Surface mounting technology - Environmental and endurance test methods for surface mount solder joint -- Part 1-1: Pull strength test

The test method described in this part of IEC 62137 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.

Oberflächenmontage-Technik - Verfahren zur Prüfung auf Umgebungseinflüsse und zur Prüfung der Haltbarkeit von Oberflächen-Lötverbindungen - Teil 1-1: Zugfestigkeitsprüfung

Technique du montage en surface - Méthodes d'essai d'environnement et d'endurance des joints de soudure pour montage en surface - Partie 1-1: Essai de force d'arrachement

La méthode d'essai décrite dans la CEI 62137-1-1:2007 est applicable aux composants montés en surface, munis d'une sortie en aile de mouette. La méthode est conçue pour soumettre à essai et évaluer l'endurance du joint brasé entre les broches de raccordements et les plages d'accueil sur un substrat, via une contrainte mécanique de type traction. Cet essai permet d'évaluer les effets de variations répétées de la température sur la résistance du joint brasé entre les bornes du composant et les plages d'accueil sur un substrat.

Tehnologija površinske montaže - Okoljske in vzdržljivostne preskusne metode za spoje površinske montaže - 1-1. del: Preskus odtržne trdnosti (IEC 62137-1-1:2007)

General Information

Status
Published
Publication Date
22-Nov-2007
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
09-Oct-2007
Due Date
14-Dec-2007
Completion Date
23-Nov-2007

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SLOVENSKI STANDARD
SIST EN 62137-1-1:2008
01-januar-2008
Tehnologija površinske montaže - Okoljske in vzdržljivostne preskusne metode za

spoje površinske montaže - 1-1. del: Preskus odtržne trdnosti (IEC 62137-1-1:2007)

Surface mounting technology - Environmental and endurance test methods for surface

mount solder joint -- Part 1-1: Pull strength test

Oberflächenmontage-Technik - Verfahren zur Prüfung auf Umgebungseinflüsse und zur

Prüfung der Haltbarkeit von Oberflächen-Lötverbindungen - Teil 1-1:
Zugfestigkeitsprüfung

Technique du montage en surface - Méthodes d'essai d'environnement et d'endurance

des joints de soudure pour montage en surface - Partie 1-1: Essai de force
d'arrachement
Ta slovenski standard je istoveten z: EN 62137-1-1:2007
ICS:
19.040 Preskušanje v zvezi z Environmental testing
okoljem
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN 62137-1-1:2008 en,fr,de

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------
EUROPEAN STANDARD
EN 62137-1-1
NORME EUROPÉENNE
August 2007
EUROPÄISCHE NORM
ICS 31.190
English version
Surface mounting technology -
Environmental and endurance test methods
for surface mount solder joint -
Part 1-1: Pull strength test
(IEC 62137-1-1:2007)
Technique du montage en surface - Oberflächenmontage-Technik -
Méthodes d'essai d'environnement Verfahren zur Prüfung
et d'endurance des joints de soudure auf Umgebungseinflüsse
pour montage en surface - und zur Prüfung der Haltbarkeit
Partie 1-1: Essai de force d'arrachement von Oberflächen-Lötverbindungen -
(CEI 62137-1-1:2007) Teil 1-1: Zugfestigkeitsprüfung
(IEC 62137-1-1:2007)

This European Standard was approved by CENELEC on 2007-08-01. CENELEC members are bound to comply

with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard

the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on

application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other

language made by translation under the responsibility of a CENELEC member into its own language and notified

to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the

Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,

Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,

Sweden, Switzerland and the United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 62137-1-1:2007 E
---------------------- Page: 2 ----------------------
EN 62137-1-1:2007 - 2 -
Foreword

The text of document 91/681/FDIS, future edition 1 of IEC 62137-1-1, prepared by IEC TC 91, Electronics

assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC

as EN 62137-1-1 on 2007-08-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2008-05-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2010-08-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice

The text of the International Standard IEC 62137-1-1:2007 was approved by CENELEC as a European

Standard without any modification.

In the official version, for Bibliography, the following note has to be added for the standard indicated:

IEC 60068-2-21 NOTE Harmonized as EN 60068-2-21:2006 (not modified).
__________
---------------------- Page: 3 ----------------------
- 3 - EN 62137-1-1:2007
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated

references, only the edition cited applies. For undated references, the latest edition of the referenced

document (including any amendments) applies.

NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD

applies.
Publication Year Title EN/HD Year
1) 2)
IEC 60068-1 - Environmental testing - EN 60068-1 1994
Part 1: General and guidance
1) 2)
IEC 60068-2-14 - Environmental testing - EN 60068-2-14 1999
Part 2: Tests - Test N: Change of temperature
1) 2)
IEC 60194 - Printed board design, manufacture and EN 60194 2006
assembly - Terms and definitions
IEC 61188-5-5 200X Printed boards and printed board - -
assemblies - Design and use -
Part 5-5: Attachment (land/joint)
considerations - Components with gull-wing
leads on four sides
1) 2)
IEC 61190-1-1 - Attachment materials for electronic EN 61190-1-1 2002
assembly -
Part 1-1: Requirements for soldering fluxes
for high-quality interconnections in electronics
assembly
1) 2)
IEC 61190-1-2 - Attachment materials for electronic EN 61190-1-2 2007
assembly -
Part 1-2: Requirements for soldering paste for
high-quality interconnects in electronics
assembly
1) 2)
IEC 61190-1-3 - Attachment materials for electronic EN 61190-1-3 2007
assembly -
Part 1-3: Requirements for electronic grade
solder alloys and fluxed and non-fluxed solid
solders for electronic soldering applications
1) 2)
IEC 61249-2-7 - Materials for printed boards and other EN 61249-2-7 2002
interconnecting structures - + corr. September 2005
Part 2-7: Reinforced base materials, clad and
unclad - Epoxide woven E-glass laminated
sheet of defined flammability (vertical burning
test), copper-clad
Undated reference.
Valid edition at date of issue.
At draft stage.
---------------------- Page: 4 ----------------------
INTERNATIONAL IEC
STANDARD 62137-1-1
First edition
2007-07
Surface mounting technology –
Environmental and endurance test
methods for surface mount solder joint –
Part 1-1:
Pull strength test
PRICE CODE
Commission Electrotechnique Internationale P
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue
---------------------- Page: 5 ----------------------
– 2 – 62137-1-1 © IEC:2007(E)
CONTENTS

FOREWORD...........................................................................................................................3

1 Scope...............................................................................................................................5

2 Normative references .......................................................................................................5

3 Terms and definitions .......................................................................................................6

4 General remarks...............................................................................................................6

5 Test equipment and materials...........................................................................................7

5.1 Flow soldering equipment........................................................................................7

5.2 Reflow soldering equipment ....................................................................................7

5.3 Pull strength test equipment ....................................................................................7

5.4 Optical microscope..................................................................................................7

5.5 Test substrate .........................................................................................................7

5.6 Solder alloy .............................................................................................................8

5.7 Flux for flow soldering .............................................................................................8

5.8 Solder paste............................................................................................................8

6 Mounting method..............................................................................................................8

6.1 Flow soldering.........................................................................................................8

6.2 Reflow soldering......................................................................................................9

7 Test conditions ...............................................................................................................10

7.1 Test: Rapid change of temperature........................................................................10

7.2 Pull strength test ...................................................................................................10

8 Test procedure ...............................................................................................................10

8.1 Test sequence.......................................................................................................10

8.2 Pre-conditioning ....................................................................................................11

8.3 Initial pull strength measurement...........................................................................11

8.4 Rapid change of temperature ................................................................................11

8.5 Recovery...............................................................................................................11

8.6 Intermediate/final pull strength measurement ........................................................11

9 Items to be included in the test report.............................................................................11

10 Items to be given in the product specification .................................................................12

Annex A (normative) Pull strength test – Details ..................................................................13

Bibliography..........................................................................................................................15

Figure 1 – Gull-wing leaded component ..................................................................................6

Figure 2 – Area under evaluation in the pull strength test........................................................7

Figure 3 – Example of a flow soldering profile (actual measurement for double-wave

soldering) ...............................................................................................................................

Figure 4 – Typical reflow profile ............................................................................................10

Figure 5 – Test procedure.....................................................................................................11

Figure A.1 – Pull strength test...............................................................................................14

Figure A.2 – An example of the shape of the tip of the pulling jig ..........................................14

Figure A.3 – Failure modes in pull strength test ....................................................................14

---------------------- Page: 6 ----------------------
62137-1-1 © IEC:2007(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SURFACE MOUNTING TECHNOLOGY –
ENVIRONMENTAL AND ENDURANCE TEST METHODS
FOR SURFACE MOUNT SOLDER JOINT –
Part 1-1: Pull strength test
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC

Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested

in the subject dealt with may participate in this preparatory work. International, governmental and non-

governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

with the International Organization for Standardization (ISO) in accordance with conditions determined by

agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence

between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in

the latter.

5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any

equipment declared to be in conformity with an IEC Publication.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 62137-1-1 has been prepared by IEC technical committee 91:

Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/681/FDIS 91/697/RVD

Full information on the voting for the approval of this standard can be found in the report on

voting indicated in the above table.

This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

---------------------- Page: 7 ----------------------
– 4 – 62137-1-1 © IEC:2007(E)

A list of all the parts in the IEC 62137 series, under the general title Surface mounting

technology – Environmental and endurance test methods for surface mount solder joint, can

be found on the IEC website.

The committee has decided that the contents of this publication will remain unchanged until

the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in

the data related to the specific publication. At this date, the publication will be

• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.
---------------------- Page: 8 ----------------------
62137-1-1 © IEC:2007(E) – 5 –
SURFACE MOUNTING TECHNOLOGY –
ENVIRONMENTAL AND ENDURANCE TEST METHODS
FOR SURFACE MOUNT SOLDER JOINT –
Part 1-1: Pull strength test
1 Scope

The test method described in this part of IEC 62137 is applicable to gull-wing lead surface

mounting components.

The method is designed to test and evaluate the endurance of the solder joint between

component leads and lands on a substrate, by means of a pull type mechanical stress. This

test is suitable for evaluating the effects of repeated temperature change on the strength of

the solder joint between component terminals and lands on a substrate.
2 Normative references

The following referenced documents are indispensable for the application of this document.

For dated references, only the edition cited applies. For undated references, the latest edition

of the referenced document (including any amendments) applies.
IEC 60068-1: Environmental testing – Part 1: General and gui
...

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