SIST EN 123200:2001

Sectional Specification: Single and double sided printed boards with plated-through holes

Supersedes CECC 23 200:1985 * D97/081: CECC/SC 52 disbanded

Rahmenspezifikation: Leiterplatten mit Leiterbildern auf einer oder auf beiden Seiten mit metallisierten Löchern

Spécification intermédiaire: Cartes imprimées simples et doubles faces avec trous métallisés

Sectional Specification: Single and double sided printed boards with plated-through holes

General Information

• Status: Published
• Publication Date: 28-Feb-2001
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 01-Mar-2001
• Due Date: 01-Mar-2001
• Completion Date: 01-Mar-2001
• Ref Project: EN 123200:1992 - Sectional Specification: Single and double sided printed boards with plated-through holes

Relations

• Amended By: SIST EN 123200:2001/A1:1997 - Sectional Specification: Single and double sided printed boards with plated-through holes
• Effective Date: 28-Jan-2023
• Amended By: SIST EN 123200:2001/A1:1997 - Sectional Specification: Single and double sided printed boards with plated-through holes
• Effective Date: 01-Aug-1997

Standards Content (Sample)

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Sectional Specification: Single and double sided printed boards with plated-through holesRahmenspezifikation: Leiterplatten mit Leiterbildern auf einer oder auf beiden Seiten mit metallisierten LöchernSpécification intermédiaire: Cartes imprimées simples et doubles faces avec trous métallisésSectional Specification: Single and double sided printed boards with plated-through holes31.180SORãþHPrinted circuits and boardsICS:Ta slovenski standard je istoveten z:EN 123200:1992SIST EN 123200:2001en01-marec-2001SIST EN
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