SIST EN IEC 61188-6-1:2021

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

This part of IEC 61188 specifies the requirements for soldering surfaces on circuit boards. This
includes lands and land pattern for surface mounted components and also solderable hole
configurations for through-hole mounted components. These requirements are based on the
solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.

Leiterplatten und Flachbaugruppen - Konstruktion und Anwendung - Teil 6-1: Anschlussflächengestaltung - Allgemeine Anforderungen an die Anschlussflächenstruktur auf Leiterplatten

Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 6-1: Conception de la zone de report - Exigences génériques pour la zone de report sur les cartes imprimées

L’IEC 61188-6-1:2021 spécifie les exigences relatives aux surfaces de brasage sur les cartes imprimées. Cela comprend les pastilles et la zone de report des composants montés en surface, ainsi que les configurations des trous de brasage des composants montés par trous traversants. Ces exigences se fondent sur les exigences relatives au joint de brasure de l’IEC 61191-1, l’IEC 61191-2, l’IEC 61191-3 et l’IEC 61191-4.

Plošče tiskanih vezij in sestavi plošč tiskanih vezij - Zasnova in uporaba - 6-1. del: Razmestitev priključkov - Osnovne zahteve za razmestitev priključkov na tiskanih vezjih

General Information

• Status: Published
• Publication Date: 12-Sep-2021
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 28-Apr-2021
• Due Date: 03-Jul-2021
• Completion Date: 13-Sep-2021
• Ref Project: EN IEC 61188-6-1:2021 - Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

Relations

• Revised: SIST EN 61188-5-1:2003 - Printed boards and printed board assemblies - Design and use -- Part 5-1: Attachment (land/joint) considerations - Generic requirements
• Effective Date: 23-Mar-2021
• Replaces: SIST EN 61188-5-1:2003 - Printed boards and printed board assemblies - Design and use -- Part 5-1: Attachment (land/joint) considerations - Generic requirements
• Effective Date: 07-Jun-2022

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN IEC 61188-6-1:2021
01-oktober-2021
Nadomešča:
SIST EN 61188-5-1:2003
Plošče tiskanih vezij in sestavi plošč tiskanih vezij - Zasnova in uporaba - 6-1. del:
Razmestitev priključkov - Osnovne zahteve za razmestitev priključkov na tiskanih
vezjih
Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern
design - Generic requirements for land pattern on circuit boards
Ta slovenski standard je istoveten z: EN IEC 61188-6-1:2021
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
SIST EN IEC 61188-6-1:2021 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN IEC 61188-6-1:2021

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SIST EN IEC 61188-6-1:2021


EUROPEAN STANDARD EN IEC 61188-6-1

NORME EUROPÉENNE

EUROPÄISCHE NORM
April 2021
ICS 31.180; 31.190 Supersedes EN 61188-5-1:2002 and all of its
amendments and corrigenda (if any)
English Version
Circuit boards and circuit board assemblies - Design and use -
Part 6-1: Land pattern design - Generic requirements for land
pattern on circuit boards
(IEC 61188-6-1:2021)
Cartes imprimées et cartes imprimées équipées - Leiterplatten und Flachbaugruppen - Konstruktion und
Conception et utilisation - Partie 6-1: Conception de la zone Anwendung - Teil 6-1: Anschlussflächengestaltung -
de report - Exigences génériques pour la zone de report sur Allgemeine Anforderungen an die Anschlussflächenstruktur
les cartes imprimées auf Leiterplatten
(IEC 61188-6-1:2021) (IEC 61188-6-1:2021)
This European Standard was approved by CENELEC on 2021-03-30. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2021 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN IEC 61188-6-1:2021 E

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SIST EN IEC 61188-6-1:2021
EN IEC 61188-6-1:2021 (E)

European foreword
The text of document 91/1636/CDV, future edition 1 of IEC 61188-6-1, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61188-6-1:2021.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2021-12-30
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2024-03-30
document have to be withdrawn
This document supersedes EN 61188-5-1:2002 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 61188-6-1:2021 was approved by CENELEC as a
European Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 61188-5-1:2002 NOTE Harmonized as EN 61188-5-1:2002 (not modified)
IEC 61188-5-2:2003 NOTE Harmonized as EN 61188-5-2:2003 (not modified)
IEC 61188-5-3:2007 NOTE Harmonized as EN 61188-5-3:2007 (not modified)
IEC 61188-5-4:2007 NOTE Harmonized as EN 61188-5-4:2007 (not modified)
IEC 61188-5-5:2007 NOTE Harmonized as EN 61188-5-5:2007 (not modified)
IEC 61188-5-6:2003 NOTE Harmonized as EN 61188-5-6:2003 (not modified)
IEC 61188-5-8:2007 NOTE Harmonized as EN 61188-5-8:2008 (not modified)
IEC 61188-6-2 NOTE Harmonized as EN IEC 61188-6-2
IEC 61760-1 NOTE Harmonized as EN IEC 61760-1

2

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SIST EN IEC 61188-6-1:2021
EN IEC 61188-6-1:2021 (E)

Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60194 - Printed board design, manufacture and - -
assembly - Terms and definitions
IEC 61191-1 - Printed board assemblies - Part 1: Generic EN IEC 61191-1 -
specification - Requirements for soldered
electrical and electronic assemblies using
surface mount and related assembly
technologies
IEC 61191-2 2017 Printed board assemblies - Part 2: EN 61191-2 2017
Sectional specification - Requirements for
surface mount soldered assemblies
IEC 61191-3 - Printed board assemblies - Part 3: EN 61191-3 -
Sectional specification - Requirements for
through-hole mount soldered assemblies
IEC 61191-4 - Printed board assemblies - Part 4: EN 61191-4 -
Sectional specification - Requirements for
terminal soldered assemblies
IEC 61760-3 - Surface mounting technology - Part 3: EN IEC 61760-3 -
Standard method for the specification of
components for through-hole reflow (THR)
soldering

3

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SIST EN IEC 61188-6-1:2021




IEC 61188-6-1

®


Edition 1.0 2021-02




INTERNATIONAL



STANDARD




NORME


INTERNATIONALE
colour

inside










Circuit boards and circuit board assemblies – Design and use –

Part 6-1: Land pattern design – Generic requirements for land pattern on

circuit boards



Cartes imprimées et cartes imprimées équipées – Conception et utilisation –

Partie 6-1: Conception de la zone de report – Exigences génériques pour la zone


de report sur les cartes imprimées













INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE


INTERNATIONALE




ICS 31.180; 31.190 ISBN 978-2-8322-9443-7




Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN IEC 61188-6-1:2021
– 2 – IEC 61188-6-1:2021 © IEC 2021
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 7
4 Design requirements . 10
4.1 General . 10
4.2 Product classification . 10
4.3 General surface mount land and land pattern requirements. 11
4.4 Component packages and soldering process . 11
4.5 Soldering surface requirements. 11
4.5.1 Main soldering techniques . 11
4.5.2 Reflow soldering . 11
4.5.3 Reflow soldering of leaded components . 12
4.5.4 Wave soldering of surface mounted components . 12
4.5.5 Wave soldering of through-hole mounted components . 14
4.6 Soldering surface definition techniques . 15
4.6.1 General . 15
4.6.2 Metal defined lands . 15
4.6.3 Solder mask defined lands . 15
4.6.4 Comparison of solder mask defined and non solder mask defined
solderable surfaces . 16
5 Component classification . 16
5.1 General . 16
5.2 Leaded components . 16
5.3 Surface mount components . 17
6 The proportional dimensioning system . 17
7 Terminal classification . 18
7.1 Leaded terminals . 18
7.2 Surface mount terminals . 18
7.2.1 Terminal classes. 18
7.2.2 Flat bottom terminals . 18
7.2.3 General land requirements for flat bottom terminals . 19
7.2.4 Flat bottom and vertical side terminals . 19
7.2.5 General land requirements for flat bottom and vertical side terminals . 20
8 Requirements for lands of solder joints . 20
8.1 Land/Pad dimensioning considerations of leaded terminals . 20
8.2 Land dimensioning considerations of surface mount terminals . 20
Annex A (informative)  Dimensioning concept of former IEC 61188-5-1 . 21
A.1 Dimensioning systems . 21
A.1.1 General . 21
A.1.2 Component tolerancing . 22
A.1.3 Solving for dimension Z . 25
A.1.4 Land tolerancing . 25
A.1.5 Fabrication allowances . 25
A.1.6 Assembly tolerancing . 26

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SIST EN IEC 61188-6-1:2021
IEC 61188-6-1:2021 © IEC 2021 – 3 –
A.1.7 Dimension and tolerance analysis . 27
Annex B (informative)  History of land dimensioning standards . 29
B.1 IPC-782 . 29
B.2 IEC 61188-5 series . 29
B.3 IPC-7351 . 29
Bibliography . 30

Figure 1 – Component placed on solder paste . 12
Figure 2 – Component glued for wave soldering. 13
Figure 3 – Wave soldered component with solder thieves . 14
Figure 4 – Solder joint of a leaded component . 15
Figure 5 – Leaded component – Capacitor . 17
Figure 6 – Surface mount component – Chip capacitor . 17
Figure 7 – Flat bottom terminals with wettable flanks . 18
Figure A.1 – Profile tolerancing method . 21
Figure A.2 – Example of 3216M capacitor dimensioning for optimum solder fillet
condition . 22
Figure A.3 – Profile dimensioning of gull-wing leaded SOIC . 23
Figure A.4 – Pitch for multiple leaded component . 28

Table 1 – Flat bottom terminals . 19
Table 2 – Flat bottom/vertical side terminals . 19
Table A.1 – Conductor width tolerances . 26
Table A.2 – Feature location accuracy . 26

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INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

CIRCUIT BOARDS AND CIRCUIT BOARD ASSEMBLIES –
DESIGN AND USE –

Part 6-1: Land pattern design –
Generic requirements for land pattern on circuit boards

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 61188-6-1 has been prepared by IEC technical committee 91: Electronics assembly
technology. It is an International Standard.
This first edition cancels and replaces the first edition of IEC 61188-5-1 published in 2002, and
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) The content is completely updated to reflect current industry requirements. See Introduction.

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SIST EN IEC 61188-6-1:2021
IEC 61188-6-1:2021 © IEC 2021 – 5 –
The text of this International Standard is based on the following documents:
Draft Report on voting
91/1636/CDV 91/1671/RVC

Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.
A list of all parts in the IEC 61188 series, published under the general title Circuit boards and
circuit board assemblies – Design and use, can be found on the IEC website.
Future documents in this series will carry the new general title as cited above. Titles of existing
documents in this series will be updated at the time of the next edition.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
 reconfirmed,
 withdrawn,
 replaced by a revised edition, or
 amended.

IMPORTANT – The "colour inside" logo on the cover page of this document indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this document using a colour printer.

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SIST EN IEC 61188-6-1:2021
– 6 – IEC 61188-6-1:2021 © IEC 2021
INTRODUCTION
Explanation why the following standards will be replaced by the new IEC 6188-6 series:
IEC 61188-5-1:2002, Printed boards and printed board assemblies – Design and use – Part 5‑1:
Attachment (land/joint) considerations – Generic requirements
‑2:
IEC 61188-5-2:2003, Printed boards and printed board assemblies – Design and use – Part 5
Attachment (land/joint) considerations – Discrete components
IEC 61188-5-3:2007, Printed boards and printed board assemblies – Design and use – Part 5‑3:
Attachment (land/joint) considerations – Components with gull-wing leads on two sides
IEC 61188-5-4:2007, Printed boards and printed board assemblies – Design and use – Part 5‑4:
Attachment (land/joint) considerations – Components with J leads on two sides
IEC 61188-5-5:2007, Printed boards and printed board assemblies – Design and use – Part 5‑5:
Attachment (land/joint) considerations – Components with gull-wing leads on four sides
‑6:
IEC 61188-5-6:2003, Printed boards and printed board assemblies – Design and use – Part 5
Attachment (land/joint) considerations – Chip carriers with J-leads on four sides
IEC 61188-5-8:2007, Printed board and printed board assemblies – Design and use – Part 5‑8:
Attachment (land/joint) considerations – Area array components (BGA, FBGA, CGA, LGA)
Content is mostly equivalent to IPC-782A with Amendments 1 and 2, which was replaced in
2002 by IPC-7351. The component spectrum and pitch levels have dramatically increased since
publication of the IEC 61188-5 (all parts) and the dimensioning concept does no longer fulfil the
mounting and soldering requirements.

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SIST EN IEC 61188-6-1:2021
IEC 61188-6-1:2021 © IEC 2021 – 7 –
CIRCUIT BOARDS AND CIRCUIT BOARD ASSEMBLIES –
DESIGN AND USE –

Part 6-1: Land pattern design –
Generic requirements for land pattern on circuit boards



1 Scope
This part of IEC 61188 specifies the requirements for soldering surfaces on circuit boards. This
includes lands and land pattern for surface mounted components and also solderable hole
configurations for through-hole mounted components. These requirements are based on the
solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60194, Printed board design, manufacture and assembly – Terms and definitions
IEC 61191-1, Printed board assemblies – Part 1: Generic specification – Requirements for
soldered electrical and electronic assemblies using surface mount and related assembly

technologies
IEC 61191-2:2017, Printed board assemblies – Part 2: Sectional specification – Requirements
for surface mount soldered assemblies
IEC 61191-3, Printed board assemblies – Part 3: Sectional specification – Requirements for
through-hole mount soldered assemblies
IEC 61191-4, Printed board assemblies – Part 4: Sectional specification – Requirements for
terminal soldered assemblies
IEC 61760-3, Surface mounting technology – Part 3: Standard method for the specification of
components for through hole reflow (THR) soldering
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60194, and the
following apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp

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3.1
assembly
number of parts, subassemblies or combinations thereof joined together
Note 1 to entry: This term can be used in conjunction with other terms listed herein, for example, "printed board
assembly".
[SOURCE: IEC 60194:2015, 80.1327, modified – The second term "assembled board" has been
removed.]
3.2
annular ring
portion of conductive material that completely surrounds a hole
3.3
basic dimension
numerical value used to describe the theoretical exact location of a feature or hole
Note 1 to entry: it is the basis from which permissible variations are established by tolerance on other dimensions
in notes or by feature-control symbols.
[SOURCE: IEC 60194-1:2021, 3.2.24, modified – In the definition "for example a hole" has been
replaced by "or hole".]
3.4
castellation
recessed metallised feature on the edge of a leadless chip carrier that is used to interconnect
conducting surfaces or planes within or on the chip carrier
[SOURCE: IEC 60194-1:2021, 3.3.17]
3.5
component
individual part or combination of parts that, when together, perform (a) design function(s)
Note 1 to entry: See also "discrete component" in 3.4.17 of IEC 60194-2:2017.
[SOURCE: IEC 60194-2:2017, 3.3.19]
3.6
land
portion of a conductive pattern usually, but not exclusively, used for the connection and/or
attachment of components
3.7
land pattern
footprint
combination of lands that is used for the mounting, interconnection and testing of a particular
component
Note 1 to entry: Land pattern is also known as "footprint".
[SOURCE: IEC 60194-1:2021, 3.12.9]
3.8
nominal dimension
dimension that is between the maximum and minimum size of a feature (the tolerance on a
nominal dimension gives the limits of variation of a feature size)

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IEC 61188-6-1:2021 © IEC 2021 – 9 –
3.9
plated through-hole
PTH
hole with plating on its walls that makes an electrical connection between conductive patterns
on internal layers, external layers, or both, of a printed board
[SOURCE: IEC 60194-1, 3.16.72, modified – The figure has been removed.]
3.10
printed board
PB
completely processed printed circuit and printed wiring configurations
Note 1 to entry: This includes single-sided, double-sided and multilayer boards with rigid, flexible, and rigid-flex
base materials.
Note 2 to entry: "Printed board" is a general term.
[SOURCE: IEC 60194-2:2017, 3.16.23, modified – The second term "board" has been removed
as well as the admitted terms "card" and "circuit card.]
3.11
registration
degree of conformity of the position of a pattern (or portion thereof), a hole, or other feature to
its intended position on a product
[SOURCE: IEC 60194-1:2021, 3.18.28]
3.12
soldering surface
solderable metallized surfaces on circuit boards
Note 1 to entry: This includes lands, annular rings and solderable surfaces of plated through-holes.
3.13
SOIC
small outline integrated circuit
surface-mount technology
SMT
technology where electrical connection of components is made to the surface of a conductive
pattern of a printed board and does not utilize component lead holes
3.14
terminal
connection element of an electronic component
3.15
through-hole technology
THT
assembly process for mounting component packages where leads are passed through
supported (plated-through) or unsupported (bare) holes in an interconnection substrate
3.16
via
plated through-hole that is used as an interlayer connection, but in which there is no intention
to insert a component lead or other reinforcing material
Note 1 to entry: See also "blind via" and "buried via" in 3.2.57 and 3.2.118 of IEC 60194-1:2021.
[SOURCE: IEC 60194-1:2021, 3.22.15]

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