EN 62326-1:2002
(Main)Printed boards - Part 1: Generic specification
Printed boards - Part 1: Generic specification
Defines capability approval procedures for printed boards. In addition, a technology approval schedule may also be provided as an alternative for manufacturers employing a system of process control for establishing product conformity. Both CA and TA procedures apply to printed boards irrespective of their methods of manufacture, when they are ready for the mounting of components.
Leiterplatten - Teil 1: Fachgrundspezifikation
Cartes imprimées - Partie 1: Spécification générique
Définit les procédures d'agrément de savoir-faire pour les cartes imprimées. De plus, l'agrément de technologie peut être également fourni en tant que variante pour les fabricants utilisant un système de commande de processus en vue de l'établissement de la conformité de produit. Les procédures CA et TA s'appliquent aux cartes imprimées, indépendamment de leurs procédés de fabrication, lorsqu'elles sont prêtes pour le montage des composants.
Printed boards - Part 1: Generic specification
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STANDARDPrinted boards - Part 1: Generic specification©
Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljenoReferenčna številkaSIST EN 62326-1:2003(en)ICS31.180
EUROPEAN STANDARDEN 62326-1NORME EUROPÉENNEEUROPÄISCHE NORMJune 2002CENELECEuropean Committee for Electrotechnical StandardizationComité Européen de Normalisation ElectrotechniqueEuropäisches Komitee für Elektrotechnische NormungCentral Secretariat: rue de Stassart 35, B - 1050 Brussels© 2002 CENELEC -All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.Ref. No. EN 62326-1:2002 EICS 31.180Supersedes EN 62326-1:1997English versionPrinted boardsPart 1: Generic specification(IEC 62326-1:2002)Cartes impriméesPartie 1: Spécification générique(CEI 62326-1:2002)LeiterplattenTeil 1: Fachgrundspezifikation(IEC 62326-1:2002)This European Standard was approved by CENELEC on 2002-06-01. CENELEC members are bound tocomply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this EuropeanStandard the status of a national standard without any alteration.Up-to-date lists and bibliographical references concerning such national standards may be obtained onapplication to the Central Secretariat or to any CENELEC member.This European Standard exists in three official versions (English, French, German). A version in any otherlanguage made by translation under the responsibility of a CENELEC member into its own language andnotified to the Central Secretariat has the same status as the official versions.CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta,Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.
F, G, H, I, J, K and Lare informative.Annex ZA has been added by CENELEC.__________Endorsement noticeThe text of the International Standard IEC 62326-1:2002 was approved by CENELEC as a EuropeanStandard without any modification.__________
- 3 -EN 62326-1:2002Annex ZA(normative)Normative references to international publicationswith their corresponding European publicationsThis European Standard incorporates by dated or undated reference, provisions from otherpublications. These normative references are cited at the appropriate places in the text and thepublications are listed hereafter. For dated references, subsequent amendments to or revisions of anyof these publications apply to this European Standard only when incorporated in it by amendment orrevision. For undated references the latest edition of the publication referred to applies (includingamendments).NOTEWhen an international publication has been modified by common modifications, indicated by (mod), the relevantEN/HD applies.PublicationYearTitleEN/HDYearIEC 60194- 1)Printed board design, manufacture andassembly - Terms and definitions--IEC 61182-11994Printed boards - Electronic datadescription and transferPart 1: Printed board description indigital form--IEC 61189-31997Test methods for electrical materials,printed boards and otherinterconnection structures andassembliesPart 3: Test methods for interconnectionstructures (printed boards)EN 61189-31997IEC 61249-2-4- 1)Materials for printed boards and otherinterconnecting structuresPart 2-4: Reinforced base materials,clad and unclad - Polyester non-woven/woven fibreglass laminated sheetof defined flammability (vertical burningtest), copper-cladEN 61249-2-42002 2)IEC 61249-2-7- 1)Part 2-7: Reinforced base materials cladand unclad - Epoxide woven E-glasslaminated sheet of defined flammability(vertical burning test), copper-cladEN 61249-2-72002 2)IEC 61249-2-12- 1)Part 2-12: Sectional specification set forreinforced base materials, clad andunclad - Epoxide non-woven aramidlaminate of defined flammability,copper-cladEN 61249-2-121999 2)IEC 62326SeriesPrinted boardsEN 62326Series
1) Undated reference.2) Valid edition at date of issue.
NORMEINTERNATIONALECEIIECINTERNATIONALSTANDARD62326-1QC 230000Deuxième éditionSecond edition2002-03Cartes imprimées –Partie 1:Spécification génériquePrinted boards –Part 1:Generic specificationPour prix, voir catalogue en vigueurFor price, see current catalogue© IEC 2002
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Copyright - all rights reservedAucune partie de cette publication ne peut être reproduite niutilisée sous quelque forme que ce soit et par aucun procédé,électronique ou mécanique, y compris la photocopie et lesmicrofilms, sans l'accord écrit de l'éditeur.No part of this publication may be reproduced or utilized in anyform or by any means, electronic or mechanical, includingphotocopying and microfilm, without permission in writing fromthe publisher.International Electrotechnical Commission,
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Web: www.iec.chCODE PRIXPRICE CODEXACommission Electrotechnique InternationaleInternational Electrotechnical Commission
62326-1 © IEC:2002– 3 –CONTENTSFOREWORD.9INTRODUCTION.131Scope.152Normative references.153General.173.1General considerations.173.2Structure of the specification series.194Particular stipulations.254.1Primary stage of manufacture.254.2Structurally similar printed boards.254.3Certified records of released lots (CRRL).254.4Delayed delivery.254.5Release for delivery before the completion of all tests.274.6Re-submission of rejected lots.274.7Marking of printed boards and package.274.7.1Printed boards.274.7.2Package.274.8Ordering information.275Capability approval and maintenance of capability approval.275.1General.275.2Capability approval requirements.295.3Description of capability.295.4Register of firms, products and services information (RFPS).295.5Demonstration of IECQ capability.315.5.1Test programme.315.5.2Product capability.315.5.3Process capability.335.6Capability approval test report.355.7Range of capability approval.355.7.1Range of product capability.355.7.2Range of process capability.355.7.3Extended range of approval of product/process capability.355.7.4Significant changes.375.7.5Amendment procedures.375.8Maintenance of capability approval.375.9Suspension and withdrawal of capability approval.395.10Capability approval testing.395.11Inspection information in the Cap DS.396Quality assessment.396.1Quality conformance inspection.396.2Groupings of tests.41
62326-1 © IEC:2002– 5 –6.2.1Category V inspection (visual).436.2.2Category D inspection (dimensional).436.2.3Category S inspection (surface condition).436.2.4Category E inspection (electrical).456.2.5Category P inspection (physical).456.2.6Category Y inspection (structure integrity).456.2.7Category Z inspection.456.3Inspection information in the CDS.456.4IECQ technology approval.476.5Indirect measuring methods.477Rules for the preparation of detail specifications.477.1Capability detail specification (Cap DS).477.1.1Requirements for the preparation of the Cap DS.477.1.2Numbering and content.477.1.3Drawing information.497.2Customer detail specification (CDS).497.2.1General.497.2.2Numbering and content.517.2.3Drawing information.517.2.4Electronic manufacturing data.537.2.5Marking.537.2.6Performance requirements.53Annex A (informative)
Example of a CDS check-list.55Annex B (informative)
Future structure of the specification series.57Annex C (informative)
Structure of the capability qualifying component (CQC).59Annex D (informative)
Abbreviations and acronyms related to IECQand their explanations.61Annex E (informative)
Guide to the form and content of a capability manual.63E.1General requirements.63E.2Scope of capability approval.67E.3Technology (process description).67E.4Subcontracting.69E.5Limits of capability.69E.6Description of capability.71E.7Manufacturer to customer interface.73E.8Design rules.73E.9Materials list.73E.10Manufacture.73E.11Procedure in the event of CQC or product failure.75E.12Test programme for capability approval.75E.13Maintenance of approval.79E.14Modifications to the capability approval.79
62326-1 © IEC:2002– 7 –Annex F (informative)
Example of process description.83F.1Base materials.83F.2Basic processing method.83F.3Method of pattern or image definition.83F.4Method of producing holes.83F.5Method of producing board shape.83F.6Method of construction.83F.7Metallic and organic finishes.83F.8Types of interconnections.83Annex G (informative)
Example of limits of approval.85Annex H (informative)
Example of description of capability.87Annex I (informative)
Example of manufacturer-to-customer interface.89Annex J (informative)
Example of CQC detail specification.91Annex K (informative)
Example of test programme matrix.97Annex L (informative)
Example of test programme schedule.99Annex M (normative)
Requirements for capability approval test reports.101Table 1 – Sample size selection.41Table C.1 – Capability qualifying component (CQC).59Table E.1 – Content of a capability manual.67
62326-1 © IEC:2002– 9 –INTERNATIONAL ELECTROTECHNICAL COMMISSION___________PRINTED BOARDS –Part 1: Generic specificationFOREWORD1)The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprisingall national electrotechnical committees (IEC National Committees). The object of the IEC is to promoteinternational co-operation on all questions concerning standardization in the electrical and electronic fields. Tothis end and in addition to other activities, the IEC publishes International Standards. Their preparation isentrusted to technical committees; any IEC National Committee interested in the subject dealt with mayparticipate in this preparatory work. International, governmental and non-governmental organizations liaisingwith the IEC also participate in this preparation. The IEC collaborates closely with the International Organizationfor Standardization (ISO) in accordance with conditions determined by agreement between the twoorganizations.2)The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, aninternational consensus of opinion on the relevant subjects since each technical committee has representationfrom all interested National Committees.3)The documents produced have the form of recommendations for international use and are published in the formof standards, technical specifications, technical reports or guides and they are accepted by the NationalCommittees in that sense.4)
In order to promote international unification, IEC National Committees undertake to apply IEC InternationalStandards transparently to the maximum extent possible in their national and regional standards. Anydivergence between the IEC Standard and the corresponding national or regional standard shall be clearlyindicated in the latter.5)
The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for anyequipment declared to be in conformity with one of its standards.6)
Attention is drawn to the possibility that some of the elements of this international standard may be the subjectof patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.International Standard IEC 62326-1 has been prepared by IEC technical committee 91:Electronics assembly technology.This second edition cancels and replaces the first edition, published in 1996, and constitutes atechnical revision.The text of this standard is based on the following documents:FDISReport on voting91/274/FDIS91/285/RVDFull information on the voting for approval of this standard can be found in the report on votingindicated in the above table.This publication has been drafted in accordance with the ISO/IEC Directives, Part 3.Annex M forms an integral part of this standard.Annexes A through L are for information only.
62326-1 © IEC:2002– 11 –The QC number that appears on the front cover of this publication is the specification numberin the IEC Quality Assessment System for Electronic Components (IECQ).The committee has decided that the contents of this publication will remain unchanged until2007. At this date, the publication will be•reconfirmed;•withdrawn;•replaced by a revised edition, or•amended.
62326-1 © IEC:2002– 13 –INTRODUCTIONIEC 62326 is applicable to printed boards, irrespective of their method of manufacture, whenthey are ready for the mounting of components.IEC 62326 is composed of separate parts covering information for the designer, manufacturer,and user generic, sectional and capability detail specifications for the IECQ and requirementsfor the various types of printed boards.IECQ is the IEC quality assessment system for electronic components. It is a third-partycertification system. Its rules (including a description of the role of the inspectorates) arepublished in the following:–IEC QC 001001: Basic Rules;–IEC QC 001002: Rules of Procedure (several parts).This part of IEC 62326 comprises the generic specification for printed boards of assessedquality and forms part of the sectional specifications and capability detail specificationscirculated to the National Committees.EXAMPLEFor rigid multilayer printed board the following standards apply: IEC 62326-1, IEC 62326-4 andIEC 62326-4-1.All three standards should be considered jointly.For further information regarding specification structure and inter-relationship between thespecifications, see annex B.
62326-1 © IEC:2002– 15 –PRINTED BOARDS –Part 1: Generic specification1 ScopeThis part of IEC 62326 defines capability approval (CA) procedures for printed boards. WhenIECQ recognition is required, the capability approval procedures of IEC 001002 should beused. In addition, a technology approval (TA) schedule may also be provided as an alternativefor manufacturers employing a system of process control for establishing product conformity.Both CA and TA procedures apply to printed boards irrespective of their methods ofmanufacture, when they are ready for the mounting of components. The information andrequirements may also be used for second-party approvals or for self-declaration by a manu-facturer of products covered by these specifications.2 Normative referencesThe following referenced documents are indispensable for the application of this document. Fordated references, only the edition cited applies. For undated references, the latest edition ofthe referenced document (including any amendments) applies.IEC 60194, Printed board design, manufacture and assembly – Terms and definitionsIEC 61182-1:1994, Printed boards – Electronic data description and transfer – Part 1: Printedboard description in digital formIEC 61189-3:1997, Test methods for electrical materials, interconnection structures andassemblies – Part 3: Test methods for interconnection structures (printed boards)IEC 61249-2-4, Materials for printed boards and other interconnecting structures – Part 2-4:Reinforced base materials, clad and unclad – Polyester non-woven/woven fiberglass laminatedsheet of defined flammability (vertical burning test), copper-cladIEC 61249-2-7, Materials for printed boards and other interconnecting structures −Part 2-7:Reinforced base materials, clad and unclad – Epoxide woven E-glass laminated sheet ofdefined flammability (vertical burning test), copper-cladIEC 61249-2-12, Materials for printed boards and other interconnecting structures − Part 2-12:Sectional specification set for reinforced base materials, clad and unclad − Epoxide non-wovenaramid laminate of defined flammability, copper-cladIEC 62326 (all parts), Printed boardsIEC 62326-4, Printed boards – Part 4: Rigid multilayer printed boards with interlayerconnections – Sectional specificationIEC 62326-4-1, Printed boards – Part 4: Rigid multilayer printed boards with interlayerconnections – Sectional specification – Section 1: Capability Detail Specification –Performance levels A, B and C
62326-1 © IEC:2002– 17 –IEC QC 001001, IEC Quality Assessment System for Electronic Components (IECQ) –Basic RulesIEC 001002-1, IEC Quality Assessment System for Electronic Components (IECQ) –Rules of procedure – Part 1: AdministrationIEC QC 001002-2, IEC Quality Assessment System for Electronic Components (IECQ) –Rules of procedure – Part 2: DocumentationIEC QC 001002-3, IEC Quality Assessment System for Electronic Components (IECQ) –Rules of procedure – Part 3: Approval proceduresIEC QC 001005, Register of Firms, Products and Services approved under the IECQ System,including ISO 9000ISO 9001:2000, Quality management systems – Requirements3 General3.1 General considerationsPrinted boards differ from most other electronic components in important factors, such as:–there are no standard boards with standard patterns and dimensions but an infinite varietyof shapes and circuit configurations;–they are "custom tailored", i.e. all details for a particular board are agreed betweenmanufacturer and customer;–although they are made in considerable total quantities, the production quantity of a parti-cular printed board may be small.The qualification approval procedures detailed in clause 3 of IEC QC 001002-3 are notconsidered suitable for the approval of printed board manufacturers, and the capabilityapproval procedures of clause 4 of IEC QC 001002-3 shall be applied. Additionally, themanufacturer shall demonstrate that the quality management system complies with ISO 9001,as appropriate. Manufacturers seeking IECQ capability approval shall hold IECQ organizationapproval in accordance with clause 2 of IEC QC 001002-3 as a prerequisite.In the case of printed boards, capability approval is based on the use of capability test board(CTB) or suitable production printed board (PPB) as capability qualifying components with anappropriate selection of test methods and requirements for each type of printed board, forexample:–rigid single and double-sided printed boards without interlayer connections;–rigid single and double-sided printed boards with interlayer connections;–rigid multilayer printed boards with interlayer connections;–flexible multilayer printed boards with interlayer connections.NOTE
This list is not intended to be exhaustive. Conductive holes may be achieved by plating-through, by othermetallization techniques or by deposit of conductive polymeric materials. Requirements for non-plated-throughconductive holes are under consideration.
62326-1 © IEC:2002– 19 –An important requirement of capability approval is that a manufacturer shall demonstrate theclaimed capability to manufacture a given product. This capability approval system is describedin clause 5.In the case of printed boards, product and process capability are differentiated (see also 5.1,5.5.2 and 5.5.3) and are defined in an IEC capability detail specification (Cap DS).Capability detail specifications (Cap DSs) have been prepared for use with the IEC 62326series. Further Cap DSs may be prepared by approved manufacturers, user groups or nationalstandards bodies, and shall be registered by IEC. The format of such Cap DSs shall be basedupon those published by IEC and shall comply with the system requirements for the publicationof detail specifications.Product capability is the capability to manufacture a product of defined characteristics.Examples of product characteristics include:–maximum size of printed boards that can be processed;–minimum diameter of plated-through holes relative to board thickness;–minimum conductor width and/or spacing;–maximum number of layers.Process capability is the capability to use processes for the manufacture of printed boards asdefined in the Cap DS.Examples include:–processing of computer-aided design (CAD) data;–electrolytic copper plating;–tin lead plating;–solder resist application.Materials used to produce printed boards are specific to the product type and have an influenceon printed board performance. Appropriate materials are described in the Cap DS.Examples of base materials include:IEC 61249-2-7;IEC 61249-2-12.3.2 Structure of the specification seriesAlthough printed boards differ from other electronic components, the specifications asdescribed in the rules of procedure for components under the qualification approval procedurewill be used as far as practicable.All levels of specifications have essentially the same significance for both components underqualification approval and printed boards under capability approval.
62326-1 © IEC:2002– 21 –These are as follows:–basic specifications;–generic specification;–sectional specifications;–blank detail specifications;–detail specifications.Basic specifications (BS) are applicable to all electronic components, for example, basicenvironmental tests, SI units, etc.The generic specification (GS) for printed boards is this standard.Each sectional specification (SS) covers one type of printed board, for example, rigid singleand double-sided printed boards with interlayer connections, rigid multilayer printed boards withinterlayer connections, etc.The SS gives the requirements, test specimens and test sequence which are applicable for aperformance level (PL).A performance level is a level of requirements of a characteristic.The combination of test schedule (for example, number and type of tests), performance leveland sample size selection is called assessment criteria. Applicable assessment criteria arespecified in table 1 of the relevant SS.A blank detail specification is not applicable to printed boards. For printed boards two differenttypes of detail specifications are in use:–capability detail specification (Cap DS);–customer detail specification (CDS).The capability detail specification (Cap DS) fully describes the capability qualifying component(CQC) and applies one of the performance levels of the SS to that CQC, for example:–performance level A;–performance level B;–performance level C;–performance level X.Performance level A is intended for printed boards used in products with a low environmentalstress and low consumer expectation (for example, toys, electronic games and non-criticalconsumer or industrial control devices, etc.). These boards represent low-cost alternatives dueto reduced inspection and testing.Performance level B is intended for printed boards which meet a higher environmental stressand higher consumer expectations (for example, critical industrial control devices,telecommunication equipment, computers, etc.) than performance level A but lower thanperformance level C.
62326-1 © IEC:2002– 23 –Performance level C is intended for printed boards used in products where continuedperformance is critical, equipment downtime cannot be tolerated or the equipment is a life-support item (for example, medical electronics, automotive engine part, etc.). These boardsincur much higher costs due to the required materials, process complexity, inspection andtesting.Performance level X is available for use by manufacturers and their customers where levels A,B and C do not adequately address the needs of their product and/or business. The levels ofcapability demonstration and requirements for quality conformance inspection shall be definedin a capability detail specification registered by the IEC.The customer detail specification (CDS) describes the product to be delivered, i.e. the customdesigned printed board. The customer prescribes the assessment in accordance with one ofthe performance levels given in the SS. Products to be manufactured should be addressed tomanufacturers that have approved capability for the corresponding performance level or higher.The performance levels quoted in a CDS can be as follows:–performance level Ain accordance with table 1 of the SS–performance level B(for example, see IEC 62326-4)–performance level C–a combination thereof–performance level XPerformance level A is the minimum assessment criteria.Performance level B consists of a more stringent performance and assessment criteria thanperformance level A.Performance level C consists of a more stringent performance and assessment criteria thanperformance level B.Performance level X is defined by a published Cap DS and may make reference to existingIEC 62326 standards. The IEC 62326 series Cap DSs shall be used wherever possible toreduce the proliferation of similar documents.Where assessment criteria differ from the performance levels given in table 1 of the SS, forexample, comprising additional tests (see 7.2.6.2), and/or more severe sample size selection isnecessary, it shall be described in the CDS. This performance level is called level X. In no caseshall the performance level required by a CDS be lower than performance level A as specifiedin the relevant SS.When performance level X requires testing of characteristics not listed in the relevant SS, anappropriate test of IEC 61189-3 shall be used.If a new test not covered by IEC 61189-3 is necessary, the CDS shall contain completeinformation regarding test method, conditions and requirements, specimens to be tested, testcircuits, sample size selection and performance level.
62326-1 © IEC:2002– 25 –For special performance requirements the customer has the responsibility for establishingthese requirements.NOTE
The customer is reminded of the possibly increased cost of including additional tests or specifyingunnecessarily tight sample size selection.The Cap DS and CDS each have two functions:–to define the conditions of testing and qualification;–to describe the product to be delivered.A survey of the structure of the specification series is given in annex B. Further details of bothCap DS and CDS, as well as rules for their preparation, are given in clause 7.4 Particular stipulations4.1 Primary stage of manufactureThe primary stage of manufacture is defined as the incoming inspection of the materials usedfor the manufacturing of the printed board materials (i.e. copper-clad laminates, platingchemicals, solder resist, etc.) prior to processing.This stage, and all subsequent processes, shall be carried out under the authority of thedesignated management representative (DMR) with defined authorities (formerly known inthe IECQ as the chief inspector). Where this first and subsequent stages of processing arecarried out by a subcontractor, capability approval may be granted provided that in each casethe equivalent disciplines apply.4.2 Structurally similar printed boardsPrinted boards having all of the following common features are considered as structurallysimilar:–the same types of base material, for example, 61249-2-4-IEC-EP-GC-Cu;–the same type of printed board, for example, rigid single and double-sided printed boardswithout interlayer connections or rigid single and double-sided printed boards with interlayerconnections or rigid multilayer printed boards with interlayer connections;–the same type of surface finish, for example tin-lead and/or gold and/or copper;–approximately similar product complexity.4.3 Certified records of released lots (CRRL)The content of certified records shall be as prescribed in 6.1 and 6.2 of this GS and in therelevant SS, stating the number of specimens tested.4.4 Delayed deliveryWhen printed boards are held by the manufacturer for a period of more than six months afterthe quality conformance inspection, the following tests shall be carried out prior to delivery:–solderability test 3X07 as specified for quality conformance inspection, in the relevant CDS;(to include the specified baking requirement of Test 3X07).–visual examination of the appearance, as specified for quality conformance inspection inthe relevant CDS.
62326-1 © IEC:2002– 27 –4.5 Release for delivery before the completion of all testsThe manufacturer is permitted, with the agreement of the customer, to release printed boardsbefore the completion of periodic (monthly or quarterly) tests or lot inspection tests which takemore time (for example, solder test after accelerated ageing).4.6 Re-submission of rejected lotsWhere a sample fails to meet the requirements of a periodic test, action shall be taken inaccordance with 4.2.10 of IEC QC 001002-3.4.7 Marking of printed boards and package4.7.1 Printed boardsEach printed board shall be clearly and permanently marked with the reference specified by thecustomer.The marking may, for example, be printed with permanent ink, be formed with a metal pattern,be integrated as part of the permanent polymer coatings, etc.Marking with additional information, such as manufacturer's name or identification code,number of the SS, date code, etc. may be applied if explicitly agreed between manufacturerand customer.The location of any marking shall be agreed between manufacturer and customer.4.7.2 PackageThe package shall be marked with the information given in 4.7.1 and any special markingrequired by the CDS (for example, customer's identification number).4.8 Ordering informationPrinted boards shall be ordered in accordance with the CDS. The CDS shall contain orreference all information necessary to define the printed board clearly and completely.5 Capability approval and maintenance of capability approval5.1 GeneralThis clause states the requirements and procedures for obtaining capability approval and forthe maintenance of capability approval.In the case of printed boards, a manufacturer's capability is divided into two parts:–product capability. This capability is defined in the IEC Cap DS. The materials used tomake the product covered by the SS are also specified in the Cap DS. Examples of productcharacteristics are board size, hole diameter, number of layers, etc.;–process capability. This capability, also defined in the Cap DS, is granted for definedprocesses. Examples of processes are "in-house" photoplotting, gold plating, solder coating(levelled), etc.See also 3.1.
62326-1 © IEC:2002– 29 –5.2 Capability approval requirementsThe general rules as laid down in clause 2 of IEC QC 001002-3 shall apply.A manufacturer wishing to obtain capability approval for printed boards shall:–prepare a description of capability (see 5.3);–prepare an abstract of the description of capability for publication in IEC QC 001005;(see 5.4),–demonstrate capability (product and process; see 5.5);–prepare a capability approval test report (see 5.6).These requirements are most readily accommodated by the development of a capabilitymanual. Annexes E to L provide guidance on the format and content of a capability manual foruse with the IEC 62326 series.5.3 Description of capabilityThe manufacturer shall describe the capability for which he is seeking approval and which he isprepared to demonstrate in the capability approval test and shall list the specifications forprocess control and materials used.The description of capability shall be presented in accordance with the relevant Cap DS.5.4 Register of firms, products and services information (RFPS)When capability approval is requested, the manufacturer shall identify the product (printedboard characteristic) and the processes (manufacturing stages) to be published in the RFPS.A manufacturer will be listed as an organization in part 1 of IEC QC 001005. An abstract of themanufacturer’s capability will be included in part 2 of IEC QC 001005.The information shall, as a minimum, contain the following:–reference to the SS;–reference to the Cap DS;–performance level;–material for which approval has been granted;–processes used to manufacture the product as quoted in the relevant Cap DS;–product characteristics as quoted in the Cap DS and demonstrated by the CQC(see annex C);–manufacturer's name, address, and country of manufacture;–identification codes for the aspects covered (quoted in the order as given in the relevantCap DS);–information on type of capability that was approved;–date of approval;–approving authority.Where a manufacturer is approved to level X, the RFPS and capability approval certificate shallclearly identify the number of the IECQ registered Cap DS against which the approval has beengranted.
62326-1 © IEC:2002– 31 –5.5 Demonstration of IECQ capabilityDemonstration of IECQ capability shall meet or exceed all requirements stated in the relevantCap DS for the claimed product capability. Capability already recognized under otherestablished capability systems may contribute to obtain an IECQ-recognized capability,provided that the total capability demonstrated is judged to be sufficiently equivalent to the fullIECQ requirements for the claimed capability. The judgement is made by the relevant nationalsupervising inspectorate (NSI). In case of dispute, the details shall be forwarded to the IECQcertification management committee (CMC) who shall, in conduction with an appropriateNational committee, be responsible for arbitration.5.5.1 Test programmeThe manufacturer shall demonstrate to the appropriate approval authority the ability to produceprinted boards of acceptable quality in conformance with the requirements of this GS,the appropriate SS, and the appropriate IEC Cap DS.The DMR shall prepare a programme for the assessment of the claimed capability. Thisprogramme shall be so designed that the claimed capability will be assessed completely andshall include the following:–reference to the Cap DS and performance level to which the capability is claimed;–details of the test specimens or production boards used to establish capability;–details of inspection requirements and test conditions for the capability.Tables showing inspection requirements and tests for the capability qualifying components(CQC) are given in the relevant Cap DS.Where the capability qualifying components are designed and produced solely for the purposeof obtaining capability approval, the same controls and discipline as used in the normalproduction shall be applied.The tests shall be carried out by the manufacturer using his own approved testing facilities orby a test laboratory approved by IECQ.The test methods detailed in the IEC 62326 series are from IEC 61189-3. However, it ispermitted by clause 2 of IEC QC 001002-3 to substitute these methods with testing of equal orgreater severity. Therefore, test data produced for other approval regimes (for examplemilitary, CENELEC 1), etc.) may be used in lieu of the IEC 61189-3 tests, where this is accept-able to the approval authority. Such test data may only be accepted where the testing has beencarried out by the approved manufacturer or by an approved test laboratory.5.5.2 Product capabilityA capability qualifying component (CQC) may be either a capability test board (CTB),a capability test segment (CTS), a production printed board (PPB) or an individual testspecimen (ITS). See annex C.Each manufacturer shall make a sufficient number of test specimens to meet the testconditions of the particular Cap DS.________1)
European Committee for Electrotechnical Standardization.
62326-1 © IEC:2002– 33 –One or more capability test boards (CTB) containing individual test specimens (ITS), requiredfor the capability approval, may be manufactured on the test panels (TP) as a single lot fromproduction. The CTB and the ITS are specified and shown in the relevant Cap DS.One or more production printed boards (PPB) and individual test specimens (ITS) required forthe capability approval may be manufactured on production panels (PP). A portion of theprinted board and of the ITS may be used as CQC, provided they are similar to those shown inthe relevant Cap DS.The test specimens shall be subjected to the tests stated in the relevant Cap DS.The product capa
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