SIST EN 62326-1:2003
(Main)Printed boards -- Part 1: Generic specification
Printed boards -- Part 1: Generic specification
Defines capability approval procedures for printed boards. In addition, a technology approval schedule may also be provided as an alternative for manufacturers employing a system of process control for establishing product conformity. Both CA and TA procedures apply to printed boards irrespective of their methods of manufacture, when they are ready for the mounting of components.
Leiterplatten -- Teil 1: Fachgrundspezifikation
Cartes imprimées -- Partie 1: Spécification générique
Définit les procédures d'agrément de savoir-faire pour les cartes imprimées. De plus, l'agrément de technologie peut être également fourni en tant que variante pour les fabricants utilisant un système de commande de processus en vue de l'établissement de la conformité de produit. Les procédures CA et TA s'appliquent aux cartes imprimées, indépendamment de leurs procédés de fabrication, lorsqu'elles sont prêtes pour le montage des composants.
Printed boards - Part 1: Generic specification
General Information
Relations
Standards Content (Sample)
SIST EN 62326-1:2003SLOVENSKIapril 2003
STANDARDPrinted boards - Part 1: Generic specification©
Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljenoReferenčna številkaSIST EN 62326-1:2003(en)ICS31.180
EUROPEAN STANDARDEN 62326-1NORME EUROPÉENNEEUROPÄISCHE NORMJune 2002CENELECEuropean Committee for Electrotechnical StandardizationComité Européen de Normalisation ElectrotechniqueEuropäisches Komitee für Elektrotechnische NormungCentral Secretariat: rue de Stassart 35, B - 1050 Brussels© 2002 CENELEC -All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.Ref. No. EN 62326-1:2002 EICS 31.180Supersedes EN 62326-1:1997English versionPrinted boardsPart 1: Generic specification(IEC 62326-1:2002)Cartes impriméesPartie 1: Spécification générique(CEI 62326-1:2002)LeiterplattenTeil 1: Fachgrundspezifikation(IEC 62326-1:2002)This European Standard was approved by CENELEC on 2002-06-01. CENELEC members are bound tocomply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this EuropeanStandard the status of a national standard without any alteration.Up-to-date lists and bibliographical references concerning such national standards may be obtained onapplication to the Central Secretariat or to any CENELEC member.This European Standard exists in three official versions (English, French, German). A version in any otherlanguage made by translation under the responsibility of a CENELEC member into its own language andnotified to the Central Secretariat has the same status as the official versions.CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta,Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.
EN 62326-1:2002- 2 -ForewordThe text of document 91/274/FDIS, future edition 2 of IEC 62326-1, prepared by IEC TC 91, Electronicsassembly technology, was submitted to the IEC-CENELEC parallel vote and was approved byCENELEC as EN 62326-1 on 2002-06-01.This European Standard supersedes EN 62326-1:1997.The following dates were fixed:–latest date by which the EN has to be implementedat national level by publication of an identicalnational standard or by endorsement(dop)2003-03-01–latest date by which the national standards conflictingwith the EN have to be withdrawn(dow)2005-06-01Annexes designated "normative" are part of the body of the standard.Annexes designated "informative" are given for information only.In this standard, annexes M and ZA are normative and annexes A, B, C, D, E,
F, G, H, I, J, K and Lare informative.Annex ZA has been added by CENELEC.__________Endorsement noticeThe text of the International Standard IEC 62326-1:2002 was approved by CENELEC as a EuropeanStandard without any modification.__________
- 3 -EN 62326-1:2002Annex ZA(normative)Normative references to international publicationswith their corresponding European publicationsThis European Standard incorporates by dated or undated reference, provisions from otherpublications. These normative references are cited at the appropriate places in the text and thepublications are listed hereafter. For dated references, subsequent amendments to or revisions of anyof these publications apply to this European Standard only when incorporated in it by amendment orrevision. For undated references the latest edition of the publication referred to applies (includingamendments).NOTEWhen an international publication has been modified by common modifications, indicated by (mod), the relevantEN/HD applies.PublicationYearTitleEN/HDYearIEC 60194- 1)Printed board design, manufacture andassembly - Terms and definitions--IEC 61182-11994Printed boards - Electronic datadescription and transferPart 1: Printed board description indigital form--IEC 61189-31997Test methods for electrical materials,printed boards and otherinterconnection structures andassembliesPart 3: Test methods for interconnectionstructures (printed boards)EN 61189-31997IEC 61249-2-4- 1)Materials for printed boards and otherinterconnecting structuresPart 2-4: Reinforced base materials,clad and unclad - Polyester non-woven/woven fibreglass laminated sheetof defined flammability (vertical burningtest), copper-cladEN 61249-2-42002 2)IEC 61249-2-7- 1)Part 2-7: Reinforced base materials cladand unclad - Epoxide woven E-glasslaminated sheet of defined flammability(vertical burning test), copper-cladEN 61249-2-72002 2)IEC 61249-2-12- 1)Part 2-12: Sectional specification set forreinforced base materials, clad andunclad - Epoxide non-woven aramidlaminate of defined flammability,copper-cladEN 61249-2-121999 2)IEC 62326SeriesPrinted boardsEN 62326Series
1) Undated reference.2) Valid edition at date of issue.
EN 62326-1:2002- 4 -PublicationYearTitleEN/HDYearIEC 62326-4- 1)Part 4: Rigid multilayer printed boardswith interlayer connections - SectionalspecificationEN 62326-41997 2)IEC 62326-4-1- 1)Part 4: Rigid multilayer printed boardswith interlayer connections - SectionalspecificationSection 1: Capability DetailSpecification - Performance levels A, Band CEN 62326-4-11997 2)IEC QC 001001- 1)IEC quality assessment system forelectronic components (IECQ) - Basicrules--IEC QC 001002-1- 1)IEC quality assessment system forelectronic components (IECQ) - Rulesof procedurePart 1: Administration--IEC QC 001002-2- 1)Part 2: Documentation--IEC QC 001002-3- 1)Part 3: Approval procedures--IEC QC 001005- 1)Register of firms, products and servicesapproved under the IECQ system,including ISO 9000--ISO 90012000Quality management systems -RequirementsEN ISO 90012000
NORMEINTERNATIONALECEIIECINTERNATIONALSTANDARD62326-1QC 230000Deuxième éditionSecond edition2002-03Cartes imprimées –Partie 1:Spécification génériquePrinted boards –Part 1:Generic specificationPour prix, voir catalogue en vigueurFor price, see current catalogue© IEC 2002
Droits de reproduction réservés
⎯
Copyright - all rights reservedAucune partie de cette publication ne peut être reproduite niutilisée sous quelque forme que ce soit et par aucun procédé,électronique ou mécanique, y compris la photocopie et lesmicrofilms, sans l'accord écrit de l'éditeur.No part of this publication may be reproduced or utilized in anyform or by any means, electronic or mechanical, includingphotocopying and microfilm, without permission in writing fromthe publisher.International Electrotechnical Commission,
3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, SwitzerlandTelephone: +41 22 919 02 11
Telefax: +41 22 919 03 00
E-mail: inmail@iec.ch
Web: www.iec.chCODE PRIXPRICE CODEXACommission Electrotechnique InternationaleInternational Electrotechnical Commission
62326-1 © IEC:2002– 3 –CONTENTSFOREWORD.9INTRODUCTION.131Scope.152Normative references.153General.173.1General considerations.173.2Structure of the specification series.194Particular stipulations.254.1Primary stage of manufacture.254.2Structurally similar printed boards.254.3Certified records of released lots (CRRL).254.4Delayed delivery.254.5Release for delivery before the completion of all tests.274.6Re-submission of rejected lots.274.7Marking of printed boards and package.274.7.1Printed boards.274.7.2Package.274.8Ordering information.275Capability approval and maintenance of capability approval.275.1General.275.2Capability approval requirements.295.3Description of capability.295.4Register of firms, products and services information (RFPS).295.5Demonstration of IECQ capability.315.5.1Test programme.315.5.2Product capability.315.5.3Process capability.335.6Capability approval test report.355.7Range of capability approval.355.7.1Range of product capability.355.7.2Range of process capability.355.7.3Extended range of approval of product/process capability.355.7.4Significant changes.375.7.5Amendment procedures.375.8Maintenance of capability approval.375.9Suspension and withdrawal of capability approval.395.10Capability approval testing.395.11Inspection information in the Cap DS.396Quality assessment.396.1Quality conformance inspection.396.2Groupings of tests.41
62326-1 © IEC:2002– 5 –6.2.1Category V inspection (visual).436.2.2Category D inspection (dimensional).436.2.3Category S inspection (surface condition).436.2.4Category E inspection (electrical).456.2.5Category P inspection (physical).456.2.6Category Y inspection (structure integrity).456.2.7Category Z inspection.456.3Inspection information in the CDS.456.4IECQ technology approval.476.5Indirect measuring methods.477Rules for the preparation of detail specifications.477.1Capability detail specification (Cap DS).477.1.1Requirements for the preparation of the Cap DS.477.1.2Numbering and content.477.1.3Drawing information.497.2Customer detail specification (CDS).497.2.1General.497.2.2Numbering and content.517.2.3Drawing information.517.2.4Electronic manufacturing data.537.2.5Marking.537.2.6Performance requirements.53Annex A (informative)
Example of a CDS check-list.55Annex B (informative)
Future structure of the specification series.57Annex C (informative)
Structure of the capability qualifying component (CQC).59Annex D (informative)
Abbreviations and acronyms related to IECQand their explanations.61Annex E (informative)
Guide to the form and content of a capability manual.63E.1General requirements.63E.2Scope of capability approval.67E.3Technology (process description).67E.4Subcontracting.69E.5Limits of capability.69E.6Description of capability.71E.7Manufacturer to customer interface.73E.8Design rules.73E.9Materials list.73E.10Manufacture.73E.11Procedure in the event of CQC or product failure.75E.12Test programme for capability approval.75E.13Maintenance of approval.79E.14Modifications to the capability approval.79
62326-1 © IEC:2002– 7 –Annex F (informative)
Example of process description.83F.1Base materials.83F.2Basic processing method.83F.3Method of pattern or image definition.83F.4Method of producing holes.83F.5Method of producing board shape.83F.6Method of construction.83F.7Metallic and organic finishes.83F.8Types of interconnections.83Annex G (informative)
Example of limits of approval.85Annex H (informative)
Example of description of capability.87Annex I (informative)
Example of manufacturer-to-customer interface.89Annex J (informative)
Example of CQC detail specification.91Annex K (informative)
Example of test programme matrix.97Annex L (informative)
Example of test programme schedule.99Annex M (normative)
Requirements for capability approval test reports.101Table 1 – Sample size selection.41Table C.1 – Capability qualifying component (CQC).59Table E.1 – Content of a capability manual.67
62326-1 © IEC:2002– 9 –INTERNATIONAL ELECTROTECHNICAL COMMISSION___________PRINTED BOARDS –Part 1: Generic specificationFOREWORD1)The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprisingall national electrotechnical committees (IEC National Committees). The object of the IEC is to promoteinternational co-operation on all questions concerning standardization in the electrical and electronic fields. Tothis end and in addition to other activities, the IEC publishes International Standards. Their preparation isentrusted to technical committees; any IEC National Committee interested in the subject dealt with mayparticipate in this preparatory work. International, governmental and non-governmental organizations liaisingwith the IEC also participate in this preparation. The IEC collaborates closely with the International Organizationfor Standardization (ISO) in accordance with conditions determined by agreement between the twoorganizations.2)The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, aninternational consensus of opinion on the relevant subjects since each technical committee has representationfrom all interested National Committees.3)The documents produced have the form of recommendations for international use and are published in the formof standards, technical specifications, technical reports or guides and they are accepted by the NationalCommittees in that sense.4)
In order to promote international unification, IEC National Committees undertake to apply IEC InternationalStandards transparently to the maximum extent possible in their national and regional standards. Anydivergence between the IEC Standard and the corresponding national or regional standard shall be clearlyindicated in the latter.5)
The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for anyequipment declared to be in conformity with one of its standards.6)
Attention is drawn to the possibility that some of the elements of this international standard may be the subjectof patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.International Standard IEC 62326-1 has been prepared by IEC technical committee 91:Electronics assembly technology.This second edition cancels and replaces the first edition, published in 1996, and constitutes atechnical revision.The text of this standard is based on the following documents:FDISReport on voting91/274/FDIS91/285/RVDFull information on the voting for approval of this standard can be found in the report on votingindicated in the above table.This publication has been drafted in accordance with the ISO/IEC Directives, Part 3.Annex M forms an integral part of this standard.Annexes A through L are for information only.
62326-1 © IEC:2002– 11 –The QC number that appears on the front cover of this publication is the specification numberin the IEC Quality Assessment System for Electronic Components (IECQ).The committee has decided that the contents of this publication will remain unchanged until2007. At this date, the publication will be•reconfirmed;•withdrawn;•replaced by a revised edition, or•amended.
62326-1 © IEC:2002– 13 –INTRODUCTIONIEC 62326 is applicable to printed boards, irrespective of their method of manufacture, whenthey are ready for the mounting of components.IEC 62326 is composed of separate parts covering information for the designer, manufacturer,and user generic, sectional and capability detail specifications for the IECQ and requirementsfor the various types of printed boards.IECQ is the IEC quality assessment system for electronic components. It is a third-partycertification system. Its rules (including a description of the role of the inspectorates) arepublished in the following:–IEC QC 001001: Basic Rules;–IEC QC 001002: Rules of Procedure (several parts).This part of IEC 62326 comprises the generic specification for printed boards of assessedquality and forms part of the sectional specifications and capability detail specificationscirculated to the National Committees.EXAMPLEFor rigid multilayer printed board the following standards apply: IEC 62326-1, IEC 62326-4 andIEC 62326-4-1.All three standards should be considered jointly.For further information regarding specification structure and inter-relationship between thespecifications, see annex B.
62326-1 © IEC:2002– 15 –PRINTED BOARDS –Part 1: Generic specification1 ScopeThis part of IEC 62326 defines capability approval (CA) procedures for printed boards. WhenIECQ recognition is required, the capability approval procedures of IEC 001002 should beused. In addition, a technology approval (TA) schedule may also be provided as an alternativefor manufacturers employing a system of process control for establishing product conformity.Both CA and TA procedures apply to printed boards irrespective of their methods ofmanufacture, when they are ready for the mounting of components. The information andrequirements may also be used for second-party approvals or for self-declaration by a manu-facturer of products covered by these specifications.2 Normative referencesThe following referenced documents are indispensable for the application of this document. Fordated references, only the edition cited applies. For undated references, the latest edition ofthe referenced document (including any amendments) applies.IEC 60194, Printed board design, manufacture and assembly – Terms and definitionsIEC 61182-1:1994, Printed boards – Electronic data description and transfer – Part 1: Printedboard description in digital formIEC 61189-3:1997, Test methods for electrical materials, interconnection structures andassemblies – Part 3: Test methods for interconnection structures (printed boards)IEC 61249-2-4, Materials for printed boards and other interconnecting structures – Part 2-4:Reinforced base materials, clad and unclad – Polyester non-woven/woven fiberglass laminatedsheet of defined flammability (vertical burning test), copper-cladIEC 61249-2-7, Materials for printed boards and other interconnecting structures −Part 2-7:Reinforced base materials, clad and unclad – Epoxide woven E-glass laminated sheet ofdefined flammability (vertical burning test), copper-cladIEC 61249-2-12, Materials for printed boards and other interconnecting structures − Part 2-12:Sectional specification set for reinforced base materials, clad and unclad − Epoxide non-wovenaramid laminate of defined flammability, copper-cladIEC 62326 (all parts), Printed boardsIEC 62326-4, Printed boards – Part 4: Rigid multilayer printed boards with interlayerconnections – Sectional specificationIEC 62326-4-1, Printed boards – Part 4: Rigid multilayer printed boards with interlayerconnections – Sectional specification – Section 1: Capability Detail Specification –Performance levels A, B and C
62326-1 © IEC:2002– 17 –IEC QC 001001, IEC Quality Assessment System for Electronic Components (IECQ) –Basic RulesIEC 001002-1, IEC Quality Assessment System for Electronic Components (IECQ) –Rules of procedure – Part 1: AdministrationIEC QC 001002-2, IEC Quality Assessment System for Electronic Components (IECQ) –Rules of procedure – Part 2: DocumentationIEC QC 001002-3, IEC Quality Assessment System for Electronic Components (IECQ) –Rules of procedure – Part 3: Approval proceduresIEC QC 001005, Register of Firms, Products and Services approved under the IECQ System,including ISO 9000ISO 9001:2000, Quality management systems – Requirements3 General3.1 General considerationsPrinted boards differ from most other electronic components in important factors, such as:–there are no standard boards with standard patterns and dimensions but an infinite varietyof shapes and circuit configurations;–they are "custom tailored", i.e. all details for a particular board are agreed betweenmanufacturer and customer;–although they are made in considerable total quantities, the production quantity of a parti-cular printed board may be small.The qualification approval procedures detailed in clause 3 of IEC QC 001002-3 are notconsidered suitable for the approval of printed board manufacturers, and the capabilityapproval procedures of clause 4 of IEC QC 001002-3 shall be applied. Additionally, themanufacturer shall demonstrate that the quality management system complies with ISO 9001,as appropriate. Manufacturers seeking IECQ capability approval shall hold IECQ organizationapproval in accordance with clause 2 of IEC QC 001002-3 as a prerequisite.In the case of printed boards, capability approval is based on the use of capability test board(CTB) or suitable production printed board (PPB) as capability qualifying components with anappropriate selection of test methods and requirements for each type of printed board, forexample:–rigid single and double-sided printed boards without interlayer connections;–rigid single and double-sided printed boards with interlayer connections;–rigid multilayer printed boards with interlayer connections;–flexible multilayer printed boards with interlayer connections.NOTE
This list is not intended to be exhaustive. Conductive holes may be achieved by plating-through, by othermetallization techniques or by deposit of conductive polymeric materials. Requirements for non-plated-throughconductive holes are under consideration.
62326-1 © IEC:2002– 19 –An important requirement of capability approval is that a manufacturer shall demonstrate theclaimed capability to manufacture a given product. This capability approval system is describedin clause 5.In the case of printed boards, product and process capability are differentiated (see also 5.1,5.5.2 and 5.5.3) and are defined in an IEC capability detail specification (Cap DS).Capability detail specifications (Cap DSs) have been prepared for use with the IEC 62326series. Further Cap DSs may be prepared by approved manufacturers, user groups or nationalstandards bodies, and shall be registered by IEC. The format of such Cap DSs shall be basedupon those published by IEC and shall comply with the system requirements for the publicationof detail specifications.Product capability is the capability to manufacture a product of defined characteristics.Examples of product characteristics include:–maximum size of printed boards that can be processed;–minimum diameter of plated-through holes relative to board thickness;–minimum conductor width and/or spacing;–maximum number of layers.Process capability is the capability to use processes for the manufacture of printed boards asdefined in the Cap DS.Examples include:–processing of computer-aided design (CAD) data;–electrolytic copper plating;–tin lead plating;–solder resist application.Materials used to produce printed boards are specific to the product type and have an influenceon printed board performance. Appropriate materials are described in the Cap DS.Examples of base materials include:IEC 61249-2-7;IEC 61249-2-12.3.2 Structure of the specification seriesAlthough printed boards differ from other electronic components, the specifications asdescribed in the rules of procedure for components under the qualification approval procedurewill be used as far as practicable.All levels of specifications have essentially the same significance for both components underqualification approval and printed boards under capability approval.
62326-1 © IEC:2002– 21 –These are as follows:–basic specifications;–
...
Questions, Comments and Discussion
Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.