SIST EN 61249-2-30:2013

Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate sheets of defined flammability (vertical burning test), copper-clad

This part of IEC 61249 gives requirements for properties of non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad in thicknesses of 0,03 mm up to 1,60 mm. The flammability rating is achieved through the use of non-halogenated inorganic and/or organic compounds acting as fire retardants. These fire retardants are contained as part of polymeric structure or in addition to it. The glass transition temperature is defined to be 160 °C minimum. Some property requirements may have several classes of performance. The class desired should be specified on the purchase order, otherwise the default class of material may be supplied.

Materialien für Leiterplatten und andere Verbindungsstrukturen - Teil 2-30: Kaschierte und unkaschierte verstärkte Basismaterialien - Kupferkaschierte mit E-Glasgewebe verstärkte Laminattafeln auf der Basis von Cyanatester-Harz, modifiziert mit halogenfreiem Epoxidharz, mit definierter Brennbarkeit (Brennprüfung mit vertikaler Prüflingslage)

Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-30: Matériaux de base renforcés, plaqués et non plaqués - Feuille stratifiée en tissu de verre époxyde non halogéné modifié et ester de cyanate, d'inflammabilité définie (essai de combustion verticale), plaquées cuivre

La CEI 61249-2-30:2012 fournit les exigences relatives aux propriétés des feuilles stratifiées en tissu de verre époxyde non halogéné modifié et ester de cyanate, d'inflammabilité définie (essai de combustion verticale), plaquées cuivre d'épaisseurs comprises entre 0,03 mm et 1,60 mm. Les caractéristiques d'inflammabilité sont obtenues par l'utilisation de composés non halogénés inorganiques et/ou organiques servant d'ignifuges. Ces ignifuges font partie de la structure polymère ou sont contenus en plus de celle-ci. La température de transition vitreuse est définie comme étant de 160 °C au minimum.

Materiali za plošče tiskanih vezij in druge povezovalne strukture - 2-30. del: Pokovinjeni in nepokovinjeni ojačeni osnovni materiali - S stekleno tkanino ojačen laminat z določeno gorljivostjo (navpični preskus gorljivosti), obdelan z modificirano, cianat ester nehalogenirano epoksidno smolo, pobakren

Ta del standarda IEC 61249 določa zahteve za lastnosti s stekleno tkanino ojačenega pobakrenega laminata z določeno gorljivostjo (navpični preskus gorljivosti), obdelanega z modificirano, cianat ester nehalogenirano epoksidno smolo, z debelino od 0,03 mm do 1,60 mm. Ocena gorljivosti se doseže z uporabo nehalogeniranih anorganskih in/ali organskih spojin, ki delujejo kot zaščitna sredstva proti ognju. Ta zaščitna sredstva proti ognju so vključena kot del polimerne strukture ali poleg nje. Točka posteklenitve je opredeljena kot najmanj 160 °C. Nekatere zahteve glede lastnosti lahko vključujejo več razredov lastnosti. Želeni razred naj bi bil opredeljen na naročilnici, sicer se lahko dobavi privzeti razred materiala.

General Information

• Status: Published
• Publication Date: 09-May-2013
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 09-May-2013
• Due Date: 14-Jul-2013
• Completion Date: 10-May-2013
• Ref Project: EN 61249-2-30:2013 - Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 61249-2-30:2013
01-junij-2013
0DWHULDOL]DSORãþHWLVNDQLKYH]LMLQGUXJHSRYH]RYDOQHVWUXNWXUHGHO
3RNRYLQMHQLLQQHSRNRYLQMHQLRMDþHQLRVQRYQLPDWHULDOL6VWHNOHQRWNDQLQRRMDþHQ
ODPLQDW]GRORþHQRJRUOMLYRVWMRQDYSLþQLSUHVNXVJRUOMLYRVWLREGHODQ]
PRGLILFLUDQRFLDQDWHVWHUQHKDORJHQLUDQRHSRNVLGQRVPRORSREDNUHQ
Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced
base materials clad and unclad - Non-halogenated epoxide modified cyanate ester
woven glass laminate sheets of defined flammability (vertical burning test), copper-clad
Materialien für Leiterplatten und andere Verbindungsstrukturen - Teil 2-30: Kaschierte
und unkaschierte verstärkte Basismaterialien - Kupferkaschierte mit E-Glasgewebe
verstärkte Laminattafeln auf der Basis von Cyanatester-Harz, modifiziert mit
halogenfreiem Epoxidharz, mit definierter Brennbarkeit (Brennprüfung mit vertikaler
Prüflingslage)
Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-30:
Matériaux de base renforcés, plaqués et non plaqués - Feuille stratifiée en tissu de verre
époxyde non halogéné modifié et ester de cyanate, d'inflammabilité définie (essai de
combustion verticale), plaquées cuivre
Ta slovenski standard je istoveten z: EN 61249-2-30:2013
ICS:
31.180 7LVNDQDYH]MD7,9LQWLVNDQH Printed circuits and boards
SORãþH
SIST EN 61249-2-30:2013 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 61249-2-30:2013

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SIST EN 61249-2-30:2013

EUROPEAN STANDARD
EN 61249-2-30

NORME EUROPÉENNE
March 2013
EUROPÄISCHE NORM

ICS 31.180


English version

Materials for printed boards and other interconnecting structures -
Part 2-30: Reinforced base materials clad and unclad -
Non-halogenated epoxide modified cyanate ester woven glass laminate of
defined flammability (vertical burning test), copper-clad
(IEC 61249-2-30:2012)

Matériaux pour circuits imprimés et autres Materialien für Leiterplatten und andere
structures d'interconnexion - Verbindungsstrukturen -
Partie 2-30: Matériaux de base renforcés, Teil 2-30: Kaschierte und unkaschierte
plaqués et non plaqués - verstärkte Basismaterialien -
Feuille stratifiée en tissu de verre époxyde Kupferkaschierte mit E-Glasgewebe
non halogéné modifié et ester de cyanate, verstärkte Laminattafeln auf der Basis von
d'inflammabilité définie (essai de Cyanatester-Harz, modifiziert mit
combustion verticale), plaquées cuivre halogenfreiem Epoxidharz, mit definierter
(CEI 61249-2-30:2012) Brennbarkeit (Brennprüfung mit vertikaler
Prüflingslage)
(IEC 61249-2-30:2012)

This European Standard was approved by CENELEC on 2013-01-03. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany,
Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland,
Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels


© 2013 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61249-2-30:2013 E

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SIST EN 61249-2-30:2013
EN 61249-2-30:2013 - 2 -
Foreword
The text of document 91/1051/FDIS, future edition 1 of IEC 61249-2-30, prepared by IEC TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN 61249-2-30:2013.

The following dates are fixed:
(dop) 2013-10-03
• latest date by which the document has
to be implemented at national level by
publication of an identical national
standard or by endorsement
(dow) 2016-01-03
• latest date by which the national
standards conflicting with the
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such patent
rights.

Endorsement notice
The text of the International Standard IEC 61249-2-30:2012 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60194:2006 NOTE  Harmonized as EN 60194:2006 (not modified).
ISO 9000:2005 NOTE  Harmonized as EN ISO 9000:2005 (not modified).
ISO 14001:2004 NOTE  Harmonized as EN ISO 14001:2004 (not modified).

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SIST EN 61249-2-30:2013
- 3 - EN 61249-2-30:2013
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year

IEC 61189-2 2006 Test methods for electrical materials, printed EN 61189-2 2006
boards and other interconnection structures
and assemblies -
Part 2: Test methods for materials for
interconnection structures


IEC 61249-5-1 1995 Materials for interconnection structures - EN 61249-5-1 1996
Part 5: Sectional specification set for
conductive foils and films with or without
coatings - Section 1: Copper foils (for the
manufacture of copper-clad base materials)


IEC/PAS 61249-6-3 2011 Specification for finished fabric woven from - -
"E" glass for printed boards


ISO 11014 2009 Safety data sheet for chemical products - - -
Content and order of sections

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SIST EN 61249-2-30:2013

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SIST EN 61249-2-30:2013



IEC 61249-2-30

®


Edition 1.0 2012-11




INTERNATIONAL



STANDARD




NORME



INTERNATIONALE











Materials for printed boards and other interconnecting structures –

Part 2-30: Reinforced base materials clad and unclad – Non-halogenated epoxide

modified cyanate ester woven glass laminate of defined flammability (vertical


burning test), copper-clad



Matériaux pour circuits imprimés et autres structures d'interconnexion –


Partie 2-30: Matériaux de base renforcés, plaqués et non plaqués – Feuille

stratifiée en tissu de verre époxyde non halogéné modifié et ester de cyanate,

d'inflammabilité définie (essai de combustion verticale), plaquée cuivre










INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE

PRICE CODE
INTERNATIONALE

CODE PRIX S


ICS 31.180 ISBN 978-2-83220-496-2



Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN 61249-2-30:2013
– 2 – 61249-2-30 © IEC:2012
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Materials and construction . 6
3.1 General . 6
3.2 Resin system . 6
3.3 Reinforcement . 7
3.4 Metal foil . 7
4 Internal marking . 7
5 Electrical properties . 7
6 Non-electrical properties of the copper-clad laminate . 7
6.1 Appearance of the copper-clad sheet . 7
6.1.1 General . 7
6.1.2 Indentations (pits and dents) . 8
6.1.3 Wrinkles . 8
6.1.4 Scratches . 8
6.1.5 Raised areas . 8
6.1.6 Surface waviness . 9
6.2 Appearance of the unclad face . 9
6.3 Laminate thickness . 9
6.4 Bow and twist . 10
6.5 Properties related to the copper foil bond . 10
6.6 Punching and machining . 10
6.7 Dimensional stability . 11
6.8 Sheet sizes . 11
6.8.1 Typical sheet sizes . 11
6.8.2 Tolerances for sheet sizes . 11
6.9 Cut panels . 11
6.9.1 Cut panel sizes . 11
6.9.2 Size tolerances for cut panels . 11
6.9.3 Rectangularity of cut panels . 12
7 Non-electrical properties of the base material after complete removal of the copper
foil . 12
7.1 Appearance of the dielectric base material . 12
7.2 Flexural strength . 13
7.3 Flammability . 13
7.4 Water absorption . 13
7.5 Measling. 14
7.6 Glass transition temperature and cure factor . 14
8 Quality assurance . 14
8.1 Quality system . 14
8.2 Responsibility for inspection . 15
8.3 Qualification inspection . 15
8.4 Quality conformance inspection . 15
8.5 Certificate of conformance . 15
8.6 Safety data sheet . 15

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SIST EN 61249-2-30:2013
61249-2-30 © IEC:2012 – 3 –
8.7 Packaging and marking . 15
9 Ordering information . 16
Annex A (informative) Engineering information . 17
Annex B (informative) Common laminate constructions . 19
Annex C (informative) Guideline for qualification and conformance inspection . 20
Bibliography . 21

Table 1 – Electrical properties . 7
Table 2 – Indentations . 8
Table 3 – Nominal thickness and tolerance of metal-clad laminate . 9
Table 4 – Bow and twist . 10
Table 5 – Pull-off and peel strength . 10
Table 6 – Dimensional stability . 11
Table 7 – Size tolerance for cut panels . 12
Table 8 – Rectangularity of cut panels . 12
Table 9 – Flexural strength . 13
Table 10 – Flammability . 13
Table 11 – Water absorption . 14
Table 12 – Measling. 14
Table 13 – Glass transition temperature and cure factor . 14
Table B.1 – Thickness . 19
Table C.1 – Qualification and conformance testing . 20

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SIST EN 61249-2-30:2013
– 4 – 61249-2-30 © IEC:2012
INTERNATIONAL ELECTROTECHNICAL COMMISSION
______________

MATERIALS FOR PRINTED BOARDS
AND OTHER INTERCONNECTING STRUCTURES –

Part 2-30: Reinforced base materials clad and unclad –
Non-halogenated epoxide modified cyanate ester woven glass laminate
of defined flammability (vertical burning test), copper-clad


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61249-2-30 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/1051/FDIS 91/1064/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

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SIST EN 61249-2-30:2013
61249-2-30 © IEC:2012 – 5 –
A list of all parts of the IEC 61249 series, under the general title Materials for printed boards
and other interconnecting structures, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

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SIST EN 61249-2-30:2013
– 6 – 61249-2-30 © IEC:2012
MATERIALS FOR PRINTED BOARDS
AND OTHER INTERCONNECTING STRUCTURES –

Part 2-30: Reinforced base materials clad and unclad –
Non-halogenated epoxide modified cyanate ester woven glass laminate
of defined flammability (vertical burning test), copper-clad



1 Scope
This part of IEC 61249 gives requirements for properties of non-halogenated epoxide modified
cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
in thicknesses of 0,03 mm up to 1,60 mm. The flammability rating is achieved through the use
of non-halogenated inorganic and/or organic compounds acting as fire retardants. These fire
retardants are contained as part of polymeric structure or in addition to it. The glass transition
temperature is defined to be 160 °C minimum.
Some property requirements may have several classes of performance. The class desired
should be specified on the purchase order, otherwise the default class of material may be
supplied.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 61189-2:2006, Test methods for electrical materials, printed boards and other
interconnection structures and assemblies – Part 2: Test methods for materials and other
interconnection structures
IEC 61249-5-1:1995, Materials for interconnection structures – Part 5: Sectional specification
set for conductive foils and films with or without coatings – Section 1: Copper foils (for the
manufacture of copper-clad base materials)
IEC/PAS 61249-6-3:2011, Specification for finished fabric woven from E-glass for printed
boards
ISO 11014:2009, Safety data sheet for chemical products – Content and order of sections
3 Materials and construction
3.1 General
The sheet consists of an insulating base with metal-foil bonded to one side or both.
3.2 Resin system
Non-halogenated epoxide modified cyanate ester resulting in a laminate with a glass
transition temperature of 160 °C minimum. The maximum total halogens contained in the resin
plus reinforcement matrix is 1 500 ppm, with a maximum chlorine of 900 ppm and maximum
bromine being 900 ppm.

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SIST EN 61249-2-30:2013
61249-2-30 © IEC:2012 – 7 –
Contrast agents may be added to enhance processing such as automated optical inspection
(AOI).
Its flame resistance is defined in terms of the flammability requirements of 7.3.
3.3 Reinforcement
Woven E-glass as specified in IEC/PAS 61249-6-3, woven E-glass fabric (for the manufacture
of prepreg and copper clad materials).
3.4 Metal foil
Copper as specified in IEC 61249-5-1, copper foil (for the manufacture of copper-clad
materials). The preferred foils are electrodeposited of defined ductility.
4 Internal marking
Not specified.
5 Electrical properties
The requirements for the electrical properties are shown in Table 1.
Table 1 – Electrical properties
Test method
Property Requirements
IEC 61189-2
Resistance of foil 2E12 As specified in IEC 61249-5-1
Surface resistance after damp heat while in
2E03 ≥10 000 MΩ
the humidity chamber (optional)
Surface resistance after damp heat and
2E03 ≥50 000 MΩ
recovery
Volume resistivity after damp heat while in
2E04 ≥10 000 MΩm
the humidity chamber (optional)
Volume resistivity after damp heat and
2E04 ≥50 000 MΩm
recovery
Relative permittivity after damp heat and
2E10
≤5,5
recovery at 1 MHz
Dissipation factor after damp heat and
2E10
≤0,020
recovery at 1 MHz
Electric strength(only for material
2E11 >30 kV/mm
thicknesses <0,5 mm)
Arc resistance (only for material
2E14 ≥120 s
thicknesses ≥ 0,5 mm thickness)
Dielectric breakdown (only for material
2E15 ≥40 kV
thicknesses ≥ 0,5 mm thickness)

6 Non-electrical properties of the copper-clad laminate
6.1 Appearance of the copper-clad sheet
6.1.1 General
The copper-clad face shall be substantially free from defects that may have an impact on the
material´s fitness for use for the intended purpose.

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SIST EN 61249-2-30:2013
– 8 – 61249-2-30 © IEC:2012
For the following specific defects the requirements given shall apply when inspection is
carried out in accordance with IEC 61189-2, method 2M18.
6.1.2 Indentations (pits and dents)
The size of an indentation, usually the length, shall be determined and given a point value to
be used as measure of the quality, see Table 2.
Table 2 – Indentations
Size Point value for each
indentation
mm
0,13 – 0,25 1
0,26 – 0,50 2
0,51 – 0,75 4
0,76 – 1,00 7
30
>1,00

The total point count for any 300 mm × 300 mm area shall be calculated to determine the
indentation class of the material.
Class A 29 maximum
Class B 17 maximum
Class C 5 maximum
Class D 0
Class X To be agreed upon by user and supplier
The required indentation class of material shall be specified in the purchase order.
Indentation Class A applies unless otherwise specified.
6.1.3 Wrinkles
There shall be no wrinkles in the copper surface.
6.1.4 Scratches
Scratches deeper than 10 µm or 20 % of the nominal thickness of the foil thickness,
whichever is lower, are not permitted.
Scratches with a depth less than 5 % of the nominal thickness of the foil shall not be counted
unless this depth is 10 µm or more.
Scratches with a depth between 5 % and 20 % of the nominal thickness of the foil are
permitted to a total length of 100 mm for a 300 mm × 300 mm area.
6.1.5 Raised areas
Raised areas are usually impressions caused by defects in the press plates used during
manufacture but may also be caused by blisters or inclusions of foreign particles under the
foil.
Raised areas caused by blisters or inclusions are not permitted.

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SIST EN 61249-2-30:2013
61249-2-30 © IEC:2012 – 9 –
Raised areas caused by impressions of defects in press plates are permitted to the following
extent:
Class A and X material Maximum height 15 µm and maximum length 15 mm
Class B and C material Maximum height 8 µm and maximum length 15 mm
Class D material Maximum height 5 µm and maximum length15 mm
6.1.6 Surface waviness
When examined in accordance to test method 2M12 of IEC 61189-2, the surface waviness in
both the machine and crossmachine direction shall not exceed 7 µm.
6.2 Appearance of the unclad face
The unclad face of a single-sided clad sheet shall have the natural appearance resulting from
the curing process. Small irregularities in colour are permitted. The gloss of the unclad face
shall be that given by the press plate, release film, or release foil used. Variations of gloss
due to the impact of pressure of gases released during the curing are permitted.
6.3 Laminate thickness
The laminate thickness may be ordered to include or exclude the copper foil contribution as
specified in the purchase order. As a general rule, laminates less than 0,8 mm are measured
excluding copper, and laminates greater or equal to 0,8 mm are measured including copper.
If the copper-clad laminate is tested in accordance with test method 2D01 of IEC 61189-2, the
thickness shall not depart from the nominal thickness by more than the appropriate value
shown in Table 3. The fine tolerances shall apply unless the other tolerances are ordered.
Table 3 – Nominal thickness and tolerance of metal-clad laminate
Nominal thickness Nominal thickness Tolerance requirement
excluding metal foil including metal foil
± mm
(material intended (material intended for single
for mutilayer boards) or double sided boards)
Coarse Fine Extra fine
mm mm
0,03 0,02 0,01
≥0,03 ≤ 0,10
0,04 0,03 0,02
>0,10 ≤ 0,15
0,05 0,04 0,03
>0,15 ≤ 0,30
0,08 0,05 0,04
>0,30 ≤ 0,50
0,09 0,06 0,05
>0,50 ≤ 0,80
0,13 0,09 0,07
>0,80 ≤ 1,00 ≥0,80 ≤ 1,00
...