SIST EN 61760-3:2010
Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering (IEC 61760-3:2010)
Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering (IEC 61760-3:2010)
This part of IEC 61760 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through hole reflow soldering technology. The object of this standard is to ensure that components with leads intended for through hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this standard defines test and requirements that need to be part of any component generic, sectional or detail specification, when through hole reflow soldering is intended. Further this standard provides component users and manufacturers with a reference set of typical process conditions used in through hole reflow soldering technology.
Oberflächenmontagetechnik - Teil 3: Genormtes Verfahren zur Spezifizierung von Durchsteckmontage-Bauelementen für das Aufschmelzlöten (THR) (IEC 61760-3:2010)
Technique du montage en surface - Partie 3: Méthode normalisée relative à la spécification des composants pour le brasage par refusion à trous traversants (THR, Through Hole Reflow) (CEI 61760-3:2010)
La CEI 61760-3:2010 fournit un ensemble de références d'exigences indiquant les conditions de processus et d'essai correspondantes qui doivent être utilisées lors de l'élaboration des spécifications des composants électroniques qui sont destinés à être utilisés dans le cadre de la technologie du brasage par refusion à trous traversants. L'objet de la présente norme est de s'assurer que les composants comportant des sorties destinées à la THR et les composants pour montage en surface peuvent être soumis au même placement et au même processus de montage. Ici, la présente norme définit les essais et les exigences faisant nécessairement partie de toute spécification générique, intermédiaire ou particulière de composant, lorsqu'il s'agit de brasage par refusion à trou traversant. De plus, la présente norme fournit aux utilisateurs de composants et à leurs fabricants un ensemble de référence des conditions de processus typiques utilisées dans le cadre de la technologie du brasage par refusion à trou traversant.
Tehnologija površinske montaže - 3. del: Standardne metode za specifikacijo komponent za spajkanje "Through Hole Reflow" (THR) (IEC 61760-3:2010)
Ta del IEC 61760 podaja referenčni sklop zahtev, procesnih pogojev in povezanih preskusnih pogojev, ki se uporabljajo pri zbiranju specifikacij elektronskih komponent, namenjenih uporabi pri tehnologiji spajkanja »Through Hole Reflow«. Namen tega standarda je zagotoviti, da za komponente z vodniki, namenjene »Through Hole Reflow«, in komponente za površinsko namestitev lahko veljajo enaki postopki namestitve in vgradnje. Pri tem ta standard opredeljuje preskus in zahteve, ki morajo biti del splošne, presečne ali podrobne specifikacije vsake komponente, kadar gre za spajkanje »Through Hole Reflow«. Nadalje standard uporabnikom in proizvajalcem komponent zagotavlja referenčni sklop značilnih procesnih pogojev, ki se uporabljajo pri tehnologiji spajkanja »Through Hole Reflow«.
General Information
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Standards Content (Sample)
SLOVENSKI STANDARD
SIST EN 61760-3:2010
01-september-2010
Tehnologija površinske montaže - 3. del: Standardne metode za specifikacijo
komponent za spajkanje "Through Hole Reflow" (THR) (IEC 61760-3:2010)
Surface mounting technology - Part 3: Standard method for the specification of
components for Through Hole Reflow (THR) soldering (IEC 61760-3:2010)
Oberflächenmontagetechnik - Teil 3: Genormtes Verfahren zur Spezifizierung von
Durchsteckmontage-Bauelementen für das Aufschmelzlöten (THR) (IEC 61760-3:2010)
Technique du montage en surface - Partie 3: Méthode normalisée relative à la
spécification des composants pour le brasage par refusion à trous traversants (THR,
Through Hole Reflow) (CEI 61760-3:2010)
Ta slovenski standard je istoveten z: EN 61760-3:2010
ICS:
31.020 Elektronske komponente na Electronic components in
splošno general
SIST EN 61760-3:2010 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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SIST EN 61760-3:2010
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SIST EN 61760-3:2010
EUROPEAN STANDARD
EN 61760-3
NORME EUROPÉENNE
April 2010
EUROPÄISCHE NORM
ICS 31.190
English version
Surface mounting technology -
Part 3: Standard method for the specification of components
for Through Hole Reflow (THR) soldering
(IEC 61760-3:2010)
Technique du montage en surface - Oberflächenmontagetechnik -
Partie 3: Méthode normalisée relative Teil 3: Genormtes Verfahren
à la spécification des composants pour zur Spezifizierung
le brasage par refusion à trous traversants von Durchsteckmontage-Bauelementen
(THR, Through Hole Reflow) für das Aufschmelzlöten (THR)
(CEI 61760-3:2010) (IEC 61760-3:2010)
This European Standard was approved by CENELEC on 2010-04-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Management Centre: Avenue Marnix 17, B - 1000 Brussels
© 2010 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61760-3:2010 E
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SIST EN 61760-3:2010
EN 61760-3:2010 - 2 -
Foreword
The text of document 91/856/CDV, future edition 1 of IEC 61760-3, prepared by IEC TC 91, Electronics
assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC
as EN 61760-3 on 2010-04-01.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent
rights.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2011-01-01
national standard or by endorsement
– latest date by which the national standards conflicting
(dow) 2013-04-01
with the EN have to be withdrawn
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61760-3:2010 was approved by CENELEC as a European
Standard without any modification.
__________
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SIST EN 61760-3:2010
- 3 - EN 61760-3:2010
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
...
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