Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances (IEC 62779-2:2016)

This part of IEC 62779 defines a measurement method on electrical performances of an
electrode that composes a semiconductor interface for human body communication (HBC). In
the measurement method, a signal transmitter is electrically isolated from a signal receiver, so
an isolation condition between the transmitter and receiver is maintained to accurately
measure the electrode’s performances. This part includes general and functional
specifications of the measurement method.
HBC uses the body of a user as a transmission medium using near-field coupling inside the
body: a signal transmitter and receiver are coupled with each other through a near field that is
formed inside the human body and air. The intensity of the near field is strong especially
inside the body due to high dielectric constant of the body, so a data signal is transmitted
through the human body by modulating the near field. A signal transmitter and receiver for
HBC include an internal ground respectively, and, in most HBC applications, the grounds are
separated from each other as maintaining the coupling condition through the air. Quality of a
data transmission strongly depends on a coupling degree between the grounds; hence, it is
important to maintain the coupling degree between grounds of a signal transmitter and
receiver for an accurate measurement of the electrode’s performances. This part defines a
measurement method to measure electrical performances of an electrode while the coupling
degree between grounds of a signal transmitter and receiver is maintained.
NOTE 1 HBC semiconductor interface consists of an electrode and analog front end.
NOTE 2 General analog and digital modulation techniques can be used to modulate a near field used in HBC, and
a modulation technique to be used is determined according to required performances for a data transmission and a
HBC application.

Halbleiterbauelemente - Halbleiterschnittstelle zur Kommunikation über den menschlichen Körper - Teil 2: Beschreibung der Schnittstellenfunktion

Dispositifs à semiconducteurs - Interface à semi-conducteurs pour les communications via le corps humain - Partie 2: Caractérisation des performances d'interfaçage (IEC 62779-2:2016)

L'IEC 62779-2:2016 définit une méthode de mesure des performances électriques d'une électrode qui constitue une interface à semiconducteurs pour les communications via le corps humain. Dans la méthode de mesure, un émetteur de signaux est isolé électriquement d'un récepteur de signaux. Ceci assure le maintien de l'isolation entre l'émetteur et le récepteur pour mesurer avec exactitude les performances d'une électrode. La présente partie inclut des spécifications générales et fonctionnelles de la méthode de mesure.

Polprevodniški elementi - Polprevodniški vmesnik za komuniciranje človeškega telesa - 2. del: Opredelitev značilnosti vmesniških zmogljivosti (IEC 62779-2:2016)

Ta del standarda IEC 62779 določa merilno metodo za električno zmogljivost elektrode, ki zajema polprevodniški vmesnik za komuniciranje človeškega telesa (HBC). Pri merilni metodi je oddajnik signala električno izoliran od sprejemnika signala, s čimer se ohranja izolirano stanje med oddajnikom in sprejemnikom, ki omogoča natančno meritev zmogljivosti elektrode. Ta del vključuje splošne in funkcionalne specifikacije merilne metode. Pri komuniciranju človeškega telesa se uporabnikovo telo uporablja kot medij prenosa na podlagi povezave prek bližnjega polja: oddajnik in sprejemnik signala sta povezana prek bližnjega polja, ki se ustvari v človeškem telesu in zraku. Bližnje polje je močno zlasti znotraj telesa (zaradi dielektrične konstante v telesu), kar omogoča prenos podatkovnega signala po telesu z modulacijo bližnjega polja. Oddajnik in sprejemnik signala za komuniciranje človeškega telesa vključujeta notranji ozemljitvi, ki sta pri večini načinov komuniciranja človeškega telesa
ločeni druga od druge, medtem ko se ohranja stanje povezave po zraku. Kakovost prenosa podatkov je zelo odvisna od stopnje povezave med ozemljitvama. Zaradi tega je pomembno, da se stopnja povezave med ozemljitvama oddajnika in sprejemnika signala ohranja za natančno meritev zmogljivosti elektrode. Ta del določa merilno metodo za merjenje električne zmogljivosti elektrode pri ohranjanju stopnje povezave med ozemljitvama oddajnika in sprejemnika signala.
OPOMBA 1: polprevodniški vmesnik za komuniciranje človeškega telesa vključuje elektrodo in analogni čelni del.
OPOMBA 2: splošne tehnike analogne in digitalne modulacije je mogoče uporabiti za modulacijo bližnjega polja pri komuniciranju človeškega telesa, ustrezna tehnika modulacije pa se določi v skladu z zahtevanimi zmogljivostmi za prenos podatkov in način komuniciranja človeškega telesa.

General Information

Status
Published
Publication Date
13-Jun-2016
Technical Committee
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
06-Jun-2016
Due Date
11-Aug-2016
Completion Date
14-Jun-2016

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SLOVENSKI STANDARD
SIST EN 62779-2:2016
01-september-2016
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Semiconductor devices - Semiconductor interface for human body communication - Part
2: Characterization of interfacing performances (IEC 62779-2:2016)
Dispositifs à semiconducteurs - Interface à semi-conducteurs pour les communications
via le corps humain - Partie 2: Caractérisation des performances d'interfaçage (IEC
62779-2:2016)
Ta slovenski standard je istoveten z: EN 62779-2:2016
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN 62779-2:2016 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 62779-2:2016

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SIST EN 62779-2:2016


EUROPEAN STANDARD EN 62779-2

NORME EUROPÉENNE

EUROPÄISCHE NORM
May 2016
ICS 31.080.01

English Version
Semiconductor devices - Semiconductor interface for human
body communication - Part 2: Characterization of interfacing
performances
(IEC 62779-2:2016)
Dispositifs à semiconducteurs - Interface à Halbleiterbauelemente - Halbleiterschnittstelle zur
semiconducteurs pour les communications via le corps Kommunikation über den menschlichen Körper -
humain - Partie 2: Caractérisation des performances Teil 2: Beschreibung der Schnittstellenfunktion
d'interfaçage (IEC 62779-2:2016)
(IEC 62779-2:2016)
This European Standard was approved by CENELEC on 2016-03-24. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2016 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN 62779-2:2016 E

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SIST EN 62779-2:2016
EN 62779-2:2016
European foreword
The text of document 47/2268/FDIS, future edition 1 of IEC 62779-2, prepared by IEC/TC 47
"Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN 62779-2:2016.
The following dates are fixed:
(dop) 2016-12-24
• latest date by which the document has to be implemented at
national level by publication of an identical national
standard or by endorsement
(dow) 2019-03-24
• latest date by which the national standards conflicting with
the document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.
Endorsement notice
The text of the International Standard IEC 62779-2:2016 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated :
IEC 62779 NOTE Harmonized in EN 62779 series.

2

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SIST EN 62779-2:2016



IEC 62779-2

®


Edition 1.0 2016-02




INTERNATIONAL



STANDARD




NORME



INTERNATIONALE











Semiconductor devices – Semiconductor interface for human body

communication –

Part 2: Characterization of interfacing performances




Dispositifs à semiconducteurs – Interface à semiconducteurs pour les

communications via le corps humain –


Partie 2: Caractérisation des performances d'interfaçage














INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE


INTERNATIONALE




ICS 31.080.01 ISBN 978-2-8322-3175-3



Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN 62779-2:2016
– 2 – IEC 62779-2:2016 © IEC 2016
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references. 6
3 Terms, definitions and letter symbols . 6
3.1 General terms . 6
3.2 Signal characteristics . 9
3.3 Letter symbols . 11
4 Measurement of electrical performances of electrode . 11
4.1 Measurement setup . 11
4.2 Measurement apparatus and signal specifications . 12
4.2.1 Transmitter and receiver module . 12
4.2.2 Synchronization module . 13
4.2.3 Measurement equipment . 13
4.2.4 Signal specifications . 13
4.3 Measurement procedure . 14
4.3.1 General . 14
4.3.2 Attachment of transmitter and receiver modules . 14
4.3.3 Transmission of pulse and synchronization signals . 14
4.3.4 Synchronization of measurement equipment . 14
4.3.5 Signal processing in receiver module . 14
4.3.6 Measurement of pulse and processed signal . 14
4.3.7 Compensation for signal processing . 14
4.3.8 Computation of impulse response and complex transfer function . 14
4.4 Post processing for electrode performances . 14
4.4.1 General . 14
4.4.2 In-band average signal-loss . 14
4.4.3 In-band average phase-shift . 15
4.4.4 RMS delay . 15
4.4.5 Coherent bandwidth . 15
Bibliography . 17

Figure 1 – Pulse signal . 8
Figure 2 – Synchronization signal . 9
Figure 3 – Measurement setup . 12

Table 1 – Letter symbols . 11

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SIST EN 62779-2:2016
IEC 62779-2:2016 © IEC 2016 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

SEMICONDUCTOR DEVICES – SEMICONDUCTOR INTERFACE
FOR HUMAN BODY COMMUNICATION –

Part 2: Characterization of interfacing performances

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
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with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
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4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
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between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
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6) All users should ensure that they have the latest edition of this publication.
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62779-2 has been prepared by IEC technical committee 47:
Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47/2268/FDIS 47/2278/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

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SIST EN 62779-2:2016
– 4 – IEC 62779-2:2016 © IEC 2016
A list of all parts in the IEC 62779 series, published under the general title Semiconductor
devices – Semiconductor interface for human body communication, can be found on the IEC
website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

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SIST EN 62779-2:2016
IEC 62779-2:2016 © IEC 2016 – 5 –
INTRODUCTION
The IEC 62779 series is composed of three parts as follow:
• IEC 62779-1 defines general requirements of a semiconductor interface for human body
communication. It includes general and functional specifications of the interface.
• IEC 62779-2 defines a measurement method on electrical performances of an electrode
that constructs a semiconductor interface for human body communication.
• IEC 62779-3 defines functional type of a semiconductor interface for human body
communication, and operational conditions of the interface.

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SIST EN 62779-2:2016
– 6 – IEC 62779-2:2016 © IEC 2016
SEMICONDUCTOR DEVICES – SEMICONDUCTOR INTERFACE
FOR HUMAN BODY COMMUNICATION –

Part 2: Characterization of interfacing performances



1 Scope
This part of IEC 62779 defines a measurement method on electrical performances of an
electrode that composes a semiconductor interface for human body communication (HBC). In
the measurement method, a signal transmitter is electrically isolated from a signal receiver, so
an isolation condition between the transmitter and receiver is maintained to accurately
measure the electrode’s performances. This part includes general and functional
specifications of the measurement method.
HBC uses the body of a user as a transmission medium using near-field coupling inside the
body: a signal transmitter and receiver are coupled with each other through a near field that is
formed inside the human body and air. The intensity of the near field is strong especially
inside the body due to high dielectric constant of the body, so a data signal is transmitted
through the human body by modulating the near field. A signal transmitter and receiver for
HBC include an internal ground respectively, and, in most HBC applications, the grounds are
separated from each other as maintaining the coupling condition throug
...

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