SIST EN 16602-70-11:2015
(Main)Space product assurance - Procurement of printed circuit boards
Space product assurance - Procurement of printed circuit boards
This Standard defines the requirements imposed on the customer, the supplier and the qualified PCB manufacturer for PCB procurement. The requirements of clause 7 apply to both qualification and procurement of finished PCBs and do not include the manufacturing tolerances. This Standard is applicable for the following type of boards: - Rigid PCBs (single-sided, double-sided, multilayer, sequential multilayer and PCBs with metal core) - Flexible PCBs (single-sided and double-sided) - Rigid-flex PCBs (multilayer and sequential multilayer) - High frequency PCBs - Special PCBs. PCBs are used for the mounting of components in order to produce PCB assemblies performing complex electrical functions. The PCBs are subjected to thermo-mechanical stresses during their assembly such as mounting of components by soldering, rework and repair under normal terrestrial conditions. In addition the assembled PCB is subjected to the environment imposed by launch and space flights. Therefore the qualification of a PCB supplier to ECSS-Q-ST-70-10 is of extreme importance before the procurement of PCB for space usage. This standard may be tailored for the specific characteristics and constraints of a space project in conformance with ECSS-S-ST-00.
Raumfahrtproduktsicherung - Beschaffung von Leiterplatten
Assurance produit des projets spatiaux - Approvisionnement des circuits imprimés
Zagotavljanje varnih proizvodov v vesoljski tehniki - Nabava plošč tiskanih vezij
Ta standard določa zahteve, ki veljajo za odjemalca, dobavitelja in kvalificiranega proizvajalca plošč tiskanih vezij za nabavo plošč tiskanih vezij. Zahteve iz točke 7 se uporabljajo za kvalifikacijo in nabavo dokončanih plošč tiskanih vezij ter ne zajemajo proizvodnih odstopanj. Ta standard se uporablja za naslednje vrste plošč: – toge plošče tiskanih vezij (enostranske, dvostranske, večslojne, zaporedne večslojne in plošče tiskanih vezij s kovinsko sredico); – gibljive plošče tiskanih vezij (enostranske in dvostranske); – toge-gibljive plošče tiskanih vezij (večslojne in zaporedne večslojne); – visokofrekvenčne plošče tiskanih vezij; – posebne plošče tiskanih vezij. Plošče tiskanih vezij se uporabljajo za nameščanje komponent za izdelavo sestavov plošč tiskanih vezij, ki izvajajo kompleksne električne funkcije. Plošče tiskanih vezij so med sestavljanjem podvržene toplotno-mehanskim obremenitvam, kot je nameščanje komponent s spajkanjem, predelavo in popravilom pod normalnimi zemeljskimi pogoji. Poleg tega pa so sestavljene plošče tiskanih vezij podvržene okolju, ki ga povzročijo izstrelitev in vesoljski poleti. Zato je kvalifikacija dobavitelja plošč tiskanih vezij v skladu s standardom ECSS-Q-ST-70-10 izredno pomembna pred nabavo plošč tiskanih vezij za uporabo v vesolju. Ta standard se lahko prilagodi posameznim lastnostim in omejitvam vesoljskega projekta v skladu s standardom ECSS-S-ST-00.
General Information
Relations
Standards Content (Sample)
SLOVENSKI STANDARD
SIST EN 16602-70-11:2015
01-april-2015
=DJRWDYOMDQMHYDUQLKSURL]YRGRYYYHVROMVNLWHKQLNL1DEDYDSORãþWLVNDQLKYH]LM
Space product assurance - Procurement of printed circuit boards
Raumfahrtproduktsicherung - Beschaffung von Leiterplatten
Assurance produit des projets spatiaux - Approvisionnement des circuits imprimés
Ta slovenski standard je istoveten z: EN 16602-70-11:2015
ICS:
31.180 7LVNDQDYH]MD 7,9 LQWLVNDQH Printed circuits and boards
SORãþH
49.140 Vesoljski sistemi in operacije Space systems and
operations
SIST EN 16602-70-11:2015 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
---------------------- Page: 1 ----------------------
SIST EN 16602-70-11:2015
---------------------- Page: 2 ----------------------
SIST EN 16602-70-11:2015
EUROPEAN STANDARD
EN 16602-70-11
NORME EUROPÉENNE
EUROPÄISCHE NORM
January 2015
ICS 31.180; 49.140
English version
Space product assurance - Procurement of printed circuit
boards
Assurance produit des projets spatiaux - Raumfahrtproduktsicherung - Beschaffung von Leiterplatten
Approvisionnement des circuits imprimés
This European Standard was approved by CEN on 11 October 2014.
CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving
this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning
such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CEN and CENELEC
member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CEN and CENELEC member into its own language and notified to the CEN-CENELEC Management Centre
has the same status as the official versions.
CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium, Bulgaria,
Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece,
Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia,
Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom.
CEN-CENELEC Management Centre:
Avenue Marnix 17, B-1000 Brussels
© 2015 CEN/CENELEC All rights of exploitation in any form and by any means reserved Ref. No. EN 16602-70-11:2015 E
worldwide for CEN national Members and for CENELEC
Members.
---------------------- Page: 3 ----------------------
SIST EN 16602-70-11:2015
EN 16602-70-11:2015 (E)
Table of contents
Foreword . 4
1 Scope . 5
2 Normative references . 6
3 Terms, definitions and abbreviated terms . 7
3.1 Terms from other standards . 7
3.2 Terms specific to the present standard . 7
3.3 Abbreviated terms. 10
4 Principles . 11
5 Requirements . 12
5.1 Procurement of PCBs . 12
5.1.1 General . 12
5.1.2 Design and layout . 12
5.2 Base materials . 13
5.2.1 Base laminate materials . 13
5.2.2 Basic metallic layer . 14
5.2.3 Plated metallic layers and finishes . 14
5.2.4 Special materials . 15
5.3 PCB delivery . 16
5.3.1 Marking . 16
5.3.2 Associated test coupons . 16
5.3.3 Outgoing inspection and PCB manufacturer data package . 17
5.4 Packaging . 17
5.4.1 Handling and storage . 17
5.4.2 Packaging . 17
5.5 Supplier acceptance of PCBs . 18
5.5.1 Supplier acceptance inspection . 18
5.5.2 Electrical test . 18
6 Inspection of PCBs . 19
6.1 General . 19
2
---------------------- Page: 4 ----------------------
SIST EN 16602-70-11:2015
EN 16602-70-11:2015 (E)
6.2 Visual inspection and non-destructive test . 19
6.2.1 Verification of marking . 19
6.2.2 Visual aspects . 19
6.2.3 External dimensions . 22
6.2.4 Warp . 23
6.2.5 Twist . 23
6.3 Microsection inspection criteria . 24
6.3.1 General . 24
6.3.2 Thickness of metal-plating . 25
6.3.3 Aspect of plated-through holes . 27
7 Requirements for PCBs . 30
7.1 Rigid single-sided and double-sided PCBs . 30
7.2 Rigid single-sided and double-sided PCBs for high frequency application . 32
7.3 Flexible PCBs . 35
7.4 Rigid-flex PCBs . 36
7.5 Rigid multilayer PCBs . 37
7.6 Sequential rigid multilayer PCBs . 39
Annex A (normative) PCB Certificate of conformance (CoC) – DRD . 43
Bibliography . 45
Figures
Figure 6-1: Arbitrary defects on conductors . 22
Figure 6-2: Arbitrary defects on spacing between conductors. 22
Figure 6-3: Misalignment of cover layer (for flexible PCBs) . 22
Figure 6-4: Warp . 23
Figure 6-5: Twist. 24
Figure 6-6: Dimensional parameters to be measured . 24
Figure 6-7: Microsection of a PTH . 26
Figure 6-8: Undercut for PCBs with fused SnPb finish . 27
Figure 6-9: Undercut for PCBs with Au/Ni or Au finish . 27
Figure 6-10: Overhang for PCBs with Au/Ni or Au finish . 27
Figure 6-11: Microsection in PTH: Possible defects . 28
Figure 6-12: Microsection of PTH: Possible defects . 29
Figure 6-13: Voids in resin inside buried vias . 29
Figure A-1 : Example of a PCB CoC . 44
3
---------------------- Page: 5 ----------------------
SIST EN 16602-70-11:2015
EN 16602-70-11:2015 (E)
Foreword
This document (EN 16602-70-11:2015) has been prepared by Technical
Committee CEN/CLC/TC 5 “Space”, the secretariat of which is held by DIN.
This standard (EN 16602-70-11:2015) originates from ECSS-Q-ST-70-11C.
This European Standard shall be given the status of a national standard, either
by publication of an identical text or by endorsement, at the latest by July 2015,
and conflicting national standards shall be withdrawn at the latest by July 2015.
Attention is drawn to the possibility that some of the elements of this document
may be the subject of patent rights. CEN [and/or CENELEC] shall not be held
responsible for identifying any or all such patent rights.
This document has been prepared under a mandate given to CEN by the
European Commission and the European Free Trade Association.
This document has been developed to cover specifically space systems and has
therefore precedence over any EN covering the same scope but with a wider
domain of applicability (e.g. : aerospace).
According to the CEN-CENELEC Internal Regulations, the national standards
organizations of the following countries are bound to implement this European
Standard: Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France,
Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania,
Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania,
Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United
Kingdom.
4
---------------------- Page: 6 ----------------------
SIST EN 16602-70-11:2015
EN 16602-70-11:2015 (E)
1
Scope
This Standard defines the requirements imposed on the customer, the supplier
and the qualified PCB manufacturer for PCB procurement.
The requirements of clause 7 apply to both qualification and procurement of
finished PCBs and do not include the manufacturing tolerances.
This Standard is applicable for the following type of boards:
• Rigid PCBs (single-sided, double-sided, multilayer, sequential multilayer
and PCBs with metal core)
• Flexible PCBs (single-sided and double-sided)
• Rigid-flex PCBs (multilayer and sequential multilayer)
• High frequency PCBs
• Special PCBs.
PCBs are used for the mounting of components in order to produce PCB
assemblies performing complex electrical functions. The PCBs are subjected to
thermo-mechanical stresses during their assembly such as mounting of
components by soldering, rework and repair under normal terrestrial
conditions. In addition the assembled PCB is subjected to the environment
imposed by launch and space flights. Therefore the qualification of a PCB
supplier to ECSS-Q-ST-70-10 is of extreme importance before the procurement
of PCB for space usage.
This standard may be tailored for the specific characteristics and constraints of a
space project in conformance with ECSS-S-ST-00.
5
---------------------- Page: 7 ----------------------
SIST EN 16602-70-11:2015
EN 16602-70-11:2015 (E)
2
Normative references
The following normative documents contain provisions which, through
reference in this text, constitute provisions of this ECSS Standard. For dated
references, subsequent amendments to, or revision of any of these publications
do not apply. However, parties to agreements based on this ECSS Standard are
encouraged to investigate the possibility of applying the more recent editions of
the normative documents indicated below. For undated references, the latest
edition of the publication referred to applies.
EN reference Reference in text Title
EN 16601-00-01 ECSS-S-ST-00-01 ECSS system — Glossary of terms
EN 16602-70 ECSS-Q-ST-70 Space product assurance — Material, mechanical
parts and processes
EN 16602-70-02 ECSS-Q-ST-70-02 Space product assurance — Thermal vacuum
outgassing test for the screening of space materials
EN 16602-70-07 ECSS-Q-ST-70-07 Space product assurance — Verification and
approval of automatic machine wave soldering
EN 16602-70-08 ECSS-Q-ST-70-08 Space product assurance — Manual soldering of
high-reliability electrical connections
EN 16602-70-10 ECSS-Q-ST-70-10 Space product assurance — Qualification of printed
circuit boards
EN 16602-70-28 ECSS-Q-ST-70-28 Space product assurance — Repair and modification
of printed circuit board assemblies for space use
EN 16602-70-38 ECSS-Q-ST-70-38 Space product assurance — High-reliability soldering
for surface-mount and mixed technology
printed-circuit boards
IEC 60249 (1993-05) Base materials for printed circuits
IEC 60326-2-am 1 Printed boards. Part 2: Test methods
(1992-06)
IPC-4101 Specification for base materials for rigid and
mulitlayer printed boards
IPC-MF-150F Metal foil for printed wiring applications
IPC-CF-152B Composite metallic material specification for printed
wiring board
6
---------------------- Page: 8 ----------------------
SIST EN 16602-70-11:2015
EN 16602-70-11:2015 (E)
3
Terms, definitions and abbreviated terms
3.1 Terms from other standards
For the purpose of this Standard, the terms and definitions from ECSS-S-ST-00-01
apply.
3.2 Terms specific to the present standard
3.2.1 associated test coupon
small piece of PCB designated to have a limited specific set of tests performed
NOTE The associated test coupon is manufactured as
part of a PCB and at the final manufacturing
stage it is separated from it. The associated test
coupon is thus associated with the PCB, with
which it was simultaneously manufactured.
3.2.2 blister
delamination in the form of a localized swelling and separation between any of
the layers of a lamination base material, or between base material and
conductive foil or protective coating
[IEC 60194 (1999-04)]
3.2.3 cover layer (flexible circuit)
layer of insulating material that is applied covering totally or partially over a
conductive pattern on the outer surfaces of a PCB
[IEC 60194 (1999-04)]
3.2.4 crazing
internal condition that occurs in reinforced base material whereby glass fibres
are separated from the resin at the weave intersections
NOTE 1 This condition manifests itself in the form of
connected white spots or crosses that are below
the surface of the base material. It is usually
related to mechanically induced stress.
NOTE 2 See also “measling”.
[IEC 60194 (1999-04)]
7
---------------------- Page: 9 ----------------------
SIST EN 16602-70-11:2015
EN 16602-70-11:2015 (E)
3.2.5 delamination
separation between plies within a base material, between base material and a
conductive foil, or any other planar separation with a PCB
NOTE See also “blister”.
[IEC 60194 (1999-04)]
3.2.6 dewetting
condition that results when molten solder coats a surface and then recedes to
leave irregularly-shaped mounds of solder that are separated by areas that are
covered with a thin film of solder and with the basis metal not exposed
[IEC 60194 (1999-04)]
3.2.7 flexible PCB
PCB either single, double sided or multilayer consisting of a printed circuit or
printed wiring using flexible base materials only
[IEC 60194 (1999-04)]
3.2.8 haloing
mechanically-induced fracturing or delamination, on or below the surface of a
base material, that is usually exhibited by a light area around holes or other
machined features
[IEC 60194 (1999-04)]
3.2.9 high frequency PCB
PCB used for high frequency applications, that has specific requirements to the
dielectric properties of the base laminates as well as special dimensional
requirements to the lay-out for electrical purposes
3.2.10 inclusions
foreign particles, metallic or non-metallic, that may be entrapped in an
insulating material, conductive layer, plating, base material or solder
connection
[IEC 60194 (1999-04)]
3.2.11 key personnel
personnel with specialist knowledge responsible for defined production or
product assurance areas
3.2.12 measling
condition that occurs in laminated base material in which internal glass fibres
are separated from the resin at the weave intersection
NOTE 1 This condition manifests itself in the form of
discrete white spots or “crosses” that are below
the surface of the base material. It is usually
related to thermally-induced stress.
NOTE 2 See also “crazing”.
[IEC 60194 (1999-04)]
8
---------------------- Page: 10 ----------------------
SIST EN 16602-70-11:2015
EN 16602-70-11:2015 (E)
3.2.13 metal core PCB
PCB using a metal core base material
[IEC 60194 (1999-04)]
3.2.14 multilayer PCB
PCB that consist of rigid or flexible insulation materials and three or more
alternate printed wiring and/or printed circuit layers that have been bonded
together and electrically interconnected
[IEC 60194 (1999-04)]
3.2.15 prepreg
sheet of material that has been impregnated with a resin and cured to an
intermediate stage
NOTE B-staged resin.
[IEC 60194 (1999-04)]
3.2.16 printed circuit board (PCB)
printed board that provides both point-to-point connections and printed
components in a predetermined arrangement on a common base
NOTE This includes single-sided, double sided and
multilayer PCBs with rigid, flexible, and
rigid-flex base materials.
[IEC 60194 (1999-04)]
3.2.17 rigid double-sided PCB
double-sided PCB, either printed circuit or printed wiring, using rigid base
materials only
[IEC 60194 (1999-04)]
3.2.18 rigid-flex PCB
PCB with both rigid and flexible base materials
[IEC 60194 (1999-04)]
3.2.19 rigid-flex double-sided PCB
double-sided PCB, either printed circuit or printed wiring, using combinations
of rigid and flexible base materials
[IEC 60194 (1999-04)]
3.2.20 rigid-flex multilayer PCB
multilayer PCB, either printed circuit or printed wiring, using combinations of
rigid multilayer and flexible single and double-sided base materials
3.2.21 rigid PCB
PCB using rigid base materials only
[IEC 60194 (1999-04)]
9
---------------------- Page: 11 ----------------------
SIST EN 16602-70-11:2015
EN 16602-70-11:2015 (E)
3.2.22 rigid single-sided PCB
single-sided PCB, either printed circuit or printed wiring, using rigid base
materials only
[IEC 60194 (1999-04)]
3.2.23 rigid multilayer PCB
multilayer PCB, either printed circuit or printed wiring, using rigid base
materials only
[IEC 60194 (1999-04)]
3.2.24 scratch
narrow furrow or grove in a surface
NOTE It is usually shallow and caused by the marking
or rasping of the surface with a pointed or
sharp object.
[IEC 60194 (1999-04)]
3.2.25 sequentially laminated multilayer PCB
multilayer PCB that is formed by laminating together through hole plated
double-sided or multilayer PCBs
NOTE Thus, some of its conductive layers are
interconnected with blind or buried vias.
[IEC 60194 (1999-04)]
3.2.26 test pattern
part of the PCB that refers to the copper pattern on and within the PCB
substrate for a specific test
3.3 Abbreviated terms
For the purpose of this Standard, the abbreviated terms from ECSS-S-ST-00-01
and the following apply:
Abbreviation Meaning
certificate of conformance
CoC
declared material list
DML
not applicable
n.a.
printed circuit board
PCB
plated-through hole
PTH
polytetrafluoroethylene
PTFE
root-mean-square
r.m.s.
to be defined
TBD
10
---------------------- Page: 12 ----------------------
SIST EN 16602-70-11:2015
EN 16602-70-11:2015 (E)
4
Principles
For the need of this Standard the role “PCB manufacturer” as lowest level
supplier has been explicitly introduced to allow proper allocation of
requirements.
11
---------------------- Page: 13 ----------------------
SIST EN 16602-70-11:2015
EN 16602-70-11:2015 (E)
5
Requirements
5.1 Procurement of PCBs
5.1.1 General
a. The supplier shall procure PCBs from a PCB manufacturer with a
qualification approval for an identified technology in conformance with
ECSS-Q-ST-70-10.
NOTE The supplier can procure space quality PCBs
from a PCB manufacturer with qualification
approval according to ECSS-ST-Q-70-10 during
the valid period of the approval.
b. The supplier shall perform the incoming inspection and control of the
delivered PCBs.
5.1.2 Design and layout
a. The supplier and PCB manufacturer shall agree on the following issues:
1. The transfer of the plotting, drilling and routing data from the
supplier to the PCB manufacturer;
2. The numbering system for the different issues;
NOTE This is done to avoid mistakes.
3. Construction data, such as hole sizes, contours and thickness
dimensions, as well as specific requirements regarding electrical
requirements and dielectric properties.
NOTE The agreement between the supplier and the
PCB manufacturer can be described in the
specific procurement document.
b. The supplier shall provide the PCB manufacturer with the net list
documentation with a suitable format.
NOTE The net list is used to verify that the supplier’s
data files are correctly transferred to the PCB
manufacturer and to set up the electrical
functional testing of the finished PCBs.
12
---------------------- Page: 14 ----------------------
SIST EN 16602-70-11:2015
EN 16602-70-11:2015 (E)
c. The supplier shall include the manufacturing tolerances given by the
PCB manufacturer when designing the PCB layout.
NOTE The tolerances and requirements for the various
finished PCBs are specified in clause 7.
d. Multilayer PCBs shall have a layout and be built as symmetrical as
possible to avoid excessive wrapage and twist.
e. The supplier shall use a minimum of two prepregs, between layers.
f. The number of electrical layers shall be an even number.
g. For rigid-flex PCBs the customer shall order the PCB with its frame
attached.
NOTE 1 This is done in order not to stress the flexible
parts during handling and mounting of
components.
NOTE 2 The frame can be detached after the assembly
of the PCBs.
h. The PCB may be procured without the frame providing that stressing of
the flexible connection is avoided.
i. The PCB manufacturer shall define during the design together with the
supplier the amount of copper and its distribution.
NOTE An even distribution is preferred.
j. For surface mount technology and circuits to be wave soldered, only
pads on the external layer should be used.
NOTE This is done because high density circuitry on
external layers is not reliable.
k. The supplier shall use teardrop design for fine lines and small annular
rings.
l. The PCB manufacturer shall not use hot air solder levelling (HAL or
HASL) and infrared reflow.
NOTE These techniques can be destructive because of
overheating of the PCB. Also it does not appear
possible to fulfil the requirement for the tin-
lead surface finish with regard to dimensions.
m. Before any installation of components or soldering or desoldering
operations a bake-out shall be performed as specified in ECSS-Q-ST-70-08.
5.2 Base materials
5.2.1 Base laminate materials
a. The PCB manufacturer shall use materials which conform to ECSS-Q-ST-
70, IEC 60249 (1993-05) and IPC-4101 Standards.
NOTE All base materials are mentioned in clause 7.
13
---------------------- Page: 15 ----------------------
SIST EN 16602-70-11:2015
EN 16602-70-11:2015 (E)
5.2.2 Basic metallic layer
a. The supplier shall design the external layer using basic copper thickness
of 70 µm, 35 µm, 17,5 µm and 9 µm.
b. The supplier shall design the internal layers using basic copper thickness
of 70 µm, 35 µm and 17,5 µm.
c. For Cu-foil the PCB manufacturer shall use copper quality “HTE” (IPC-
MF-150F).
5.2.3 Plated metallic layers and finishes
5.2.3.1 Copper (electrolytic)
a. The PCB shall be manufactured with copper of purity of at least 99,5 %.
b. The copper ductility shall be at least 12 %.
NOTE A ductility of 18 % is recommended.
c. The PCB manufacturer shall plate the plated-through holes with the
following copper thickness:
1. For soldering holes at least 25 µm
2. Via holes at least 20 µm.
d. The total basic and plated copper on surface layers for soldering pads
shall have a thickness of at least 40 µm.
e. The total basic and plated copper for internal layers shall have a
thickness of at least 17,5 µm.
5.2.3.2 Electroplated tin-lead thickness over copper
a. The fused tin-lead shall have a minimum thickness of 8 µm in the highest
part of the pad and tracks.
NOTE Before reflow the thickness of (15 ± 7) µm is
recommended.
b. The fused tin-lead shall have a minimum thickness of 2 µm on the corner
of the PTH.
NOTE A fused tin-lead thickness of 1 µm on the corner
of the PTH can be tolerated provided that the
solderability is acceptable.
c. The fused tin-lead shall have a thickness of 8 µm on half of the height of
the hole wall.
d. The fused tin-lead shall have a thickness of 2 µm on the remaining two
quarters of the hole wall.
e. The fused tin-lead should reflow over the edges of the copper pads and
tracks.
14
---------------------- Page: 16 ----------------------
SIST EN 16602-70-11:2015
EN 16602-70-11:2015 (E)
5.2.3.3 Nickel electrolytic plating (optional) over copper
plating
a. The electrolytic nickel plating over copper shall have a thickness from
2 µm to 10 µm.
5.2.3.4 Gold (electrolytic)
a. The PCB manufacturer shall use gold for high frequency circuits or other
assembly methods when specified by the supplier.
b. When gold finish is needed the PCB shall be manufactured with gold of a
purity of at least 99,8 %.
c. When gold finish is needed the PCB shall be manufactured with gold that
does not contain more than 0,2 % of silver.
NOTE Alternative types of gold (e.g. for high
frequency circuits) can be used, provided that
the gold is proven to be satisfactory during
execution of the qualification programme.
d. The thickness of gold over bare copper shall be between 3 µm and 7 µm.
e. The thickness of gold over nickel plating shall be between 1 µm and
7 µm.
f. If tin-lead plating is applied together with gold plating on the same PCB,
a tin-lead overlap on gold of minimum 200 µm shall be used on the
surface of the PCB.
NOTE This is done in order to ensure protection of the
plated copper layer.
g. The tin-lead overlap area shall be a minimum of 200 µm distance from the
termination pad designated for soldering as given in ECSS-Q-ST-70-08
clause 8.4.
5.2.4 Special materials
5.2.4.1 Metal core
a. The PCB manufacturer shall use copper - invar – copper or copper -
molybdenum – copper in conformance with IPC-CF-152B.
5.2.4.2 Heat-sinks: material and surface treatment
a. For copper, aluminium and brass heat-sinks, the PCB manufacturer shall
use the material as specified by the supplier’s DML.
15
---------------------- Page: 17 ----------------------
SIST EN 16602-70-11:2015
EN 16602-70-11:2015 (E)
5.3 PCB delivery
5.3.1 Marking
a. The PCB manufacturer shall mark the PCBs as follows:
1. PCB manufacturer’s logo
2. PCB reference code and serial number
NOTE In the event that there is not sufficient space on
the PCBs for the marking, the PCB
manufacturer can ensure traceability by other
means or request for waiver.
3. Number of layers.
b. Marking inks shall be as follows:
1. Permanent polymer inks
2. Specified in the procurement documentation
3. Capable of withstanding fluxes, cleaning solvents, soldering,
cleaning and coating processes encountered in later manufacturing
processes according to ECSS-Q-ST-70-07, ECSS-Q-ST-70-08, ECSS-
Q-ST-70-28, ECSS-Q-ST-70-38
4. Conform to the outgassing requirements of ECSS-Q-ST-70-02.
c. If a conductive marking is used, the marking shall be treated as
...
Questions, Comments and Discussion
Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.