SIST EN ISO 11553-2:2007
(Main)Safety of machinery - Laser processing machines - Part 2: Safety requirements for hand-held laser processing devices (ISO 11553-2:2007)
Safety of machinery - Laser processing machines - Part 2: Safety requirements for hand-held laser processing devices (ISO 11553-2:2007)
This part of ISO 11553 specifies the requirements for laser processing devices, as defined in ISO 11553-1, which are hand-held or hand-operated. The purpose of this part of ISO 11553 is to draw attention to the particular hazards related to the use of hand-held laser and hand-operated laser processing devices and to prevent personal injury. This includes both the areas of hazard analysis and risk assessment as well as protective measures. Requirements concerning noise as a hazard are not included in this part of ISO 11553. These requirements are to be included in a subsequent amendment. This part of ISO 11553 does not apply to laser products or equipment manufactured solely or expressly for applications which are excluded from the scope of ISO 11553-1.
Sicherheit von Maschinen - Laserbearbeitungsmaschinen - Teil 2: Sicherheitsanforderungen an handgeführte Laserbearbeitungsgeräte (ISO 11553-2:2007)
Dieser Teil der ISO 11553 gilt für Anforderungen an die in ISO 11553 1 definierten Laserbearbeitungsgeräte, die von Hand geführt oder positioniert werden.
Der Zweck dieses Teiles der ISO 11553 besteht darin, die Aufmerksamkeit auf die besonderen Gefährdungen zu richten, die mit der Anwendung von handgeführten und handpositionierten Laserbearbeitungsgeräten verbunden sind und Verletzungen von Personen zu verhindern. Dazu werden sowohl die Bereiche der Gefährdungsanalyse als auch der Risikobewertung sowie Schutzmaßnahmen erfasst.
Anforderungen mit Bezug auf Lärm als Gefährdung werden in diesem Teil der ISO 11553 nicht erfasst. Diese Anforderungen müssen in einer Änderung zu einem späteren Zeitpunkt berücksichtigt werden.
Dieser Teil der ISO 11553 ist nicht auf Laserprodukte oder Einrichtungen anwendbar, die nur oder ausdrücklich für Anwendungen hergestellt werden, die außerhalb des Anwendungsbereichs der ISO 11553 1 liegen.
Sécurité des machines - Machines a laser - Partie 2: Exigences de sécurité pour dispositifs de traitement laser portatifs (ISO 11553-2:2007)
Varnost strojev - Laserski obdelovalni stroji - 2. del: Varnostne zahteve za ročne laserske obdelovalne naprave (ISO 11553-2:2007)
General Information
Relations
Standards Content (Sample)
SLOVENSKI STANDARD
SIST EN ISO 11553-2:2007
01-september-2007
9DUQRVWVWURMHY/DVHUVNLREGHORYDOQLVWURMLGHO 9DUQRVWQH]DKWHYH]DURþQH
ODVHUVNHREGHORYDOQHQDSUDYH ,62
Safety of machinery - Laser processing machines - Part 2: Safety requirements for hand-
held laser processing devices (ISO 11553-2:2007)
Sicherheit von Maschinen - Laserbearbeitungsmaschinen - Teil 2:
Sicherheitsanforderungen an handgeführte Laserbearbeitungsgeräte (ISO 11553-
2:2007)
Sécurité des machines - Machines a laser - Partie 2: Exigences de sécurité pour
dispositifs de traitement laser portatifs (ISO 11553-2:2007)
Ta slovenski standard je istoveten z: EN ISO 11553-2:2007
ICS:
13.110 Varnost strojev Safety of machinery
31.260 Optoelektronika, laserska Optoelectronics. Laser
oprema equipment
SIST EN ISO 11553-2:2007 en,fr,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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EUROPEAN STANDARD
EN ISO 11553-2
NORME EUROPÉENNE
EUROPÄISCHE NORM
March 2007
ICS 13.110; 31.260
English Version
Safety of machinery - Laser processing machines - Part 2:
Safety requirements for hand-held laser processing devices
(ISO 11553-2:2007)
Sécurité des machines - Machines à laser - Partie 2: Sicherheit von Maschinen - Laserbearbeitungsmaschinen -
Exigences de sécurité pour dispositifs de traitement laser Teil 2: Sicherheitsanforderungen an handgeführte
portatifs (ISO 11553-2:2007) Laserbearbeitungsgeräte (ISO 11553-2:2007)
This European Standard was approved by CEN on 28 February 2007.
CEN members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national
standards may be obtained on application to the CEN Management Centre or to any CEN member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CEN member into its own language and notified to the CEN Management Centre has the same status as the
official versions.
CEN members are the national standards bodies of Austria, Belgium, Bulgaria, Cyprus, Czech Republic, Denmark, Estonia, Finland,
France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal,
Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and United Kingdom.
EUROPEAN COMMITTEE FOR STANDARDIZATION
COMITÉ EUROPÉEN DE NORMALISATION
EUROPÄISCHES KOMITEE FÜR NORMUNG
Management Centre: rue de Stassart, 36 B-1050 Brussels
© 2007 CEN All rights of exploitation in any form and by any means reserved Ref. No. EN ISO 11553-2:2007: E
worldwide for CEN national Members.
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EN ISO 11553-2:2007 (E)
Foreword
This document (EN ISO 11553-2:2007) has been prepared by Technical Committee ISO/TC 172
"Optics and optical instruments" in collaboration with Technical Committee CEN/TC 123 "Lasers and
photonics", the secretariat of which is held by DIN.
This European Standard shall be given the status of a national standard, either by publication of
an identical text or by endorsement, at the latest by September 2007, and conflicting national
standards shall be withdrawn at the latest by September 2007.
This document has been prepared under a mandate given to CEN by the European Commission
and the European Free Trade Association, and supports essential requirements of EU
Directive(s).
For relationship with EU Directive(s), see informative Annex ZA, which is an integral part of this
document.
According to the CEN/CENELEC Internal Regulations, the national standards organizations of
the following countries are bound to implement this European Standard: Austria, Belgium,
Bulgaria, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece,
Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway,
Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and United
Kingdom.
Endorsement notice
The text of ISO 11553-2:2007 has been approved by CEN as EN ISO 11553-2:2007 without any
modifications.
2
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EN ISO 11553-2:2007 (E)
Annex ZA
(informative)
Clauses of this European Standard addressing essential
requirements or other provisions of EU directives 98/37/EC
This European standard has been prepared under a mandate given to CEN by the European
Commission and the European Free Trade Association and supports essential requirement
1.5.12 of the following EU Directives: Machinery safety Directive 98/37/EC.
Once this standard is cited in the Official Journal of the European Communities under that
Directive and has been implemented as a national standard in at least one Member State,
compliance with the normative clauses of this standard confers, within the limits of the scope of
this standard, a presumption of conformity with the corresponding Essential Requirements of
that Directive and associated EFTA regulations.
WARNING: Other requirements and other EU Directives may be applicable to the product(s)
falling within the scope of this standard.
3
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INTERNATIONAL ISO
STANDARD 11553-2
First edition
2007-03-01
Safety of machinery — Laser processing
machines —
Part 2:
Safety requirements for hand-held laser
processing devices
Sécurité des machines — Machines à laser —
Partie 2: Exigences de sécurité pour dispositifs de traitement laser
portatifs
Reference number
ISO 11553-2:2007(E)
©
ISO 2007
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ISO 11553-2:2007(E)
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ii © ISO 2007 – All rights reserved
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ISO 11553-2:2007(E)
Contents Page
Foreword. iv
Introduction . v
1 Scope .1
2 Normative references .1
3 Terms and definitions .2
4 Hazards .2
4.1 Inherent hazards .2
4.2 Hazards induced by external effects (interferences) .3
4.3 Further hazards related to the use of hand-held laser processing devices.4
5 Safety requirements and measures.4
5.1 General requirements.4
5.2 Risk assessment.5
5.3 Implementation of corrective measures.5
5.4 Design requirements .7
6 Verification of safety requirements and measures .11
6.1 General conformance.11
6.2 Control category classification .11
6.3 Laser classification .12
7 Information for the user .12
7.1 Additional requirements .12
7.2 Recommended inclusions .13
8 Labelling .14
Annex A (informative) Risk assessment examples .15
Annex B (informative) Types of hand-held laser processing machines.17
Bibliography .19
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ISO 11553-2:2007(E)
Foreword
ISO (the International Organization for Standardization) is a worldwide federation of national standards bodies
(ISO member bodies). The work of preparing International Standards is normally carried out through ISO
technical committees. Each member body interested in a subject for which a technical committee has been
established has the right to be represented on that committee. International organizations, governmental and
non-governmental, in liaison with ISO, also take part in the work. ISO collaborates closely with the
International Electrotechnical Commission (IEC) on all matters of electrotechnical standardization.
International Standards are drafted in accordance with the rules given in the ISO/IEC Directives, Part 2.
The main task of technical committees is to prepare International Standards. Draft International Standards
adopted by the technical committees are circulated to the member bodies for voting. Publication as an
International Standard requires approval by at least 75 % of the member bodies casting a vote.
Attention is drawn to the possibility that some of the elements of this document may be the subject of patent
rights. ISO shall not be held responsible for identifying any or all such patent rights.
ISO 11553-2 was prepared by Technical Committee ISO/TC 172, Optics and photonics, Subcommittee SC 9,
Electro-optical systems.
This first edition, together with ISO 11553-1, cancels and replaces ISO 11553:1996, which has been
technically revised.
ISO 11553 consists of the following parts, under the general title Safety of machinery — Laser processing
machines:
⎯ Part 1: General safety requirements
⎯ Part 2: Safety requirements for hand-held laser processing devices
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ISO 11553-2:2007(E)
Introduction
This document is a type C standard as stated in ISO 12100-1:2003.
The machinery concerned and the extent to which hazards, hazardous situations and events are covered are
indicated in the scope of this document. When provisions of this type C standard are different from those
which are stated in type A or B standards, the provisions of this type C standard take precedence over the
provisions of the other standards, for machines that have been designed and built according to the provisions
of this type C standard.
It is applicable to machines using laser radiation to process materials. The purpose of this part of ISO 11553 is
to prevent injuries to persons:
⎯ by listing potential hazards generated by machines containing lasers;
⎯ by specifying safety measures and verifications necessary for reducing the risk caused by specific
hazardous conditions;
⎯ by providing references to pertinent standards;
⎯ by specifying the information which is to be supplied to the users so that they can establish proper
procedures and precautions.
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INTERNATIONAL STANDARD ISO 11553-2:2007(E)
Safety of machinery — Laser processing machines —
Part 2:
Safety requirements for hand-held laser processing devices
1 Scope
This part of ISO 11553 specifies the requirements for laser processing devices, as defined in ISO 11553-1,
which are hand-held or hand-operated.
The purpose of this part of ISO 11553 is to draw attention to the particular hazards related to the use of
hand-held laser and hand-operated laser processing devices and to prevent personal injury. This includes
both the areas of hazard analysis and risk assessment as well as protective measures.
Requirements concerning noise as a hazard are not included in this part of ISO 11553. These requirements
are to be included in a subsequent amendment.
This part of ISO 11553 does not apply to laser products or equipment manufactured solely or expressly for
applications which are excluded from the scope of ISO 11553-1.
2 Normative references
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
ISO 3864-1:2002, Graphical symbols — Safety colours and safety signs — Part 1: Design principles for safety
signs in workplaces and public areas
ISO 3864-2:2004, Graphical symbols — Safety colours and safety signs — Part 2: Design principles for
product safety labels
ISO 3864-3:2006, Graphical symbols — Safety colours and safety signs — Part 3: Design principles for
graphical symbols used in safety signs
ISO 11145:2006, Optics and photonics — Lasers and laser-related equipment — Vocabulary and symbols
ISO 11252:2004, Lasers and laser related equipment — Laser device — Minimum requirements for
documentation
ISO 11553-1:2005, Safety of machinery — Laser processing machines — Part 1: General safety requirements
ISO 12100-1:2003, Safety of machinery — Basic concepts, general principles for design — Part 1: Basic
terminology, methodology
ISO 12100-2:2003, Safety of machinery — Basic concepts, general principles for design — Part 2: Technical
principles
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ISO 11553-2:2007(E)
ISO 13849-1:1999, Safety of machinery — Safety-related parts of control systems — Part 1: General
principles for design
ISO 13850:1996, Safety of machinery — Emergency stop — Principles for design
ISO 14118:2000, Safety of machinery — Prevention of unexpected start-up
ISO 14119:1998, Safety of machinery — Interlocking devices associated with guards — Principles for design
and selection
IEC 60204-1:2005, Safety of machinery — Electrical equipment of machines — Part 1: General requirements
IEC 60825-1 ed. 1.2:2001, Safety of laser products — Part 1: Equipment classification, requirements and
user’s guide
IEC/TR 60825-14:2004; Safety of laser products — Part 14: A user's guide
IEC 60825-4-am1:2002, Safety of laser products — Part 4: Laser guards
3 Terms and definitions
For the purposes of this document, the terms and definitions given in ISO 11145, ISO 11553-1, ISO 12100-1,
IEC 60825-4 and the following apply.
3.1
hand-held laser processing device
device in which a laser provides sufficient energy/power to melt, evaporate or cause a phase transition in
a part of the workpiece and where the laser output or workpiece to be processed is guided manually or
hand-held during the laser process
NOTE For the purposes of this document, the terms “hand-held” and “hand-operated” have the same meaning.
3.2
confined spaces
working areas surrounded on all sides, or for the most part, by solid walls where they, on account of their
confinement or containment of materials, preparation or equipment, augment or can augment particular
hazards that considerably exceed the hazard potential normally prevailing at workplaces
3.3
supply unit
all devices that provide the process energies and operating material supply, direct these energies to the point
of action and are absolutely necessary for the operation of the hand-held laser processing device (e.g. cooling
system, power and gas supply)
3.4
disposal units
equipment that captures and removes effluents and by-products during laser material processing passing
these on for filtration (e.g. capture devices, pipes, filtration systems, ventilation systems)
4 Hazards
4.1 Inherent hazards
The following hazards (see ISO 12100-1 and ISO 12100-2) may be generated by a laser-processing device:
a) mechanical hazards;
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ISO 11553-2:2007(E)
b) electrical hazards;
c) thermal hazards;
d) vibration hazards;
e) radiation hazards; examples include:
1) hazards generated by direct or reflected laser beams, (also take into account that radiation can occur
on the back of the workpiece, e.g. when cutting or due to transparency of the workpiece),
2) hazards generated by ionizing radiation,
3) hazards generated by collateral (UV, microwave, etc.) radiation produced, for example, by flash
lamps, discharge tubes or RF-power sources,
4) hazards generated by secondary radiation re-emitted by targets due to beam effects (the wavelength
of the re-emitted radiation may be different from that of the beam);
f) hazards generated by materials and substances; examples include:
1) hazards due to products which are used in the laser-processing device (e.g. laser gases, laser dyes,
solvents),
2) hazards resulting from interaction between the beam and the material (e.g. fumes, particles, vapours,
debris), fire or explosion,
3) hazards from associated gases (see for example 5.4.10) used to assist laser target interactions and
from any fumes that are produced; these hazards include explosion, fire, toxic effects and oxygen
depletion,
4) hazards due to the leakage of liquids (e.g. coolant);
g) hazards generated by neglecting ergonomic principles in the design of the laser-processing device.
4.2 Hazards induced by external effects (interferences)
Power conditions and the environment in which the laser-processing device operates may cause the device to
malfunction thus giving rise to hazardous conditions and/or making it necessary for someone to intervene
within hazard zones.
Additional environmental interferences include:
a) temperature;
b) humidity;
c) external shock/vibration;
d) vapours, dust or gases from the environment;
e) electromagnetic interference;
f) lightning strike;
g) source voltage interruption/fluctuation;
h) insufficient hardware/software compatibility and integrity;
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ISO 11553-2:2007(E)
i) hand-held laser processing devices capable of being separated from the radiation source (see also
Annex B);
j) non-observance of interface specification (including power limits, control signals).
4.3 Further hazards related to the use of hand-held laser processing devices
4.3.1 Confined rooms
Hand-held laser processing devices could be used in confined rooms. Hazards can be constituted by:
a) concentration of harmful substances in the room air;
b) enrichment of process gases (nitrogen, argon, helium, oxygen) in the room air;
c) oxygen depletion;
d) electrical current;
e) increased radiation hazard through direct as well as directly or diffusely reflected laser radiation;
f) increased tripping and impact (shock) hazard.
4.3.2 Working at heights
Hand-held laser processing devices may be used at heights above the ground or other load bearing surfaces.
Hazards are:
a) falling objects;
b) fall of the user.
4.3.3 Environmental effects
Hazards that can directly affect the user due to the prevailing environmental conditions. This applies in
particular when hand-held laser processing machines are used outdoors.
This includes the following environmental effects:
a) temperature (cold, heat);
b) humidity (rain, fog, hail);
c) mechanical effects (vibration, wind pressure);
d) electromagnetic effects (lightning strike);
e) visibility (sunlight, lighting).
5 Safety requirements and measures
5.1 General requirements
Machinery shall comply, as appropriate, with ISO 12100-1 or ISO 12100-2 for hazards that are not covered by
this part of ISO 11553.
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ISO 11553-2:2007(E)
Manufacturers shall ensure the safety of hand-held laser processing devices by:
a) hazard identification and risk analysis;
b) implementation of safety measures;
c) verification of the implemented safety measures;
d) provision of appropriate information for the user.
Based on the hazard identification (see 5.2), appropriate safety measures shall be incorporated into the
hand-held laser processing device by design and manufacture.
The following requirements shall be satisfied:
⎯ each manufacturer shall comply with the safety requirements and measures stipulated in this clause;
⎯ the manufacturer of a hand-held laser processing device is responsible for compliance of the complete
hand-held laser processing device with the requirements, including associated components (e.g. handling
unit, laser assembly).
These measures apply to all hazards specified in Clause 4 and reflect the results of hazard analysis and risk
assessment. The information given in Annexes A and B should be taken into account.
5.2 Risk assessment
A risk assessment shall be performed:
a) for all phases of hand-held laser processing device ”life” (as applicable); for examples see ISO 12100-1;
b) after each modification of the hand-held laser processing device by the person or organization
responsible for the modification.
A risk assessment involves a hazard identification, which includes but is not limited to:
c) hazards listed in 4.1 and 4.3;
d) danger zones, particularly those associated with
1) the laser system,
2) the laser beam path/propagation, beam delivery system,
3) the process zone,
4) interferences listed in 4.2.
The results of the risk assessment shall be duly documented.
5.3 Implementation of corrective measures
5.3.1 General requirements
Manufacturers shall ensure the safety of hand-held laser processing devices by:
⎯ hazard analysis and risk assessment;
⎯ integration of safety measures;
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ISO 11553-2:2007(E)
⎯ verification of safety measures;
⎯ provision of appropriate information for the user.
5.3.2 Protection against laser radiation hazards
5.3.2.1 General
The possibility of people being to exposed to levels of laser radiation exceeding the Maximum Permissible
4
Exposure (MPE) limits for 3 × 10 exposure, as defined in standards IEC 60825-1 and IEC/TR 60825-14, shall
be eliminated during operation.
To satisfy this, the following requirements shall be met:
a) Risk assessment shall be performed.
b) Unauthorized human access to a danger zone should be prevented by engineering controls as specified
in IEC 60825-1.
c) If access cannot be prevented, exposure above the ocular MPE shall be eliminated by use of engineering
or administrative controls, including Personal Protective Equipment.
1) The design of protective devices, such as shutters, guards, beam dissipation devices, trip devices
and deterring/impeding devices shall meet the requirements specified in IEC 60825-1. In cases of
ambiguity or difference of interpretation between ISO 12100-1 and ISO 12100-2 and IEC 60825-1,
the first two sentences of 5.3.2.1.1, 5.3.2.1.2 and 5.3.2.1.3 of ISO 11553-1:2005 shall be definitive.
2) The same protective device may be used to provide simultaneous protection against more than one
hazard.
5.3.2.2 Protection during operation
The principal danger zone is usually the process zone, but the danger zone must be defined as a result of the
risk assessment. The Nominal Hazard Area (NHA) as defined in IEC/TR 60825-14 or the volumetric space is
where laser radiation may exceed the MPE.
In the danger zone, human exposure shall be limited during operation to levels of laser radiation no greater
4
than the MPE for 3 × 10 s exposure duration by use of engineering or administrative controls, including the
use of Personal Protective Equipment (e.g. local protection using a protective enclosure or the provision of
personal protective equipment) such as eyewear and clothing.
5.3.2.3 Protection during service
During service procedures, human access to laser radiation exceeding the Accessible Emission limit (AEL) for
Class 1 is sometimes unavoidable. During servicing it shall be ensured that only authorized persons are
allowed access to zones exposed to levels of laser radiation that exceed the AEL values for Class 1. Laser-
processing devices shall therefore be designed and appropriate safety measures provided, with respect to the
following four situations listed in order of preference.
1) Servicing takes place outside danger zones.
2) Servicing takes place in danger zones to which access is controlled in the same manner as during
production (e.g. interlocked cover).
3) Servicing takes place in a danger zone (e.g. with open guards that are normally closed during
production) but accessible laser radiation does not exceed the AEL for Class 1.
4) Servicing takes place in danger zones, e.g. because opening of guards (normally closed during
production) is necessary. In this case, accessible laser radiation exceeds the AEL for Class 1.
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ISO 11553-2:2007(E)
The manufacturer shall indicate the class of accessible laser radiation and recommended safety procedures
for each of these situations (as applicable).
When servicing hand-held laser processing devices, the laser device should be switched off. For activities
(e.g. adjustment), where this is not possible, a nominal ocular hazard area should be established.
5.4 Design requirements
5.4.1 Design
The design of the hand-held laser processing devices shall take place according to ergonomic principles.
5.4.2 Protective enclosure
The technical design requirements for the protective enclosure shall be determined on the basis of risk
analysis.
5.4.3 Authorizing control device
For hand-held laser processing devices connected to an external laser device via a beam delivery system, a
technical device for the prevention of unauthorized operation (e.g. key-operated switch) shall be provided at
the hand-held laser processing device or in the immediate vicinity of the hand-held laser processing device.
5.4.4 Emission warning device
For hand-held laser processing devices, the following radiation warning devices shall be provided in the field
of vision of the operator:
Laser ready indicator:
⎯ every hand-held laser processing device shall have a visible laser ready indicator (e.g. LED).
Indication device for laser emissions:
⎯ in addition to the laser ready indicator, every hand-held laser processing device/laser device shall be
provided with an optical and/or acoustic indication device, which indicates laser radiation emissions
above Class 3R (e.g. LED).
The warning devices shall also be clearly visible when warning personal eye protection (laser eye-protectors).
5.4.5 Alignment laser
The beam power of the alignment laser (if available) shall not exceed the AEL values for Class
...
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