All rights reserved. Unless otherwise specified, or required in the context of its implementation, no part of this publication may
be reproduced or utilized otherwise in any form or by any means, electronic or mechanical, including photocopying, or posting on
the internet or an intranet, without prior written permission. Permission can be requested from either ISO at the address below
or ISO’s member body in the country of the requester.
ISO copyright office
CP 401 • Ch. de Blandonnet 8
CH-1214 Vernier, Geneva
Phone: +41 22 749 01 11
Email: copyright@iso.org
Website: www.iso.org
Published in Switzerland
ii
© ISO 2023 – All rights reserved
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ISO 8181:2023(E)
Contents Page
Foreword .iv
Introduction .v
1 Scope . 1
2 Normative references . 1
3 Terms and definitions . 1
4 Terms related to atomic layer deposition . 2
4.1 General terms . 2
4.2 Film growth of atomic layer deposition . 3
4.3 Classification of atomic layer deposition . 4
Annex A (informative) Examples of schematic diagrams for a time separated ALD and a
spatial ALD . 7
Bibliography . 9
Index .10
iii
© ISO 2023 – All rights reserved
---------------------- Page: 3 ----------------------
ISO 8181:2023(E)
Foreword
ISO (the International Organization for Standardization) is a worldwide federation of national standards
bodies (ISO member bodies). The work of preparing International Standards is normally carried out
through ISO technical committees. Each member body interested in a subject for which a technical
committee has been established has the right to be represented on that committee. International
organizations, governmental and non-governmental, in liaison with ISO, also take part in the work.
ISO collaborates closely with the International Electrotechnical Commission (IEC) on all matters of
electrotechnical standardization.
The procedures used to develop this document and those intended for its further maintenance are
described in the ISO/IEC Directives, Part 1. In particular, the different approval criteria needed for the
different types of ISO document should be noted. This document was drafted in accordance with the
editorial rules of the ISO/IEC Directives, Part 2 (see www.iso.org/directives).
ISO draws attention to the possibility that the implementation of this document may involve the use
of (a) patent(s). ISO takes no position concerning the evidence,
...
FINAL
INTERNATIONAL ISO/FDIS
DRAFT
STANDARD 8181
ISO/TC 107
Atomic layer deposition — Vocabulary
Secretariat: KATS
Voting begins on: Dépôt de couches atomiques — Vocabulaire
2023-06-13
Voting terminates on:
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Reference number
BEING ACCEPTABLE FOR INDUSTRIAL, TECHNO-
ISO/FDIS 8181:2023(E)
LOGICAL, COMMERCIAL AND USER PURPOSES,
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NATIONAL REGULATIONS. © ISO 2023
---------------------- Page: 1 ----------------------
ISO/FDIS 8181:2023(E)
FINAL
INTERNATIONAL ISO/FDIS
DRAFT
STANDARD 8181
ISO/TC 107
Atomic layer deposition — Vocabulary
Secretariat: KATS
Voting begins on: Dépôt de couches atomiques — Vocabulaire
Voting terminates on:
COPYRIGHT PROTECTED DOCUMENT
© ISO 2023
All rights reserved. Unless otherwise specified, or required in the context of its implementation, no part of this publication may
be reproduced or utilized otherwise in any form or by any means, electronic or mechanical, including photocopying, or posting on
the internet or an intranet, without prior written permission. Permission can be requested from either ISO at the address below
or ISO’s member body in the country of the requester.
RECIPIENTS OF THIS DRAFT ARE INVITED TO
ISO copyright office
SUBMIT, WITH THEIR COMMENTS, NOTIFICATION
OF ANY RELEVANT PATENT RIGHTS OF WHICH
CP 401 • Ch. de Blandonnet 8
THEY ARE AWARE AND TO PROVIDE SUPPOR TING
CH-1214 Vernier, Geneva
DOCUMENTATION.
Phone: +41 22 749 01 11
IN ADDITION TO THEIR EVALUATION AS
Reference number
Email: copyright@iso.org
BEING ACCEPTABLE FOR INDUSTRIAL, TECHNO
ISO/FDIS 8181:2023(E)
Website: www.iso.org
LOGICAL, COMMERCIAL AND USER PURPOSES,
DRAFT INTERNATIONAL STANDARDS MAY ON
Published in Switzerland
OCCASION HAVE TO BE CONSIDERED IN THE
LIGHT OF THEIR POTENTIAL TO BECOME STAN
DARDS TO WHICH REFERENCE MAY BE MADE IN
ii
© ISO 2023 – All rights reserved
NATIONAL REGULATIONS. © ISO 2023
---------------------- Page: 2 ----------------------
ISO/FDIS 8181:2023(E)
Contents Page
Foreword .iv
Introduction .v
1 Scope . 1
2 Normative references . 1
3 Terms and definitions . 1
4 Terms related to atomic layer deposition . 2
4.1 General terms . 2
4.2 Film growth of atomic layer deposition . 3
4.3 Classification of atomic layer deposition . 4
Annex A (informative) Examples of schematic diagrams for a time separated ALD and a
spatial ALD . 7
Bibliography . 9
Index .
...
FINAL DRAFT INTERNATIONAL STANDARD
ISO/FDIS 8181:2023(E)
ISO TC 107/WG 5
Secretariat: KATS
Date: 2023-03-27
Atomic layer deposition — TerminologyVocabulary
First edition
Date: 2023-05-30
---------------------- Page: 1 ----------------------
ISO/FDIS 8181:2023(E)
© ISO 2022 2023
All rights reserved. Unless otherwise specified, or required in the context of its implementation,
no part of this publication may be reproduced or utilized otherwise in any form or by any means,
electronic or mechanical, including photocopying, or posting on the internet or an intranet,
without prior written permission. Permission can be requested from either ISO at the address
below or ISO’sISO's member body in the country of the requester.
ISO Copyright Office
CP 401 • CH. de Blandonnet 8
CH-1214 Vernier, Geneva
Phone: + 41 22 749 01 11
Email: copyright@iso.org copyright@iso.org
Website: www.iso.org
Published in Switzerland.
ii © ISO 2023 – All rights reserved
---------------------- Page: 2 ----------------------
ISO/FDIS 8181:2023(E)
Contents
Foreword . v
Introduction . vi
1 Scope . 1
2 Normative references . 1
3 Terms and definitions . 1
4 Atomic layer deposition - Terms . 2
4.1 General terms . 2
4.2 Film growth of atomic layer deposition . 3
4.3 Classification of atomic layer deposition . 5
Annex A (informative) Example of Schematic diagram for time separated ALD and spatial
ALD . 8
Bibliography . 9
© ISO 2023 – All rights reserved iii
---------------------- Page: 3 ----------------------
ISO/FDIS 8181:2023(E)
Foreword
ISO (the International Organization for Standardization) is a worldwide federation of national
standards bodies (ISO member bodies). The work of preparing International Standards is normally
carried out through ISO technical committees. Each member body interested in a subject for which a
technical committee has been established has the right to be represented on that committee.
International organizations, governmental and non-governmental, in liaison with ISO, also take part in
the work. ISO collaborates closely with the International Electrotechnical Commission (IEC) on all
matters of electrotechnical standardization.
The procedures used to develop this document and those intended for its further maintenance are
described in the ISO/IEC Directives, Part 1. In particular, the different approval criteria needed for the
different types of ISO documentsdocument should be noted. This document was drafted in accordance
with the editorial rules of the ISO/IEC Directives, Part 2 (see www.iso.org/directives).
Field Code Changed
Attention is drawnISO draws attention to the possibility that some of the elementsimplementation of
this document may beinvolve the subjectuse of (a) patent(s). ISO takes no position concerning the
evidence, validity or applicability of any claimed patent rights in respect thereof. As of the date of
publication of this document, ISO had not received notice of (a) patent(s) which may be required to
implement this document. However, implementers are cautioned that this may not represent the latest
information, which may be obtained from the patent database available at www.iso.org/patents. ISO
shall not be held responsible for identifying any or all such patent rights. Details of any patent rights
identified during the development of the document will be in the Introduction and/or on the ISO list of
patent declarations received (see ).
Any trade name used i
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