SIST EN 16602-70-28:2015
(Main)Space product assurance - Repair and modification of printed circuit board assemblies for space use
Space product assurance - Repair and modification of printed circuit board assemblies for space use
The requirements and procedures for repair and modification detailed in this Standard are designed to maintain the rigorous standards set
by the customer for the manufacture and assembly of space-quality printed circuit boards.
This Standard is confined to the repair and modification of singlesided, doublesided and multilayer printed circuit board assemblies.
This Standard does not address the potential need for rework resulting from a repair or modification and unassembled (bare) printed
circuits boards.
This standard may be tailored for the specific characteristics and constraints of a space project, in conformance with ECSS-S-ST-00.
Raumfahrtproduktsicherung - Reparatur und Modifikation von Leiterplatten-Baugruppen für den Einsatz im Weltraum
Assurance produit des projets spatiaux - Réparation et modification des ensembles de circuits imprimés pour utilisation spatiale
Zagotavljanje varnih proizvodov v vesoljski tehniki - Popravilo in spreminjanje plošč tiskanih vezij za vesoljsko uporabo
Zahteve in postopki za popravilo in spreminjanje iz tega standarda so namenjeni ohranjanju strogih standardov, ki jih določa odjemalec za proizvodnjo in sestavo plošč tiskanih vezij za vesoljsko uporabo. Ta standard je omejen na popravilo in spreminjanje enostranskih, dvostranskih in večslojnih plošč tiskanih vezij. Ta standard ne obravnava potencialne potrebe po predelavi, ki izhaja iz popravila ali spreminjanja, ter nesestavljenih (praznih) plošč tiskanih vezij. Ta standard se lahko prilagodi posameznim lastnostim in omejitvam vesoljskega projekta v skladu s standardom ECSS-S-ST-00.
General Information
Standards Content (Sample)
SLOVENSKI STANDARD
SIST EN 16602-70-28:2015
01-januar-2015
=DJRWDYOMDQMHYDUQLKSURL]YRGRYYYHVROMVNLWHKQLNL3RSUDYLORLQVSUHPLQMDQMH
SORãþWLVNDQLKYH]LM]DYHVROMVNRXSRUDER
Space product assurance - Repair and modification of printed circuit board assemblies
for space use
Raumfahrtproduktsicherung - Reparatur und Modifikation von Leiterplatten-Baugruppen
für den Einsatz im Weltraum
Assurance produit des projets spatiaux - Réparation et modification des ensembles de
circuits imprimés pour utilisation spatiale
Ta slovenski standard je istoveten z: EN 16602-70-28:2014
ICS:
31.180 7LVNDQDYH]MD 7,9 LQWLVNDQH Printed circuits and boards
SORãþH
49.140 Vesoljski sistemi in operacije Space systems and
operations
SIST EN 16602-70-28:2015 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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SIST EN 16602-70-28:2015
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SIST EN 16602-70-28:2015
EUROPEAN STANDARD
EN 16602-70-28
NORME EUROPÉENNE
EUROPÄISCHE NORM
October 2014
ICS 49.140
English version
Space product assurance - Repair and modification of printed
circuit board assemblies for space use
Assurance produit des projets spatiaux - Réparation et Raumfahrtproduktsicherung - Reparatur und Modifikation
modification des ensembles de circuits imprimés pour von Leiterplatten-Baugruppen für den Einsatz im Weltraum
utilisation spatiale
This European Standard was approved by CEN on 11 April 2014.
CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving
this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning
such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CEN and CENELEC
member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CEN and CENELEC member into its own language and notified to the CEN-CENELEC Management Centre
has the same status as the official versions.
CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium, Bulgaria,
Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece,
Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia,
Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom.
CEN-CENELEC Management Centre:
Avenue Marnix 17, B-1000 Brussels
© 2014 CEN/CENELEC All rights of exploitation in any form and by any means reserved Ref. No. EN 16602-70-28:2014 E
worldwide for CEN national Members and for CENELEC
Members.
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SIST EN 16602-70-28:2015
EN 16602-70-28:2014 (E)
Table of contents
Foreword . 9
1 Scope . 10
2 Normative references . 11
3 Terms, definitions and abbreviated terms . 12
3.1 Terms from other standards . 12
3.2 Terms specific to the present standard . 12
3.3 Abbreviated terms. 13
4 Requirements . 14
4.1 Basic requirements . 14
4.1.1 Hazard, health and safety precautions . 14
4.1.2 Materials . 14
4.1.3 Facilities . 14
4.1.4 General . 14
4.2 Repairs . 15
4.2.1 Repair criteria . 15
4.2.2 Number of repairs . 15
4.3 Modifications . 15
4.3.1 Modification criteria . 15
4.3.2 Number of modifications. 16
4.4 Rework . 16
4.4.1 Rework criteria . 16
4.4.2 Number of reworks . 16
4.5 Other requirements . 16
4.6 Removal of conformal coating . 17
4.6.1 Requirements . 17
4.6.2 Procedure . 17
4.6.3 Acceptance criteria. 17
4.7 Solder joint removal and unclinching . 18
4.7.1 Procedure . 18
2
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SIST EN 16602-70-28:2015
EN 16602-70-28:2014 (E)
4.7.2 Acceptance criteria. 18
4.8 Repair of damaged gold-plated areas . 18
4.8.1 Requirements . 18
4.8.2 Procedure . 18
4.8.3 Acceptance criteria. 19
4.9 Repair of damaged conductor tracks . 19
4.9.1 Requirements . 19
4.9.2 Procedure . 19
4.9.3 Acceptance criteria. 20
4.10 Repair of lifted conductors . 20
4.10.1 Requirements . 20
4.10.2 Procedure . 20
4.10.3 Acceptance criteria. 20
4.11 Repair of lifted terminal areas (pads) . 21
4.11.1 Requirements . 21
4.11.2 Procedure . 21
4.11.3 Acceptance criteria. 21
4.12 Terminal post replacement . 21
4.12.1 Requirements . 21
4.12.2 Procedure . 21
4.12.3 Acceptance criteria. 21
4.13 Wire-to-wire joints . 22
4.13.1 Requirements . 22
4.13.2 Procedure . 22
4.13.3 Acceptance criteria. 22
4.14 Addition of components . 22
4.14.1 Requirements . 22
4.14.2 Procedure . 23
4.14.3 Acceptance criteria. 23
4.15 Removal and replacement of axial and multi-lead components. 24
4.15.1 Requirements . 24
4.15.2 Procedure . 24
4.15.3 Acceptance criteria. 24
4.16 Removal and replacement of flat-pack components . 24
4.16.1 Requirements . 24
4.16.2 Procedure . 24
4.16.3 Acceptance criteria. 25
3
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SIST EN 16602-70-28:2015
EN 16602-70-28:2014 (E)
4.17 Modification of component connections . 25
4.17.1 Requirements . 25
4.17.2 Procedure . 25
4.17.3 Acceptance criteria. 26
4.18 Cutting of internal track of a multi-layer printed circuit board . 26
4.18.1 Procedure . 26
4.18.2 Acceptance criteria. 26
4.19 Quality assurance . 26
4.19.1 General . 26
4.19.2 Data . 26
4.19.3 Nonconformance . 27
4.19.4 Calibration . 27
4.19.5 Traceability . 27
4.19.6 Operator and inspector training and certification . 27
Annex A (informative) Removal of conformal coating . 28
A.1 Introduction . 28
A.2 Tools and materials . 28
A.3 Methods for the removal of conformal coating . 28
A.3.1 Method for the removal of polyurethane and silicone-type coating . 28
A.3.2 Method for the removal of epoxy-type coating . 29
Annex B (informative) Solder joint removal and unclinching . 31
B.1 Introduction . 31
B.2 Tools and materials . 31
B.3 Methods for solder joint removal and unclinching . 31
B.3.1 Method for solder extraction with continuous vacuum . 31
B.3.2 Method for solder extraction using sucker . 32
B.3.3 Method for hot jet extraction . 33
B.3.4 Method for the use of wicking braid . 33
B.3.5 Method for unclinching of leads . 34
Annex C (informative) Repair of damaged gold-plated areas . 35
C.1 Introduction . 35
C.2 Tools and materials . 35
C.3 Methods for the repair of damaged gold-plated areas . 35
C.3.1 Method for the removal of solder splatter on gold plating . 35
Annex D (informative) Repair of damaged conductor tracks . 36
D.1 Introduction . 36
4
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EN 16602-70-28:2014 (E)
D.2 Tools and materials . 36
D.3 Method for the repair of damaged conductor tracks . 36
Annex E (informative) Repair of lifted conductors . 37
E.1 Introduction . 37
E.2 Tools and materials . 37
E.3 Methods for repair of lifted conductors . 38
E.3.1 Method for the use of epoxy under conductor . 38
E.3.2 Method for the use of epoxy over conductor . 38
Annex F (informative) Repair of lifted terminal areas (pads) . 39
F.1 Introduction . 39
F.2 Tools and materials . 40
F.3 Method for the repair of lifted terminal areas (pads) . 40
Annex G (informative) Terminal post replacement . 41
G.1 Introduction . 41
G.2 Tools and materials . 41
G.3 Method for the replacement of terminal post . 41
Annex H (informative) Wire-to-wire joints . 43
H.1 Introduction . 43
H.2 Tools and materials . 43
H.3 Method for wire-to-wire joining . 43
Annex I (informative) Addition of components . 45
I.1 Introduction . 45
I.2 Tools and materials . 45
I.3 Methods for addition of components . 46
I.3.1 Method for additional components mounted on reverse
(non-component) side of board . 46
I.3.2 Method for additional components mounted on component side of
board. 47
I.3.3 Method for additional components mounted on terminal posts,
including “piggyback“ mounting . 48
I.3.4 Method for additional components mounted (on reverse side or on
component side of board) using staking compound. 49
I.3.5 Method for additional components mounted (on reverse side or on
component side of board) to leads of adjacent components . 50
I.3.6 Method for the addition of a wire link onto soldered chips on a single
side piece of PCB with appropriate pads . 55
I.3.7 Method for the addition of a wire link onto metallized cap of chips
directly glued on PCB . 56
5
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SIST EN 16602-70-28:2015
EN 16602-70-28:2014 (E)
Annex J (informative) Removal and replacement of axial and multi-lead
components . 57
J.1 Introduction . 57
J.2 Tools and materials . 57
J.3 Methods for removal and replacement of axial and multi-lead components . 57
J.3.1 Method for the removal of components with axial leads (destructive
removal) . 57
J.3.2 Method for the removal of multi-lead components (destructive
removal) . 58
Annex K (informative) Removal and replacement of flat-pack components . 60
K.1 Introduction . 60
K.2 Tools and materials . 60
K.3 Method for the removal and replacement of flat-pack components . 60
Annex L (informative) Modification of component connections . 62
L.1 Introduction . 62
L.2 Tools and materials . 62
L.3 Methods for modification of component connections . 62
L.3.1 Method for the soldering of a wrap-around connection to an extended
component lead . 62
L.3.2 Method for the soldering of component lead to a stud lead mounted
into an existing hole . 63
L.3.3 Method for mounting a dual-in-line (DIL) package with or without a
wire link soldered onto a cropped lead . 64
L.3.4 Method for mounting a connector with or without a wire link soldered
onto a cropped lead . 66
L.3.5 Method for the addition of a wire link into a plated-through hole
occupied by a flat-section lead . 67
L.3.6 Method for the addition of a wire link on top of a flat-pack lead . 69
L.3.7 Method for the isolation of a component lead . 69
L.3.8 Method for the addition of a wire link onto terminal pad of soldered
chips . 71
Annex M (informative) Cutting of internal track of a multi-layer printed
circuit board . 73
M.1 Introduction . 73
M.2 Tools and materials . 73
M.3 Method for cutting the internal track of a multi-layer printed circuit board . 73
Bibliography . 75
6
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SIST EN 16602-70-28:2015
EN 16602-70-28:2014 (E)
Figures
Figure A-1 : Removal of coating by thermal parting device . 30
Figure B-1 : Continuous vacuum solder extraction on stud lead . 32
Figure B-2 : Pulse-type solder sucker in use . 32
Figure B-3 : Lifting individual leads with hot jet . 33
Figure B-4 : Cross-sectional view of wicking method . 34
Figure B-5 : Hot unclinching with thermal parting device . 34
Figure E-1 : Lifted conductors. 37
Figure E-2 : Repair using epoxy under conductor . 38
Figure E-3 : Repair using epoxy over conductor . 38
Figure F-1 : Lifted terminal area . 39
Figure F-2 : Terminal areas without track . 39
Figure F-3 : Terminal areas with track attached . 40
Figure G-1 : Terminal post replacement . 42
Figure H-1 : Use of approved type support clamp/heat sink . 44
Figure I-1 : Additional components mounted on reverse (non-component) side of board . 47
Figure I-2 : Additional components mounted on component side of board . 48
Figure I-3 :“Piggyback” mounting of one component on top of another . 49
Figure I-4 : Mounting and wiring of additional axially-leaded components mounted (on
reverse side or on component side of board) using staking compound . 51
Figure I-5 : Upside down mounting and wiring of additional side-brazed DIL component
(on reverse side or on component side of board) using staking compound . 52
Figure I-6 : Mounting of additional non-axially leaded components, e.g. capacitors, with
wire connecting top or bottom sides of the circuit board using staking
compound (on reverse side or on component side of board) . 52
Figure I-7 : Mounting of additional component (on component side of board) with wire
connections on reverse side of board using staking compound . 53
Figure I-8 : Mounting of additional component (on reverse side of board) across
extended leads of adjacent components . 53
Figure I-9 : Mounting of additional component by linking to a “pigtailed” lead of an
adjacent component . 54
Figure I-10 : Mounting of additional component by linking to lead of an adjacent
transistor (or other large component) . 55
Figure I-11 : Addition of a wire link onto metallized cap of chips directly glued on PCB . 56
Figure J-1 : Removal of multi-lead components, clipping of component leads . 58
Figure J-2 : Removal of multi-lead components, removal of remaining component leads . 59
Figure K-1 : Removal of flat-pack components . 61
Figure L-1 : Soldering of a wrap-around connection to an extended component lead . 63
Figure L-2 : Soldering of component lead to a stud lead mounted into an existing hole . 64
7
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SIST EN 16602-70-28:2015
EN 16602-70-28:2014 (E)
Figure L-3 : Mounting a dual-in-line package with or without a wire link soldered onto a
cropped lead (cropped lead without connection and cropped lead with
connection led through hole and onto board) . 65
Figure L-4 : Mounting a dual-in-line package with or without a wire link soldered onto a
cropped lead (wire link passing away from board) . 66
Figure L-5 : Mounting a connector with a wire link soldered onto a cropped lead . 67
Figure L-6 : Addition of a wire link into a plated through hole occupied by a flat-section
lead (wire link entering from the reverse side of the board) . 68
Figure L-7 : Addition of a wire link into a plated through hole occupied by a flat-section
lead (wire link entering from the component side of the board) . 68
Figure L-8 : Addition of a wire link on top of a flat-pack lead . 69
Figure L-9 : Isolation of a component lead . 71
Figure L-10 : Addition of a wire link onto terminal pad of soldered chips . 72
Figure M-1 : Cutting of internal track of a multi-layer circuit board . 74
Tables
Table 4-1: Wire diameters for given conductor widths . 19
8
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SIST EN 16602-70-28:2015
EN 16602-70-28:2014 (E)
Foreword
This document (EN 16602-70-28:2014) has been prepared by Technical
Committee CEN/CLC/TC 5 “Space”, the secretariat of which is held by DIN.
This standard (EN 16602-70-28:2014) originates from ECSS-Q-ST-70-28C.
This European Standard shall be given the status of a national standard, either
by publication of an identical text or by endorsement, at the latest by April 2015,
and conflicting national standards shall be withdrawn at the latest by April
2015.
Attention is drawn to the possibility that some of the elements of this document
may be the subject of patent rights. CEN [and/or CENELEC] shall not be held
responsible for identifying any or all such patent rights.
This document has been prepared under a mandate given to CEN by the
European Commission and the European Free Trade Association.
This document has been developed to cover specifically space systems and has
therefore precedence over any EN covering the same scope but with a wider
domain of applicability (e.g. : aerospace).
According to the CEN-CENELEC
...
SLOVENSKI STANDARD
kSIST FprEN 16602-70-28:2014
01-februar-2014
=DJRWDYOMDQMHYDUQLKSURL]YRGRYYYHVROMVNLWHKQLNL3RSUDYLORLQVSUHPLQMDQMH
SORãþWLVNDQLKYH]LM]DYHVROMVNRXSRUDER
Space product assurance - Repair and modification of printed circuit board assemblies
for space use
Raumfahrtproduktsicherung - Reparatur und Modifikation von Leiterplatten-Baugruppen
für den Einsatz im Weltraum
Assurance produit des projets spatiaux - Réparation et modification des ensembles de
circuits imprimés pour utilisation spatiale
Ta slovenski standard je istoveten z: FprEN 16602-70-28
ICS:
31.180 7LVNDQDYH]MD 7,9 LQWLVNDQH Printed circuits and boards
SORãþH
49.140 Vesoljski sistemi in operacije Space systems and
operations
kSIST FprEN 16602-70-28:2014 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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kSIST FprEN 16602-70-28:2014
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kSIST FprEN 16602-70-28:2014
EUROPEAN STANDARD
FINAL DRAFT
FprEN 16602-70-28
NORME EUROPÉENNE
EUROPÄISCHE NORM
October 2013
ICS 49.140
English version
Space product assurance - Repair and modification of printed
circuit board assemblies for space use
Assurance produit des projets spatiaux - Réparation et Raumfahrtproduktsicherung - Reparatur und Modifikation
modification des ensembles de circuits imprimés pour von Leiterplatten-Baugruppen für den Einsatz im Weltraum
utilisation spatiale
This draft European Standard is submitted to CEN members for unique acceptance procedure. It has been drawn up by the Technical
Committee CEN/CLC/TC 5.
If this draft becomes a European Standard, CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal
Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
This draft European Standard was established by CEN and CENELEC in three official versions (English, French, German). A version in any
other language made by translation under the responsibility of a CEN and CENELEC member into its own language and notified to the
CEN-CENELEC Management Centre has the same status as the official versions.
CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium, Bulgaria,
Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece,
Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia,
Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom.
Recipients of this draft are invited to submit, with their comments, notification of any relevant patent rights of which they are aware and to
provide supporting documentation.
Warning : This document is not a European Standard. It is distributed for review and comments. It is subject to change without notice and
shall not be referred to as a European Standard.
CEN-CENELEC Management Centre:
Avenue Marnix 17, B-1000 Brussels
© 2013 CEN/CENELEC All rights of exploitation in any form and by any means reserved Ref. No. FprEN 16602-70-28:2013 E
worldwide for CEN national Members and for CENELEC
Members.
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kSIST FprEN 16602-70-28:2014
FprEN 16602-70-28:2013 (E)
Table of contents
Foreword . 9
1 Scope . 10
2 Normative references . 11
3 Terms, definitions and abbreviated terms . 12
3.1 Terms from other standards . 12
3.2 Terms specific to the present standard . 12
3.3 Abbreviated terms. 13
4 Requirements . 14
4.1 Basic requirements . 14
4.1.1 Hazard, health and safety precautions . 14
4.1.2 Materials . 14
4.1.3 Facilities . 14
4.1.4 General . 14
4.2 Repairs . 15
4.2.1 Repair criteria . 15
4.2.2 Number of repairs . 15
4.3 Modifications . 15
4.3.1 Modification criteria . 15
4.3.2 Number of modifications. 16
4.4 Rework . 16
4.4.1 Rework criteria . 16
4.4.2 Number of reworks . 16
4.5 Other requirements . 16
4.6 Removal of conformal coating . 17
4.6.1 Requirements . 17
4.6.2 Procedure . 17
4.6.3 Acceptance criteria. 17
4.7 Solder joint removal and unclinching . 18
4.7.1 Procedure . 18
2
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kSIST FprEN 16602-70-28:2014
FprEN 16602-70-28:2013 (E)
4.7.2 Acceptance criteria. 18
4.8 Repair of damaged gold-plated areas . 18
4.8.1 Requirements . 18
4.8.2 Procedure . 18
4.8.3 Acceptance criteria. 19
4.9 Repair of damaged conductor tracks . 19
4.9.1 Requirements . 19
4.9.2 Procedure . 19
4.9.3 Acceptance criteria. 20
4.10 Repair of lifted conductors . 20
4.10.1 Requirements . 20
4.10.2 Procedure . 20
4.10.3 Acceptance criteria. 20
4.11 Repair of lifted terminal areas (pads) . 21
4.11.1 Requirements . 21
4.11.2 Procedure . 21
4.11.3 Acceptance criteria. 21
4.12 Terminal post replacement . 21
4.12.1 Requirements . 21
4.12.2 Procedure . 21
4.12.3 Acceptance criteria. 21
4.13 Wire-to-wire joints . 22
4.13.1 Requirements . 22
4.13.2 Procedure . 22
4.13.3 Acceptance criteria. 22
4.14 Addition of components . 22
4.14.1 Requirements . 22
4.14.2 Procedure . 23
4.14.3 Acceptance criteria. 23
4.15 Removal and replacement of axial and multi-lead components. 24
4.15.1 Requirements . 24
4.15.2 Procedure . 24
4.15.3 Acceptance criteria. 24
4.16 Removal and replacement of flat-pack components . 24
4.16.1 Requirements . 24
4.16.2 Procedure . 24
4.16.3 Acceptance criteria. 25
3
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kSIST FprEN 16602-70-28:2014
FprEN 16602-70-28:2013 (E)
4.17 Modification of component connections . 25
4.17.1 Requirements . 25
4.17.2 Procedure . 25
4.17.3 Acceptance criteria. 26
4.18 Cutting of internal track of a multi-layer printed circuit board . 26
4.18.1 Procedure . 26
4.18.2 Acceptance criteria. 26
4.19 Quality assurance . 26
4.19.1 General . 26
4.19.2 Data . 26
4.19.3 Nonconformance . 27
4.19.4 Calibration . 27
4.19.5 Traceability . 27
4.19.6 Operator and inspector training and certification . 27
Annex A (informative) Removal of conformal coating . 28
A.1 Introduction . 28
A.2 Tools and materials . 28
A.3 Methods for the removal of conformal coating . 28
A.3.1 Method for the removal of polyurethane and silicone-type coating . 28
A.3.2 Method for the removal of epoxy-type coating . 29
Annex B (informative) Solder joint removal and unclinching . 31
B.1 Introduction . 31
B.2 Tools and materials . 31
B.3 Methods for solder joint removal and unclinching . 31
B.3.1 Method for solder extraction with continuous vacuum . 31
B.3.2 Method for solder extraction using sucker . 32
B.3.3 Method for hot jet extraction . 33
B.3.4 Method for the use of wicking braid . 33
B.3.5 Method for unclinching of leads . 34
Annex C (informative) Repair of damaged gold-plated areas . 35
C.1 Introduction . 35
C.2 Tools and materials . 35
C.3 Methods for the repair of damaged gold-plated areas . 35
C.3.1 Method for the removal of solder splatter on gold plating . 35
Annex D (informative) Repair of damaged conductor tracks . 36
D.1 Introduction . 36
4
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kSIST FprEN 16602-70-28:2014
FprEN 16602-70-28:2013 (E)
D.2 Tools and materials . 36
D.3 Method for the repair of damaged conductor tracks . 36
Annex E (informative) Repair of lifted conductors . 37
E.1 Introduction . 37
E.2 Tools and materials . 37
E.3 Methods for repair of lifted conductors . 38
E.3.1 Method for the use of epoxy under conductor . 38
E.3.2 Method for the use of epoxy over conductor . 38
Annex F (informative) Repair of lifted terminal areas (pads) . 39
F.1 Introduction . 39
F.2 Tools and materials . 40
F.3 Method for the repair of lifted terminal areas (pads) . 40
Annex G (informative) Terminal post replacement . 41
G.1 Introduction . 41
G.2 Tools and materials . 41
G.3 Method for the replacement of terminal post . 41
Annex H (informative) Wire-to-wire joints . 43
H.1 Introduction . 43
H.2 Tools and materials . 43
H.3 Method for wire-to-wire joining . 43
Annex I (informative) Addition of components . 45
I.1 Introduction . 45
I.2 Tools and materials . 45
I.3 Methods for addition of components . 46
I.3.1 Method for additional components mounted on reverse
(non-component) side of board . 46
I.3.2 Method for additional components mounted on component side of
board. 47
I.3.3 Method for additional components mounted on terminal posts,
including “piggyback“ mounting . 48
I.3.4 Method for additional components mounted (on reverse side or on
component side of board) using staking compound. 49
I.3.5 Method for additional components mounted (on reverse side or on
component side of board) to leads of adjacent components . 50
I.3.6 Method for the addition of a wire link onto soldered chips on a single
side piece of PCB with appropriate pads . 55
I.3.7 Method for the addition of a wire link onto metallized cap of chips
directly glued on PCB . 56
5
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kSIST FprEN 16602-70-28:2014
FprEN 16602-70-28:2013 (E)
Annex J (informative) Removal and replacement of axial and multi-lead
components . 57
J.1 Introduction . 57
J.2 Tools and materials . 57
J.3 Methods for removal and replacement of axial and multi-lead components . 57
J.3.1 Method for the removal of components with axial leads (destructive
removal) . 57
J.3.2 Method for the removal of multi-lead components (destructive
removal) . 58
Annex K (informative) Removal and replacement of flat-pack components. 60
K.1 Introduction . 60
K.2 Tools and materials . 60
K.3 Method for the removal and replacement of flat-pack components . 60
Annex L (informative) Modification of component connections . 62
L.1 Introduction . 62
L.2 Tools and materials . 62
L.3 Methods for modification of component connections . 62
L.3.1 Method for the soldering of a wrap-around connection to an extended
component lead . 62
L.3.2 Method for the soldering of component lead to a stud lead mounted
into an existing hole . 63
L.3.3 Method for mounting a dual-in-line (DIL) package with or without a
wire link soldered onto a cropped lead . 64
L.3.4 Method for mounting a connector with or without a wire link soldered
onto a cropped lead . 66
L.3.5 Method for the addition of a wire link into a plated-through hole
occupied by a flat-section lead . 67
L.3.6 Method for the addition of a wire link on top of a flat-pack lead . 69
L.3.7 Method for the isolation of a component lead . 69
L.3.8 Method for the addition of a wire link onto terminal pad of soldered
chips . 71
Annex M (informative) Cutting of internal track of a multi-layer printed
circuit board . 73
M.1 Introduction . 73
M.2 Tools and materials . 73
M.3 Method for cutting the internal track of a multi-layer printed circuit board . 73
Bibliography . 75
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Figures
Figure A-1 : Removal of coating by thermal parting device . 30
Figure B-1 : Continuous vacuum solder extraction on stud lead . 32
Figure B-2 : Pulse-type solder sucker in use . 32
Figure B-3 : Lifting individual leads with hot jet . 33
Figure B-4 : Cross-sectional view of wicking method . 34
Figure B-5 : Hot unclinching with thermal parting device . 34
Figure E-1 : Lifted conductors. 37
Figure E-2 : Repair using epoxy under conductor . 38
Figure E-3 : Repair using epoxy over conductor . 38
Figure F-1 : Lifted terminal area . 39
Figure F-2 : Terminal areas without track . 39
Figure F-3 : Terminal areas with track attached . 40
Figure G-1 : Terminal post replacement . 42
Figure H-1 : Use of approved type support clamp/heat sink . 44
Figure I-1 : Additional components mounted on reverse (non-component) side of board . 47
Figure I-2 : Additional components mounted on component side of board . 48
Figure I-3 :“Piggyback” mounting of one component on top of another . 49
Figure I-4 : Mounting and wiring of additional axially-leaded components mounted (on
reverse side or on component side of board) using staking compound . 51
Figure I-5 : Upside down mounting and wiring of additional side-brazed DIL component
(on reverse side or on component side of board) using staking compound . 52
Figure I-6 : Mounting of additional non-axially leaded components, e.g. capacitors, with
wire connecting top or bottom sides of the circuit board using staking
compound (on reverse side or on component side of board) . 52
Figure I-7 : Mounting of additional component (on component side of board) with wire
connections on reverse side of board using staking compound . 53
Figure I-8 : Mounting of additional component (on reverse side of board) across
extended leads of adjacent components . 53
Figure I-9 : Mounting of additional component by linking to a “pigtailed” lead of an
adjacent component . 54
Figure I-10 : Mounting of additional component by linking to lead of an adjacent
transistor (or other large component) . 55
Figure I-11 : Addition of a wire link onto metallized cap of chips directly glued on PCB . 56
Figure J-1 : Removal of multi-lead components, clipping of component leads . 58
Figure J-2 : Removal of multi-lead components, removal of remaining component leads . 59
Figure K-1 : Removal of flat-pack components . 61
Figure L-1 : Soldering of a wrap-around connection to an extended component lead . 63
Figure L-2 : Soldering of component lead to a stud lead mounted into an existing hole . 64
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Figure L-3 : Mounting a dual-in-line package with or without a wire link soldered onto a
cropped lead (cropped lead without connection and cropped lead with
connection led through hole and onto board) . 65
Figure L-4 : Mounting a dual-in-line package with or without a wire link soldered onto a
cropped lead (wire link passing away from board) . 66
Figure L-5 : Mounting a connector with a wire link soldered onto a cropped lead . 67
Figure L-6 : Addition of a wire link into a plated through hole occupied by a flat-section
lead (wire link entering from the reverse side of the board) . 68
Figure L-7 : Addition of a wire link into a plated through hole occupied by a flat-section
lead (wire link entering from the component side of the board) . 68
Figure L-8 : Addition of a wire link on top of a flat-pack lead . 69
Figure L-9 : Isolation of a component lead . 71
Figure L-10 : Addition of a wire link onto terminal pad of soldered chips . 72
Figure M-1 : Cutting of internal track of a multi-layer circuit board . 74
Tables
Table 4-1: Wire diameters for given conductor widths . 19
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Foreword
This document (FprEN 16602-70-28:2013) has been prepared by Technical
Committee CEN/CLC/TC 5 “Space”, the secretariat of which is held by DIN
(Germany).
This document (FprEN 16602-70-28:2013) originates from ECSS-Q-ST-70-28C.
This document is currently submitted to the Unique Acceptance Procedure.
This document has been developed to cover specifically space systems and will
the-refore have precedence over any EN covering the same scope but with a
wider do-main of applicability (e.g. : aerospace).
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