SIST EN IEC 61760-3:2021
(Main)Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering
Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering
This part of IEC 61760 gives a reference set of requirements, process conditions and related
test conditions to be used when compiling specifications of electronic components that are
intended for usage in through-hole reflow soldering technology.
The object of this document is to ensure that components with leads intended for through-hole
reflow and surface mounting components can be subjected to the same placement and
mounting processes. Hereto, this document defines test and requirements that need to be part
of any component generic, sectional or detail specification, when through-hole reflow soldering
is intended.
Furthermore, this document provides component users and manufacturers with a reference set
of typical process conditions used in through-hole reflow soldering technology.
Oberflächenmontagetechnik - Teil 3: Genormtes Verfahren zur Spezifizierung von Durchsteckmontage-Bauelementen für das Aufschmelzlöten (THR)
Technique du montage en surface - Partie 3 : Méthode normalisée relative à la spécification des composants pour le brasage par refusion à trous traversants (THR, Through Hole Reflow)
L’IEC 61760-3:2021 fournit un référentiel d’exigences et définit les conditions de procédé ainsi que les conditions d’essai correspondantes à utiliser pour élaborer les spécifications des composants électroniques destinés à être employés avec la technique du brasage par refusion à trous traversants (THR).
L’objet du présent document est de s’assurer que les composants équipés de sorties destinées à la THR et les composants pour montage en surface peuvent être soumis aux mêmes procédés de placement et de montage. Ici, le présent document définit les essais et les exigences faisant nécessairement partie de toute spécification générique, intermédiaire ou particulière de composant, lorsqu’il s’agit de brasage par refusion à trous traversants.
De plus, le présent document fournit aux utilisateurs de composants et à leurs fabricants un référentiel des conditions de procédés typiques utilisées dans le cadre de la technologie du brasage par refusion à trous traversants.
Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
a) modification de l’exigence relative à la tolérance de position (0,4 mm au maximum et entre 0,2 mm et 0,4 mm);
b) introduction de la méthode du trou traversant vide comme méthode d’application de pâte à braser.
Tehnologija površinske montaže - 3. del: Standardne metode za specifikacijo komponent za spajkanje "Through Hole Reflow" (THR)
General Information
Relations
Standards Content (Sample)
SLOVENSKI STANDARD
SIST EN IEC 61760-3:2021
01-junij-2021
Nadomešča:
SIST EN 61760-3:2010
Tehnologija površinske montaže - 3. del: Standardne metode za specifikacijo
komponent za spajkanje "Through Hole Reflow" (THR)
Surface mounting technology - Part 3: Standard method for the specification of
components for through hole reflow (THR) soldering
Technique du montage en surface - Partie 3 : Méthode normalisée relative à la
spécification des composants pour le brasage par refusion à trous traversants (THR,
Through Hole Reflow)
Ta slovenski standard je istoveten z: EN IEC 61760-3:2021
ICS:
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN IEC 61760-3:2021 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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SIST EN IEC 61760-3:2021
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SIST EN IEC 61760-3:2021
EUROPEAN STANDARD EN IEC 61760-3
NORME EUROPÉENNE
EUROPÄISCHE NORM
March 2021
ICS 31.190 Supersedes EN 61760-3:2010 and all of its amendments
and corrigenda (if any)
English Version
Surface mounting technology - Part 3: Standard method for the
specification of components for through-hole reflow (THR)
soldering
(IEC 61760-3:2021)
Technique du montage en surface - Partie 3: Méthode Oberflächenmontagetechnik - Teil 3: Genormtes Verfahren
normalisée relative à la spécification des composants pour zur Spezifizierung von Durchsteckmontage-Bauelementen
le brasage par refusion à trous traversants (THR, Through für das Aufschmelzlöten (THR)
Hole Reflow) (IEC 61760-3:2021)
(IEC 61760-3:2021)
This European Standard was approved by CENELEC on 2021-03-10. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2021 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61760-3:2021 E
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SIST EN IEC 61760-3:2021
EN IEC 61760-3:2021 (E)
European foreword
The text of document 91/1684/FDIS, future edition 2 of IEC 61760-3, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61760-3:2021.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2021-12-10
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2024-03-10
document have to be withdrawn
This document supersedes EN 61760-3:2010 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 61760-3:2021 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 60068-2-82:2019 NOTE Harmonized as EN IEC 60068-2-82:2019 (not modified)
IEC 62090 NOTE Harmonized as EN 62090
2
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SIST EN IEC 61760-3:2021
EN IEC 61760-3:2021 (E)
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60068 series Environmental testing - -
IEC 60068-2-20 2008 Environmental testing - Part 2-20: Tests - EN 60068-2-20 2008
Test T: Test methods for solderability and
resistance to soldering heat of devices
with leads
IEC 60068-2-21 - Environmental testing - Part 2-21: Tests - EN 60068-2-21 -
Test U: Robustness of terminations and
integral mounting devices
IEC 60068-2-45 1980 Basic environmental testing procedures - EN 60068-2-45 1992
Part 2-45: Tests - Test XA and guidance:
Immersion in cleaning solvents
+ A1 1993 + A1 1993
IEC 60068-2-58 - Environmental testing - Part 2-58: Tests - EN 60068-2-58 -
Test Td: Test methods for solderability,
resistance to dissolution of metallization
and to soldering heat of surface mounting
devices (SMD)
1
IEC 60068-2-77 - Environmental testing - Part 2-77: Tests - EN 60068-2-77 -
Test 77: Body strength and impact shock
IEC 60194-1 - Printed boards design, manufacture and - -
assembly - Vocabulary - Part 1: Common
usage in printed board and electronic
assembly technologies
1
To be integrated into the seventh edition of IEC 60068-2-21. Stage at the time of publication: IEC/AFDIS 60068-
2-21:2021.
3
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SIST EN IEC 61760-3:2021
EN IEC 61760-3:2021 (E)
Publication Year Title EN/HD Year
IEC 60286 series Packaging of components for automatic EN 60286 series
handling
IEC 60286-3 - Packaging of components for automatic EN IEC 60286-3 -
handling - Part 3: Packaging of surface
mount components on continuous tapes
IEC 60286-4 - Packaging of components for automatic EN 60286-4 -
handling - Part 4: Stick magazines for
electronic components encapsulated in
packages of different forms
IEC 60286-5 - Packaging of components for automatic EN IEC 60286-5 -
handling - Part 5: Matrix trays
IEC 60749-20 - Semiconductor devices - Mechanical and EN IEC 60749-20 -
climatic test methods - Part 20:
Resistance of plastic encapsulated SMDs
to the combined effect of moisture and
soldering heat
IEC 61188-6-4 - Printed boards and printed board EN IEC 61188-6-4 -
assemblies - Design and use - Part 6-4:
Land pattern design - Generic
requirements for dimensional drawings of
surface mounted components (SMD) from
the viewpoint of land pattern design
IEC 61191-3 - Printed board assemblies - Part 3: EN 61191-3 -
Sectional specification - Requirements for
through-hole mount soldered assemblies
IEC 61760-1 2020 Surface mounting technology - Part 1: EN IEC 61760-1 2020
Standard method for the specification of
surface mounting components (SMDs)
IEC 61760-2 - Surface mounting technology - Part 2: EN 61760-2 -
Transportation and storage conditions of
surface mounting devices (SMD) -
Application guide
IEC 61760-4 2015 Surface mounting technology - Part 4: EN 61760-4 2015
Classification, packaging, labelling and
handling of moisture sensitive devices
IPC/JEDEC - Moisture/Reflow Sensitivity Classification - -
J-STD-020 for Non-hermetic Solid State Surface
Mount Devices
IPC-A-610 - Acceptability of Electronics Assemblies - -
4
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SIST EN IEC 61760-3:2021
IEC 61760-3
®
Edition 2.0 2021-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Surface mounting technology –
Part 3: Standard method for the specification of components for through-hole
reflow (THR) soldering
Technique du montage en surface –
Partie 3: Méthode normalisée relative à la spécification des composants pour
le brasage par refusion à trous traversants (THR, Through Hole Reflow)
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.190 ISBN 978-2-8322-9294-5
Warning! Make sure that you obtained this publication from an authorized distributor.
Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.
® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
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SIST EN IEC 61760-3:2021
– 2 – IEC 61760-3:2021 © IEC 2021
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 7
4 Requirements to component design and component specifications . 9
4.1 General requirement . 9
4.2 Packaging . 9
4.3 Labelling of component packaging . 10
4.4 Component marking . 10
4.5 Storage and transportation . 10
4.6 Component outline and design . 10
4.6.1 Drawing and specification . 10
4.6.2 Requirement of pick-up area . 11
4.6.3 Component tilt . 13
4.6.4 Bottom surface requirements . 13
4.6.5 Terminal requirements . 14
4.6.6 Optical recognition . 19
4.6.7 Component height . 19
4.6.8 Component mass . 20
4.7 Mechanical stress . 20
4.8 Component reliability . 20
4.9 Additional requirements for compatibility with lead-free soldering . 20
5 Typical process conditions for THR soldering process . 20
5.1 Mounting by through-hole reflow soldering . 20
5.2 Solder paste supply . 21
5.3 Component insertion . 22
5.4 Reflow soldering methods (recommended) . 22
5.5 Cleaning . 23
5.5.1 General . 23
5.5.2 Cleaning medium and cleaning method . 23
5.5.3 Cleaning process conditions . 23
5.6 Removal and/or replacement of soldered components . 24
6 Relevant tests and requirements for components and component specifications for
THR soldering process . 24
6.1 General . 24
6.2 Wettability . 25
6.3 Dewetting . 25
6.4 Resistance to soldering heat . 25
6.5 Resistance to cleaning solvent . 25
6.5.1 General . 25
6.5.2 Solvent resistance of component . 26
6.5.3 Solvent resistance of marking . 26
6.6 Soldering profile . 26
6.7 Moisture sensitivity level . 26
7 Quality criteria for THR soldering . 26
Annex A (informative) Flux creeping-up and solder wicking . 27
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SIST EN IEC 61760-3:2021
IEC 61760-3:2021 © IEC 2021 – 3 –
Bibliography . 28
Figure 1 – Example of a component with marked specific orientation put in tape
and tray . 9
Figure 2 – Example of components in a tape . 10
Figure 3 – Pick-up area . 12
Figure 4 – Chuck jaw . 12
Figure 5 – Component side flat surface . 13
Figure 6 – Component top flat surface . 13
Figure 7 – Clearance . 14
Figure 8 – Stand-off height . 14
Figure 9 – Terminal length and protrusion length . 15
Figure 10 – Terminal position tolerance 0,2 mm . 16
Figure 11 – Terminal position tolerance 0,4 mm . 17
Figure 12 – Terminal shape . 18
Figure 13 – Solder wetting . 19
Figure 14 – Typical soldering process steps. 21
Figure 15 – Solder paste supply . 22
Figure A.1 – Example of the flux creeping-up . 27
Figure A.2 – Example of the solder wicking . 27
Table 1 – Typical cleaning conditions. 24
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INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SURFACE MOUNTING TECHNOLOGY –
Part 3: Standard method for the specification of
components for through-hole reflow (THR) soldering
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 61760-3 has been prepared by IEC technical committee 91: Electronics assembly
technology. It is an International Standard.
This second edition cancels and replaces the first edition published in 2010. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) change position tolerance requirement (0,4 mm maximum to between 0,2 mm and 0,4 mm);
b) introduce through-hole vacant method as a solder paste supply method.
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SIST EN IEC 61760-3:2021
IEC 61760-3:2021 © IEC 2021 – 5 –
The text of this International Standard is based on the following documents:
Draft Report on voting
91/1684/FDIS 91/1702/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.
A list of all parts in the IEC 61760 series, published under the general title Surface mounting
technology, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
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SURFACE MOUNTING TECHNOLOGY –
Part 3: Standard method for the specification of
components for through-hole reflow (THR) soldering
1 Scope
This part of IEC 61760 gives a reference set of requirements, process conditions and related
test conditions to be used when compiling specifications of electronic components that are
intended for usage in through-hole reflow soldering technology.
The object of this document is to ensure that components with leads intended for through-hole
reflow and surface mounting components can be subjected to the same placement and
mounting processes. Hereto, this document defines test and requirements that need to be part
of any component generic, sectional or detail specification, when through-hole reflow soldering
is intended.
Furthermore, this document provides component users and manufacturers with a reference set
of typical process conditions used in through-hole reflow soldering technology.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60068 (all parts), Environmental testing
IEC 60068-2-20:2008, Environmental testing – Part 2-20: Tests – Test T: Test methods for
solderability and resistance to soldering heat of devices with leads
IEC 60068-2-21, Environmental testing – Part 2-21: Tests – Test U: Robustness of terminations
and integral mounting devices
IEC 60068-2-45:1980, Basic environmental testing procedures – Part 2-45: Tests – Test XA
and guidance: Immersion in cleaning solvents
IEC 60068-2-45:1980/AMD1:1993
IEC 60068-2-58, Environmental testing – Part 2-58: Tests – Test Td: Test methods for
solderability, resistance to dissolution of metallization and to soldering heat of surface mounting
devices (SMD)
1
, Environmental testing – Part 2-77: Tests – Test 77: Body strength and impact
IEC 60068-2-77
shock
IEC 60194-1, Printed boards design, manufacture and assembly – Vocabulary – Part 1:
Common usage in printed board and electronic assembly technologies
___________
1
To be integrated into the seventh edition of IEC 60068-2-21.
Stage at the time of publication: IEC/AFDIS 60068-2-21:2021.
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SIST EN IEC 61760-3:2021
IEC 61760-3:2021 © IEC 2021 – 7 –
IEC 60286 (all parts), Packaging of components for automatic handling
IEC 60286-3, Packaging of components for automatic handling – Part 3: Packaging of surface
mount components on continuous tapes
IEC 60286-4, Packaging of components for automatic handling – Part 4: Stick magazines for
electronic components encapsulated in packages of different forms
IEC 60286-5, Packaging of components for automatic handling – Part 5: Matrix trays
IEC 60749-20, Semiconductor devices – Mechanical and climatic test methods – Part 20:
Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
IEC 61188-6-4, Printed boards and printed board assemblies – Design and use – Part 6-4: Land
pattern design – Generic requirements for dimensional drawings of surface mounted
components (SMD) from the viewpoint of land pattern design
IEC 61191-3, Printed board assemblies – Part 3: Sectional specification – Requirements for
through-hole mount soldered assemblies
IEC 61760-1:2020, Surface mounting technology – Part 1: Standard method for the
specification of surface mounting components (SMDs)
IEC 61760-2, Surface mounting technology – Part 2: Transportation and storage conditions of
surface mounting devices (SMD) – Application guide
IEC 61760-4:2015, Surface mounting technology – Part 4: Classification, packaging, labelling
and handling of moisture sensitive devices
IPC/JEDEC J-STD-020, Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State
Surface Mount Devices
IPC-A-610G, Acceptability of Electronic Assemblies
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60194-1 and the
following apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at https://www.iso.org/obp
3.1
through-hole reflow
THR
reflow soldering process for electronic component terminals inserted into the through-hole of
the circuit board
3.2
THR components
through-hole reflow components
electronic components with leads which are intended to be subject to through-hole reflow
soldering
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SIST EN IEC 61760-3:2021
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3.3
vacuum nozzle
pipette
type of tooling for component to pick-up and place the component with vacuum
3.4
chuck
gripper
type of tooling for component transfer
3.5
chucking
gripping
motion of the chuck (3.4) to hold the components
3.6
pick-up area
component surface area for vacuum suction or chucking to transfer within pick and place
machine
3.7
cavity of packaging
depression area to place component in taping or tray
3.8
stand-off
protrusion(s) from the component body which are used to make a space between the component
body and the seating plane
Note 1 to entry: Stand-off prevents the component touching the solder paste.
3.9
clearance
space to avoid contact between component body and solder paste and to ensure sufficient heat
transfer to soldering regions
3.10
auxiliary terminal
protrusion which has no electrical function inserted into a circuit board
3.11
stencil
stencil foil
thin sheet of material containing openings to reflect a specific pattern, designed to transfer
solder paste like material to a circuit board for the purpose of component attachment
[SOURCE: IEC 60194-1:2021, 3.19.187, modified – The words " paste-like material " have been
replaced by "solder paste like material" and “substrate” has been replaced by “circuit board”.]
3.12
A side
circuit board surface to which THR components (3.2) are to be mounted
3.13
B side
reverse surface of A side (3.12)
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SIST EN IEC 61760-3:2021
IEC 61760-3:2021 © IEC 2021 – 9 –
3.14
solder wicking
capillary movement of solder between metal surfaces, such as strands of wire
[SOURCE: IEC 60194-1:2021, 3.19.125]
4 Requirements to component design and component specifications
4.1 Genera
...
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